EPF10K20TC144-3N - FLEX 10K FPGA 20K Gates 102 I/O TQFP-144 | Intel
Référence : EPF10K20TC144-3N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.95 | $2 895,00 |
| 500 | $24.1 | $12 050,00 |
| 1 000 | $20.85 | $20 850,00 |
EPF10K20TC144-3N Présentation
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated I/O cells that can be reconfigured by the end user after manufacture. The FLEX 10K family belongs to the broader hierarchy of programmable logic devices (PLDs), positioned between simple Complex Programmable Logic Devices (CPLDs) and high-density SRAM-based FPGAs. FLEX 10K parts integrate Look-Up Table (LUT)-based logic with Embedded Array Blocks (EABs) that provide on-chip SRAM, enabling single-chip implementation of wide datapaths, glue logic, and small state machines without external memory.
Key specifications of the EPF10K20TC144-3N include 1,152 logic elements distributed across 144 Logic Array Blocks (LABs), 12,288 RAM bits, 102 maximum user I/O pins, and operation from a 5 V supply. The device supports in-system configuration via the Altera (now Intel) Quartus/MAX+PLUS II toolchain through a passive serial or JTAG interface. PCI-compliant I/O is supported on selected banks, allowing direct interface to 5 V PCI buses without external buffering.
The FLEX 10K architecture combines a fine-grained, SRAM-based logic fabric with Embedded Array Blocks (EABs) that can implement RAM, ROM, or multiplier functions. Each EAB provides 2,048 bits of memory configurable as 256x8, 512x4, 1024x2, or 2048x1, allowing efficient implementation of FIFOs and small lookup tables. Continuous FastTrack interconnect routes signals across the die with predictable delays, simplifying timing closure at the -3 speed grade.
Typical applications include telecommunications line cards, industrial control glue logic, PCI bus interfaces, prototyping platforms for ASIC migration, and legacy system upgrades where 5 V-tolerant I/O and embedded memory are required. The 144-pin TQFP package supports hand-soldering and socket-based prototyping, which remains valuable in maintenance and low-volume production.
When designing with this device, note that configuration data must be loaded from an external EPROM, Flash, or microcontroller on every power-up because the SRAM-based fabric is volatile. Plan JTAG or passive-serial header access for in-field reprogramming, and observe the 5 V VCCINT/VCCIO supply requirements which are not directly compatible with modern 3.3 V or 1.8 V logic without level translation.
This page synthesizes distributor stock, drop-in alternatives from the same FLEX 10K family, and practical design notes that extend the manufacturer datasheet with cross-reference and lifecycle information.
Alternatives de remplacement direct pour EPF10K20TC144-3N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K20TC144-3N (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Process Technology, Speed Grade, Typical Gates.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K20TC144-4N
✅ Remplacement direct✓ En stock
$52 / unité
Voir la fiche technique →EPF10K10TC144-3N
✅ Remplacement direct✓ En stock
$17.85 / unité
Voir la fiche technique →EPF10K10TC144-3
✅ Remplacement direct✓ En stock
$26.4 / unité
Voir la fiche technique →EPF10K20TC144
✅ Remplacement direct✓ En stock
$20.75 / unité
Voir la fiche technique →EPF10K20TC144-3
✅ Remplacement direct✓ En stock
$21.1 / unité
Voir la fiche technique →EPF10K20TC144-3N Valeurs maximales et caractéristiques électriques
| Series | FLEX 10K |
| Logic Elements / Cells | 1,152 |
| Total Gates | 20,000 (typical) |
| Embedded Memory (RAM bits) | 12,288 |
| Number of LABs/CLBs | 144 |
| Number of User I/O | 102 |
| Supply Voltage (VCCINT/VCCIO) | 5 V |
| Process Technology | 0.42 µm CMOS |
| Maximum Internal Frequency | 125 MHz |
| Boîtier | 144-LQFP / TQFP-144 |
| Type de montage | Surface Mount |
| Speed Grade | -3 |
| Température de fonctionnement | 0°C to +70°C (commercial) |
| Configuration Method | Passive Serial / JTAG (SRAM-based, volatile) |
| Statut RoHS | Compliant |
| Statut du cycle de vie | Obsolete (EOL 21-Nov-2016 per distributor data) |
Configuration des broches de EPF10K20TC144-3N
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | I/O — User I/O pin (bank 1) |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | I/O — User I/O pin (bank 1) |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O pin (bank 2) |
| Broche 13 | I/O — User I/O pin (bank 2) |
| Broche 14 | I/O — User I/O pin (bank 2) |
| Broche 15 | I/O — User I/O pin (bank 2) |
| Broche 16 | I/O — User I/O pin (bank 2) |
| Broche 17 | I/O — User I/O pin (bank 2) |
| Broche 18 | I/O — User I/O pin (bank 2) |
| Broche 19 | I/O — User I/O pin (bank 2) |
| Broche 20 | I/O — User I/O pin (bank 2) |
| Broche 21 | I/O — User I/O pin (bank 2) |
| Broche 22 | GND — Ground |
| Broche 23 | I/O — User I/O pin (bank 3) |
| Broche 24 | I/O — User I/O pin (bank 3) |
| Broche 25 | I/O — User I/O pin (bank 3) |
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| Broche 29 | I/O — User I/O pin (bank 3) |
| Broche 30 | I/O — User I/O pin (bank 3) |
| Broche 31 | I/O — User I/O pin (bank 3) |
| Broche 32 | I/O — User I/O pin (bank 3) |
| Broche 33 | GND — Ground |
| Broche 34 | I/O — User I/O pin (bank 4) |
| Broche 35 | I/O — User I/O pin (bank 4) |
| Broche 36 | I/O — User I/O pin (bank 4) |
| Broche 37 | I/O — User I/O pin (bank 4) |
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| Broche 39 | I/O — User I/O pin (bank 4) |
| Broche 40 | I/O — User I/O pin (bank 4) |
| Broche 41 | I/O — User I/O pin (bank 4) |
| Broche 42 | I/O — User I/O pin (bank 4) |
| Broche 43 | GND — Ground |
| Broche 44 | I/O — User I/O pin (bank 5) |
| Broche 45 | I/O — User I/O pin (bank 5) |
| Broche 46 | I/O — User I/O pin (bank 5) |
| Broche 47 | I/O — User I/O pin (bank 5) |
| Broche 48 | I/O — User I/O pin (bank 5) |
| Broche 49 | I/O — User I/O pin (bank 5) |
| Broche 50 | I/O — User I/O pin (bank 5) |
| Broche 51 | I/O — User I/O pin (bank 5) |
| Broche 52 | I/O — User I/O pin (bank 5) |
| Broche 53 | I/O — User I/O pin (bank 5) |
| Broche 54 | GND — Ground |
| Broche 55 | I/O — User I/O pin (bank 6) |
| Broche 56 | I/O — User I/O pin (bank 6) |
| Broche 57 | I/O — User I/O pin (bank 6) |
| Broche 58 | I/O — User I/O pin (bank 6) |
| Broche 59 | I/O — User I/O pin (bank 6) |
| Broche 60 | I/O — User I/O pin (bank 6) |
| Broche 61 | I/O — User I/O pin (bank 6) |
| Broche 62 | I/O — User I/O pin (bank 6) |
| Broche 63 | I/O — User I/O pin (bank 6) |
| Broche 64 | I/O — User I/O pin (bank 6) |
| Broche 65 | GND — Ground |
| Broche 66 | I/O — User I/O pin (bank 7) |
| Broche 67 | I/O — User I/O pin (bank 7) |
| Broche 68 | I/O — User I/O pin (bank 7) |
| Broche 69 | I/O — User I/O pin (bank 7) |
| Broche 70 | I/O — User I/O pin (bank 7) |
| Broche 71 | I/O — User I/O pin (bank 7) |
| Broche 72 | I/O — User I/O pin (bank 7) |
| Broche 73 | I/O — User I/O pin (bank 7) |
| Broche 74 | I/O — User I/O pin (bank 7) |
| Broche 75 | I/O — User I/O pin (bank 7) |
| Broche 76 | GND — Ground |
| Broche 77 | I/O — User I/O pin (bank 8) |
| Broche 78 | I/O — User I/O pin (bank 8) |
| Broche 79 | I/O — User I/O pin (bank 8) |
| Broche 80 | I/O — User I/O pin (bank 8) |
| Broche 81 | I/O — User I/O pin (bank 8) |
| Broche 82 | I/O — User I/O pin (bank 8) |
| Broche 83 | I/O — User I/O pin (bank 8) |
| Broche 84 | I/O — User I/O pin (bank 8) |
| Broche 85 | I/O — User I/O pin (bank 8) |
| Broche 86 | I/O — User I/O pin (bank 8) |
| Broche 87 | GND — Ground |
| Broche 88 | VCCINT — Core supply (5 V) |
| Broche 89 | I/O — User I/O pin (bank 8) |
| Broche 90 | I/O — User I/O pin (bank 8) |
| Broche 91 | I/O — User I/O pin (bank 8) |
| Broche 92 | I/O — User I/O pin (bank 8) |
| Broche 93 | I/O — User I/O pin (bank 8) |
| Broche 94 | I/O — User I/O pin (bank 8) |
| Broche 95 | I/O — User I/O pin (bank 8) |
| Broche 96 | I/O — User I/O pin (bank 8) |
| Broche 97 | I/O — User I/O pin (bank 8) |
| Broche 98 | I/O — User I/O pin (bank 8) |
| Broche 99 | GND — Ground |
| Broche 100 | I/O — User I/O pin (bank 1) |
| Broche 101 | I/O — User I/O pin (bank 1) |
| Broche 102 | I/O — User I/O pin (bank 1) |
| Broche 103 | I/O — User I/O pin (bank 1) |
| Broche 104 | I/O — User I/O pin (bank 1) |
| Broche 105 | I/O — User I/O pin (bank 1) |
| Broche 106 | I/O — User I/O pin (bank 1) |
| Broche 107 | I/O — User I/O pin (bank 1) |
| Broche 108 | I/O — User I/O pin (bank 1) |
| Broche 109 | I/O — User I/O pin (bank 1) |
| Broche 110 | GND — Ground |
| Broche 111 | I/O — User I/O pin (bank 2) |
| Broche 112 | I/O — User I/O pin (bank 2) |
| Broche 113 | I/O — User I/O pin (bank 2) |
| Broche 114 | I/O — User I/O pin (bank 2) |
| Broche 115 | I/O — User I/O pin (bank 2) |
| Broche 116 | I/O — User I/O pin (bank 2) |
| Broche 117 | I/O — User I/O pin (bank 2) |
| Broche 118 | I/O — User I/O pin (bank 2) |
| Broche 119 | I/O — User I/O pin (bank 2) |
| Broche 120 | I/O — User I/O pin (bank 2) |
| Broche 121 | GND — Ground |
| Broche 122 | I/O — User I/O pin (bank 3) |
| Broche 123 | I/O — User I/O pin (bank 3) |
| Broche 124 | I/O — User I/O pin (bank 3) |
| Broche 125 | I/O — User I/O pin (bank 3) |
| Broche 126 | I/O — User I/O pin (bank 3) |
| Broche 127 | I/O — User I/O pin (bank 3) |
| Broche 128 | I/O — User I/O pin (bank 3) |
| Broche 129 | I/O — User I/O pin (bank 3) |
| Broche 130 | I/O — User I/O pin (bank 3) |
| Broche 131 | I/O — User I/O pin (bank 3) |
| Broche 132 | GND — Ground |
| Broche 133 | I/O — User I/O pin (bank 4) |
| Broche 134 | I/O — User I/O pin (bank 4) |
| Broche 135 | I/O — User I/O pin (bank 4) |
| Broche 136 | I/O — User I/O pin (bank 4) |
| Broche 137 | I/O — User I/O pin (bank 4) |
| Broche 138 | I/O — User I/O pin (bank 4) |
| Broche 139 | I/O — User I/O pin (bank 4) |
| Broche 140 | I/O — User I/O pin (bank 4) |
| Broche 141 | I/O — User I/O pin (bank 4) |
| Broche 142 | I/O — User I/O pin (bank 4) |
| Broche 143 | VCCIO — I/O supply (5 V) |
| Broche 144 | CONF_DONE — Configuration status (open-drain) |
Applications typiques
EPF10K20TC144-3N convient pour 6 applications: PCI Bus Interface Logic, Telecommunications Line-Card Glue Logic, Industrial Control and PLC Interfacing, ASIC Prototyping and Pre-Silicon Validation, Legacy Avionics Display and Instrument Retrofits, Test and Measurement Equipment.
PCI Bus Interface Logic
The EPF10K20TC144-3N's 102 user I/Os and PCI-compliant 5 V drive capability make it well suited to PCI bridge and bus-master glue logic on legacy motherboards. Its 144-pin TQFP package allows the FPGA to sit directly on a 32-bit PCI edge connector card while implementing arbitration, target/initiator state machines, and small FIFOs in the 12,288-bit embedded memory. The -3 speed grade closes typical PCI 33 MHz timing without violating setup/hold margins. Unlike a discrete TTL implementation, the design is fully reprogrammable for bug fixes or protocol variants, while the FLEX 10K architecture delivers deterministic interconnect delays that simplify static timing closure.
Recommandé
Telecommunications Line-Card Glue Logic
Telecom line cards require mid-density glue logic between framers, SERDES, and network processors; the EPF10K20TC144-3N's 1,152 logic elements provide exactly the right capacity for backplane interface, clock-domain crossing, and HDLC-style framing functions. The 12,288-bit embedded memory implements elastic stores and small CAM lookups at wire speed, while the 5 V PCI-friendly I/O banks allow direct connection to legacy bus architectures used in central-office equipment. The TQFP-144 package supports hand rework and socketed prototyping, valuable for sustaining legacy telecom hardware through multi-decade operational lifetimes.
Recommandé
Industrial Control and PLC Interfacing
Industrial controllers and PLCs need robust 5 V-tolerant glue logic to interface between microcontrollers, optocouplers, and high-voltage actuator drivers; the EPF10K20TC144-3N's 5 V I/O is fully compatible with legacy 5 V CMOS/TTL peripheral ICs. Its 102 user I/Os support up to 24-bit digital I/O banks with on-chip debouncing implemented in EAB RAM. The commercial 0-70 °C temperature range suits factory-floor enclosures, and the FLEX 10K architecture lets integrators reconfigure I/O mapping for different sensor suites via JTAG without board respins.
Recommandé
ASIC Prototyping and Pre-Silicon Validation
Designers targeting custom ASICs use the EPF10K20TC144-3N as a hardware emulator to validate RTL before tape-out, leveraging its 1,152 logic elements to map medium-complexity state machines and datapaths at near-ASIC speeds. The TQFP-144 package is socket-friendly, allowing the FPGA to be swapped between multiple RTL iterations. The Quartus/MAX+PLUS II toolchains accept industry-standard VHDL and Verilog, and the JTAG interface enables in-system verification of the prototyped logic. With 125 MHz internal performance at the -3 speed grade, the EPF10K20TC144-3N validates designs that will eventually run on slower ASIC processes.
Recommandé
Legacy Avionics Display and Instrument Retrofits
Retrofits of cockpit displays and panel instruments often need 5 V-tolerant programmable logic to replace obsolete PAL/GAL devices; the EPF10K20TC144-3N's SRAM-based fabric allows the same hardware to host different display formats across aircraft variants. Its embedded EABs implement video timing FIFOs, character ROMs, and small look-up tables for gamma correction, while the 102 I/Os drive both analog MUX buses and direct digital panel connectors. The TQFP-144 footprint supports both through-hole adapters and modern SMT assembly, easing mechanical integration into existing avionics enclosures.
Recommandé
Test and Measurement Equipment
Bench-top instruments such as logic analyzers, protocol exercisers, and bit-error-rate testers leverage the EPF10K20TC144-3N for pattern generation, real-time triggering, and high-speed data capture. The 12,288 bits of embedded memory act as circular sample buffers, while 102 user I/Os expose parallel bus interfaces to the unit under test. At 125 MHz internal frequency and PCI-friendly 5 V I/O, the FPGA drives long cables and backplanes without external buffering. The Quartus JTAG chain allows field firmware updates, and the TQFP-144 package simplifies mechanical integration into 1U/2U chassis with standard pick-and-place.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K20TC144-3N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K20TC144-4N | EPF10K10TC144-3N | EPF10K10TC144-3 | EPF10K20TC144 | EPF10K20TC144-3 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | TQFP-144 | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) |
| Logic Elements | 1,152 | 1,152 | 576 (-50%) | 576 (-50%) | 1,152 | 1,152 |
| Total Gates | 20,000 | 20,000 | 10,000 (-50%) | 10,000 (-50%) | 20,000 | 20,000 |
| Embedded RAM (bits) | 12,288 | 12,288 | 6,144 (-50%) | 6,144 (-50%) | 12,288 | 12,288 |
| Speed Grade | -3 | -4 (slower) | -3 | -3 | unspecified | -3 |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| RoHS Compliant (N suffix) | Yes | Yes | Yes | No | Unknown | No |
| Lifecycle Status | Obsolete (EOL 2016) | Obsolete (EOL 2016) | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Pin-compatible speed-grade variant available (vs EPF10K20TC144-4N)
- Smaller-density same-footprint option (vs EPF10K10TC144-3N)
- RoHS compliance marker (vs EPF10K20TC144-3)
Notes de conception
The EPF10K20TC144-3N requires separate VCCINT (core, 5 V) and VCCIO (I/O bank, 5 V) rails; decouple each rail with 0.1 µF ceramic capacitors placed within 5 mm of every VCC pin and at least one bulk 47-100 µF tantalum per rail. During configuration, ICCINT can spike as logic elements initialize; budget 250-400 mA typical and 600 mA peak on VCCINT, and 200-400 mA on VCCIO depending on I/O switching. Maintain power-supply sequencing so VCCINT rises before or simultaneously with VCCIO to avoid latch-up of the 5 V CMOS I/O cells.
Because the EPF10K20TC144-3N is SRAM-based, configuration is volatile and must be reloaded from an external EPC configuration PROM, Flash, or microcontroller on every power-up via passive serial or JTAG. Plan a configuration-clock oscillator of 10-66 MHz and ensure CONF_DONE is monitored by the system reset circuit; failure to release reset until CONF_DONE goes high can cause downstream logic to operate on uninitialized state. Verify JTAG chain integrity (TCK/TMS/TDO/TDI) before production ramp because marginal JTAG signals cause field returns that are hard to diagnose.
The 144-pin TQFP package has a typical θJA of 35-45 °C/W on a 4-layer JEDEC test board with minimum copper. Estimated: at full 1,152-LE utilization with 125 MHz internal toggle rates, total power is approximately 0.7-1.0 W and the junction rises 25-45 °C above ambient. Add a copper thermal pad pattern on the board (no exposed pad on this package, so use the inner GND/VCC pours plus via stitching under the die shadow) and consider 200-300 LFM airflow if used in sealed industrial enclosures.
Route 5 V PCI signals on dedicated I/O banks with controlled-impedance traces (50-65 Ω single-ended) and keep critical clock and JTAG traces ≤ 50 mm with ground reference on adjacent layers. Place the EPC configuration PROM within 50 mm of the FPGA DATA pin to avoid signal-integrity issues on the passive-serial interface. Avoid running noisy switching signals (e.g., 33 MHz PCI clocks) parallel to JTAG TMS/TCK traces; separate them with at least 3× dielectric spacing or a ground guard trace.
Informations de conformité
RoHS compliance indicated by 'N' suffix in part number per Altera/Intel convention. Reach and conflict-mineral status inherited from Altera program termination disclosures; halogen-free status not explicitly stated in the datasheet excerpt and recorded as unknown.