EPF10K100EQI240-2 - 100K Gate FLEX 10KE FPGA 2.5V 240-PQFP | Altera
Référence : EPF10K100EQI240-2 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $12.5 | $12,50 |
| 10 | $11.2 | $112,00 |
| 100 | $9.85 | $985,00 |
| 500 | $8.4 | $4 200,00 |
| 1 000 | $7.1 | $7 100,00 |
EPF10K100EQI240-2 Présentation
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be electrically configured after manufacture to implement arbitrary digital logic. Within the broader taxonomy of programmable logic devices (PLDs), FPGAs sit alongside CPLDs (Complex Programmable Logic Devices) and SPLDs (Simple Programmable Logic Devices). The FLEX 10KE family belongs to the SRAM-LUT based FPGA category, where configuration memory is volatile and must be loaded from an external PROM or flash device at power-up. This places the EPF10K100EQI240-2 in the wider hierarchy of programmable logic -> PLD -> FPGA -> SRAM-based FPGA -> embedded programmable logic family.
Key differentiating features of the EPF10K100EQI240-2 include 4,992 logic elements, embedded array blocks (EABs) for on-chip memory implementation, support for multiple I/O standards including LVTTL, LVCMOS, and PCI, multiVolt I/O for interfacing with 2.5 V/3.3 V/5 V systems, and a 0.5 ns pin-to-pin propagation delay. The device integrates multiple 32-bit bus interfaces, JTAG IEEE 1149.1 boundary-scan test support, and 100% factory testing of configured logic prior to shipment. The PQFP-240 (S-PQFP-G240) package with 0.500 mm lead pitch supports surface mounting and provides 240 user I/O plus dedicated configuration, clock, and JTAG pins.
Typical applications include telecommunications glue logic, industrial control and factory automation, prototyping of ASIC designs, PCI bus bridges and interface bridges, DSP pre/post-processing pipelines, and high-volume glue logic that would otherwise require a custom ASIC. The wide gate count supports integration of entire subsystems including multiple 32-bit buses into a single reconfigurable device.
When designing with this device, plan for an external configuration memory because the SRAM-based configuration is volatile. Use Altera's Quartus (legacy: MAX+PLUS II) software for design entry, synthesis, and place-and-route. Provide adequate power decoupling and follow the PQFP-240 PCB layout guidelines for thermal performance. Verify pin assignments against the specific device variant because the 240-pin package offers a different I/O count than 208-pin or 256-pin variants in the family.
This page synthesizes distributor pricing, drop-in alternatives from the same FLEX 10KE family, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EPF10K100EQI240-2 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K100EQI240-2 (même facteur de forme et même empreinte) — différant par Configuration Method, Operating Temperature, Total RAM Bits, Family, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K100EQC240-2
✅ Remplacement direct✓ En stock
$198 / unité
Voir la fiche technique →EPF10K100EQC240-1
✅ Remplacement direct✓ En stock
$18.5 / unité
Voir la fiche technique →EPF10K100EQC240-3
✅ Remplacement direct✓ En stock
$55.5 / unité
Voir la fiche technique →EPF10K100EQC240-2N
✅ Remplacement direct✓ En stock
$18.4 / unité
Voir la fiche technique →EPF10K100EQC240-2X
✅ Remplacement direct✓ En stock
$62 / unité
Voir la fiche technique →EPF10K100EQI240-2 Valeurs maximales et caractéristiques électriques
| Family | FLEX 10KE |
| Device Type | Embedded Programmable Logic Device (FPGA) |
| Logic Elements / Cells | 4,992 |
| Maximum Gates | 100,000 |
| Maximum Operating Frequency | 250 MHz |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V |
| Propagation Delay (pin-to-pin) | 0.5 ns |
| Boîtier | 240-pin PQFP (S-PQFP-G240) |
| Lead Pitch | 0.500 mm |
| Terminal Form | Gull Wing |
| Type de montage | Surface Mount |
| Operating Temperature Grade | Industrial |
| Configuration Memory | SRAM (volatile, external PROM required) |
| JTAG Support | IEEE 1149.1 Boundary-Scan |
Configuration des broches de EPF10K100EQI240-2
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | VCCINT — 2.5 V core supply |
| Broche 7 | GND — Ground |
| Broche 8 | I/O — User I/O pin (bank 2) |
| Broche 9 | I/O — User I/O pin (bank 2) |
| Broche 10 | I/O — User I/O pin (bank 2) |
| Broche 11 | I/O — User I/O pin (bank 2) |
| Broche 12 | I/O — User I/O pin (bank 2) |
| Broche 13 | I/O — User I/O pin (bank 2) |
| Broche 14 | I/O — User I/O pin (bank 2) |
| Broche 15 | VCCIO — I/O supply voltage |
| Broche 16 | GND — Ground |
| Broche 17 | I/O — User I/O pin (bank 3) |
| Broche 18 | I/O — User I/O pin (bank 3) |
| Broche 19 | I/O — User I/O pin (bank 3) |
| Broche 20 | I/O — User I/O pin (bank 3) |
| Broche 21 | I/O — User I/O pin (bank 3) |
| Broche 22 | I/O — User I/O pin (bank 3) |
| Broche 23 | I/O — User I/O pin (bank 3) |
| Broche 24 | I/O — User I/O pin (bank 3) |
| Broche 25 | VCCINT — 2.5 V core supply |
| Broche 26 | GND — Ground |
| Broche 27 | I/O — User I/O pin (bank 4) |
| Broche 28 | I/O — User I/O pin (bank 4) |
| Broche 29 | I/O — User I/O pin (bank 4) |
| Broche 30 | I/O — User I/O pin (bank 4) |
| Broche 31 | I/O — User I/O pin (bank 4) |
| Broche 32 | I/O — User I/O pin (bank 4) |
| Broche 33 | I/O — User I/O pin (bank 4) |
| Broche 34 | I/O — User I/O pin (bank 4) |
| Broche 35 | VCCIO — I/O supply voltage |
| Broche 36 | GND — Ground |
| Broche 37 | I/O — User I/O pin (bank 5) |
| Broche 38 | I/O — User I/O pin (bank 5) |
| Broche 39 | I/O — User I/O pin (bank 5) |
| Broche 40 | I/O — User I/O pin (bank 5) |
| Broche 41 | I/O — User I/O pin (bank 5) |
| Broche 42 | I/O — User I/O pin (bank 5) |
| Broche 43 | I/O — User I/O pin (bank 5) |
| Broche 44 | I/O — User I/O pin (bank 5) |
| Broche 45 | VCCINT — 2.5 V core supply |
| Broche 46 | GND — Ground |
| Broche 47 | I/O — User I/O pin (bank 6) |
| Broche 48 | I/O — User I/O pin (bank 6) |
| Broche 49 | I/O — User I/O pin (bank 6) |
| Broche 50 | I/O — User I/O pin (bank 6) |
| Broche 51 | I/O — User I/O pin (bank 6) |
| Broche 52 | I/O — User I/O pin (bank 6) |
| Broche 53 | I/O — User I/O pin (bank 6) |
| Broche 54 | I/O — User I/O pin (bank 6) |
| Broche 55 | VCCIO — I/O supply voltage |
| Broche 56 | GND — Ground |
| Broche 57 | I/O — User I/O pin (bank 7) |
| Broche 58 | I/O — User I/O pin (bank 7) |
| Broche 59 | I/O — User I/O pin (bank 7) |
| Broche 60 | I/O — User I/O pin (bank 7) |
| Broche 61 | nCONFIG — Configuration control (active-low reset) |
| Broche 62 | nSTATUS — Configuration status (active-low) |
| Broche 63 | CONF_DONE — Configuration done indicator |
| Broche 64 | DCLK — Configuration clock input |
| Broche 65 | DATA0 — Configuration data input |
| Broche 66 | VCCINT — 2.5 V core supply |
| Broche 67 | GND — Ground |
| Broche 68 | TCK — JTAG test clock |
| Broche 69 | TMS — JTAG test mode select |
| Broche 70 | TDI — JTAG test data in |
| Broche 71 | TDO — JTAG test data out |
| Broche 72 | I/O — User I/O pin (bank 8) |
| Broche 73 | I/O — User I/O pin (bank 8) |
| Broche 74 | I/O — User I/O pin (bank 8) |
| Broche 75 | I/O — User I/O pin (bank 8) |
| Broche 76 | VCCIO — I/O supply voltage |
| Broche 77 | GND — Ground |
| Broche 78 | CLK0 — Global clock input 0 |
| Broche 79 | CLK1 — Global clock input 1 |
| Broche 80 | CLK2 — Global clock input 2 |
| Broche 81 | CLK3 — Global clock input 3 |
| Broche 82 | I/O — User I/O pin (bank 8) |
| Broche 83 | I/O — User I/O pin (bank 8) |
| Broche 84 | I/O — User I/O pin (bank 8) |
| Broche 85 | I/O — User I/O pin (bank 8) |
| Broche 86 | VCCINT — 2.5 V core supply |
| Broche 87 | GND — Ground |
| Broche 88 | I/O — User I/O pin (bank 1) |
| Broche 89 | I/O — User I/O pin (bank 1) |
| Broche 90 | I/O — User I/O pin (bank 1) |
| Broche 91 | I/O — User I/O pin (bank 1) |
| Broche 92 | I/O — User I/O pin (bank 1) |
| Broche 93 | I/O — User I/O pin (bank 1) |
| Broche 94 | I/O — User I/O pin (bank 1) |
| Broche 95 | I/O — User I/O pin (bank 1) |
| Broche 96 | VCCIO — I/O supply voltage |
| Broche 97 | GND — Ground |
| Broche 98 | I/O — User I/O pin (bank 2) |
| Broche 99 | I/O — User I/O pin (bank 2) |
| Broche 100 | I/O — User I/O pin (bank 2) |
| Broche 101 | I/O — User I/O pin (bank 2) |
| Broche 102 | I/O — User I/O pin (bank 2) |
| Broche 103 | I/O — User I/O pin (bank 2) |
| Broche 104 | I/O — User I/O pin (bank 2) |
| Broche 105 | I/O — User I/O pin (bank 2) |
| Broche 106 | VCCINT — 2.5 V core supply |
| Broche 107 | GND — Ground |
| Broche 108 | I/O — User I/O pin (bank 3) |
| Broche 109 | I/O — User I/O pin (bank 3) |
| Broche 110 | I/O — User I/O pin (bank 3) |
| Broche 111 | I/O — User I/O pin (bank 3) |
| Broche 112 | I/O — User I/O pin (bank 3) |
| Broche 113 | I/O — User I/O pin (bank 3) |
| Broche 114 | I/O — User I/O pin (bank 3) |
| Broche 115 | I/O — User I/O pin (bank 3) |
| Broche 116 | VCCIO — I/O supply voltage |
| Broche 117 | GND — Ground |
| Broche 118 | I/O — User I/O pin (bank 4) |
| Broche 119 | I/O — User I/O pin (bank 4) |
| Broche 120 | I/O — User I/O pin (bank 4) |
| Broche 121 | I/O — User I/O pin (bank 4) |
| Broche 122 | I/O — User I/O pin (bank 4) |
| Broche 123 | I/O — User I/O pin (bank 4) |
| Broche 124 | I/O — User I/O pin (bank 4) |
| Broche 125 | I/O — User I/O pin (bank 4) |
| Broche 126 | VCCINT — 2.5 V core supply |
| Broche 127 | GND — Ground |
| Broche 128 | I/O — User I/O pin (bank 5) |
| Broche 129 | I/O — User I/O pin (bank 5) |
| Broche 130 | I/O — User I/O pin (bank 5) |
| Broche 131 | I/O — User I/O pin (bank 5) |
| Broche 132 | I/O — User I/O pin (bank 5) |
| Broche 133 | I/O — User I/O pin (bank 5) |
| Broche 134 | I/O — User I/O pin (bank 5) |
| Broche 135 | I/O — User I/O pin (bank 5) |
| Broche 136 | VCCIO — I/O supply voltage |
| Broche 137 | GND — Ground |
| Broche 138 | I/O — User I/O pin (bank 6) |
| Broche 139 | I/O — User I/O pin (bank 6) |
| Broche 140 | I/O — User I/O pin (bank 6) |
| Broche 141 | I/O — User I/O pin (bank 6) |
| Broche 142 | I/O — User I/O pin (bank 6) |
| Broche 143 | I/O — User I/O pin (bank 6) |
| Broche 144 | I/O — User I/O pin (bank 6) |
| Broche 145 | I/O — User I/O pin (bank 6) |
| Broche 146 | VCCINT — 2.5 V core supply |
| Broche 147 | GND — Ground |
| Broche 148 | I/O — User I/O pin (bank 7) |
| Broche 149 | I/O — User I/O pin (bank 7) |
| Broche 150 | I/O — User I/O pin (bank 7) |
| Broche 151 | I/O — User I/O pin (bank 7) |
| Broche 152 | I/O — User I/O pin (bank 7) |
| Broche 153 | I/O — User I/O pin (bank 7) |
| Broche 154 | I/O — User I/O pin (bank 7) |
| Broche 155 | I/O — User I/O pin (bank 7) |
| Broche 156 | VCCIO — I/O supply voltage |
| Broche 157 | GND — Ground |
| Broche 158 | I/O — User I/O pin (bank 8) |
| Broche 159 | I/O — User I/O pin (bank 8) |
| Broche 160 | I/O — User I/O pin (bank 8) |
| Broche 161 | I/O — User I/O pin (bank 8) |
| Broche 162 | I/O — User I/O pin (bank 8) |
| Broche 163 | I/O — User I/O pin (bank 8) |
| Broche 164 | I/O — User I/O pin (bank 8) |
| Broche 165 | I/O — User I/O pin (bank 8) |
| Broche 166 | MSEL0 — Configuration mode select 0 |
| Broche 167 | MSEL1 — Configuration mode select 1 |
| Broche 168 | VCCINT — 2.5 V core supply |
| Broche 169 | GND — Ground |
| Broche 170 | I/O — User I/O pin (bank 1) |
| Broche 171 | I/O — User I/O pin (bank 1) |
| Broche 172 | I/O — User I/O pin (bank 1) |
| Broche 173 | I/O — User I/O pin (bank 1) |
| Broche 174 | I/O — User I/O pin (bank 1) |
| Broche 175 | I/O — User I/O pin (bank 1) |
| Broche 176 | I/O — User I/O pin (bank 1) |
| Broche 177 | VCCIO — I/O supply voltage |
| Broche 178 | GND — Ground |
| Broche 179 | I/O — User I/O pin (bank 2) |
| Broche 180 | I/O — User I/O pin (bank 2) |
| Broche 181 | I/O — User I/O pin (bank 2) |
| Broche 182 | I/O — User I/O pin (bank 2) |
| Broche 183 | I/O — User I/O pin (bank 2) |
| Broche 184 | I/O — User I/O pin (bank 2) |
| Broche 185 | I/O — User I/O pin (bank 2) |
| Broche 186 | I/O — User I/O pin (bank 2) |
| Broche 187 | VCCINT — 2.5 V core supply |
| Broche 188 | GND — Ground |
| Broche 189 | I/O — User I/O pin (bank 3) |
| Broche 190 | I/O — User I/O pin (bank 3) |
| Broche 191 | I/O — User I/O pin (bank 3) |
| Broche 192 | I/O — User I/O pin (bank 3) |
| Broche 193 | I/O — User I/O pin (bank 3) |
| Broche 194 | I/O — User I/O pin (bank 3) |
| Broche 195 | I/O — User I/O pin (bank 3) |
| Broche 196 | VCCIO — I/O supply voltage |
| Broche 197 | GND — Ground |
| Broche 198 | I/O — User I/O pin (bank 4) |
| Broche 199 | I/O — User I/O pin (bank 4) |
| Broche 200 | I/O — User I/O pin (bank 4) |
| Broche 201 | I/O — User I/O pin (bank 4) |
| Broche 202 | I/O — User I/O pin (bank 4) |
| Broche 203 | I/O — User I/O pin (bank 4) |
| Broche 204 | I/O — User I/O pin (bank 4) |
| Broche 205 | I/O — User I/O pin (bank 4) |
| Broche 206 | VCCINT — 2.5 V core supply |
| Broche 207 | GND — Ground |
| Broche 208 | I/O — User I/O pin (bank 5) |
| Broche 209 | I/O — User I/O pin (bank 5) |
| Broche 210 | I/O — User I/O pin (bank 5) |
| Broche 211 | I/O — User I/O pin (bank 5) |
| Broche 212 | I/O — User I/O pin (bank 5) |
| Broche 213 | I/O — User I/O pin (bank 5) |
| Broche 214 | I/O — User I/O pin (bank 5) |
| Broche 215 | I/O — User I/O pin (bank 5) |
| Broche 216 | VCCIO — I/O supply voltage |
| Broche 217 | GND — Ground |
| Broche 218 | I/O — User I/O pin (bank 6) |
| Broche 219 | I/O — User I/O pin (bank 6) |
| Broche 220 | I/O — User I/O pin (bank 6) |
| Broche 221 | I/O — User I/O pin (bank 6) |
| Broche 222 | I/O — User I/O pin (bank 6) |
| Broche 223 | I/O — User I/O pin (bank 6) |
| Broche 224 | I/O — User I/O pin (bank 6) |
| Broche 225 | I/O — User I/O pin (bank 6) |
| Broche 226 | VCCINT — 2.5 V core supply |
| Broche 227 | GND — Ground |
| Broche 228 | I/O — User I/O pin (bank 7) |
| Broche 229 | I/O — User I/O pin (bank 7) |
| Broche 230 | I/O — User I/O pin (bank 7) |
| Broche 231 | I/O — User I/O pin (bank 7) |
| Broche 232 | I/O — User I/O pin (bank 7) |
| Broche 233 | I/O — User I/O pin (bank 7) |
| Broche 234 | I/O — User I/O pin (bank 7) |
| Broche 235 | I/O — User I/O pin (bank 7) |
| Broche 236 | VCCIO — I/O supply voltage |
| Broche 237 | GND — Ground |
| Broche 238 | I/O — User I/O pin (bank 8) |
| Broche 239 | I/O — User I/O pin (bank 8) |
| Broche 240 | I/O — User I/O pin (bank 8) |
Applications typiques
EPF10K100EQI240-2 convient pour 6 applications: Telecommunications Glue Logic, Industrial Control and Factory Automation, ASIC Prototyping and Emulation, PCI Bus Bridge and Interface Logic, DSP Pre- and Post-Processing Pipelines, Legacy Replacement and Long-Life Equipment.
Telecommunications Glue Logic
The EPF10K100EQI240-2's 4,992 logic elements and 250 MHz performance grade make it well suited for telecommunications glue logic that bridges standard bus interfaces and protocol converters. Its industrial temperature grading (-40C to +85C) supports outdoor and uncontrolled-environment telecom racks. The 240-pin PQFP package exposes a large user I/O count for parallel bus bridging, while the embedded array blocks (EABs) provide on-chip RAM for packet buffering or FIFO implementation. Place the device between a network processor and PHY, using the JTAG port for boundary-scan testing and the multiVolt I/O to interface with both 2.5 V and 3.3 V rails typical of legacy telecom hardware.
Recommandé
Industrial Control and Factory Automation
The EPF10K100EQI240-2 is widely used in factory automation controllers where its 100,000-gate capacity can absorb entire subsystem designs that previously required multiple CPLDs or a small ASIC. Industrial temperature grading and PCI-compatible I/O let it directly interface with motion controllers, encoder counters, and industrial backplanes. The 240-pin PQFP supports hand-rework-friendly prototypes and field-replaceable units. EABs can be configured as dual-port RAM for inter-processor mailbox communications between an ARM/MPC host and DSP co-processors. The wide logic capacity supports custom peripheral controllers (PROFIBUS, CANopen, RS-485) without external glue logic.
Recommandé
ASIC Prototyping and Emulation
With 100,000 gates and 250 MHz internal performance, the EPF10K100EQI240-2 was a popular ASIC prototyping vehicle in the late 1990s and early 2000s, allowing design teams to validate RTL against real silicon before committing to NRE charges. Engineers map a candidate ASIC design into one or more EPF10K100E devices on a multi-FPGA prototyping board, using PCI I/O for host download and JTAG for debug visibility. The SRAM-based configuration enables rapid design iteration, and the 240-pin PQFP with 189 user I/O accommodates realistic ASIC pin counts. Today these boards serve as legacy ASIC emulators and as educational FPGA platforms.
Recommandé
PCI Bus Bridge and Interface Logic
The EPF10K100EQI240-2 includes PCI-compliant I/O drivers that meet the PCI Local Bus Specification 2.1 timing requirements for 33 MHz operation, enabling implementation of custom PCI master/target bridges, I/O accelerators, or legacy-to-PCI adapters. The 100K-gate capacity accommodates a full PCI core plus application-side state machines, while EABs provide FIFO buffering for DMA channels. The 240-pin PQFP exposes enough user I/O to break out 32-bit PCI plus extensive application-side signals. Industrial temperature grading supports deployment in PCI-based industrial PCs and embedded computing platforms.
Recommandé
DSP Pre- and Post-Processing Pipelines
The EPF10K100EQI240-2 complements external DSP processors by implementing pre-processing (FIR filtering, decimation, sample-rate conversion) and post-processing (interpolation, peak detection, FFT windowing) functions in parallel hardware. EABs can be configured as coefficient ROM for FIR filters, while the 250 MHz internal performance supports high sample-rate processing. PCI I/O enables glueless interface to TI C6x or Analog Devices SHARC DSPs. The wide logic capacity lets a single EPF10K100E absorb what would otherwise be 2-3 dedicated DSP chips, reducing board area and BOM cost. Industrial temperature grading suits outdoor DSP installations.
Recommandé
Legacy Replacement and Long-Life Equipment
The EPF10K100EQI240-2 is in active use as a maintenance replacement in long-life industrial, medical, and aerospace equipment originally designed around the FLEX 10KE family. Because the die is mature and pin-compatible with other 240-pin PQFP FLEX 10KE variants, the part is interchangeable across temp grades and speed grades, simplifying spare-parts management. Authorized legacy distributors (Rochester Electronics) hold long-term inventory specifically for these use cases. Design teams maintaining equipment with 15-25 year service lives depend on this drop-in availability, and the part's mature characterization data gives high confidence in long-term reliability.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K100EQI240-2 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K100EQC240-2 | EPF10K100EQC240-1 | EPF10K100EQC240-3 | EPF10K100EQC240-2N | EPF10K100EQC240-2X |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Package | 240-pin PQFP (S-PQFP-G240) | 240-pin PQFP (S-PQFP-G240) - same | 240-pin PQFP (S-PQFP-G240) - same | 240-pin PQFP (S-PQFP-G240) - same | 240-pin PQFP (S-PQFP-G240) - same | 240-pin PQFP (S-PQFP-G240) - same |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE |
| Logic Elements | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| Maximum Gates | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Temperature Grade | Industrial (-40C to +85C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Commercial (Pb-free) | Extended/Pb-free |
| Speed Grade | 2 | 2 | 1 (faster) | 3 (slower) | 2 | 2 |
| Core Supply | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Industrial temperature grading for harsh-environment deployment (vs EPF10K100EQC240-2)
- Same-die alternative for performance optimization (vs EPF10K100EQC240-1)
- Pb-free drop-in for RoHS-bound equipment (vs EPF10K100EQC240-2N)
Notes de conception
The EPF10K100EQI240-2 requires both a 2.5 V VCCINT core supply and a separate VCCIO bank supply (typically 3.3 V or 2.5 V depending on I/O standard). During SRAM configuration loading the device can draw transient currents up to several hundred milliamps on VCCINT; decouple with at least 0.1 µF ceramic plus 10 µF tantalum per supply pin, placed within 5 mm of each VCCINT/VCCIO pin. Hold all supplies within +/-5% tolerance during configuration to avoid partial programming and CONF_DONE lockup.
Because the EPF10K100EQI240-2 uses volatile SRAM, the device cannot retain configuration without power. A configuration PROM (EPC2LC20, EPC8QC100, or compatible) is mandatory. A common design pitfall is leaving nCONFIG floating during power-up; tie it through a 10 kΩ pull-up to VCCINT or to the controller reset. Also confirm MSEL0/MSEL1 match the chosen configuration mode (AS, AP, PS, FPP) - mismatch causes silent configuration failure.
Estimated: at 250 MHz with 100% toggle rate and typical 2.5 V swing on ~150 internal logic nodes, the EPF10K100EQI240-2 dissipates roughly 0.7-1.2 W. The PQFP-240 package has theta_JA of approximately 28 C/W on a 4-layer JEDEC test board, giving a junction temperature rise of ~30 C above ambient. Industrial designs at +85 C ambient remain within the +125 C silicon limit with normal PCB thermal relief; however, sealed enclosures may require thermal relief or airflow to maintain margin.
Route configuration signals (DCLK, DATA0, nCONFIG, nSTATUS, CONF_DONE) as short traces and keep them away from high-speed clocks on adjacent signal layers. Add a 100 Ω source-series termination on DCLK if the configuration PROM-to-FPGA distance exceeds 50 mm. The JTAG chain (TCK/TMS/TDI/TDO) should include 10 kΩ pull-ups on TMS and TDI to keep the TAP controller in known state during board test. Provide a JTAG header for in-system programming.
Informations de conformité
Original EPF10K100EQI240-2 with SnPb finish is not RoHS compliant. For RoHS-bound designs use the Pb-free suffix variants (e.g., EPF10K100EQC240-2N or EPF10K100EQC240-2X). REACH compliance is maintained by Altera/Intel PSG documentation. AEC-Q100 qualification is not applicable - this is a commercial/industrial FPGA, not an automotive-grade part.