EPF10K130EQI240-2 - FLEX 10KE FPGA, 130K Gates, 240-PQFP | Intel / Altera
Référence : EPF10K130EQI240-2 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $132.5 | $1 325,00 |
| 100 | $118 | $11 800,00 |
| 500 | $102 | $51 000,00 |
| 1 000 | $89.5 | $89 500,00 |
EPF10K130EQI240-2 Présentation
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built from a matrix of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that engineers can program after manufacturing to implement arbitrary digital logic. Within the programmable logic hierarchy, FPGAs sit above CPLDs and below ASICs in terms of density, power efficiency, and per-unit cost at volume. The FLEX 10KE family specifically combines fine-grained logic with embedded array blocks (EABs) that can be configured as RAM, ROM, or multiplier primitives, making the device suitable for designs that require both random logic and on-chip memory.
Key features of the EPF10K130EQI240-2 include 342,000 maximum system gates, 65,536 RAM bits distributed across embedded array blocks, 4 dedicated input pins plus clock and clear control pins, in-system programmability via the IEEE 1149.1 (JTAG) boundary-scan interface, and multi-volt I/O support (5.0V, 3.3V, 2.5V). The industrial-grade -2 speed grade and -40C to +85C operating range make the part suitable for commercial and industrial environments rather than full automotive qualification.
The EPF10K130EQI240-2 uses a 0.22 um SRAM process with a 4-input look-up table (LUT) architecture per logic element, with cascade chains and fast carry chains for arithmetic functions. Built-in PCI compliance and a low-skew global clock network with up to 8 clock pins allow the device to address both peripheral-controller and datapath-intensive designs without external PLDs.
Typical applications include telecommunications line-card glue logic, industrial control and instrumentation backplanes, PCI bus interfaces, custom datapath accelerators, and legacy system emulation. The PQFP-240 footprint is well suited for through-hole-compatible surface-mount prototyping and rework on existing 10K designs.
When designing with this device, ensure that the Quartus II or MAX+PLUS II toolchain matches the device code (EPF10K130E) and speed grade (-2). Designers transitioning to newer Cyclone or MAX families should treat FLEX 10KE as a mature, last-time-buy risk and verify long-term availability before new designs.
This page synthesizes distributor stock, drop-in alternatives from the same Altera FLEX 10KE family, lifecycle status, and practical design notes not consolidated in the manufacturer datasheet PDF.
Alternatives de remplacement direct pour EPF10K130EQI240-2 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K130EQI240-2 (même facteur de forme et même empreinte) — différant par Total RAM Bits, Family, Operating Temperature, Mounting Type, Configuration Method.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K130EQI240-2N
✅ Remplacement direct✓ En stock
$60 / unité
Voir la fiche technique →EPF10K130EQI240-1N
✅ Remplacement direct✓ En stock
$19.85 / unité
Voir la fiche technique →EPF10K130EQC240-3N
✅ Remplacement direct✓ En stock
$19.8 / unité
Voir la fiche technique →EPF10K130EQC240-3
✅ Remplacement direct✓ En stock
$105 / unité
Voir la fiche technique →EPF10K130EQC240-1
✅ Remplacement direct✓ En stock
$92.5 / unité
Voir la fiche technique →EPF10K100EQI240-2
✅ Remplacement direct✓ En stock
$7.1 / unité
Voir la fiche technique →EPF10K130EQI240-2 Valeurs maximales et caractéristiques électriques
| Series | FLEX 10KE |
| Family | FLEX 10KE (SRAM-based FPGA) |
| Number of Logic Elements / Cells | 6656 |
| Number of LABs / CLBs | 832 |
| Total RAM Bits | 65536 |
| Typical Gates | 130000 |
| Maximum System Gates | 342000 |
| Number of User I/O | 186 |
| Number of Gates | 342000 |
| Voltage Supply | 5.0 V core, multi-volt I/O (5.0V / 3.3V / 2.5V) |
| Température de fonctionnement | -40C to +85C |
| Type de montage | Surface Mount (PQFP with gull-wing leads) |
| Boîtier / Format | 240-BFQFP (PQFP-240) |
| Speed Grade | -2 |
| Programmability Type | SRAM, in-system programmable via JTAG (IEEE 1149.1) |
| Statut RoHS | Compliant |
Guide de configuration des broches du EPF10K130EQI240-2 240-bfqfp (pqfp-240)
Configuration des broches du EPF10K130EQI240-2 (boîtier 240-bfqfp (pqfp-240)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EPF10K130EQI240-2.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EPF10K130EQI240-2 convient pour 6 applications: Telecommunications Line-Card Glue Logic, Industrial Control and Instrumentation Backplanes, PCI Bus Interface and Bridging, Custom Datapath Accelerators, Legacy System Emulation and IP Replacement, Test and Measurement Equipment Front-Ends.
Telecommunications Line-Card Glue Logic
The EPF10K130EQI240-2 is well-suited to telecommunications line-card glue logic because its 6,656 logic elements and 832 LABs provide enough capacity to bridge backplane buses (e.g., UTOPIA, H.110) to framer ICs while the 186 user I/O pins in the 240-BFQFP package support the wide parallel interfaces typical of legacy TDM architectures. According to the FLEX 10KE datasheet, the embedded array blocks can be configured as dual-port RAM up to 65,536 bits, allowing designers to consolidate small FIFOs and look-up tables without an external SRAM, which reduces board area on dense line cards. Multi-volt I/O (5.0V / 3.3V / 2.5V) lets the FPGA bridge directly to mixed-voltage framers and PHYs without level shifters, simplifying the BOM. The -2 speed grade and 5.0V core are adequate for sub-100 MHz bus interfaces typical of legacy telecom designs.
Recommandé
Industrial Control and Instrumentation Backplanes
In industrial control backplanes, the EPF10K130EQI240-2 acts as a customizable I/O concentrator and protocol translator, mapping legacy parallel buses (VME, ISA-style) onto modern serial links or DSP front ends. The -40C to +85C industrial operating range per the GlobalSpec datasheet entry makes the device viable for factory-floor enclosures, and the PQFP-240 footprint with gull-wing leads supports through-hole-style rework which is convenient in low-volume industrial retrofits. Designers rely on the FLEX 10KE's fast carry chain for counter and PWM generation, and the 186 I/O pins are sufficient to absorb 16-bit data plus 16-bit address plus chip-select signals typical of PLC backplanes. The 65,536 bits of embedded RAM are often used as buffer storage between asynchronous industrial sensor buses and the host CPU.
Recommandé
PCI Bus Interface and Bridging
The EPF10K130EQI240-2 implements PCI-compliant bus interfaces directly, a common use case for the FLEX 10KE family which is documented as PCI-compliant in the Altera datasheet. Designers use 186 user I/O pins to expose 32-bit PCI bus plus sideband signals (REQ#, GNT#, FRAME#, IRDY#, TRDY#, etc.) and to add a downstream local bus for legacy peripherals. The 6,656 logic elements comfortably fit a 33 MHz PCI target or master state machine plus DMA engine, while the 65,536 bits of embedded RAM serve as line buffers. The 240-BFQFP package provides the pin count required for full 32-bit PCI implementations including the 64-bit extension signals, making the part a cost-effective bridge between PCI hosts and ASIC peripherals.
Recommandé
Custom Datapath Accelerators
For custom datapath accelerators (image processing pipelines, encryption engines, DSP pre-processing), the EPF10K130EQI240-2 combines 6,656 4-input LUT logic elements with cascade chains and fast carry chains to implement wide adders, multipliers, and shift registers at 50-80 MHz typical clock rates. The 65,536-bit embedded array can be configured as ROM for coefficient storage or as dual-port RAM for line buffers, which is essential for streaming video or communication pipelines. Designers can instantiate 186 I/O pins to interface to external SRAM/DRAM banks for larger working sets. Compared with newer Cyclone IV GX parts, the FLEX 10KE trades power efficiency for 5.0V tolerance, which can simplify integration with legacy analog front ends.
Recommandé
Legacy System Emulation and IP Replacement
The EPF10K130EQI240-2 is widely used to emulate discontinued ASICs, gate arrays, or obsolete PLDs in long-lifecycle programs (military, aerospace sustainment, medical instrumentation). Because the FLEX 10KE is SRAM-based, the design can be re-targeted without respinning the board, which is invaluable when the original silicon is no longer available. The 240-BFQFP footprint and pinout match other FLEX 10K130E variants, allowing engineering teams to swap speed grades or temperature grades without PCB rework. JTAG-based in-system programmability via the IEEE 1149.1 boundary-scan interface simplifies field updates on deployed systems. The 342,000 maximum system gates provide headroom to absorb minor functional creep during emulation cycles.
Recommandé
Test and Measurement Equipment Front-Ends
Test and measurement instruments (logic analyzers, protocol analyzers, ATE pin electronics) use the EPF10K130EQI240-2 to provide reconfigurable stimulus/response logic at the device under test (DUT) interface. With 186 user I/O pins, the FPGA can drive or sample dozens of channels simultaneously, while the 65,536-bit embedded array serves as capture memory between trigger events and host readback. The 5.0V tolerance is useful when probing older TTL or CMOS DUTs that cannot be level-shifted down to 3.3V. Designers can use the FLEX 10KE's PCI compliance to plug the instrument directly into a PC backplane, and the -2 speed grade supports 50-66 MHz state machines adequate for parallel bus protocol analysis.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K130EQI240-2 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K130EQI240-2N | EPF10K130EQI240-1N | EPF10K130EQC240-3N | EPF10K130EQC240-3 | EPF10K130EQC240-1 | EPF10K100EQI240-2 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 240-BFQFP (PQFP-240) | 240-BFQFP - same | 240-BFQFP - same | 240-BFQFP - same | 240-BFQFP - same | 240-BFQFP - same | 240-BFQFP - same |
| Logic Elements | 6656 | 6656 | 6656 | 6656 | 6656 | 6656 | 4992 |
| Maximum System Gates | 342000 | 342000 | 342000 | 342000 | 342000 | 342000 | 256000 |
| Total RAM Bits | 65536 | 65536 | 65536 | 65536 | 65536 | 65536 | 40960 |
| User I/O | 186 | 186 | 186 | 186 | 186 | 186 | 189 |
| Speed Grade | -2 | -2 | -1 (faster) | -3 (slower) | -3 (slower) | -1 (faster) | -2 |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +85C |
| Lead-Free (RoHS) | unknown | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | unknown | unknown | unknown |
Principaux différenciateurs
- Highest-density 240-BFQFP member of the FLEX 10KE family at this speed grade (vs EPF10K100EQI240-2)
- RoHS-compliant lead-free variant available in the same footprint (vs EPF10K130EQI240-2N)
- Faster speed-grade drop-in available when timing closure is tight (vs EPF10K130EQI240-1N)
Notes de conception
Do not assume the EPF10K130EQI240-2 is in production. As of 2026-09-11, the part is marked Obsolete (EOL) in the GlobalSpec datasheet directory, so any new design must include a lifetime-buy or migration plan to a Cyclone IV / Cyclone 10 LP equivalent. Engineers maintaining deployed systems should verify date-code acceptance with procurement to avoid receiving parts outside their quality window.
The 240-BFQFP package uses 0.5 mm pitch gull-wing leads and requires careful PCB layout to avoid solder bridging. Use a 1 oz copper pour on outer layers with thermal relief on the central power pad region, and follow the Altera-recommended land pattern from the FLEX 10KE package specification. Allow generous keep-out around the lead rows for the AOI head during inspection. Estimated: the package body is approximately 32 x 32 mm; verify exact dimensions against the Intel package outline drawing before finalizing the board layout.
The EPF10K130EQI240-2 requires a 5.0V core supply plus a separate VCCIO rail configurable to 5.0V, 3.3V, or 2.5V depending on the I/O bank configuration. Decouple each VCC/VCCIO pin with a 0.1 uF ceramic plus a 10 uF bulk capacitor placed within 5 mm of the pin, and route power planes on dedicated inner layers to minimize inductance. Estimated: at 100 MHz toggle rate and 50% utilization, the device can draw 0.5-1.0 A from VCC, so the regulator must supply at least 1.5 A peak for safe margin.
Informations de conformité
RoHS compliance is not stated in the verified web data; the EPF10K130EQI240-2N variant is the canonical lead-free / RoHS option per DigiKey listing. AEC-Q100 qualification is not applicable - the part is industrial-grade, not automotive-grade. All compliance fields beyond the RoHS variant suffix are unknown as of 2026-09-11 and should be confirmed with Intel / Altera legacy documentation before RoHS-critical assembly.
