EPF10K100EQC240-2 - FLEX 10KE FPGA 100K Gates 240-PQFP | Altera
Référence : EPF10K100EQC240-2 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $268 | $2 680,00 |
| 100 | $245 | $24 500,00 |
| 500 | $220 | $110 000,00 |
| 1 000 | $198 | $198 000,00 |
EPF10K100EQC240-2 Présentation
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines the integration density of ASICs with the design flexibility of programmable logic. The FLEX 10KE family sits in the taxonomy of programmable logic as follows: programmable logic device (PLD) -> CPLD/FPGA -> SRAM-based FPGA -> embedded array block FPGA. FLEX 10KE devices pioneered the System-on-a-Programmable-Chip (SOPC) concept by embedding a high-density array block alongside the logic array, allowing designers to instantiate megafunctions such as RAM, ROM, and multiplier blocks alongside conventional logic.
Key features include 624 Logic Array Blocks (LABs), 189 user I/O pins, embedded array blocks (EABs) for memory implementation, and CMOS process technology with 0.6 ns propagation delay through Look-Up Tables (LUTs). The device is configured via the IEEE 1149.1 JTAG interface or via a serial configuration EPROM, and the device supports in-system programmability through its SRAM-based configuration cells.
Architecture-wise, the FLEX 10KE family combines rows of LABs with columns of EABs, where each LAB contains 8 LEs connected via a local interconnect. The embedded array blocks provide True-Dual-Port RAM, ROM, and synchronous function implementations with 2,048 bits per EAB, enabling efficient on-chip memory and DSP-style operations.
Typical applications include telecommunications line cards, industrial control systems, glue logic replacement, and prototyping platforms where ASIC-equivalent density is required without NRE cost. The PQFP-240 package supports through-hole or socketed assembly for ease of breadboarding and legacy system support.
When designing with this part, note that the EPF10K100EQC240-2 is a member of a mature EOL family; supply is generally limited to franchised distributors and the secondary market. Designers targeting new designs should evaluate Cyclone or Cyclone II equivalents on Intel's current roadmap unless second-source longevity is required.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone - including the FLEX 10KE device family context, end-of-life sourcing guidance, and pin-compatible speed-grade variants.
Alternatives de remplacement direct pour EPF10K100EQC240-2 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K100EQC240-2 (même facteur de forme et même empreinte) — différant par Configuration Method, Package, Family, Operating Temperature, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K100EQC240-2N
✅ Remplacement direct✓ En stock
$18.4 / unité
Voir la fiche technique →EPF10K100EQC240-2X
✅ Remplacement direct✓ En stock
$62 / unité
Voir la fiche technique →EPF10K100EQC240-1
✅ Remplacement direct✓ En stock
$18.5 / unité
Voir la fiche technique →EPF10K100EQC240-1N
✅ Remplacement direct✓ En stock
$55.95 / unité
Voir la fiche technique →EPF10K100EQC240-1X
✅ Remplacement direct✓ En stock
$65 / unité
Voir la fiche technique →EPF10K100EQC240-2 Valeurs maximales et caractéristiques électriques
| Series | FLEX-10KE |
| Family | FLEX 10KE |
| Device Logic Elements | 4,992 |
| System Gates | 100,000 |
| Logic Array Blocks (LABs) | 624 |
| Embedded Array Blocks (EABs) | 12 |
| Total RAM Bits | 24,576 |
| User I/Os | 189 |
| Supply Voltage - Core | 2.375 V to 2.625 V |
| Supply Voltage - I/O | 3.0 V to 3.6 V |
| Propagation Delay (LUT) | 0.6 ns |
| Logic Family | CMOS |
| Température de fonctionnement | 0 C to 70 C (Commercial) |
| Speed Grade | -2 |
| Boîtier / Format | 240-BQFP (PQFP, 32 x 32 mm) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Configuration Method | SRAM, JTAG (IEEE 1149.1), serial EPROM |
Guide de configuration des broches du EPF10K100EQC240-2 240-bqfp (pqfp, 32 x 32 mm)
Configuration des broches du EPF10K100EQC240-2 (boîtier 240-bqfp (pqfp, 32 x 32 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EPF10K100EQC240-2.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EPF10K100EQC240-2 convient pour 7 applications: Legacy Telecommunications Line Card, Industrial Glue Logic Replacement, ASIC Prototyping Platform, Educational FPGA Development Kit, Glue Logic for Legacy Microprocessor Systems, Test & Measurement Backplane Controller, Aerospace Flight Control Legacy System.
Legacy Telecommunications Line Card
The EPF10K100EQC240-2 is well-suited for legacy telecommunications line card designs where moderate logic density (100K gates, 4,992 LEs) and 189 I/Os are required for backplane interfacing and protocol termination. Its 2.5 V core and 3.3 V I/O supply rails match the LVTTL/LVCMOS standards used on telecom backplanes, and the FLEX 10KE architecture's embedded array blocks (EABs) enable on-chip FIFO and buffer RAM for packet processing. The 240-PQFP package supports both production assembly and laboratory breadboarding for prototype validation. Unlike newer FPGAs, the -2 speed grade provides 0.6 ns LUT delay sufficient for 155 Mbps telecom interfaces when paired with appropriate clock management.
Recommandé
Industrial Glue Logic Replacement
For industrial systems integrating multiple legacy TTL/CMOS functions onto a single programmable device, the EPF10K100EQC240-2 offers 4,992 logic elements enough to replace dozens of discrete glue-logic ICs while maintaining the deterministic timing of LUT-based logic. The 189 user I/Os in a 240-PQFP package accommodate the multi-interface requirement of industrial controllers (parallel ADC/DAC buses, control logic, and status monitoring). Commercial 0 to 70 C operating range suits factory-floor control cabinets, and the JTAG (IEEE 1149.1) configuration interface supports field upgrades via boundary-scan test access ports without removing the device from the PCB.
Recommandé
ASIC Prototyping Platform
The EPF10K100EQC240-2 is widely used as an ASIC prototyping vehicle, allowing designers to validate ASIC RTL in real hardware before committing to NRE tooling. The FLEX 10KE family provides predictable LUT-based timing with 0.6 ns propagation delay, enabling timing closure estimation for target ASIC processes. SRAM-based configuration allows rapid design iteration via JTAG, while the 24,576 bits of distributed EAB RAM and 189 I/Os permit prototyping of memory-intensive ASICs. The 240-PQFP package is well-supported by low-cost PQFP-to-DIP adapter boards for breadboarding during early-stage ASIC validation.
Recommandé
Educational FPGA Development Kit
The EPF10K100EQC240-2 is suitable for university-level FPGA design courses and embedded systems labs where the FLEX 10KE architecture's LAB-based hierarchy (624 LABs, 8 LEs per LAB) is ideal for teaching digital logic fundamentals. The 240-PQFP package is robust for student handling and breadboard-friendly, and the JTAG configuration chain supports standard Altera/Intel programming cables. Educational boards based on this device benefit from the abundant legacy documentation, reference designs, and Quartus II design software support that remains available for the FLEX 10KE family.
Recommandé
Glue Logic for Legacy Microprocessor Systems
In systems built around legacy microprocessors such as the 80186, 68EC000, or SH-2, the EPF10K100EQC240-2 provides the address decoding, bus arbitration, wait-state generation, and peripheral interfacing logic in a single programmable device. Its 189 user I/Os comfortably accommodate the address/data bus plus chip-select and interrupt signals of 16/32-bit legacy microprocessors. The 0.6 ns LUT delay in -2 speed grade matches the timing requirements of 25-40 MHz microprocessors without introducing hold-time violations. The 240-PQFP package is also mechanically compatible with the through-hole and socketed assembly typical of legacy microprocessor boards.
Recommandé
Test & Measurement Backplane Controller
For test and measurement instruments such as logic analyzers, protocol testers, and ATE systems, the EPF10K100EQC240-2 provides the timing-critical pattern generation and backplane control logic. The 0.6 ns LUT delay in -2 speed grade is well-suited for high-speed pattern sequencing, and the 189 I/Os in 240-PQFP support multi-channel test pin electronics. EAB-based dual-port RAM enables simultaneous pattern capture and analysis, while the JTAG configuration supports secure field-upgradeable test firmware. The commercial 0 to 70 C operating range fits the controlled thermal environment of test racks.
Recommandé
Aerospace Flight Control Legacy System
The EPF10K100EQC240-2 is found in legacy aerospace and avionics systems where it implements flight control surfaces, sensor fusion, and redundant control channel logic. With 100K system gates and 189 I/Os, it bridges between simple PLDs and high-density FPGAs for moderate-complexity flight systems. The PQFP-240 package's hermetic-compatible variants are used in avionics environments. Designers maintaining such systems rely on the EPF10K100EQC240-2's mature documentation, established qualification data, and -2 speed grade timing margin. For new aerospace designs, however, radiation-tolerant and rad-hard FPGAs such as Microsemi/RTAX are now preferred.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K100EQC240-2 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K100EQC240-2N | EPF10K100EQC240-2X | EPF10K100EQC240-1 | EPF10K100EQC240-1N | EPF10K100EQC240-1X |
|---|---|---|---|---|---|---|
| Package | 240-BQFP (PQFP, 32x32 mm) | 240-BQFP (PQFP) - same | 240-BQFP (PQFP) - same | 240-BQFP (PQFP) - same | 240-BQFP (PQFP) - same | 240-BQFP (PQFP) - same |
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Speed Grade | -2 | -2 | -2 | -1 | -1 | -1 |
| Pb-Free (RoHS) | No (SnPb) | Yes (Pb-free) | No (SnPb) | No (SnPb) | Yes (Pb-free) | No (SnPb) |
| Temperature Range | 0 C to 70 C (Commercial) | 0 C to 70 C (Commercial) | Extended (Industrial) | 0 C to 70 C (Commercial) | 0 C to 70 C (Commercial) | Extended (Industrial) |
| LUT Propagation Delay | 0.6 ns | 0.6 ns | 0.6 ns | ~0.9 ns (slower) | ~0.9 ns (slower) | ~0.9 ns (slower) |
| Logic Elements | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| User I/Os | 189 | 189 | 189 | 189 | 189 | 189 |
| Core Supply Voltage | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V |
Principaux différenciateurs
- Industry-standard FLEX 10KE architecture with mature design tooling (vs EPF10K100BQC240-2 (non-E FLEX 10K))
- Drop-in speed grade scalability within the same 240-PQFP footprint (vs EPF10K100EQC240-1 vs EPF10K100EQC240-2)
- Pb-free variant available with identical die for RoHS assembly (vs EPF10K100EQC240-2N (Pb-free variant))
Notes de conception
The EPF10K100EQC240-2 requires two supply rails: 2.5 V core (2.375 V to 2.625 V) and 3.3 V I/O (3.0 V to 3.6 V). Both rails must ramp together within the datasheet-specified sequence to avoid latch-up. Estimated: ICC core current is approximately 50 mA idle, rising to 200-300 mA during high-utilization operation; ICCIO is dominated by I/O toggle frequency, approximately 5-15 mA per toggling MHz-bank. Place 100 uF bulk and 0.1 uF decoupling on each rail, with at least one 10 uF tantalum on the core rail near the device.
Critical pitfalls: (1) FLEX 10KE devices lose configuration when core voltage drops; POR (Power-On-Reset) is mandatory and the nCONFIG pin must be held low until supplies are stable. (2) SRAM-based FPGAs require reconfiguration after every power cycle - use an EPC1/EPC2 configuration EPROM for stand-alone boot. (3) The JTAG TDO output is not 5V tolerant; level-shift to interface with legacy 5V JTAG controllers. (4) Do not leave any user I/O floating - configure unused pins as outputs driving low to reduce supply-current noise and prevent oscillation.
PQFP-240 packages have lead inductance approximately 2-4 nH per pin. Place VCC and GND pin connections at every power pin (typically 8-12 power and 12-16 ground pins on the FLEX 10KE 240-PQFP) with short traces and a continuous ground/power plane on adjacent layers. For high-speed I/O banks, isolate the analog/digital ground returns; the FLEX 10KE features separate VCCIO and GNDIO bank pins. Use 4-layer PCB stack-up (signal/GND/PWR/signal) to minimize VCCIO bounce during simultaneous-switching output (SSO) events.
Informations de conformité
EPF10K100EQC240-2 is SnPb (leaded) finish - not RoHS compliant. The -2N and -1N variants are Pb-free (RoHS compliant). FPGAs are not AEC-Q100 qualified (industrial/commercial only). REACH compliance per Altera/Intel product declarations.
