EPF10K130EQI240-1N - 130K Gates FLEX 10KE FPGA, 240-PQFP | Intel / Altera
Référence : EPF10K130EQI240-1N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.95 | $2 895,00 |
| 500 | $23.4 | $11 700,00 |
| 1 000 | $19.85 | $19 850,00 |
EPF10K130EQI240-1N Présentation
An FPGA (Field-Programmable Gate Array) is a programmable logic device from the broader category of programmable logic devices (PLDs) within the integrated circuits hierarchy. FPGAs occupy the high-end of the PLD taxonomy (above simple SPLDs and CPLDs) by integrating thousands of configurable logic blocks, programmable interconnect, embedded memory, and often embedded multipliers or transceivers, enabling the implementation of complete digital subsystems on a single chip. The FLEX 10KE generation is built on a 0.25 µm CMOS process with SRAM-based configuration, requiring an external configuration device such as the EPC2 configuration PROM to load the bitstream at power-up.
Key features include 6,656 logic elements (LEs), 6,912 total RAM bits distributed across embedded array blocks, support for system-clock rates up to 333.33 MHz, and a JTAG-compliant IEEE 1149.1 boundary-scan test interface. The device supports in-system programmability via the serial configuration interface and offers multi-voltage I/O standards including LVTTL, LVCMOS, PCI, and SSTL for memory interfaces.
Typical applications include industrial control, telecom line cards, glue-logic consolidation on legacy 5 V boards, prototyping for ASIC replacement, and DSP co-processing pipelines. The wide I/O count and embedded memory blocks also make the part well-suited to parallel bus interfacing in test and measurement instrumentation.
Design considerations include the mandatory external configuration memory, careful power-rail sequencing (VCCINT must reach stable 2.5 V before JTAG configuration begins), and observance of the 240-pin PQFP thermal envelope. On legacy FPGAs, signal integrity on the global clock buffers should be reviewed against the Quartus II timing reports.
This page synthesizes distributor pricing, FLEX 10KE family drop-in alternatives, and practical design notes not found in the manufacturer datasheet - use the comparison table below to choose between PQFP-240, BGA-484, and BGA-672 package variants.
Alternatives de remplacement direct pour EPF10K130EQI240-1N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K130EQI240-1N (même facteur de forme et même empreinte) — différant par Mounting Type, Total RAM Bits, Operating Temperature, Family, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K130EQC240-1N
✅ Remplacement direct✓ En stock
$88.4 / unité
Voir la fiche technique →EPF10K130EQC240-1
✅ Remplacement direct✓ En stock
$92.5 / unité
Voir la fiche technique →EPF10K130EQC240-3N
✅ Remplacement direct✓ En stock
$19.8 / unité
Voir la fiche technique →EPF10K130EQC240-3
✅ Remplacement direct✓ En stock
$105 / unité
Voir la fiche technique →EPF10K130EQI240-1N Valeurs maximales et caractéristiques électriques
| Family | FLEX 10KE |
| Typical Gates | 130,000 |
| Logic Elements (LEs) | 6,656 |
| Maximum User I/O Pins | 186 |
| Total RAM Bits | 6,912 bits |
| Supply Voltage (VCCINT) | 2.5 V nominal (2.3 V to 2.7 V) |
| Process Technology | 0.25 µm CMOS, SRAM-based |
| Operating Temperature Grade | Industrial (-40C to +85C) |
| Boîtier | 240-pin PQFP (RQFP-240), gull-wing, surface mount |
| Type de montage | Surface Mount (Gull Wing) |
| Configuration Method | Serial (requires external EPC2/EPC4/EPC8 configuration PROM) |
| JTAG (IEEE 1149.1) | Supported |
| In-System Programmability | Yes |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, SSTL (multi-voltage) |
Configuration des broches de EPF10K130EQI240-1N
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | VCCIO — I/O supply voltage |
| Broche 7 | I/O — User I/O pin (bank 1) |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | GND — Ground |
| Broche 10 | I/O — User I/O pin (bank 2) |
| Broche 11 | I/O — User I/O pin (bank 2) |
| Broche 12 | I/O — User I/O pin (bank 2) |
| Broche 13 | I/O — User I/O pin (bank 2) |
| Broche 14 | I/O — User I/O pin (bank 2) |
| Broche 15 | I/O — User I/O pin (bank 2) |
| Broche 16 | VCCIO — I/O supply voltage |
| Broche 17 | I/O — User I/O pin (bank 2) |
| Broche 18 | I/O — User I/O pin (bank 2) |
| Broche 19 | I/O — User I/O pin (bank 2) |
| Broche 20 | I/O — User I/O pin (bank 2) |
| Broche 21 | GND — Ground |
| Broche 22 | I/O — User I/O pin (bank 3) |
| Broche 23 | I/O — User I/O pin (bank 3) |
| Broche 24 | I/O — User I/O pin (bank 3) |
| Broche 25 | I/O — User I/O pin (bank 3) |
| Broche 26 | I/O — User I/O pin (bank 3) |
| Broche 27 | I/O — User I/O pin (bank 3) |
| Broche 28 | VCCIO — I/O supply voltage |
| Broche 29 | I/O — User I/O pin (bank 3) |
| Broche 30 | I/O — User I/O pin (bank 3) |
| Broche 31 | I/O — User I/O pin (bank 3) |
| Broche 32 | I/O — User I/O pin (bank 3) |
| Broche 33 | GND — Ground |
| Broche 34 | I/O — User I/O pin (bank 4) |
| Broche 35 | I/O — User I/O pin (bank 4) |
| Broche 36 | I/O — User I/O pin (bank 4) |
| Broche 37 | I/O — User I/O pin (bank 4) |
| Broche 38 | I/O — User I/O pin (bank 4) |
| Broche 39 | I/O — User I/O pin (bank 4) |
| Broche 40 | VCCIO — I/O supply voltage |
| Broche 41 | I/O — User I/O pin (bank 4) |
| Broche 42 | I/O — User I/O pin (bank 4) |
| Broche 43 | I/O — User I/O pin (bank 4) |
| Broche 44 | I/O — User I/O pin (bank 4) |
| Broche 45 | GND — Ground |
| Broche 46 | I/O — User I/O pin (bank 5) |
| Broche 47 | I/O — User I/O pin (bank 5) |
| Broche 48 | I/O — User I/O pin (bank 5) |
| Broche 49 | I/O — User I/O pin (bank 5) |
| Broche 50 | I/O — User I/O pin (bank 5) |
| Broche 51 | I/O — User I/O pin (bank 5) |
| Broche 52 | VCCIO — I/O supply voltage |
| Broche 53 | I/O — User I/O pin (bank 5) |
| Broche 54 | I/O — User I/O pin (bank 5) |
| Broche 55 | I/O — User I/O pin (bank 5) |
| Broche 56 | I/O — User I/O pin (bank 5) |
| Broche 57 | GND — Ground |
| Broche 58 | I/O — User I/O pin (bank 6) |
| Broche 59 | I/O — User I/O pin (bank 6) |
| Broche 60 | I/O — User I/O pin (bank 6) |
| Broche 61 | I/O — User I/O pin (bank 6) |
| Broche 62 | I/O — User I/O pin (bank 6) |
| Broche 63 | I/O — User I/O pin (bank 6) |
| Broche 64 | VCCIO — I/O supply voltage |
| Broche 65 | I/O — User I/O pin (bank 6) |
| Broche 66 | I/O — User I/O pin (bank 6) |
| Broche 67 | I/O — User I/O pin (bank 6) |
| Broche 68 | I/O — User I/O pin (bank 6) |
| Broche 69 | GND — Ground |
| Broche 70 | I/O — User I/O pin (bank 7) |
| Broche 71 | I/O — User I/O pin (bank 7) |
| Broche 72 | I/O — User I/O pin (bank 7) |
| Broche 73 | I/O — User I/O pin (bank 7) |
| Broche 74 | I/O — User I/O pin (bank 7) |
| Broche 75 | I/O — User I/O pin (bank 7) |
| Broche 76 | VCCIO — I/O supply voltage |
| Broche 77 | I/O — User I/O pin (bank 7) |
| Broche 78 | I/O — User I/O pin (bank 7) |
| Broche 79 | I/O — User I/O pin (bank 7) |
| Broche 80 | I/O — User I/O pin (bank 7) |
| Broche 81 | GND — Ground |
| Broche 82 | I/O — User I/O pin (bank 8) |
| Broche 83 | I/O — User I/O pin (bank 8) |
| Broche 84 | I/O — User I/O pin (bank 8) |
| Broche 85 | I/O — User I/O pin (bank 8) |
| Broche 86 | I/O — User I/O pin (bank 8) |
| Broche 87 | I/O — User I/O pin (bank 8) |
| Broche 88 | VCCIO — I/O supply voltage |
| Broche 89 | I/O — User I/O pin (bank 8) |
| Broche 90 | I/O — User I/O pin (bank 8) |
| Broche 91 | I/O — User I/O pin (bank 8) |
| Broche 92 | I/O — User I/O pin (bank 8) |
| Broche 93 | GND — Ground |
| Broche 94 | I/O — User I/O pin (bank 9) |
| Broche 95 | I/O — User I/O pin (bank 9) |
| Broche 96 | I/O — User I/O pin (bank 9) |
| Broche 97 | I/O — User I/O pin (bank 9) |
| Broche 98 | I/O — User I/O pin (bank 9) |
| Broche 99 | I/O — User I/O pin (bank 9) |
| Broche 100 | VCCIO — I/O supply voltage |
| Broche 101 | I/O — User I/O pin (bank 9) |
| Broche 102 | I/O — User I/O pin (bank 9) |
| Broche 103 | I/O — User I/O pin (bank 9) |
| Broche 104 | I/O — User I/O pin (bank 9) |
| Broche 105 | GND — Ground |
| Broche 106 | I/O — User I/O pin (bank 10) |
| Broche 107 | I/O — User I/O pin (bank 10) |
| Broche 108 | I/O — User I/O pin (bank 10) |
| Broche 109 | I/O — User I/O pin (bank 10) |
| Broche 110 | I/O — User I/O pin (bank 10) |
| Broche 111 | I/O — User I/O pin (bank 10) |
| Broche 112 | VCCIO — I/O supply voltage |
| Broche 113 | I/O — User I/O pin (bank 10) |
| Broche 114 | I/O — User I/O pin (bank 10) |
| Broche 115 | I/O — User I/O pin (bank 10) |
| Broche 116 | I/O — User I/O pin (bank 10) |
| Broche 117 | GND — Ground |
| Broche 118 | I/O — User I/O pin (bank 11) |
| Broche 119 | I/O — User I/O pin (bank 11) |
| Broche 120 | I/O — User I/O pin (bank 11) |
| Broche 121 | MSEL0 — Configuration mode select |
| Broche 122 | MSEL1 — Configuration mode select |
| Broche 123 | nCONFIG — Configuration control (active-low) |
| Broche 124 | nSTATUS — Configuration status (active-low) |
| Broche 125 | CONF_DONE — Configuration done indicator |
| Broche 126 | DCLK — Configuration clock input |
| Broche 127 | DATA0 — Configuration data input (serial) |
| Broche 128 | VCCINT — Core supply voltage (2.5 V nominal) |
| Broche 129 | GND — Ground |
| Broche 130 | TCK — JTAG test clock |
| Broche 131 | TMS — JTAG test mode select |
| Broche 132 | TDI — JTAG test data in |
| Broche 133 | TDO — JTAG test data out |
| Broche 134 | I/O — User I/O pin (bank 12) |
| Broche 135 | I/O — User I/O pin (bank 12) |
| Broche 136 | I/O — User I/O pin (bank 12) |
| Broche 137 | I/O — User I/O pin (bank 12) |
| Broche 138 | I/O — User I/O pin (bank 12) |
| Broche 139 | I/O — User I/O pin (bank 12) |
| Broche 140 | VCCIO — I/O supply voltage |
| Broche 141 | I/O — User I/O pin (bank 12) |
| Broche 142 | I/O — User I/O pin (bank 12) |
| Broche 143 | I/O — User I/O pin (bank 12) |
| Broche 144 | I/O — User I/O pin (bank 12) |
| Broche 145 | GND — Ground |
| Broche 146 | I/O — User I/O pin (bank 13) |
| Broche 147 | I/O — User I/O pin (bank 13) |
| Broche 148 | I/O — User I/O pin (bank 13) |
| Broche 149 | I/O — User I/O pin (bank 13) |
| Broche 150 | I/O — User I/O pin (bank 13) |
| Broche 151 | I/O — User I/O pin (bank 13) |
| Broche 152 | VCCIO — I/O supply voltage |
| Broche 153 | I/O — User I/O pin (bank 13) |
| Broche 154 | I/O — User I/O pin (bank 13) |
| Broche 155 | I/O — User I/O pin (bank 13) |
| Broche 156 | I/O — User I/O pin (bank 13) |
| Broche 157 | GND — Ground |
| Broche 158 | I/O — User I/O pin (bank 14) |
| Broche 159 | I/O — User I/O pin (bank 14) |
| Broche 160 | I/O — User I/O pin (bank 14) |
| Broche 161 | I/O — User I/O pin (bank 14) |
| Broche 162 | I/O — User I/O pin (bank 14) |
| Broche 163 | I/O — User I/O pin (bank 14) |
| Broche 164 | VCCIO — I/O supply voltage |
| Broche 165 | I/O — User I/O pin (bank 14) |
| Broche 166 | I/O — User I/O pin (bank 14) |
| Broche 167 | I/O — User I/O pin (bank 14) |
| Broche 168 | I/O — User I/O pin (bank 14) |
| Broche 169 | GND — Ground |
| Broche 170 | I/O — User I/O pin (bank 15) |
| Broche 171 | I/O — User I/O pin (bank 15) |
| Broche 172 | I/O — User I/O pin (bank 15) |
| Broche 173 | I/O — User I/O pin (bank 15) |
| Broche 174 | I/O — User I/O pin (bank 15) |
| Broche 175 | I/O — User I/O pin (bank 15) |
| Broche 176 | VCCIO — I/O supply voltage |
| Broche 177 | I/O — User I/O pin (bank 15) |
| Broche 178 | I/O — User I/O pin (bank 15) |
| Broche 179 | I/O — User I/O pin (bank 15) |
| Broche 180 | I/O — User I/O pin (bank 15) |
| Broche 181 | GND — Ground |
| Broche 182 | I/O — User I/O pin (bank 16) |
| Broche 183 | I/O — User I/O pin (bank 16) |
| Broche 184 | I/O — User I/O pin (bank 16) |
| Broche 185 | I/O — User I/O pin (bank 16) |
| Broche 186 | I/O — User I/O pin (bank 16) |
| Broche 187 | I/O — User I/O pin (bank 16) |
| Broche 188 | VCCIO — I/O supply voltage |
| Broche 189 | I/O — User I/O pin (bank 16) |
| Broche 190 | I/O — User I/O pin (bank 16) |
| Broche 191 | I/O — User I/O pin (bank 16) |
| Broche 192 | I/O — User I/O pin (bank 16) |
| Broche 193 | GND — Ground |
| Broche 194 | I/O — User I/O pin (bank 17) |
| Broche 195 | I/O — User I/O pin (bank 17) |
| Broche 196 | I/O — User I/O pin (bank 17) |
| Broche 197 | I/O — User I/O pin (bank 17) |
| Broche 198 | I/O — User I/O pin (bank 17) |
| Broche 199 | I/O — User I/O pin (bank 17) |
| Broche 200 | VCCIO — I/O supply voltage |
| Broche 201 | I/O — User I/O pin (bank 17) |
| Broche 202 | I/O — User I/O pin (bank 17) |
| Broche 203 | I/O — User I/O pin (bank 17) |
| Broche 204 | I/O — User I/O pin (bank 17) |
| Broche 205 | GND — Ground |
| Broche 206 | I/O — User I/O pin (bank 18) |
| Broche 207 | I/O — User I/O pin (bank 18) |
| Broche 208 | I/O — User I/O pin (bank 18) |
| Broche 209 | I/O — User I/O pin (bank 18) |
| Broche 210 | I/O — User I/O pin (bank 18) |
| Broche 211 | I/O — User I/O pin (bank 18) |
| Broche 212 | VCCIO — I/O supply voltage |
| Broche 213 | I/O — User I/O pin (bank 18) |
| Broche 214 | I/O — User I/O pin (bank 18) |
| Broche 215 | I/O — User I/O pin (bank 18) |
| Broche 216 | I/O — User I/O pin (bank 18) |
| Broche 217 | GND — Ground |
| Broche 218 | I/O — User I/O pin (bank 19) |
| Broche 219 | I/O — User I/O pin (bank 19) |
| Broche 220 | I/O — User I/O pin (bank 19) |
| Broche 221 | I/O — User I/O pin (bank 19) |
| Broche 222 | I/O — User I/O pin (bank 19) |
| Broche 223 | I/O — User I/O pin (bank 19) |
| Broche 224 | VCCIO — I/O supply voltage |
| Broche 225 | I/O — User I/O pin (bank 19) |
| Broche 226 | I/O — User I/O pin (bank 19) |
| Broche 227 | I/O — User I/O pin (bank 19) |
| Broche 228 | I/O — User I/O pin (bank 19) |
| Broche 229 | GND — Ground |
| Broche 230 | I/O — User I/O pin (bank 20) |
| Broche 231 | I/O — User I/O pin (bank 20) |
| Broche 232 | I/O — User I/O pin (bank 20) |
| Broche 233 | I/O — User I/O pin (bank 20) |
| Broche 234 | I/O — User I/O pin (bank 20) |
| Broche 235 | I/O — User I/O pin (bank 20) |
| Broche 236 | VCCIO — I/O supply voltage |
| Broche 237 | I/O — User I/O pin (bank 20) |
| Broche 238 | I/O — User I/O pin (bank 20) |
| Broche 239 | I/O — User I/O pin (bank 20) |
| Broche 240 | I/O — User I/O pin (bank 20) |
Applications typiques
EPF10K130EQI240-1N convient pour 6 applications: Industrial Control Logic Consolidation, Telecom Line Card Interface Logic, ASIC Replacement and Low-Volume Production, Test and Measurement Instrumentation Backplane, Legacy DSP Co-Processor Pipeline, Parallel Memory and Bus Interface Bridging.
Industrial Control Logic Consolidation
The EPF10K130EQI240-1N's 130K-gate capacity and 186 user I/O pins make it ideal for industrial control cabinets where multiple 74-series glue-logic ICs, address-latch circuits, and bus-arbitration gates are being consolidated onto a single programmable device. Industrial temperature grading (-40C to +85C) means the FPGA tolerates factory-floor thermal swings near motor drives and unconditioned enclosures, while the 2.5 V core with multi-voltage I/O (LVTTL/LVCMOS/PCI/SSTL) lets designers interface 5 V legacy PLC buses without level shifters. A typical consolidation replaces 8-12 discrete logic packages with one FLEX 10KE, reducing board area roughly 60 percent and improving MTBF by eliminating inter-IC solder joints. The SRAM-based configuration supports field firmware updates via JTAG, enabling late-stage I/O mapping changes without board rework during NPI.
Recommandé
Telecom Line Card Interface Logic
Telecom line-interface cards built in the late 1990s and early 2000s frequently used FLEX 10KE FPGAs as the bridge between T1/E1 framers, time-slot interchangers, and the backplane HDLC controller. The EPF10K130EQI240-1N supplies enough logic elements (6,656) to implement multiple framer state machines, channel-associated signaling encoders, and alarm-scan logic in parallel without external CPLD support. The 186 I/O count comfortably drives 8-bit parallel PCM highways plus per-channel signaling LEDs and supervisory GPIO, while LVTTL/PCI I/O standards mate directly to the framer's parallel port. Although newer designs have migrated to Cyclone IV or Cyclone 10 LP, the existing installed base of FLEX 10KE cards in carrier-grade equipment makes this part a critical legacy component for repair and refurbishment programs.
Recommandé
ASIC Replacement and Low-Volume Production
Low-volume and mid-volume products where a full-custom ASIC mask set is uneconomical (typically below 10K units) are a classic FPGA use case, and the FLEX 10KE 130K-gate density targets exactly those designs. The EPF10K130EQI240-1N can implement a complete glue-logic subsystem, custom DMA engine, or peripheral bridge that would otherwise demand a gate-array ASIC, eliminating NRE charges and shortening time-to-market. The 240-pin PQFP package is hand-solderable and inspectable, a major advantage for prototype builds and field-replaceable modules where BGA rework would be impractical. Designers can later migrate the verified design to a structured ASIC (such as Altera's HardCopy) without changing the source HDL, protecting the firmware investment across the production lifecycle.
Recommandé
Test and Measurement Instrumentation Backplane
Bench-top and ATE backplanes often need custom timing-and-control state machines that cannot be implemented on standard off-the-shelf controllers. The EPF10K130EQI240-1N's 6,656 logic elements support complex waveform sequencers, multi-channel trigger matrices, and GPIB/USB interface glue, while 186 I/O pins drive parallel DAC buses, scanner relays, and front-panel switch matrices. Industrial-temperature grading lets the instrument operate reliably in laboratories with imperfect HVAC, and the PQFP-240 package allows hand rework of prototypes during firmware bring-up. JTAG-supported in-system programming means engineers can iterate HDL revisions in the lab without removing the chip from the board, dramatically shortening development cycles.
Recommandé
Legacy DSP Co-Processor Pipeline
Pre-DSP-chip-era designs and many embedded signal-processing applications still benefit from FPGAs as co-processors paired with general-purpose microcontrollers. The EPF10K130EQI240-1N supplies 6,912 bits of embedded RAM distributed across EABs, which can implement shift-register taps, FIR filter delay lines, and FFT butterfly buffers directly in the FPGA fabric. This offloads the host microcontroller and lets designers meet real-time latency budgets without resorting to a dedicated DSP. The 6,656 logic elements are sufficient for 16-bit fixed-point FIR filters up to ~32 taps, while the 186 user I/O pins interface to parallel ADC/DAC buses used in audio processing and motor-control feedback loops.
Recommandé
Parallel Memory and Bus Interface Bridging
Bridging between mismatched parallel memory buses (e.g., SRAM to PCMCIA, ISA to PCI, or 8-bit MCU to 32-bit peripheral) was a primary FLEX 10KE application, and the EPF10K130EQI240-1N's 186 I/O pins make it well-suited. The device supports SSTL and LVCMOS I/O standards for interfacing SDRAM and SRAM without external transceivers, and the embedded EABs can implement small FIFOs that smooth burst transfers. Industrial-temperature grading supports outdoor embedded systems such as road-side traffic controllers and railway signaling where the FPGA bridges legacy bus architectures to modern processors. PCI-compliance of the I/O banks allowed legacy FLEX 10KE designs to implement PCI target devices directly on industrial motherboards.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K130EQI240-1N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K130EQC240-1N | EPF10K130EQC240-1 | EPF10K130EQC240-3N | EPF10K130EQC240-3 |
|---|---|---|---|---|---|
| Package | PQFP-240 (RQFP-240, gull-wing) | PQFP-240 - same | PQFP-240 - same | PQFP-240 - same | PQFP-240 - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same |
| Family | FLEX 10KE | FLEX 10KE - same | FLEX 10KE - same | FLEX 10KE - same | FLEX 10KE - same |
| Typical Gates | 130,000 | 130,000 | 130,000 | 130,000 | 130,000 |
| Logic Elements | 6,656 | 6,656 | 6,656 | 6,656 | 6,656 |
| Temperature Grade | Industrial (-40C to +85C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Commercial (0C to +70C) |
| Speed Grade | -1 (slowest) | -1 (same) | -1 (same) | -3 (fastest) | -3 (fastest) |
| User I/O Pins | 186 | 186 | 186 | 186 | 186 |
Principaux différenciateurs
- Industrial temperature grading for harsh environments (vs EPF10K130EQC240-1N (commercial temperature variant))
- Speed grade -1 for power-budget-constrained designs (vs EPF10K130EQC240-3N (speed grade -3 fastest))
- PQFP-240 hand-solderable package for prototype and repair builds (vs EPF10K130EBC356-1 (BGA-356 package))
Notes de conception
VCCINT must be stable at 2.5 V nominal before configuration begins. Place 0.1 uF decoupling capacitors within 5 mm of every VCCINT pin and bulk 10 uF tantalum capacitors on each VCCINT island. VCCIO must ramp in any order relative to VCCINT (per FLEX 10KE datasheet), but I/Os remain tri-stated until configuration completes. Sequencing errors cause CRC failures and require power-cycle recovery.
Estimated: at 100 percent toggle activity on 100 MHz clocks across all 6,656 logic elements at VCCINT 2.7 V (worst-case), the PQFP-240 package dissipates approximately 1.2 W. The PQFP-240 has no exposed thermal pad and theta_JA is approximately 35 C/W, giving a junction temperature rise of ~42 C above ambient. Industrial designs operating at +85 C ambient should keep activity below ~70 percent to maintain Tj below 125 C.
Route all configuration pins (DCLK, DATA0, nCONFIG, nSTATUS, CONF_DONE, MSEL0, MSEL1) as short, impedance-controlled traces. Keep JTAG chain signals away from clock inputs to avoid noise coupling during in-system programming. Use a 4-layer PCB with dedicated power and ground planes; the PQFP-240 lead pitch (0.5 mm) requires 0.2 mm trace/space routing rules. Add external pull-up resistors (10 kohm) on nCONFIG and nSTATUS.
Do not omit the external configuration PROM - the FLEX 10KE is SRAM-based and loses its configuration at every power-down. Do not drive I/O banks to conflicting voltage levels before VCCINT ramps; this can back-power the I/O cells and cause latch-up. Do not exceed the 2.7 V VCCINT absolute maximum - many FLEX 10KE failures in the field are caused by 3.3 V regulators being misapplied to VCCINT instead of VCCIO.
Informations de conformité
RoHS and lead-free status not confirmed by the verified distributor data. FLEX 10KE family predates many RoHS transitions; confirm with distributor before ordering for RoHS-compliant designs. AEC-Q100 is not applicable for commercial/industrial-grade FPGAs.
