EPF10K100EQC240-3N - 100K Gate FLEX 10KE FPGA, 240-PQFP | Intel
Référence : EPF10K100EQC240-3N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $71.2 | $712,00 |
| 100 | $63.8 | $6 380,00 |
| 500 | $56.4 | $28 200,00 |
| 1 000 | $49.95 | $49 950,00 |
EPF10K100EQC240-3N Présentation
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that engineers can re-program after manufacturing to implement arbitrary digital logic. The FLEX 10KE sits in the FPGA taxonomy above fixed-function CPLDs and below modern high-density FPGAs, offering the industry's first embedded programmable logic device family where memory and logic coexist on the same fabric. This makes the EPF10K100E series ideal for designs that need FIFO buffers, register files, or small dual-port memories alongside glue logic without an external companion memory IC.
Key features include four phase-locked loops (PLLs) for clock management, embedded IEEE Std. 1149.1 JTAG boundary-scan test circuitry (adding up to 31,250 gates), multiVolt I/O supporting 2.5 V / 3.3 V / 5 V mixed-voltage interfacing, and continuous interconnects across four rows of Enhanced Logic Array Blocks (ELABs). The "-3N" suffix denotes the commercial speed grade (fastest tier for the family) with Pb-free / lead-free matte-tin terminations, suitable for 0 °C to +70 °C operating environments.
The architecture pairs 624 Logic Array Blocks (LABs) with 16 Embedded Array Blocks (EABs), giving designers 4,992 logic cells and 24,576 RAM bits per EAB. This balance suits high-speed glue logic, peripheral bridging, telecom line cards, and legacy industrial controllers requiring deterministic behavior. Compared to modern 7 nm FPGAs, FLEX 10KE offers lower density and higher power per gate, but its mature toolchain (Quartus II) and 5 V-tolerant IOs keep it deployed in long-lifecycle industrial and aerospace systems where re-qualification cost dominates unit price.
Typical applications include PCI bus interface bridges, UART/SCSI/SPI controller consolidation, ATM and SONET framer glue logic, industrial PLC backplanes, and avionics display controllers. Engineers often pair the EPF10K100EQC240-3N with an external EPC configuration memory such as EPC2LC20N to store the bitstream at power-up.
When designing with this device, ensure your power sequencer ramps the 2.5 V core before driving I/O banks, and allocate one PLL per clock domain to minimize jitter. Unlike modern FPGAs, FLEX 10KE does not support soft-core processors natively, so pairing it with an external host MCU or Nios-equivalent state-machine is common.
Alternatives de remplacement direct pour EPF10K100EQC240-3N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K100EQC240-3N (même facteur de forme et même empreinte) — différant par Family, Operating Temperature, Series, Process Technology, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K100EQC240-3
✅ Remplacement direct✓ En stock
$55.5 / unité
Voir la fiche technique →EPF10K100EQC240-2N
✅ Remplacement direct✓ En stock
$18.4 / unité
Voir la fiche technique →EPF10K100EQC240-1N
✅ Remplacement direct✓ En stock
$55.95 / unité
Voir la fiche technique →EPF10K100BQC240-3
✅ Remplacement direct✓ En stock
$16.95 / unité
Voir la fiche technique →EPF10K100ARC240-3N
✅ Remplacement direct✓ En stock
$18.4 / unité
Voir la fiche technique →EPF10K100ARI240-3N
✅ Remplacement direct✓ En stock
$86.4 / unité
Voir la fiche technique →EPF10K100EQC240-3N Valeurs maximales et caractéristiques électriques
| Series | FLEX 10KE |
| Family | FLEX 10KE (Embedded Programmable Logic Device) |
| Logic Elements / Cells | 4,992 |
| Total System Gates | 100,000 (typical) |
| Logic Array Blocks (LABs) | 624 |
| Embedded Array Blocks (EABs) | 16 |
| Maximum User I/Os | 189 |
| Total RAM Bits | 49,152 |
| Number of PLLs | 4 |
| Propagation Delay | 0.6 ns |
| Maximum Internal Frequency | 200 MHz |
| Core Voltage | 2.5 V |
| I/O Supply Voltage | 3.3 V (5 V tolerant with PCI clamping) |
| Process Technology | 0.22 µm CMOS |
| Package Type | 240-pin BFQFP (Power Quad Flat Pack) |
| Température de fonctionnement | 0 °C to +70 °C (Commercial) |
| JTAG Support | IEEE Std. 1149.1 boundary-scan |
| Type de montage | Surface Mount |
| Lead-Free / RoHS | Pb-free matte tin (N suffix) |
| Configuration Memory Companion | EPC2LC20N or compatible |
Guide de configuration des broches du EPF10K100EQC240-3N 240-pin bfqfp (power quad flat pack)
Configuration des broches du EPF10K100EQC240-3N (boîtier 240-pin bfqfp (power quad flat pack)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EPF10K100EQC240-3N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EPF10K100EQC240-3N convient pour 6 applications: PCI Bus Interface Bridge, Industrial PLC Backplane Controller, Telecom Line-Card Glue Logic, Avionics Display Controller (Legacy DO-254), Legacy Network Router Fabric Glue, Medical Imaging Front-End Pre-Processing.
PCI Bus Interface Bridge
The EPF10K100EQC240-3N is well-suited as a PCI 2.2 / PCI-X glue-logic bridge between host processors and legacy peripherals. Its 4,992 logic cells and 189 user I/Os comfortably absorb 32-bit/33 MHz PCI target/master state machines plus 8-16 bit GPIO replication, while the 5 V PCI-clamping tolerant I/Os (multiVolt) eliminate the need for external level shifters. Place the FPGA between the PCI bus and downstream ASICs, configure it from an EPC2LC20N at power-up, and use one PLL to derive the 33 MHz PCI clock from the system 66 MHz reference. Compared to a discrete 74xx logic implementation, this consolidation reduces board area by 60-70 %.
Recommandé
Industrial PLC Backplane Controller
Long-lifecycle industrial PLCs and SCADA backplanes rely on the EPF10K100EQC240-3N for deterministic real-time logic consolidation. Its 16 Embedded Array Blocks supply 49,152 bits of dual-port RAM, ideal for inter-task FIFO messaging on Modbus or PROFIBUS backplanes, while the 624 LABs handle ladder-logic-to-state-machine translation at deterministic <50 ns cycle times. The 0-70 °C commercial grade is appropriate for cabinet-mounted controllers, but for outdoor or factory-floor deployments pair it with the industrial-temp EPF10K100ARI240-3N. The mature Quartus II toolchain allows field reconfiguration via JTAG without reprogramming, supporting decades-long product support windows typical of industrial automation.
Recommandé
Telecom Line-Card Glue Logic
The EPF10K100EQC240-3N historically served as the consolidator of choice on telecom line cards for T1/E1 framers, UTOPIA-II / POS-PHY interfaces, and ATM SAR glue. Its 4,992 logic cells and embedded EABs replace 4-6 discrete CPLDs plus companion FIFOs, while the four PLLs generate jitter-clean clocks at 1.544 / 2.048 / 8.192 / 19.44 MHz telecom rates from a single 19.44 MHz system reference. The PQFP-240 package accommodates the 32-bit UTOPIA data bus plus per-channel HDLC controllers for 8-16 E1/T1 spans. For SONET/SDH STS-1 framers, the part meets the 19.44 MHz line-rate requirement at the -3 speed grade (200 MHz fMAX).
Recommandé
Avionics Display Controller (Legacy DO-254)
Avionics display controllers for cockpit MFDs and HUDs often retain the EPF10K100EQC240-3N because the design is already DO-254 certified and re-qualification cost dominates unit price. The part handles ARINC 429 / ARINC 708 protocol conversion, video overlay timing, and discrete-to-LVDS bridging in a single chip, replacing several legacy ASICs. Its deterministic 0.6 ns propagation delay supports the 100 µs worst-case latency budget mandated for primary flight displays, and the JTAG 1149.1 boundary scan simplifies the BIT (Built-In Test) coverage required for DAL-B designs. For new avionics programs, designers now target Cyclone IV / V with DO-254 evidence packages, but the FLEX 10KE remains in service on fielded platforms.
Recommandé
Legacy Network Router Fabric Glue
Pre-2010 enterprise routers and edge switches used the EPF10K100EQC240-3N as a fabric-side glue-logic consolidator, handling SPI-4.2 / HyperTransport bridge logic, CAM lookups, and queue management arbitration. The 16 EABs serve as 16 × 2.5 kbit dual-port RAMs for packet-header buffers, while the 4,992 logic cells implement the per-port state machines and CRC engines. With 189 user I/Os, designers can connect directly to 4-6 SPI-4.2 status channels plus parallel PHY interfaces without external bus drivers. For modern replacements, the Altera/Intel MAX 10 or Lattice ECP5 family in equivalent BGA packages provides migration paths but requires PCB re-layout.
Recommandé
Medical Imaging Front-End Pre-Processing
Ultrasound and endoscopy front-end pre-processing boards pair the EPF10K100EQC240-3N with high-speed ADCs to perform beamforming, TGC (time-gain compensation), and pixel-level decimation. The 200 MHz fMAX at the -3 speed grade matches typical 14-bit 100 MSPS ADC clocking, while the EAB-based FIFO buffers smooth the pixel stream before downstream DSP. With 189 user I/Os, the FPGA interfaces to 8-12 channel ADC arrays, LVDS line drivers, and a host MCU via parallel bus. For portable ultrasound carts, the part's 0-70 °C commercial grade is adequate; for ICU ventilator monitoring, designers prefer the -40 to +85 °C industrial-temp EPF10K100ARI240-3N.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K100EQC240-3N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K100EQC240-3 | EPF10K100EQC240-2N | EPF10K100EQC240-1N | EPF10K100BQC240-3 | EPF10K100ARC240-3N | EPF10K100ARI240-3N |
|---|---|---|---|---|---|---|---|
| Package | 240-pin BFQFP (PQFP) | 240-pin BFQFP (PQFP) - same | 240-pin BFQFP (PQFP) - same | 240-pin BFQFP (PQFP) - same | 240-pin BFQFP (PQFP) - same | 240-pin BFQFP (RQFP) - same outline | 240-pin BFQFP (RQFP) - same outline |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | -3 (fastest commercial) | -3 (same) | -2 (slower) | -1 (slowest) | -3 (FLEX 10KB) | -3 (FLEX 10KA) | -3 (FLEX 10KA industrial) |
| Maximum Frequency | 200 MHz | 200 MHz | ~170 MHz | ~140 MHz | 200 MHz | 180 MHz | 180 MHz |
| Logic Cells | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| RAM Bits | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 |
| User I/Os | 189 | 189 | 189 | 189 | 189 | 189 | 189 |
| Operating Temperature | 0 to +70 °C (Commercial) | 0 to +70 °C | 0 to +70 °C | 0 to +70 °C | 0 to +70 °C | 0 to +70 °C | -40 to +85 °C (Industrial) |
Principaux différenciateurs
- Pb-free lead finish for modern reflow lines (vs EPF10K100EQC240-3 (non-N))
- Fastest -3 commercial speed grade (vs EPF10K100EQC240-2N)
- FLEX 10KE Embedded Array architecture (vs EPF10K100BQC240-3 (FLEX 10KB))
Notes de conception
Estimated: At fMAX = 200 MHz with 50% logic utilization, the EPF10K100EQC240-3N draws approximately 600 mA from the 2.5 V core rail (~1.5 W). Pair a 3 A LDO such as the LT3023 or TI TPS7A4533 with a 22 µF tantalum + 0.1 µF ceramic decoupling network. Ramp VCCINT before or simultaneously with VCCIO to avoid I/O latch-up; a sequenced power supply is mandatory, not optional, for this 0.22 µm process node.
Route all four PLL power pins (VCC_PLL) with a star topology from a single ferrite-isolated 2.5 V rail, decoupled with 0.1 µF + 10 µF per PLL. Keep PLL analog ground separate from digital ground and tie them at a single point under the package. JTAG chain integrity requires 4.7 kΩ pull-ups on TDI/TMS and a 10 kΩ pull-up on nCONFIG; nSTATUS requires a 10 kΩ pull-up to VCCIO. Trace impedance for SSTL-2 / LVTTL outputs should target 50 Ω single-ended.
Do not migrate EPF10K100EQC240-3N designs to the EPF10K100EFC484-3N BGA variant without re-laying out the PCB - the PQFP-to-BGA pinout mapping is NOT 1:1 even within the SameFrame family, because I/O banks are reorganized. Per the FLEX 10KE datasheet, SameFrame migration is supported only on the 484-pin FineLine BGA, not from 240-pin PQFP. Designers should also avoid using the EPC2 configuration memory on industrial-temp designs below -20 °C without verifying PROM timing across the full temperature range.
Informations de conformité
Pb-free matte-tin finish per N suffix. Not AEC-Q100 qualified (FLEX 10KE is not an automotive-grade family). Industrial-temp variant available as EPF10K100ARI240-3N.
