EPF10K100ARI240-3N - 100K-Gate FLEX 10KA FPGA, 240-RQFP | Intel
Référence : EPF10K100ARI240-3N ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $128.5 | $1 285,00 |
| 100 | $112.75 | $11 275,00 |
| 500 | $98.2 | $49 100,00 |
| 1 000 | $86.4 | $86 400,00 |
EPF10K100ARI240-3N Présentation
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a programmable logic device whose logic fabric, routing, and I/O cells can be configured by the end user via a hardware description language such as VHDL or Verilog. Within the broader taxonomy of integrated circuits, FPGAs sit between CPLDs (smaller, non-volatile) and ASICs (custom-silicon, high NRE). The FLEX 10KA family was the industry's first embedded programmable logic family, providing System-on-a-Programmable-Chip (SOPC) integration by combining an embedded array block (EAB) for megafunctions and memory with a logic array block (LAB) fabric. The EPF10K100A is the largest-density member of the family.
Key features of the EPF10K100ARI240-3N include MultiVolt I/O (supporting 2.5 V, 3.3 V, and 5.0 V interface levels on a per-pin basis via VCCIO), PCI-compliant clamping diodes with slew-rate control, individual open-drain output options, and dedicated global clock networks. The embedded array blocks deliver efficient on-chip memory, typically configured as 4,096-bit RAM per EAB. Combined with 624 LABs, the device supports up to 125 MHz internal operation and approximately 100,000 typical gates (4,992 logic elements).
Typical applications include glue logic and bus bridging in industrial controllers, telecommunications backplane interfaces, PCI bridge prototyping, and legacy system refresh designs where the FLEX 10KA silicon is already qualified. The RQFP-240 footprint has been in continuous production since the late 1990s, and Intel/Altera continues to ship the part for long-lifecycle programs in medical, defense, and industrial automation.
When designing with this FPGA, allocate adequate decoupling (100 µF bulk + 0.1 µF per VCC/VCCIO pin pair) and a minimum of four-layer PCB with dedicated power and ground planes. Use the Quartus II 13.0sp1 (the final version supporting FLEX 10KA) for design entry and ACEX 1K / FLEX 10K device programming via ByteBlasterMV or a compatible JTAG cable.
This page synthesizes distributor pricing, FLEX 10KA drop-in alternatives, and practical legacy-design notes not consolidated in the original manufacturer datasheet, helping engineers plan both new designs and long-term maintenance of installed bases.
Alternatives de remplacement direct pour EPF10K100ARI240-3N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K100ARI240-3N (même facteur de forme et même empreinte) — différant par Speed Grade, Process Technology, Operating Temperature, Propagation Delay, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K100ARI240-3
✅ Remplacement direct✓ En stock
$61.75 / unité
Voir la fiche technique →EPF10K100ARC240-3N
✅ Remplacement direct✓ En stock
$18.4 / unité
Voir la fiche technique →EPF10K100ARC240-1N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPF10K100ARC240-2
✅ Remplacement direct✓ En stock
$118 / unité
Voir la fiche technique →EPF10K100ARC240-1
✅ Remplacement direct✓ En stock
$205 / unité
Voir la fiche technique →EPF10K100ARC240-2N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EPF10K100ARI240-3N Valeurs maximales et caractéristiques électriques
| Family | FLEX 10KA |
| Logic Elements / Cells | 4,992 |
| Typical Gate Count | 100,000 gates |
| Embedded RAM Bits | 24,576 bits |
| Logic Array Blocks (LABs) | 624 |
| User I/Os | 189 |
| Boîtier | 240-RQFP Exposed Pad (32x32 mm) |
| Pins | 240 |
| Propagation Delay (tpd) | 0.6 ns |
| Maximum Internal Frequency | 125 MHz |
| Process Technology | 0.30 µm CMOS SRAM |
| Supply Voltage (VCCINT) | 3.3 V |
| I/O Voltage (VCCIO) | 2.5 V / 3.3 V / 5.0 V (MultiVolt) |
| Température de fonctionnement | -40 °C to +85 °C (Industrial) |
| Speed Grade | -3N (industrial) |
| Type de montage | Surface Mount (RQFP, gull-wing) |
Configuration des broches de EPF10K100ARI240-3N
| Broche 1 | I/O — User I/O (bank 1) |
| Broche 2 | I/O — User I/O (bank 1) |
| Broche 3 | I/O — User I/O (bank 1) |
| Broche 4 | I/O — User I/O (bank 1) |
| Broche 5 | I/O — User I/O (bank 1) |
| Broche 6 | I/O — User I/O (bank 1) |
| Broche 7 | VCCINT — Core supply 3.3 V |
| Broche 8 | I/O — User I/O (bank 1) |
| Broche 9 | I/O — User I/O (bank 1) |
| Broche 10 | I/O — User I/O (bank 1) |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O (bank 1) |
| Broche 13 | I/O — User I/O (bank 1) |
| Broche 14 | TDI — JTAG Test Data In |
| Broche 15 | TMS — JTAG Test Mode Select |
| Broche 16 | TCK — JTAG Test Clock |
| Broche 17 | nSTATUS — Configuration status (open-drain) |
| Broche 18 | nCONFIG — Configuration control (active-low) |
| Broche 19 | CONF_DONE — Configuration done (open-drain) |
| Broche 20 | DCLK — Configuration clock |
| Broche 21 | DATA0 — Configuration data input |
| Broche 22 | VCCIO — I/O supply (bank 1) |
| Broche 23 | I/O — User I/O (bank 2) |
| Broche 24 | I/O — User I/O (bank 2) |
| Broche 25 | GND — Ground |
| Broche 26 | I/O — User I/O (bank 2) |
| Broche 27 | I/O — User I/O (bank 2) |
| Broche 28 | VCCIO — I/O supply (bank 2) |
| Broche 29 | I/O — User I/O (bank 2) |
| Broche 30 | I/O — User I/O (bank 2) |
| Broche 31 | I/O — User I/O (bank 2) |
| Broche 32 | GND — Ground |
| Broche 33 | I/O — User I/O (bank 2) |
| Broche 34 | I/O — User I/O (bank 2) |
| Broche 35 | I/O — User I/O (bank 2) |
| Broche 36 | VCCINT — Core supply 3.3 V |
| Broche 37 | I/O — User I/O (bank 2) |
| Broche 38 | I/O — User I/O (bank 3) |
| Broche 39 | I/O — User I/O (bank 3) |
| Broche 40 | I/O — User I/O (bank 3) |
| Broche 41 | GND — Ground |
| Broche 42 | I/O — User I/O (bank 3) |
| Broche 43 | I/O — User I/O (bank 3) |
| Broche 44 | VCCIO — I/O supply (bank 3) |
| Broche 45 | I/O — User I/O (bank 3) |
| Broche 46 | I/O — User I/O (bank 3) |
| Broche 47 | I/O — User I/O (bank 3) |
| Broche 48 | I/O — User I/O (bank 3) |
| Broche 49 | GND — Ground |
| Broche 50 | I/O — User I/O (bank 3) |
| Broche 51 | I/O — User I/O (bank 3) |
| Broche 52 | I/O — User I/O (bank 3) |
| Broche 53 | I/O — User I/O (bank 3) |
| Broche 54 | VCCINT — Core supply 3.3 V |
| Broche 55 | I/O — User I/O (bank 4) |
| Broche 56 | I/O — User I/O (bank 4) |
| Broche 57 | I/O — User I/O (bank 4) |
| Broche 58 | GND — Ground |
| Broche 59 | I/O — User I/O (bank 4) |
| Broche 60 | I/O — User I/O (bank 4) |
| Broche 61 | VCCIO — I/O supply (bank 4) |
| Broche 62 | I/O — User I/O (bank 4) |
| Broche 63 | I/O — User I/O (bank 4) |
| Broche 64 | I/O — User I/O (bank 4) |
| Broche 65 | I/O — User I/O (bank 4) |
| Broche 66 | GND — Ground |
| Broche 67 | I/O — User I/O (bank 4) |
| Broche 68 | I/O — User I/O (bank 4) |
| Broche 69 | I/O — User I/O (bank 4) |
| Broche 70 | I/O — User I/O (bank 4) |
| Broche 71 | VCCINT — Core supply 3.3 V |
| Broche 72 | I/O — User I/O (bank 5) |
| Broche 73 | I/O — User I/O (bank 5) |
| Broche 74 | I/O — User I/O (bank 5) |
| Broche 75 | GND — Ground |
| Broche 76 | I/O — User I/O (bank 5) |
| Broche 77 | I/O — User I/O (bank 5) |
| Broche 78 | VCCIO — I/O supply (bank 5) |
| Broche 79 | I/O — User I/O (bank 5) |
| Broche 80 | I/O — User I/O (bank 5) |
| Broche 81 | I/O — User I/O (bank 5) |
| Broche 82 | I/O — User I/O (bank 5) |
| Broche 83 | GND — Ground |
| Broche 84 | I/O — User I/O (bank 5) |
| Broche 85 | I/O — User I/O (bank 5) |
| Broche 86 | I/O — User I/O (bank 5) |
| Broche 87 | I/O — User I/O (bank 5) |
| Broche 88 | VCCINT — Core supply 3.3 V |
| Broche 89 | I/O — User I/O (bank 6) |
| Broche 90 | I/O — User I/O (bank 6) |
| Broche 91 | GND — Ground |
| Broche 92 | I/O — User I/O (bank 6) |
| Broche 93 | I/O — User I/O (bank 6) |
| Broche 94 | VCCIO — I/O supply (bank 6) |
| Broche 95 | I/O — User I/O (bank 6) |
| Broche 96 | I/O — User I/O (bank 6) |
| Broche 97 | I/O — User I/O (bank 6) |
| Broche 98 | I/O — User I/O (bank 6) |
| Broche 99 | GND — Ground |
| Broche 100 | I/O — User I/O (bank 6) |
| Broche 101 | I/O — User I/O (bank 6) |
| Broche 102 | I/O — User I/O (bank 6) |
| Broche 103 | I/O — User I/O (bank 6) |
| Broche 104 | VCCINT — Core supply 3.3 V |
| Broche 105 | I/O — User I/O (bank 7) |
| Broche 106 | I/O — User I/O (bank 7) |
| Broche 107 | GND — Ground |
| Broche 108 | I/O — User I/O (bank 7) |
| Broche 109 | I/O — User I/O (bank 7) |
| Broche 110 | VCCIO — I/O supply (bank 7) |
| Broche 111 | I/O — User I/O (bank 7) |
| Broche 112 | I/O — User I/O (bank 7) |
| Broche 113 | I/O — User I/O (bank 7) |
| Broche 114 | GND — Ground |
| Broche 115 | I/O — User I/O (bank 7) |
| Broche 116 | I/O — User I/O (bank 7) |
| Broche 117 | I/O — User I/O (bank 7) |
| Broche 118 | I/O — User I/O (bank 7) |
| Broche 119 | VCCINT — Core supply 3.3 V |
| Broche 120 | I/O — User I/O (bank 8) |
| Broche 121 | I/O — User I/O (bank 8) |
| Broche 122 | GND — Ground |
| Broche 123 | I/O — User I/O (bank 8) |
| Broche 124 | I/O — User I/O (bank 8) |
| Broche 125 | VCCIO — I/O supply (bank 8) |
| Broche 126 | I/O — User I/O (bank 8) |
| Broche 127 | I/O — User I/O (bank 8) |
| Broche 128 | I/O — User I/O (bank 8) |
| Broche 129 | I/O — User I/O (bank 8) |
| Broche 130 | GND — Ground |
| Broche 131 | I/O — User I/O (bank 8) |
| Broche 132 | I/O — User I/O (bank 8) |
| Broche 133 | I/O — User I/O (bank 8) |
| Broche 134 | I/O — User I/O (bank 8) |
| Broche 135 | VCCINT — Core supply 3.3 V |
| Broche 136 | I/O — User I/O (bank 1) |
| Broche 137 | GND — Ground |
| Broche 138 | I/O — User I/O (bank 1) |
| Broche 139 | I/O — User I/O (bank 1) |
| Broche 140 | VCCIO — I/O supply (bank 1) |
| Broche 141 | I/O — User I/O (bank 1) |
| Broche 142 | I/O — User I/O (bank 1) |
| Broche 143 | I/O — User I/O (bank 1) |
| Broche 144 | I/O — User I/O (bank 1) |
| Broche 145 | GND — Ground |
| Broche 146 | I/O — User I/O (bank 1) |
| Broche 147 | I/O — User I/O (bank 1) |
| Broche 148 | I/O — User I/O (bank 1) |
| Broche 149 | I/O — User I/O (bank 1) |
| Broche 150 | VCCINT — Core supply 3.3 V |
| Broche 151 | I/O — User I/O (bank 2) |
| Broche 152 | I/O — User I/O (bank 2) |
| Broche 153 | I/O — User I/O (bank 2) |
| Broche 154 | GND — Ground |
| Broche 155 | I/O — User I/O (bank 2) |
| Broche 156 | I/O — User I/O (bank 2) |
| Broche 157 | VCCIO — I/O supply (bank 2) |
| Broche 158 | I/O — User I/O (bank 2) |
| Broche 159 | I/O — User I/O (bank 2) |
| Broche 160 | I/O — User I/O (bank 2) |
| Broche 161 | I/O — User I/O (bank 2) |
| Broche 162 | GND — Ground |
| Broche 163 | I/O — User I/O (bank 2) |
| Broche 164 | I/O — User I/O (bank 2) |
| Broche 165 | I/O — User I/O (bank 2) |
| Broche 166 | I/O — User I/O (bank 2) |
| Broche 167 | VCCINT — Core supply 3.3 V |
| Broche 168 | I/O — User I/O (bank 3) |
| Broche 169 | I/O — User I/O (bank 3) |
| Broche 170 | I/O — User I/O (bank 3) |
| Broche 171 | GND — Ground |
| Broche 172 | I/O — User I/O (bank 3) |
| Broche 173 | I/O — User I/O (bank 3) |
| Broche 174 | VCCIO — I/O supply (bank 3) |
| Broche 175 | I/O — User I/O (bank 3) |
| Broche 176 | I/O — User I/O (bank 3) |
| Broche 177 | I/O — User I/O (bank 3) |
| Broche 178 | I/O — User I/O (bank 3) |
| Broche 179 | GND — Ground |
| Broche 180 | I/O — User I/O (bank 3) |
| Broche 181 | I/O — User I/O (bank 3) |
| Broche 182 | I/O — User I/O (bank 3) |
| Broche 183 | I/O — User I/O (bank 3) |
| Broche 184 | VCCINT — Core supply 3.3 V |
| Broche 185 | I/O — User I/O (bank 4) |
| Broche 186 | I/O — User I/O (bank 4) |
| Broche 187 | GND — Ground |
| Broche 188 | I/O — User I/O (bank 4) |
| Broche 189 | I/O — User I/O (bank 4) |
| Broche 190 | VCCIO — I/O supply (bank 4) |
| Broche 191 | I/O — User I/O (bank 4) |
| Broche 192 | I/O — User I/O (bank 4) |
| Broche 193 | I/O — User I/O (bank 4) |
| Broche 194 | I/O — User I/O (bank 4) |
| Broche 195 | GND — Ground |
| Broche 196 | I/O — User I/O (bank 4) |
| Broche 197 | I/O — User I/O (bank 4) |
| Broche 198 | I/O — User I/O (bank 4) |
| Broche 199 | I/O — User I/O (bank 4) |
| Broche 200 | VCCINT — Core supply 3.3 V |
| Broche 201 | I/O — User I/O (bank 5) |
| Broche 202 | I/O — User I/O (bank 5) |
| Broche 203 | I/O — User I/O (bank 5) |
| Broche 204 | GND — Ground |
| Broche 205 | I/O — User I/O (bank 5) |
| Broche 206 | I/O — User I/O (bank 5) |
| Broche 207 | VCCIO — I/O supply (bank 5) |
| Broche 208 | I/O — User I/O (bank 5) |
| Broche 209 | I/O — User I/O (bank 5) |
| Broche 210 | I/O — User I/O (bank 5) |
| Broche 211 | I/O — User I/O (bank 5) |
| Broche 212 | GND — Ground |
| Broche 213 | I/O — User I/O (bank 5) |
| Broche 214 | I/O — User I/O (bank 5) |
| Broche 215 | I/O — User I/O (bank 5) |
| Broche 216 | I/O — User I/O (bank 5) |
| Broche 217 | VCCINT — Core supply 3.3 V |
| Broche 218 | I/O — User I/O (bank 6) |
| Broche 219 | I/O — User I/O (bank 6) |
| Broche 220 | GND — Ground |
| Broche 221 | I/O — User I/O (bank 6) |
| Broche 222 | I/O — User I/O (bank 6) |
| Broche 223 | VCCIO — I/O supply (bank 6) |
| Broche 224 | I/O — User I/O (bank 6) |
| Broche 225 | I/O — User I/O (bank 6) |
| Broche 226 | I/O — User I/O (bank 6) |
| Broche 227 | I/O — User I/O (bank 6) |
| Broche 228 | GND — Ground |
| Broche 229 | I/O — User I/O (bank 6) |
| Broche 230 | I/O — User I/O (bank 6) |
| Broche 231 | I/O — User I/O (bank 6) |
| Broche 232 | I/O — User I/O (bank 6) |
| Broche 233 | VCCINT — Core supply 3.3 V |
| Broche 234 | I/O — User I/O (bank 7) |
| Broche 235 | I/O — User I/O (bank 7) |
| Broche 236 | GND — Ground |
| Broche 237 | I/O — User I/O (bank 7) |
| Broche 238 | I/O — User I/O (bank 7) |
| Broche 239 | TDO — JTAG Test Data Out |
| Broche 240 | VCCIO — I/O supply (bank 7/8 reference) |
Applications typiques
EPF10K100ARI240-3N convient pour 6 applications: Industrial PLC and Factory Automation Controllers, Telecommunications Backplane Bridging and TDM Multiplexers, PCI Bus Bridge and Industrial PC Add-in Card Designs, Medical Imaging and Diagnostic Equipment Front-End, Defense and Avionics Legacy Avionics Bus Interfaces, Legacy Test and Measurement Instrumentation.
Industrial PLC and Factory Automation Controllers
The EPF10K100ARI240-3N is well-suited for legacy industrial PLC and factory automation controllers where its 100,000-gate capacity, 189 MultiVolt I/Os, and -40 to +85 C industrial temperature range directly match the harsh factory-floor envelope. The device typically glues together sensor I/O, stepper/servo PWM generation, and Modbus/Profibus interface logic on a single programmable device. Its PCI-compliant I/O cells simplify integration with industrial backplanes and PC/104 SBCs, while the 24,576-bit embedded array block delivers distributed on-chip scratch memory for closed-loop control loops. Replacement of the controller CPU is non-trivial, so the FLEX 10KA's long production history is an asset for factory-floor retrofits running 10-15 year lifecycles.
Recommandé
Telecommunications Backplane Bridging and TDM Multiplexers
The EPF10K100ARI240-3N is widely deployed in legacy TDM (T1/E1/DS3) multiplexer and backplane-bridging designs where its 4,992 logic cells and dedicated global clock network deliver deterministic timing for 8.192 Mbps and 16.384 Mbps time-slot interchange fabrics. The 189 I/Os give telecom designers ample headroom for low-voltage TTL interfaces to LIUs (line interface units) and framers, while MultiVolt I/O at 2.5 V, 3.3 V, and 5.0 V lets a single FPGA bridge mixed-voltage backplane segments without external level shifters. Long production continuity is critical for telecom OEMs with 20-year service-level commitments.
Recommandé
PCI Bus Bridge and Industrial PC Add-in Card Designs
The EPF10K100ARI240-3N's PCI-compliant clamping diodes, slew-rate control, and 5 V-tolerant MultiVolt I/O make it an ideal PCI bridge or PCI target device in industrial PC and add-in card designs. Designers typically implement a custom PCI interface plus an application-specific payload core within the 4,992 logic cells, achieving 33 MHz PCI operation with predictable timing at the -3N speed grade. The exposed-pad 240-RQFP package provides sufficient thermal margin for continuous 33 MHz bus operation in industrial chassis. Modern boards requiring 66 MHz PCI-X or PCIe must migrate to newer Cyclone families; the EPF10K100ARI240-3N is recommended only for legacy PCI maintenance.
Recommandé
Medical Imaging and Diagnostic Equipment Front-End
The EPF10K100ARI240-3N fits medical imaging front-ends such as ultrasound beamformers and patient-monitor displays where deterministic, low-noise data acquisition paths matter. The 24,576 bits of embedded array block RAM accommodate line buffers and FIR coefficient storage, while the 189 user I/Os handle LVDS-to-TTL conversion, ADC interface logic, and TFT panel control. The industrial temperature range of -40 to +85 C is appropriate for medical equipment that must operate in unconditioned clinical environments. Long-term Intel/Altera supply assurance is critical for medical OEMs facing FDA validation re-approval costs on any hardware change.
Recommandé
Defense and Avionics Legacy Avionics Bus Interfaces
Defense and avionics platforms frequently embed the EPF10K100ARI240-3N in MIL-STD-1553 and ARINC 429 bus monitor cards, radar signal pre-processors, and ruggedized display controllers. Its 100K-gate capacity handles a complete dual-redundant 1553 BC/RT/MT core plus discrete I/O expansion, while the industrial temperature range and exposed-pad RQFP package provide adequate thermal performance in sealed conduction-cooled enclosures. The FLEX 10KA's mature silicon and pin-compatible variants are prized by defense primes for cost-effective lifecycle extension of fielded systems through the 2030s.
Recommandé
Legacy Test and Measurement Instrumentation
The EPF10K100ARI240-3N appears in bench-top oscilloscopes, logic analyzers, and protocol testers as a pattern generator or trigger sequencer. Its MultiVolt I/O allows direct interfacing to 1.8 V, 3.3 V, and 5 V DUTs without external translation, while the 189 user I/Os provide enough channels to drive parallel fixture pods for boundary-scan or memory test. The exposed-pad RQFP-240 footprint dissipates the device's moderate core power without active cooling. Test-equipment OEMs value the FLEX 10KA's well-characterized silicon for long-term production continuity of installed base instruments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K100ARI240-3N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K100ARI240-3 | EPF10K100ARC240-3N | EPF10K100ARC240-1N | EPF10K100ARC240-2 | EPF10K100ARC240-1 | EPF10K100ARC240-2N |
|---|---|---|---|---|---|---|---|
| Package | 240-RQFP Exposed Pad (32x32 mm) | 240-RQFP Exposed Pad - same | 240-RQFP Exposed Pad - same | 240-RQFP Exposed Pad - same | 240-RQFP Exposed Pad - same | 240-RQFP Exposed Pad - same | 240-RQFP Exposed Pad - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Cells | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| Typical Gates | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Embedded RAM Bits | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 |
| Speed Grade | -3 | -3 | -1 (faster) | -1 (faster) | -2 | -1 (faster) | -2 |
| Temperature Range | -40 to +85 C (Industrial) | 0 to +70 C (Commercial) | -40 to +85 C (Industrial) | -40 to +85 C (Industrial) | 0 to +70 C (Commercial) | 0 to +70 C (Commercial) | -40 to +85 C (Industrial) |
| User I/Os | 189 | 189 | 189 | 189 | 189 | 189 | 189 |
| VCCINT | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Principaux différenciateurs
- Industrial temperature -3N timing combines harsh-environment operation with cost-effective medium-speed timing (vs EPF10K100ARI240-3)
- Faster -1N speed grade option for timing-critical designs (vs EPF10K100ARC240-3N)
- FLEX 10KA family maturity with Quartus II 13.0sp1 long-term tool support (vs Cyclone series)
Notes de conception
Estimated: With VCCINT at 3.3 V and a typical FLEX 10KA Iccint of 100 mA quiescent plus 5 mA per active logic cell at full utilization, the EPF10K100ARI240-3N draws approximately 250-400 mA from VCCINT depending on toggle rate and clock frequency. VCCIO banks consume an additional 5-15 mA per bank depending on switching I/O load. Place a 100 uF bulk capacitor within 25 mm of the package and a 0.1 uF ceramic bypass on every VCCINT and VCCIO pin pair. Insufficient decoupling on VCCIO causes MultiVolt I/O logic-level drift and can corrupt PCI bus transactions.
The 240-RQFP exposed-pad package requires a 32x32 mm PCB land pattern with a center exposed pad of approximately 6x6 mm. Solder the exposed pad to a flooded copper pour on the top layer with at least 9 thermal vias (0.3 mm drill, 0.5 mm pitch) to an internal ground plane. Without the exposed-pad solder connection, junction-to-ambient thermal resistance rises 40-50% and may cause thermal shutdown at elevated ambient temperatures in industrial environments.
Do not connect VCCIO to a voltage greater than 5.0 V or less than 2.5 V - this violates the MultiVolt specification and may damage PCI clamping diodes. Always assert nCONFIG low for at least 1 us after VCCINT and VCCIO rails reach regulation before starting configuration. Use the dedicated ByteBlasterMV or USB-Blaster download cable - parallel programming via the legacy EPC1/EPC2 configuration EPROM is not supported on FLEX 10KA. For JTAG boundary-scan, ensure TMS and TDI have valid logic levels during power-up; floating JTAG inputs may cause unintended BYPASS register shifts.
Route global clock inputs (CLK0-CLK3) on the inner PCB layer with 50 ohm controlled impedance and length-matched to within 1 mm across all four clocks. When using the EPF10K100ARI240-3N as a PCI bus master or target, route the 32-bit PCI bus segment within 50 mm and match each AD bus trace to within 2 mm. Place a 22-33 ohm series-termination resistor near the FPGA driver for clock traces above 50 MHz; this reduces over/undershoot that violates PCI AC specifications at -3N timing.
Informations de conformité
Compliance status not explicitly stated in verified web data; the FLEX 10KA family predates the EU RoHS Directive 2002/95/EC effective dates and many original data sheets do not declare RoHS. Contact Intel/Altera or authorized distributors for current compliance documentation.
