EP4SGX530KF43C3N - Stratix IV GX FPGA, 531K LE, 1760-BGA | Intel
Référence : EP4SGX530KF43C3N ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4250 | $4 250,00 |
| 10 | $4100 | $41 000,00 |
| 100 | $3875 | $387 500,00 |
| 500 | $3650 | $1 825 000,00 |
| 1 000 | $3425 | $3 425 000,00 |
EP4SGX530KF43C3N Présentation
A Field Programmable Gate Array (FPGA) is a programmable logic device that allows engineers to implement custom digital circuits through configuration rather than fabrication. Within the broader programmable logic taxonomy, an FPGA sits above simple programmable logic devices (SPLDs) and complex programmable logic devices (CPLDs), offering far higher logic density, embedded multipliers, block RAM, clock management tiles, and high-speed transceivers. The Stratix IV GX family specifically targets applications requiring multi-gigabit serial connectivity (up to 8.5 Gbps per channel).
Key features include 21248 logic array blocks (LABs), 880 user I/O pins, integrated transceivers capable of 600 Mbps to 8.5 Gbps operation, and support for up to 24 transceiver channels. The device operates across the commercial 0C to 85C temperature range and is built on a 40 nm process technology. Quartus II design software is used for synthesis, place-and-route, and timing closure.
The architecture combines adaptive logic modules (ALMs), TriMatrix embedded memory blocks, DSP blocks for fixed- and floating-point arithmetic, and phase-locked loops (PLLs) for clock generation. The high-speed serial interface is hardened with physical coding sublayer (PCS) and physical medium attachment (PMA) blocks supporting protocols such as PCI Express Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, XAUI, CEI-6G, and CPRI.
Typical applications include high-end wireline transport equipment (100G/40G line cards), wireless LTE and WiMAX baseband processing, military secure communication systems, broadcast video infrastructure, and high-performance computing acceleration. The combination of high logic density, multi-gigabit transceivers, and ample DSP blocks makes it well suited to packet processing, encryption, and forward-error-correction pipelines.
When designing with this device, careful attention to PCB layout is critical: controlled-impedance routing for transceiver channels, decoupling capacitor placement around the core and I/O rails, and thermal management via heatsink or airflow to keep junction temperature within the 0C to 85C commercial range. Quartus II power analysis and SignalTap II logic analyzer tools are recommended for sign-off.
This page synthesizes distributor pricing, package-compatible alternatives from the Stratix IV GX family, and practical PCB/thermal design guidance not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EP4SGX530KF43C3N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP4SGX530KF43C3N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Speed Grade, Transceivers, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP4SGX530KF43C3
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3700 / unité
Voir la fiche technique →EP4SGX530KF43C2N
✅ Remplacement direct✓ En stock
$3450 / unité
Voir la fiche technique →EP4SGX530KF43C2
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3755 / unité
Voir la fiche technique →EP4SGX530KF43C3N Valeurs maximales et caractéristiques électriques
| Device Family | Stratix IV GX |
| Logic Elements | 531,200 |
| Logic Array Blocks (LABs) | 21,248 |
| Embedded Memory | 28,033,024 bits |
| Maximum User I/O | 880 |
| Boîtier | 1760-BBGA / FCBGA |
| Package Dimensions | 42.50 x 42.50 mm |
| Internal Frequency | 800 MHz |
| Transceiver Data Rate | 600 Mbps to 8.5 Gbps |
| Température de fonctionnement | 0C to 85C (commercial) |
| Process Technology | 40 nm |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant |
| Design Software | Quartus II |
Guide de configuration des broches du EP4SGX530KF43C3N 42.50 x 42.50 mm
Configuration des broches du EP4SGX530KF43C3N (boîtier 42.50 x 42.50 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP4SGX530KF43C3N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP4SGX530KF43C3N convient pour 6 applications: 100G/40G Wireline Line Cards, Wireless LTE/eNodeB Baseband Processing, Military Secure Communications and Crypto, High-Performance Computing Acceleration, Broadcast Video Infrastructure (3G/HD-SDI), Medical Imaging (Ultrasound, CT, MRI Front-End).
100G/40G Wireline Line Cards
The EP4SGX530KF43C3N's 531,200 logic elements and 28 Mb TriMatrix memory support packet lookup tables, traffic managers, and forward-error-correction (FEC) pipelines for 100G OTN and 40G Ethernet line cards. The 8.5 Gbps transceivers map directly to OTU3/OTU4, 40G/100G KR4, and CEI-11G SR/LR interfaces, replacing multiple ASSPs with a single flexible FPGA. Designers benefit from Quartus II IP cores for OTN framer, Ethernet MAC, and Interlaken, reducing time-to-market versus ASIC development.
Recommandé
Wireless LTE/eNodeB Baseband Processing
The 21,248 LABs and DSP blocks deliver the multiply-accumulate throughput required for LTE PHY layer functions including FFT/iFFT, channel estimation, MIMO detection, and turbo/LDPC decoding. The 880 user I/O pins support CPRI/OBSAI links to remote radio heads at up to 6.144 Gbps, while 8.5 Gbps transceivers aggregate multiple CPRI streams to the baseband card. Commercial temperature grade (0C to 85C) suits controlled-environment base station chassis.
Recommandé
Military Secure Communications and Crypto
The 531K logic element fabric implements AES-256, SHA-256, and Suite B cryptographic pipelines with sustained multi-Gbps throughput, while the 28 Mb embedded memory holds key tables and S-boxes on-chip for low-latency access. The 880 I/O support multiple LVDS data ports to ADC/DAC front-ends used in software defined radio (SDR) platforms. Extended temperature grades are available within the Stratix IV family for ruggedized military environments.
Recommandé
High-Performance Computing Acceleration
FPGA-based compute accelerators in data centers leverage the EP4SGX530KF43C3N's DSP blocks and 28 Mb block RAM to accelerate search, compression, and financial Monte Carlo workloads. A single FPGA delivers up to 100s of GMACs/s, offloading CPUs and reducing power per operation. The 8.5 Gbps transceivers connect to host processors via PCI Express Gen2 x8, while the 880 I/O support multiple DDR3 memory channels at 800 MHz for high-bandwidth working data sets.
Recommandé
Broadcast Video Infrastructure (3G/HD-SDI)
The 8.5 Gbps transceivers transport uncompressed 3G-SDI (2.97 Gbps), dual-link HD-SDI, and emerging 6G/12G-SDI streams with on-chip clock recovery, scrambling, and SMPTE 425/292/259 PHY handling. The 531K logic element fabric runs multi-channel up/down/cross converters, frame synchronizers, and HDR/WCG color processing in real time. The 880 user I/O integrate video lookup tables, audio embedding, and ancillary data extraction without external ASSPs.
Recommandé
Medical Imaging (Ultrasound, CT, MRI Front-End)
The high DSP block count and 28 Mb embedded memory enable multi-channel beamforming, Hilbert transforms, and matched filtering across 64 to 256 ultrasound channels in a single FPGA. The 880 user I/O interface directly to LVDS ADC front-ends sampling at 40-80 MSPS per channel. PCI Express Gen2 connectivity streams processed images to the host processor at multi-Gbps rates. Commercial 0-85C temperature grade suits controlled clinical environments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP4SGX530KF43C3N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP4SGX530KF43C3 | EP4SGX530KF43C2N | EP4SGX530KF43C2 | EP4SGX530HH35C3N |
|---|---|---|---|---|---|
| Package | 1760-FCBGA (KF43) | 1760-FCBGA (KF43) | 1760-FCBGA (KF43) | 1760-FCBGA (KF43) | 1517-HBGA (HH35) |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 531,200 | 531,200 | 531,200 | 531,200 | 531,200 |
| Embedded Memory | 28,033,024 bits | 28,033,024 bits | 28,033,024 bits | 28,033,024 bits | 28,033,024 bits |
| Speed Grade | C3 (fastest commercial) | C3 | C2 (-15% Fmax) | C2 (-15% Fmax) | C3 |
| Transceiver Data Rate | 600 Mbps to 8.5 Gbps | 600 Mbps to 8.5 Gbps | 600 Mbps to 8.5 Gbps | 600 Mbps to 8.5 Gbps | 600 Mbps to 8.5 Gbps |
| Operating Temperature | 0C to 85C | 0C to 85C | 0C to 85C | 0C to 85C | 0C to 85C |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Principaux différenciateurs
- Highest logic density in Stratix IV GX family (vs EP4SGX360KF43C3N)
- Maximum transceiver count in 1760-BGA package (vs EP4SGX530HH35C3N)
- Fastest speed grade available in KF43 package (vs EP4SGX530KF43C2N)
Notes de conception
The 1760-FCBGA KF43 package uses 1.0 mm ball pitch; PCB fabrication must specify laser-drilled microvias (HDI stack-up) with a 4-1-4 or 5-2-5 build-up sequence to fan out the inner rows. Use 0.5 oz copper outer layers and 1 oz inner layers, with the core and I/O voltage planes on dedicated layers under the BGA to provide low-impedance power delivery. Place 0402-size 0.1 uF and 0.01 uF decoupling capacitors on every four BGA balls across the bottom-side fan-out, with 10 uF bulk tantalum or ceramic capacitors at the PCB edge near voltage regulator outputs.
Stratix IV GX transceiver channels require controlled-impedance differential routing (100 ohm +/- 10%) with maximum length matching of 0.127 mm (5 mil) within a transceiver quad. Use stripline or coplanar waveguide with ground (CPWG) on inner layers for crosstalk isolation. AC-coupling capacitors (0.1 uF X7R 0402) must be placed within 250 mil of the FPGA balls. Reference Intel Application Note AN 532 for full transceiver layout guidelines and via stub recommendations.
Estimated: At 50% logic utilization, the Stratix IV GX 530 device can dissipate 15-25W. Without airflow, the FCBGA-1760 theta_JA is roughly 4-6 C/W, so junction temperature can exceed the 85C commercial limit within seconds of power-up. A thermal management strategy combining an aluminum or copper heatsink with thermal interface material (TIM) plus 200-400 LFM forced airflow is recommended for most designs. Use Quartus II PowerPlay early in the design cycle to estimate junction temperature under worst-case workload.
Informations de conformité
RoHS compliance and lead-free finish per Intel/Altera product documentation. Reach, halogen-free, and conflict minerals data not provided in verified web data; marked unknown per Data Authenticity Rules.
