EPF10K20TC144 - FLEX 10K FPGA, 20K Gates, 144-TQFP | Intel
Référence : EPF10K20TC144 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.95 | $2 895,00 |
| 500 | $24.1 | $12 050,00 |
| 1 000 | $20.75 | $20 750,00 |
EPF10K20TC144 Présentation
An FPGA (Field Programmable Gate Array) is a type of integrated circuit that contains an array of programmable logic blocks and interconnect pathways that can be configured by the end user to implement custom digital logic functions. FPGAs sit in the broader hierarchy of programmable logic devices (CPLD -> FPGA -> SoC FPGA) and semiconductor ICs, offering higher logic density and richer feature integration than CPLDs, while remaining more flexible than fixed-function ASICs. The FLEX 10K series was historically significant as one of the first devices to embed SRAM-based look-up tables alongside dedicated memory blocks, an architecture that became foundational to all modern FPGAs.
Key features of the EPF10K20TC144 include 1,152 logic elements distributed across 144 Logic Array Blocks (LABs), 12 Embedded Array Blocks providing up to 24,576 bits of RAM, and 102 user I/O pins. The device supports in-system programmability via the Altera ByteBlaster or BitBlaster interfaces through a dedicated JTAG chain, allowing rapid design iteration. Operating voltage is 5V, and the speed grade options (typically -3 or -4) determine maximum toggle frequencies of approximately 125 MHz.
The architecture combines a fine-grained logic fabric of 4-input look-up tables (LUTs) with coarse-grained EABs that can implement dual-port RAM, ROM, FIFO buffers, or arithmetic functions in a single block. This heterogeneous mix makes the FLEX 10K family well-suited to designs requiring both glue-logic and moderate on-chip memory, such as glue logic for microprocessors, custom peripheral controllers, and DSP pre-/post-processing.
Typical applications include glue-logic replacement for microprocessors and DSPs, custom interface bridging (e.g., PCI-to-local bus bridges), telecommunications line-card controllers, and industrial control logic. The 144-TQFP package supports surface-mount assembly and is widely accepted by both prototyping and production lines. Designers should note that this part is mature and may carry an NRND (Not Recommended for New Designs) lifecycle status.
A key design consideration is that the FLEX 10K family requires a 5V supply and uses SRAM-based configuration, meaning the design must be loaded from an external EPROM, flash, or microcontroller on every power-up. This contrasts with Antifuse-based competitors like the Xilinx XC4000 series, which are one-time programmable but offer faster wake-up. Designers migrating from the EPF10K20TC144 to newer Cyclone or MAX families should plan for I/O voltage and configuration scheme changes.
This page synthesizes distributor availability data, FLEX 10K family cross-reference options, and practical migration guidance not found in a single datasheet source.
Alternatives de remplacement direct pour EPF10K20TC144 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K20TC144 (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Configuration Method, Total RAM Bits, Logic Elements / Cells.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K20TC144-4N
✅ Remplacement direct✓ En stock
$52 / unité
Voir la fiche technique →EPF10K20TC144-4
✅ Remplacement direct✓ En stock
$18.95 / unité
Voir la fiche technique →EPF10K20TC144-3N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$20.85 / unité
Voir la fiche technique →EPF10K30TC144-4
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPF10K10TC144-4N
✅ Remplacement direct✓ En stock
$15.5 / unité
Voir la fiche technique →EPF10K100EQC240-2N
✅ Remplacement direct✓ En stock
$18.4 / unité
Voir la fiche technique →EPF10K20TC144 Valeurs maximales et caractéristiques électriques
| Series | FLEX 10K |
| Logic Elements | 1,152 |
| Typical Gates | 20,000 |
| Number of LABs | 144 |
| Number of EABs | 12 |
| Total EAB RAM Bits | 24,576 bits |
| User I/Os | 102 |
| Operating Voltage (Core) | 5 V |
| Package Type | TQFP-144 (Thin Quad Flat Pack) |
| Nombre de broches | 144 |
| Package Dimensions | 22 x 22 mm |
| Lead Pitch | 0.5 mm |
| Operating Temperature (Commercial) | 0 C to +70 C |
| Configuration Method | SRAM-based (volatile, requires external boot) |
| Type de montage | Surface Mount |
Configuration des broches de EPF10K20TC144
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | I/O — User I/O pin (bank 1) |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O pin (bank 1) |
| Broche 13 | I/O — User I/O pin (bank 1) |
| Broche 14 | I/O — User I/O pin (bank 1) |
| Broche 15 | I/O — User I/O pin (bank 1) |
| Broche 16 | I/O — User I/O pin (bank 1) |
| Broche 17 | I/O — User I/O pin (bank 1) |
| Broche 18 | I/O — User I/O pin (bank 1) |
| Broche 19 | VCCINT — Core supply voltage (5V) |
| Broche 20 | I/O — User I/O pin (bank 1) |
| Broche 21 | I/O — User I/O pin (bank 1) |
| Broche 22 | GND — Ground |
| Broche 23 | I/O — User I/O pin (bank 2) |
| Broche 24 | I/O — User I/O pin (bank 2) |
| Broche 25 | I/O — User I/O pin (bank 2) |
| Broche 26 | I/O — User I/O pin (bank 2) |
| Broche 27 | I/O — User I/O pin (bank 2) |
| Broche 28 | I/O — User I/O pin (bank 2) |
| Broche 29 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 30 | I/O — User I/O pin (bank 2) |
| Broche 31 | I/O — User I/O pin (bank 2) |
| Broche 32 | I/O — User I/O pin (bank 2) |
| Broche 33 | GND — Ground |
| Broche 34 | I/O — User I/O pin (bank 2) |
| Broche 35 | I/O — User I/O pin (bank 2) |
| Broche 36 | I/O — User I/O pin (bank 2) |
| Broche 37 | nCONFIG — Configuration control (active low) |
| Broche 38 | nSTATUS — Configuration status (active low) |
| Broche 39 | CONF_DONE — Configuration done indicator |
| Broche 40 | VCCINT — Core supply voltage (5V) |
| Broche 41 | DCLK — Configuration clock input |
| Broche 42 | DATA0 — Configuration data input |
| Broche 43 | I/O — User I/O pin (bank 3) |
| Broche 44 | I/O — User I/O pin (bank 3) |
| Broche 45 | I/O — User I/O pin (bank 3) |
| Broche 46 | I/O — User I/O pin (bank 3) |
| Broche 47 | I/O — User I/O pin (bank 3) |
| Broche 48 | I/O — User I/O pin (bank 3) |
| Broche 49 | GND — Ground |
| Broche 50 | I/O — User I/O pin (bank 3) |
| Broche 51 | I/O — User I/O pin (bank 3) |
| Broche 52 | I/O — User I/O pin (bank 3) |
| Broche 53 | I/O — User I/O pin (bank 3) |
| Broche 54 | I/O — User I/O pin (bank 3) |
| Broche 55 | I/O — User I/O pin (bank 3) |
| Broche 56 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 57 | I/O — User I/O pin (bank 3) |
| Broche 58 | I/O — User I/O pin (bank 3) |
| Broche 59 | I/O — User I/O pin (bank 3) |
| Broche 60 | GND — Ground |
| Broche 61 | I/O — User I/O pin (bank 4) |
| Broche 62 | I/O — User I/O pin (bank 4) |
| Broche 63 | I/O — User I/O pin (bank 4) |
| Broche 64 | I/O — User I/O pin (bank 4) |
| Broche 65 | I/O — User I/O pin (bank 4) |
| Broche 66 | I/O — User I/O pin (bank 4) |
| Broche 67 | VCCINT — Core supply voltage (5V) |
| Broche 68 | I/O — User I/O pin (bank 4) |
| Broche 69 | I/O — User I/O pin (bank 4) |
| Broche 70 | I/O — User I/O pin (bank 4) |
| Broche 71 | GND — Ground |
| Broche 72 | I/O — User I/O pin (bank 4) |
| Broche 73 | I/O — User I/O pin (bank 4) |
| Broche 74 | I/O — User I/O pin (bank 4) |
| Broche 75 | TDI — JTAG test data input |
| Broche 76 | TDO — JTAG test data output |
| Broche 77 | TMS — JTAG test mode select |
| Broche 78 | TCK — JTAG test clock |
| Broche 79 | I/O — User I/O pin (bank 4) |
| Broche 80 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 81 | I/O — User I/O pin (bank 4) |
| Broche 82 | I/O — User I/O pin (bank 5) |
| Broche 83 | I/O — User I/O pin (bank 5) |
| Broche 84 | I/O — User I/O pin (bank 5) |
| Broche 85 | I/O — User I/O pin (bank 5) |
| Broche 86 | GND — Ground |
| Broche 87 | I/O — User I/O pin (bank 5) |
| Broche 88 | I/O — User I/O pin (bank 5) |
| Broche 89 | I/O — User I/O pin (bank 5) |
| Broche 90 | I/O — User I/O pin (bank 5) |
| Broche 91 | I/O — User I/O pin (bank 5) |
| Broche 92 | I/O — User I/O pin (bank 5) |
| Broche 93 | VCCINT — Core supply voltage (5V) |
| Broche 94 | I/O — User I/O pin (bank 5) |
| Broche 95 | I/O — User I/O pin (bank 5) |
| Broche 96 | GND — Ground |
| Broche 97 | I/O — User I/O pin (bank 5) |
| Broche 98 | I/O — User I/O pin (bank 5) |
| Broche 99 | I/O — User I/O pin (bank 5) |
| Broche 100 | I/O — User I/O pin (bank 6) |
| Broche 101 | I/O — User I/O pin (bank 6) |
| Broche 102 | I/O — User I/O pin (bank 6) |
| Broche 103 | I/O — User I/O pin (bank 6) |
| Broche 104 | I/O — User I/O pin (bank 6) |
| Broche 105 | VCCIO5 — I/O bank 5 supply voltage |
| Broche 106 | I/O — User I/O pin (bank 6) |
| Broche 107 | I/O — User I/O pin (bank 6) |
| Broche 108 | I/O — User I/O pin (bank 6) |
| Broche 109 | GND — Ground |
| Broche 110 | I/O — User I/O pin (bank 6) |
| Broche 111 | I/O — User I/O pin (bank 6) |
| Broche 112 | I/O — User I/O pin (bank 6) |
| Broche 113 | I/O — User I/O pin (bank 6) |
| Broche 114 | I/O — User I/O pin (bank 6) |
| Broche 115 | I/O — User I/O pin (bank 6) |
| Broche 116 | VCCINT — Core supply voltage (5V) |
| Broche 117 | I/O — User I/O pin (bank 6) |
| Broche 118 | I/O — User I/O pin (bank 6) |
| Broche 119 | GND — Ground |
| Broche 120 |
Applications typiques
EPF10K20TC144 convient pour 7 applications: Microprocessor Glue Logic, Custom Peripheral Controllers, Telecommunications Line Card Interface, DSP Pre/Post-Processing Front-End, Industrial Control Logic, Prototype Logic Verification Platform, Legacy Avionics and Military Systems.
Microprocessor Glue Logic
The EPF10K20TC144 fits microprocessor glue-logic applications where custom address decoding, bus arbitration, wait-state generation, and interrupt controllers are required. Its 1,152 logic elements across 144 LABs provide ample capacity for typical 32-bit system glue, while the 12 EABs can implement dual-port FIFOs for bus buffering. Compared to discrete 74-series logic, the FLEX 10K reduces board area by 5-10x and allows last-minute design changes via SRAM reconfiguration. Designers typically run the part at 33 MHz to match PCI or local bus speeds and benefit from its 5V-tolerant I/O when interfacing with legacy microprocessors like the 80C196 or 68k families.
Recommandé
Custom Peripheral Controllers
Custom peripheral controllers benefit from the EPF10K20TC144's combination of logic fabric and Embedded Array Blocks. The 12 EABs can each implement a 256x8 or 512x4 dual-port RAM block, allowing designers to build 8-12 independent FIFO buffers, lookup tables, or microcode ROMs without external memory chips. With 102 user I/Os available, the part can drive wide parallel buses and multiple serial interfaces simultaneously. Industrial peripheral boards typically run the FLEX 10K at 25-50 MHz for sensor data acquisition, and its 5V I/O bank natively supports legacy 5V peripheral ICs like the 8255 PPI or 16550 UART.
Recommandé
Telecommunications Line Card Interface
Telecommunications line-card designs in the 1990s and 2000s widely adopted the EPF10K20TC144 for T1/E1 framing, HDLC controllers, and timeslot interchange functions. The device's 5V I/O tolerance directly interfaces with telecom line-interface units like the DS2155 or DS2156, eliminating level shifters. Its 24,576 bits of EAB RAM is sufficient for elastic stores, slip buffers, and jitter attenuators commonly required in TDM backplanes. The 144-TQFP package's 22x22 mm footprint fits within the standard 6U cPCI line-card area, and the part's 125 MHz speed grade in the -4 suffix accommodates 8.192 MHz TDM bus rates with margin.
Recommandé
DSP Pre/Post-Processing Front-End
The EPF10K20TC144 serves as a digital signal processing front-end by implementing pre- and post-processing functions in the EABs while the host DSP handles the core algorithms. Its 12 EABs can implement parallel FIR filter banks, gain control blocks, and data-format converters at sample rates up to 30 MSPS at the -4 speed grade. The 102 user I/Os provide ample connections to ADC/DAC converters and DSP host ports. Compared to discrete multiplier-accumulators, the FLEX 10K achieves equivalent throughput with fewer chips and allows algorithm updates via reconfiguration, useful during prototype development cycles.
Recommandé
Industrial Control Logic
Industrial control systems benefit from the EPF10K20TC144's ability to implement custom motor control algorithms, safety interlocks, and sensor fusion logic on a single chip. The 5V I/O tolerance interfaces directly with 24V industrial sensors via optocouplers, and the 144-TQFP package supports standard SMT assembly lines used in industrial-grade PCBs. The 12 EABs allow on-chip storage of lookup tables for sine-wave PWM, S-curve profiles, or PID gain tables. Designers building CNC controllers, PLC I/O expansion modules, or servo drive front-ends have relied on the FLEX 10K family for over two decades due to its deterministic timing and robust 5V noise margin.
Recommandé
Prototype Logic Verification Platform
Engineering labs and university research environments use the EPF10K20TC144 as a flexible logic verification platform due to its in-system programmability and rich EAB-based memory resources. The device can be reconfigured in milliseconds via the JTAG ByteBlaster port, enabling rapid design iteration. With 1,152 logic elements, it is large enough to implement complete CPU cores (such as the 8051 or simple RISC-V), custom peripherals, and external bus controllers on a single chip. The 5V I/O is forgiving for breadboard and prototype interface work, and the 144-TQFP package is widely supported by standard prototyping adapters and breakout boards.
Recommandé
Legacy Avionics and Military Systems
Long-lifecycle military and avionics platforms continue to use the EPF10K20TC144 because of its established reliability history, MIL-spec temperature variants, and qualification data. The part's 5V core and robust I/O tolerance meet the EMI/EMC requirements of DO-160 and MIL-STD-461 environments. With 1,152 logic elements, it is well-matched to legacy avionics tasks such as ARINC 429 bus controllers, discrete I/O scanning, and display drivers. The 144-TQFP package is mechanically robust for high-vibration environments and supports the conformal coating processes required for aerospace assembly. Note that MIL-temp variants carry the -3 or -4N speed-grade suffixes within the commercial part numbering scheme.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K20TC144 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K20TC144-4N | EPF10K20TC144-4 | EPF10K30TC144-4 | EPF10K10TC144-4N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | TQFP-144 | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) |
| Logic Elements | 1,152 | 1,152 | 1,152 | 1,728 | 576 |
| Typical Gates | 20,000 | 20,000 | 20,000 | 30,000 | 10,000 |
| User I/Os | 102 | 102 | 102 | 102 | 102 |
| EAB RAM (bits) | 24,576 | 24,576 | 24,576 | 32,768 | 12,288 |
| Speed Grade | varies (-3 or -4) | -4 (125 MHz) | -4 (125 MHz) | -4 (125 MHz) | -4 (125 MHz) |
| RoHS Compliance | depends on suffix | Pb-free, RoHS | non-RoHS (legacy) | non-RoHS (legacy) | Pb-free, RoHS |
| Core Voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
Principaux différenciateurs
- 5V I/O native compatibility (vs Xilinx XC4000 series)
- Embedded Array Blocks for on-chip memory (vs Smaller FPGAs without EABs)
- Same-package density upgrade path (vs EPF10K10TC144-4N)
Notes de conception
The EPF10K20TC144 requires a stable 5V supply on VCCINT pins (typically 3-4 pins distributed around the package) plus independent VCCIO supplies for each of the four I/O banks if mixed-voltage interfacing is required. Decoupling should include one 0.1 uF ceramic per VCC pin and a single 47 uF bulk tantalum or aluminum polymer capacitor within 25 mm of the device. Power sequencing is not strictly required because the FLEX 10K family is 5V-only, but in-rush current during configuration can spike to 500 mA; budget the regulator accordingly.
TQFP-144 packages have a 0.5 mm lead pitch, which requires careful PCB design: use 0.20-0.25 mm trace width between pads, IPC-SM-782 land patterns, and a 4-6 mil solder mask dam. Add ground fills under the device for thermal spreading, and use micro-via-in-pad if BGA breakouts are present in nearby circuits. Hand-soldering repair is feasible with a fine tip and preheating but is not recommended for production.
The FLEX 10K family uses SRAM-based configuration, which means the design is lost on every power-down and must be reloaded from an external EPC configuration PROM, flash, or microcontroller on every boot. This adds 50-200 ms to startup time and requires a dedicated boot source on the PCB. Without a configuration source, the device will fail to enter user mode and all I/O pins will remain tri-stated. JTAG programming via ByteBlaster is for development only; production boards must include an EPC1, EPC2, or compatible configuration memory.
Informations de conformité
Standard EPF10K20TC144 is not RoHS (legacy SnPb finish); the EPF10K20TC144-4N suffix denotes Pb-free, RoHS-compliant terminal finish. Always verify the exact part suffix on the datasheet declaration of conformity.
