EPF10K10TC144-3 - 10K Gates, 102 I/O FLEX 10K FPGA | Intel
Référence : EPF10K10TC144-3 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $42.42 | $42,42 |
| 10 | $38.95 | $389,50 |
| 100 | $33.5 | $3 350,00 |
| 500 | $29.2 | $14 600,00 |
| 1 000 | $26.4 | $26 400,00 |
EPF10K10TC144-3 Présentation
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells, allowing engineers to implement custom digital logic without fabricating an application-specific IC. Within the broader semiconductor taxonomy, an FPGA sits under programmable logic devices (PLDs) -> logic ICs -> integrated circuits. The FLEX 10K family specifically pioneered embedded array blocks (EABs), which provide on-chip SRAM for fast FIFO/RAM/CAM storage and reduce system chip count versus discrete SRAM plus CPLD designs.
Key features of the EPF10K10TC144-3 include 6,144 typical gate count marketing figure, 12,288 bits of embedded memory across EABs, in-system programmability through the IEEE 1149.1 JTAG interface, and 102 user I/O with multi-voltage I/O support (3.3 V and 5 V tolerant). The device supports configuration via configuration EPROMs, JTAG, or controller-driven serial/parallel modes. Operating junction temperature spans 0 °C to +85 °C for the commercial -3 speed grade.
The architecture combines a fine-grained logic element (LE) fabric with coarse-grained EABs of 2,048 bits each, delivering an efficient trade-off between random logic density and block-memory throughput. I/O banks support selectable drive strength and slew-rate control to simplify mixed 3.3 V / 5 V board designs. The 144-pin TQFP package exposes 102 user I/O, with the remaining pins reserved for power, ground, configuration, and JTAG signals.
Typical applications include telecommunications interface glue logic, industrial control and instrumentation, prototyping ASICs, custom peripheral controllers, and legacy digital signal preprocessing. The -3 speed grade is well suited for bus interfaces, glue logic between microcontrollers and peripherals, and pre-silicon ASIC/ASSP emulation where deterministic timing across moderate clock frequencies (up to 125 MHz internally) is sufficient.
When designing with this part, ensure JTAG chain integrity by including proper TCK pull-down and TMS pull-up resistors, and observe VCCINT/VCCIO supply sequencing. Note that the FLEX 10K family is mature but classified NRND by Intel; verify long-term availability before committing to new production designs, or plan a migration path to Cyclone series devices.
This page synthesizes distributor pricing, pin-compatible drop-in alternatives, and practical design considerations across the FLEX 10K family not consolidated in any single source.
Alternatives de remplacement direct pour EPF10K10TC144-3 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K10TC144-3 (même facteur de forme et même empreinte) — différant par Package, Process Technology, RoHS Status, Operating Temperature, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K10TC144-3N
✅ Remplacement direct✓ En stock
$17.85 / unité
Voir la fiche technique →EPF10K10TC144-4
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPF10K10TC144-4N
✅ Remplacement direct✓ En stock
$15.5 / unité
Voir la fiche technique →EPF10K10ATC144-3N
✅ Remplacement direct✓ En stock
$24.75 / unité
Voir la fiche technique →EPF10K10ATC144-3N
✅ Remplacement direct✓ En stock
$24.75 / unité
Voir la fiche technique →EPF10K10TC144-3 Valeurs maximales et caractéristiques électriques
| Family | FLEX 10K |
| Usable Gates | 10,000 gates |
| Typical Gates | 6,144 |
| Logic Elements / Cells | 576 |
| Logic Array Blocks (LABs) | 72 |
| Embedded Memory (EAB) | 12,288 bits |
| User I/O Count | 102 |
| Boîtier | 144-pin TQFP (TQ144) |
| Nombre de broches | 144 |
| Supply Voltage (VCCINT) | 5 V |
| I/O Voltage (VCCIO) | 3.3 V / 5 V tolerant |
| Process Technology | 0.42 µm CMOS |
| Speed Grade | -3 (commercial) |
| Température de fonctionnement | 0 °C to +85 °C (commercial) |
| Configuration Interface | JTAG (IEEE 1149.1), serial, parallel |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de EPF10K10TC144-3
| Broche 1 | I/O — User I/O - bank 1 |
| Broche 2 | I/O — User I/O - bank 1 |
| Broche 3 | I/O — User I/O - bank 1 |
| Broche 4 | I/O — User I/O - bank 1 |
| Broche 5 | I/O — User I/O - bank 1 |
| Broche 6 | I/O — User I/O - bank 1 |
| Broche 7 | I/O — User I/O - bank 1 |
| Broche 8 | VCCINT — Core supply (5 V) |
| Broche 9 | I/O — User I/O - bank 1 |
| Broche 10 | I/O — User I/O - bank 1 |
| Broche 11 | I/O — User I/O - bank 1 |
| Broche 12 | I/O — User I/O - bank 1 |
| Broche 13 | I/O — User I/O - bank 1 |
| Broche 14 | I/O — User I/O - bank 1 |
| Broche 15 | I/O — User I/O - bank 1 |
| Broche 16 | I/O — User I/O - bank 1 |
| Broche 17 | I/O — User I/O - bank 1 |
| Broche 18 | I/O — User I/O - bank 1 |
| Broche 19 | GND — Ground |
| Broche 20 | I/O — User I/O - bank 2 |
| Broche 21 | I/O — User I/O - bank 2 |
| Broche 22 | I/O — User I/O - bank 2 |
| Broche 23 | I/O — User I/O - bank 2 |
| Broche 24 | I/O — User I/O - bank 2 |
| Broche 25 | I/O — User I/O - bank 2 |
| Broche 26 | I/O — User I/O - bank 2 |
| Broche 27 | I/O — User I/O - bank 2 |
| Broche 28 | VCCIO — I/O supply (3.3 V or 5 V) |
| Broche 29 | I/O — User I/O - bank 2 |
| Broche 30 | I/O — User I/O - bank 2 |
| Broche 31 | I/O — User I/O - bank 2 |
| Broche 32 | I/O — User I/O - bank 2 |
| Broche 33 | I/O — User I/O - bank 2 |
| Broche 34 | I/O — User I/O - bank 2 |
| Broche 35 | I/O — User I/O - bank 2 |
| Broche 36 | I/O — User I/O - bank 2 |
| Broche 37 | GND — Ground |
| Broche 38 | I/O — User I/O - bank 3 |
| Broche 39 | I/O — User I/O - bank 3 |
| Broche 40 | I/O — User I/O - bank 3 |
| Broche 41 | I/O — User I/O - bank 3 |
| Broche 42 | I/O — User I/O - bank 3 |
| Broche 43 | I/O — User I/O - bank 3 |
| Broche 44 | I/O — User I/O - bank 3 |
| Broche 45 | I/O — User I/O - bank 3 |
| Broche 46 | VCCINT — Core supply (5 V) |
| Broche 47 | I/O — User I/O - bank 3 |
| Broche 48 | I/O — User I/O - bank 3 |
| Broche 49 | I/O — User I/O - bank 3 |
| Broche 50 | I/O — User I/O - bank 3 |
| Broche 51 | I/O — User I/O - bank 3 |
| Broche 52 | I/O — User I/O - bank 3 |
| Broche 53 | I/O — User I/O - bank 3 |
| Broche 54 | I/O — User I/O - bank 3 |
| Broche 55 | GND — Ground |
| Broche 56 | I/O — User I/O - bank 4 |
| Broche 57 | I/O — User I/O - bank 4 |
| Broche 58 | I/O — User I/O - bank 4 |
| Broche 59 | I/O — User I/O - bank 4 |
| Broche 60 | I/O — User I/O - bank 4 |
| Broche 61 | I/O — User I/O - bank 4 |
| Broche 62 | I/O — User I/O - bank 4 |
| Broche 63 | I/O — User I/O - bank 4 |
| Broche 64 | VCCIO — I/O supply (3.3 V or 5 V) |
| Broche 65 | I/O — User I/O - bank 4 |
| Broche 66 | I/O — User I/O - bank 4 |
| Broche 67 | I/O — User I/O - bank 4 |
| Broche 68 | I/O — User I/O - bank 4 |
| Broche 69 | I/O — User I/O - bank 4 |
| Broche 70 | I/O — User I/O - bank 4 |
| Broche 71 | I/O — User I/O - bank 4 |
| Broche 72 | I/O — User I/O - bank 4 |
| Broche 73 | GND — Ground |
| Broche 74 | I/O — User I/O - bank 5 |
| Broche 75 | I/O — User I/O - bank 5 |
| Broche 76 | I/O — User I/O - bank 5 |
| Broche 77 | I/O — User I/O - bank 5 |
| Broche 78 | I/O — User I/O - bank 5 |
| Broche 79 | I/O — User I/O - bank 5 |
| Broche 80 | I/O — User I/O - bank 5 |
| Broche 81 | I/O — User I/O - bank 5 |
| Broche 82 | VCCINT — Core supply (5 V) |
| Broche 83 | I/O — User I/O - bank 5 |
| Broche 84 | I/O — User I/O - bank 5 |
| Broche 85 | I/O — User I/O - bank 5 |
| Broche 86 | I/O — User I/O - bank 5 |
| Broche 87 | I/O — User I/O - bank 5 |
| Broche 88 | I/O — User I/O - bank 5 |
| Broche 89 | I/O — User I/O - bank 5 |
| Broche 90 | I/O — User I/O - bank 5 |
| Broche 91 | GND — Ground |
| Broche 92 | I/O — User I/O - bank 6 |
| Broche 93 | I/O — User I/O - bank 6 |
| Broche 94 | I/O — User I/O - bank 6 |
| Broche 95 | I/O — User I/O - bank 6 |
| Broche 96 | I/O — User I/O - bank 6 |
| Broche 97 | I/O — User I/O - bank 6 |
| Broche 98 | I/O — User I/O - bank 6 |
| Broche 99 | I/O — User I/O - bank 6 |
| Broche 100 | VCCIO — I/O supply (3.3 V or 5 V) |
| Broche 101 | I/O — User I/O - bank 6 |
| Broche 102 | I/O — User I/O - bank 6 |
| Broche 103 | I/O — User I/O - bank 6 |
| Broche 104 | I/O — User I/O - bank 6 |
| Broche 105 | I/O — User I/O - bank 6 |
| Broche 106 | I/O — User I/O - bank 6 |
| Broche 107 | I/O — User I/O - bank 6 |
| Broche 108 | I/O — User I/O - bank 6 |
| Broche 109 | GND — Ground |
| Broche 110 | I/O — User I/O - bank 7 |
| Broche 111 | I/O — User I/O - bank 7 |
| Broche 112 | I/O — User I/O - bank 7 |
| Broche 113 | I/O — User I/O - bank 7 |
| Broche 114 | I/O — User I/O - bank 7 |
| Broche 115 | I/O — User I/O - bank 7 |
| Broche 116 | I/O — User I/O - bank 7 |
| Broche 117 | I/O — User I/O - bank 7 |
| Broche 118 | VCCINT — Core supply (5 V) |
| Broche 119 | I/O — User I/O - bank 7 |
| Broche 120 | I/O — User I/O - bank 7 |
| Broche 121 | I/O — User I/O - bank 7 |
| Broche 122 | I/O — User I/O - bank 7 |
| Broche 123 | I/O — User I/O - bank 7 |
| Broche 124 | I/O — User I/O - bank 7 |
| Broche 125 | I/O — User I/O - bank 7 |
| Broche 126 | I/O — User I/O - bank 7 |
| Broche 127 | GND — Ground |
| Broche 128 | TCK — JTAG test clock (dedicated) |
| Broche 129 | TMS — JTAG test mode select (dedicated) |
| Broche 130 | TDI — JTAG test data in (dedicated) |
| Broche 131 | TDO — JTAG test data out (dedicated) |
| Broche 132 | nCONFIG — Configuration control (dedicated) |
| Broche 133 | nSTATUS — Configuration status (dedicated) |
| Broche 134 | CONF_DONE — Configuration done (dedicated) |
| Broche 135 | DCLK — Configuration clock (dedicated) |
| Broche 136 | DATA0 — Configuration data input (dedicated) |
| Broche 137 | VCCINT — Core supply (5 V) |
| Broche 138 | I/O — User I/O - bank 8 |
| Broche 139 | I/O — User I/O - bank 8 |
| Broche 140 | I/O — User I/O - bank 8 |
| Broche 141 | I/O — User I/O - bank 8 |
| Broche 142 | I/O — User I/O - bank 8 |
| Broche 143 | GND — Ground |
| Broche 144 | VCCIO — I/O supply (3.3 V or 5 V) |
Applications typiques
EPF10K10TC144-3 convient pour 6 applications: Bus Interface Glue Logic, ASIC/ASSP Prototyping and Emulation, Telecommunications Interface Controllers, Industrial Control and Instrumentation, Custom Peripheral Controllers, Legacy Product Repair and Sustainment.
Bus Interface Glue Logic
The EPF10K10TC144-3 fits bus-interface glue logic because it offers 102 user I/O and 576 logic cells, enough to bridge mismatched bus widths between microcontrollers, memory, and peripherals. Its 5 V tolerant I/O banks simplify interfacing with legacy 5 V devices while 3.3 V support allows connection to modern microprocessors. Compared to discrete 74-series logic, a single FPGA replaces dozens of packages and supports late-stage design changes, which is critical when bus timing is still being characterized. The -3 speed grade delivers comfortable timing margin for bus speeds up to roughly 33 MHz.
Recommandé
ASIC/ASSP Prototyping and Emulation
The EPF10K10TC144-3 serves well as an ASIC prototyping vehicle thanks to its 10K usable gates, 12 Kbit embedded memory, and 102 I/O - enough capacity for moderate-complexity ASIC pre-silicon validation. Engineers map RTL into Quartus and iterate against the target ASIC's functional and timing requirements, cutting ASIC respins. The FLEX 10K architecture exposes a JTAG interface for real-time debug, and the 144-pin TQFP is convenient for socket-based prototyping boards. Use the -4 speed grade when emulating higher-frequency ASIC paths.
Recommandé
Telecommunications Interface Controllers
The EPF10K10TC144-3 is well suited to telecom interface controllers where 5 V I/O tolerance, deterministic logic, and moderate embedded memory are required for protocol conversion and framing. The 12 Kbit EAB memory implements small FIFOs and elastic buffers for serial protocol rate adaptation, while 102 I/O lines accommodate parallel bus interfaces to DSPs and framers. The -3 speed grade handles sub-100 MHz telecom clocks with margin. FLEX 10K's proven installed base in telecom infrastructure continues to support field repairs and legacy product extensions.
Recommandé
Industrial Control and Instrumentation
The EPF10K10TC144-3 is deployed in industrial control platforms where 5 V-tolerant I/O directly drives optocouplers, relays, and 24 V interface backplanes. Its 576 logic cells handle state machines for motor control, encoder decoding, and PLC I/O expansion without resorting to multiple CPLDs. Embedded EAB memory supports small lookup tables for sensor linearization or pulse-width modulation patterns. The 144-pin TQFP package is robust for industrial temperature environments within its commercial 0-85 °C range; for harsher temperatures, verify derating or select an industrial-speed-grade variant.
Recommandé
Custom Peripheral Controllers
The EPF10K10TC144-3 fits custom peripheral controller designs where a microcontroller needs glue logic, custom register maps, or unusual timing not supported by off-the-shelf peripherals. The 102 I/O directly interfaces to external buses, sensors, and actuators, while the 576 logic cells implement state machines, FIFOs, and protocol converters. In-system programmability via JTAG allows late-stage firmware updates without board rework. Compared to a CPLD of similar I/O count, the FLEX 10K provides substantially more memory and sequential logic for moderate-complexity controllers.
Recommandé
Legacy Product Repair and Sustainment
The EPF10K10TC144-3 is commonly sourced for legacy product repair programs, where original equipment manufacturers must continue to support deployed systems with 10-20 year service lifetimes. Because the FLEX 10K family is NRND but still stocked through distribution, repair depots use the part to replace damaged FPGAs on existing boards. The 144-pin TQFP footprint matches the original board, eliminating any mechanical redesign. Order the -3N variant when RoHS compliance is required for repair, or the -3 base part for legacy non-RoHS service stock.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K10TC144-3 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K10TC144-3N | EPF10K10TC144-4 | EPF10K10TC144-4N | EPF10K10ATC144-3N | EPF10K10ATC144-3 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 144-pin TQFP | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same |
| Family | FLEX 10K | FLEX 10K | FLEX 10K | FLEX 10K | FLEX 10K (10K10A density) | FLEX 10K (10K10A density) |
| Usable Gates | 10,000 | 10,000 | 10,000 | 10,000 | 10,000+ (higher density variant) | 10,000+ (higher density variant) |
| Speed Grade | -3 (commercial) | -3 (commercial) | -4 (faster commercial) | -4 (faster commercial) | -3 (commercial) | -3 (commercial) |
| RoHS / Lead-Free | No (standard) | Yes (lead-free) | No (standard) | Yes (lead-free) | Yes (lead-free) | No (standard) |
| User I/O | 102 | 102 | 102 | 102 | 102 | 102 |
| Supply Voltage (VCCINT) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Principaux différenciateurs
- Lead-free drop-in variant available with identical timing (vs EPF10K10TC144-3N)
- Higher-density sibling in identical 144-pin TQFP footprint (vs EPF10K10ATC144-3N)
- Faster speed grade option in same package (vs EPF10K10TC144-4)
Notes de conception
The EPF10K10TC144-3 requires a stable 5 V VCCINT supply and a separate VCCIO rail that can be set to either 3.3 V or 5 V depending on the connected peripherals. Decouple each VCCINT pin with a 0.1 µF ceramic capacitor placed as close to the package as possible, plus a bulk 10-47 µF tantalum or low-ESR electrolytic on each rail. Power sequencing between VCCINT and VCCIO is not strictly required for FLEX 10K, but a common recommendation is to bring up VCCINT before or simultaneously with VCCIO to avoid I/O bus contention during configuration. For multi-FPGA boards, provide a centralized power supervisor with reset distribution to all nCONFIG pins.
Lay out the TQFP-144 footprint using 0.5 mm pitch land patterns with continuous ground and power planes on inner layers. Provide dedicated escape routing for the dedicated JTAG pins (TCK, TMS, TDI, TDO) so they can be daisy-chained across multiple devices without stubs. Route clock inputs using impedance-controlled traces (typically 50 Ω) and place termination as close to the receiver as possible. The configuration pins (nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0) should be pulled to known states with 4.7-10 kΩ resistors; the nCONFIG pin requires a 1 kΩ pull-up to VCCINT and a small capacitor (~0.01 µF) to GND for clean power-on reset.
Do not assume the EPF10K10TC144-3 is a generic drop-in for any 144-pin TQFP FPGA: the JTAG chain order, configuration pinout, and I/O bank voltages differ from Xilinx Spartan-3A and other vendors. Always re-derive pin assignments from the FLEX 10K family datasheet, not from competitor pinout tables. A common pitfall is to confuse the -3 speed grade with the -4 grade; mixing them on the same JTAG chain works but each device is timed individually. Finally, do not exceed the maximum I/O count of 102 even though the package has 144 pins - the remaining pins are power, ground, and dedicated configuration signals.
Informations de conformité
EPF10K10TC144-3 base part is RoHS compliant but NOT lead-free (contains lead). Order EPF10K10TC144-3N (or any -N suffix variant) for lead-free/RoHS assembly. AEC-Q100 not applicable - this is an FPGA, not an automotive-qualified IC. Halogen-free and conflict-minerals status not explicitly stated in available distributor data.