Intel

EPF10K40RC208-3N - Flex 10K FPGA 40K Gates 5V 208-RQFP | Intel

Référence : EPF10K40RC208-3N ✗ Fin de vie
En stock Expédié sous 1 à 3 jours ouvrés
5 V Vdss 208-pin RQFP (Power QFP, 28x28 mm, gull-wing) Package 66.67 MHz Speed
À partir de $12.95 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-09-11
Tarifs dégressifs
Qté Prix unitaire Total
1 $28.5 $28,50
10 $24.9 $249,00
100 $19.75 $1 975,00
500 $15.4 $7 700,00
1 000 $12.95 $12 950,00
ℹ️ Tous les prix sont en USD

EPF10K40RC208-3N Présentation

The Intel (formerly Altera) EPF10K40RC208-3N is a member of the Flex 10K family of FPGAs, featuring 40,000 equivalent gates, 2,304 logic elements (LEs) and 16,384 bits of embedded SRAM in a 208-pin RQFP (Power QFP) surface-mount package. It is built on a 0.42 µm CMOS SRAM process and operates from a 5 V supply, delivering a propagation delay of 0.6 ns and supporting internal clock frequencies up to 66.67 MHz per the manufacturer description, with 147 user I/O pins available on the RQFP-208 footprint.

The Flex 10K family was the industry's first embedded programmable logic device (PLD) family, providing System-on-a-Programmable-Chip (SOPC) integration. An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit whose logic blocks, routing and I/O cells are defined by a user-supplied bitstream stored in SRAM. Flex 10K sits in the broader taxonomy as PLD -> CPLD/FPGA -> programmable logic -> integrated circuit, and historically pioneered embedded-array blocks (EABs) used as on-chip ROM, RAM, or multiplier functions.

Key features of the EPF10K40RC208-3N include 2,304 logic elements, 16,384 bits (16 Kb) of embedded array SRAM, 147 user I/Os with multi-voltage I/O support (3.3 V and 5 V), and an exposed thermal pad option on the 208-BFQFP package. Speed grade -3 places it in the mid-speed bin of the family, and the -N suffix denotes a lead-free / Pb-free terminal finish.

The device uses a hierarchical interconnect architecture with embedded array blocks (EABs), look-up table (LUT)-based logic elements, and continuous FastTrack routing. Configuration is loaded from a serial PROM or microcontroller into on-chip SRAM cells, allowing unlimited in-system reconfiguration. MultiVolt I/O allows it to interface with both 3.3 V and 5 V peripherals on the same board, an important feature during the transition era of mixed-voltage logic.

Typical applications of the EPF10K40RC208-3N include glue logic replacement, custom peripheral controllers, industrial bus bridges, telecommunications line-card interface logic, and legacy industrial/embedded glue. It is also widely used to bridge legacy TTL/CMOS logic blocks and as a prototyping vehicle before migrating to a structured ASIC.

Design considerations include ensuring the JTAG configuration chain supports 5 V signaling, using a stable 5 V core supply, and following the MAX+PLUS II or Quartus design flow (where the EPF10K40 is still supported for legacy projects). Because this part has been in production since the late 1990s, lifecycle status should be confirmed before any new commitment.

This page consolidates distributor pricing, drop-in replacement candidates, and design notes that complement (but do not replace) the manufacturer datasheet and legacy configuration manuals.

Alternatives de remplacement direct pour EPF10K40RC208-3N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EPF10K40RC208-3N (même facteur de forme et même empreinte) — différant par Mounting Type, Operating Temperature.

Intel
Mounting Type: Surface Mount
Operating Temperature: 0 °C to 70 °C (commercial)
Comparer avec EPF10K40RC208-3N →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

EPF10K40RC208-3

✅ Remplacement direct
📦 208-RQFP (Power QFP)
same die, same 208-RQFP footprint, non-N (Pb-bearing) terminal finish; functionally identical

📋 Alternative de référence (hors catalogue)

EPF10K40RC208-4N

✅ Remplacement direct
📦 208-RQFP (Power QFP)
same die, same 208-RQFP footprint, speed grade -4 (slower, lower power)

📋 Alternative de référence (hors catalogue)

EPF10K40RC208-2N

✅ Remplacement direct
📦 208-RQFP (Power QFP)
same die, same 208-RQFP footprint, speed grade -2 (faster, higher power)

📋 Alternative de référence (hors catalogue)

EPF10K40RC208-1N

✅ Remplacement direct
📦 208-RQFP (Power QFP)
same die, same 208-RQFP footprint, speed grade -1 (fastest grade)

📋 Alternative de référence (hors catalogue)

EPF10K40RC208-3

✅ Remplacement direct ⚠️ Spécifications non vérifiées
📦 208-RQFP (Power QFP)
identical silicon, used as cross-reference for obsolete sourcing

📋 Alternative de référence (hors catalogue)

EPF10K40RC208-3N Valeurs maximales et caractéristiques électriques

Family Flex 10K
Logic Elements 2304
Equivalent Gates 40,000
Embedded SRAM 16,384 bits (16 Kb)
User I/Os 147
Boîtier 208-pin RQFP (Power QFP, 28x28 mm, gull-wing)
Process Technology 0.42 µm CMOS, SRAM-based
Propagation Delay 0.6 ns
Internal Frequency (max) 66.67 MHz
Core Supply Voltage 5 V
I/O Supply Voltage 3.3 V or 5 V (MultiVolt)
Température de fonctionnement 0 °C to +70 °C (Commercial)
Terminal Finish Lead-free / Pb-free (-N suffix)
Type de montage Surface Mount (Gull-wing)

Configuration des broches de EPF10K40RC208-3N

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Broche 1 I/O — User I/O (bank-dependent)
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Broche 8 VCCINT — 5 V core supply
Broche 9 VCCIO — I/O supply voltage (3.3 V or 5 V)
Broche 10 I/O — User I/O
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Broche 20 GND — Ground
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Broche 43 GND — Ground
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Broche 67 VCCINT — 5 V core supply
Broche 68 GND — Ground
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Broche 86 VCCIO — I/O supply voltage
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Broche 107 GND — Ground
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Broche 143 GND — Ground
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Broche 205 VCCINT — 5 V core supply
Broche 206 GND — Ground
Broche 207 I/O — User I/O
Broche 208 I/O — User I/O

Applications typiques

EPF10K40RC208-3N convient pour 6 applications: Legacy Industrial Glue Logic, Telecommunications Line-Card Interface Logic, Custom Peripheral Controller (ISA/PCI Bridge), Legacy Test & Measurement Equipment, Aerospace & Defense Avionics Subsystems, Educational FPGA Laboratory Boards.

🏭

Legacy Industrial Glue Logic

The EPF10K40RC208-3N's 2,304 logic elements and 147 user I/Os make it well-suited for replacing multiple discrete TTL/CMOS glue-logic ICs on legacy industrial controllers. Its 5 V MultiVolt I/O allows direct interface with 5 V and 3.3 V peripherals without level shifters. The exposed pad aids thermal dissipation when operating at full internal clock frequency (66.67 MHz) in factory-automation backplanes. The part is pin-compatible with other EPF10K40RC208 variants, allowing easy speed-grade swaps in long-life industrial product lines.

🌐

Telecommunications Line-Card Interface Logic

In telecom line-card and central-office equipment, the EPF10K40RC208-3N was widely used as a programmable interface for T1/E1 framers, HDLC controllers, and serializer/deserializer chips. The 16 Kb embedded SRAM supports small lookup tables, FIFO buffers, and protocol-state-machine scratch memory. MultiVolt I/O simplifies bridging 5 V line-driver ASICs with 3.3 V framer chips. Speed grade -3 supports 66.67 MHz internal operation, sufficient for E1 (2.048 MHz) and T1 (1.544 MHz) line-rate processing with margin.

🖥️

Custom Peripheral Controller (ISA/PCI Bridge)

The EPF10K40RC208-3N delivers enough logic (2,304 LEs) to implement ISA-bus or PCI-bus peripheral controllers, custom DMA engines, and interrupt controllers in legacy x86-based industrial PCs. Its 147 user I/Os accommodate the address/data bus plus control signals and interrupt inputs. SRAM configuration allows field upgrades via JTAG, useful for industrial PCs requiring in-system firmware updates. Embedded array blocks (EABs) can be configured as dual-port RAM for mailbox-register communication.

🔧

Legacy Test & Measurement Equipment

Bench-top test instruments and ATE (Automatic Test Equipment) platforms deployed in the late 1990s and 2000s frequently used the EPF10K40RC208-3N as a flexible stimulus generator, pattern buffer, or timing generator. The 147 I/Os interface directly to 5 V logic analyzers and instrument buses. Speed grade -3 delivers 0.6 ns propagation delay, suitable for sub-100 ns stimulus pulse generation. In-system SRAM programmability lets ATE platforms adapt to new device-under-test pinout maps without board respins.

✈️

Aerospace & Defense Avionics Subsystems

Some long-lifecycle avionics platforms continue to use the EPF10K40RC208-3N for non-critical display, bus-arbitration, and MIL-STD-1553 interface logic where formal re-qualification of newer FPGAs would be cost-prohibitive. The commercial-grade temperature range (0 °C to +70 °C) is acceptable in temperature-controlled avionics bays. Lead-free terminal finish (-N) supports RoHS-conformant production for new-build spares. Mission-critical paths remain on formally qualified radiation-hardened parts; Flex 10K handles peripheral glue.

🎓

Educational FPGA Laboratory Boards

University digital-logic and VLSI-design laboratories historically adopted the EPF10K40RC208-3N as a teaching platform due to its manageable logic capacity, generous I/O count, and well-documented Quartus II / MAX+PLUS II flow. Students implement RISC cores, FSMs, UARTs, and DSP blocks across 2,304 LEs. The 208-RQFP package on a 0.5 mm or 0.4 mm pitch is hand-solderable by advanced students. Legacy Flex 10K dev kits remain in use for coursework continuity.

Récapitulatif des produits recommandés

EPC2LC20 Altera Utilisé dans : Legacy Industrial Glue Logic EPF10K30RC208-4N Intel Utilisé dans : Legacy Industrial Glue Logic, Legacy Test & Measurement Equipment EPF10K40RC208-2N Higher-speed grade -2 for telecom timing-critical paths Utilisé dans : Telecommunications Line-Card Interface Logic EPC8QC100 Altera Utilisé dans : Telecommunications Line-Card Interface Logic EPC2LI20 Altera Utilisé dans : Custom Peripheral Controller (ISA/PCI Bridge), Educational FPGA Laboratory Boards EPF10K40RC208-4N Lower-power grade -4 for thermally constrained PC expansion cards Utilisé dans : Custom Peripheral Controller (ISA/PCI Bridge) EPC4Q100 4-Mbit configuration PROM for complex T&M bitstreams Utilisé dans : Legacy Test & Measurement Equipment EPF10K40RC208-3 Pb-bearing variant for legacy non-RoHS avionics spares Utilisé dans : Aerospace & Defense Avionics Subsystems EPC2TC32 Altera Utilisé dans : Aerospace & Defense Avionics Subsystems EPF10K10TC144-3 Intel Utilisé dans : Educational FPGA Laboratory Boards
What is the EPF10K40RC208-3N?
The EPF10K40RC208-3N is a member of Intel's (formerly Altera's) Flex 10K FPGA family, integrating 2,304 logic elements, 16 Kb of embedded SRAM, and 147 user I/Os in a 208-pin RQFP package. It is built on a 0.42 µm CMOS SRAM process and operates from a 5 V core supply. Per the manufacturer description, it is the industry's first embedded programmable logic device family supporting System-on-a-Programmable-Chip (SOPC) integration.
What is the maximum clock frequency of the EPF10K40RC208-3N?
The EPF10K40RC208-3N supports an internal operating frequency up to 66.67 MHz, as stated on distributor datasheet summaries. Speed grade -3 positions it in the mid-range of the Flex 10K family; grades -2 and -4 offer different speed/power trade-offs. The propagation delay is approximately 0.6 ns for internal combinatorial paths under typical conditions.
How many user I/O pins does the EPF10K40RC208-3N have?
The EPF10K40RC208-3N provides 147 user I/O pins out of 208 total package pins. The remaining pins are allocated to power, ground, JTAG (TCK, TMS, TDI, TDO), configuration (nCONFIG, nSTATUS, CONF_DONE, MSELn, DCLK, DATA0), and dedicated clock inputs. This 208-RQFP package was the highest I/O-count option for the EPF10K40 die.
What is the difference between EPF10K40RC208-3N and EPF10K40RC208-3?
The EPF10K40RC208-3N is the lead-free (Pb-free) terminal-finish variant of the EPF10K40RC208-3, indicated by the -N suffix in Intel/Altera's legacy naming convention. Both parts share the same 208-pin RQFP package, Flex 10K die, 2,304 logic elements, 147 user I/Os, and 5 V core supply. They are functionally drop-in compatible on the same PCB footprint, differing only in terminal plating to satisfy RoHS requirements.
What design tool supports the EPF10K40RC208-3N?
The EPF10K40RC208-3N is supported by Intel/Altera's Quartus II design software (legacy versions) and the older MAX+PLUS II development system. Quartus II versions prior to v13.0 retain Flex 10K device support; newer Quartus releases have removed support for the Flex 10K family. For new designs, designers are advised to migrate to Cyclone IV/V or MAX II/10 families.
Where to buy EPF10K40RC208-3N online?
The EPF10K40RC208-3N is available through authorized distributors including DigiKey, Mouser, and several legacy-stock brokers such as Ampheo, Veswin, and Vyrian, as listed on Octopart. Pricing as of 2026-09-11 starts around USD 28.50 for qty-1 from third-party distributors, with bulk discounts available. Lead time is typically 4-8 weeks for fresh stock due to obsolete-lifecycle status.
What is the price of EPF10K40RC208-3N?
The EPF10K40RC208-3N is priced at approximately USD 28.50 for qty-1, USD 24.90 for qty-10, USD 19.75 for qty-100, USD 15.40 for qty-500, and USD 12.95 for qty-1000, as of 2026-09-11. Prices reflect legacy/obsolete market rates and may fluctuate with available stock. Bulk discounts are typical for volume procurement through specialized legacy-component distributors.
What is the lead time for EPF10K40RC208-3N?
Lead time for the EPF10K40RC208-3N typically ranges from 4 to 8 weeks when sourced from authorized distributors or legacy-stock brokers, as of 2026-09-11. Because the part is in obsolete lifecycle status, lead times may extend significantly when distributor inventory is exhausted. Engineers are advised to confirm stock and lead time before committing to production schedules.
EPF10K40RC208-3N vs EPF10K30AQC240-3 - which is better for new designs?
The EPF10K40RC208-3N (40K gates, 2,304 LEs, 147 I/Os) outperforms the EPF10K30AQC240-3 (30K gates, 1,728 LEs, 189 I/Os) in logic density, but the EPF10K30AQC240-3 has more I/Os in a QFP-240 package. For new designs requiring higher gate count, choose EPF10K40RC208-3N; for designs needing many I/Os with lower density, choose EPF10K30AQC240-3. Note that neither is recommended for new designs due to obsolete status; consider Cyclone IV or Cyclone V as modern replacements.
What is the best drop-in replacement for EPF10K40RC208-3N?
The best drop-in replacement for the EPF10K40RC208-3N is the EPF10K40RC208-3 (the non-N, lead-bearing variant), which shares the same 208-RQFP footprint and identical Flex 10K die. For RoHS-compliant designs, the EPF10K40RC208-3N itself is the drop-in target. Both parts are obsolete; for new designs requiring a modern equivalent with similar density, the Intel Cyclone IV EP4CE40F29C8N in FBGBA-256 is recommended after PCB redesign.
When should I choose EPF10K40RC208-3N over EPF10K40RC208-3?
The EPF10K40RC208-3N should be chosen over the EPF10K40RC208-3 for new designs and production requiring RoHS compliance, as the -N suffix indicates lead-free terminal finish. Both parts share identical silicon, package, and electrical specifications. The EPF10K40RC208-3 is preferable only when working with legacy non-RoHS assemblies where lead-bearing terminals are acceptable or required.
Is the EPF10K40RC208-3N suitable for new industrial designs in 2026?
No, the EPF10K40RC208-3N is not recommended for new industrial designs in 2026 due to its obsolete lifecycle status, limited long-term availability, and the discontinuation of first-party design tool support. Intel Quartus II support for the Flex 10K family ended in earlier Quartus versions, complicating ongoing maintenance. For new industrial designs, the Cyclone IV/V or MAX II/10 families provide modern, supported alternatives with comparable or greater logic density.
Where to download the EPF10K40RC208-3N datasheet PDF?
The EPF10K40RC208-3N datasheet is available as part of the Flex 10K Family Data Sheet document from Intel/Altera, which is archived on third-party sites such as Datasheet Directory, datasheets.globalspec.com, and chipdig.com. The original datasheet was published by Altera (now Intel). Engineers can request the official document through Intel's FPGA legacy support portal or via legacy distributor documentation channels.
Where to find the EPF10K40RC208-3N pinout?
The EPF10K40RC208-3N pinout is documented in the Flex 10K Family Data Sheet, where pin assignments for the 208-pin RQFP variant are listed by function group: user I/O banks, dedicated inputs, JTAG (TCK/TMS/TDI/TDO), configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSELn, DCLK, DATA0), and power/ground. Pin 1 is located at the top-left corner when the package is oriented with the dot marker upward. Refer to the manufacturer datasheet for the complete 208-pin assignment table.

Données de référence d'ingénierie pour EPF10K40RC208-3N — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the EPF10K40RC208-3N when you need pin-compatible drop-in replacement in an existing 208-RQFP PCB designed for the Flex 10K family and require RoHS-compliant lead-free terminal finish. The -N suffix is mandatory for new production builds targeting EU/US markets. For legacy non-RoHS assemblies, choose EPF10K40RC208-3 instead. Speed grade -3 is the mid-range choice; upgrade to -2 or -1 only if timing closure fails, or downgrade to -4 for power savings. For new designs in 2026, do not use this part - migrate to Cyclone IV/V, MAX II, or MAX 10 families for active manufacturer support, modern tools, and longer lifecycle. The Flex 10K family is officially obsolete.

Comparaison avec les alternatives

Paramètre Ce produit EPF10K40RC208-3 EPF10K40RC208-4N EPF10K40RC208-2N EPF10K40RC208-1N
Package 208-RQFP (Power QFP) 208-RQFP (Power QFP) - same 208-RQFP (Power QFP) - same 208-RQFP (Power QFP) - same 208-RQFP (Power QFP) - same
Brand Intel Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Logic Elements 2,304 2,304 (identical die) 2,304 2,304 2,304
Equivalent Gates 40,000 40,000 40,000 40,000 40,000
Speed Grade -3 (mid) -3 (mid) -4 (slowest) -2 (faster) -1 (fastest)
Terminal Finish Lead-free (Pb-free) Pb-bearing (SnPb) Lead-free (Pb-free) Lead-free (Pb-free) Lead-free (Pb-free)
User I/Os 147 147 147 147 147
Operating Temperature 0 °C to +70 °C (Commercial) 0 °C to +70 °C 0 °C to +70 °C 0 °C to +70 °C 0 °C to +70 °C

Principaux différenciateurs

  • Lead-free terminal finish for RoHS compliance (vs EPF10K40RC208-3)
  • Mid-range speed grade -3 balance (vs EPF10K40RC208-2N / -1N)
  • First-generation embedded programmable logic (vs Modern Cyclone IV/MAX 10 families)

Notes de conception

The EPF10K40RC208-3N requires a stable 5 V VCCINT supply and a separate VCCIO rail that can be either 3.3 V or 5 V (MultiVolt). Decouple each VCCINT pin with a 0.1 µF ceramic capacitor placed within 5 mm of the pin, plus a bulk 47 µF tantalum capacitor near the regulator. Estimate: at 66.67 MHz with all 2,304 LEs toggling, expect ICCINT around 200-300 mA; design the 5 V regulator for at least 1.5x margin.

Use a 4-layer PCB with a dedicated ground plane for the EPF10K40RC208-3N. Route all eight GND pins directly to the ground plane using multiple vias for low inductance. Place configuration memory (EPC2 or EPC8) within 50 mm of DATA0/DCLK/nCONFIG. Maintain 50 Ω controlled impedance on clock inputs to avoid reflections that could cause double-clocking at 66.67 MHz.

Do not confuse the EPF10K40RC208-3N (lead-free) with the EPF10K40RC208-3 (Pb-bearing); the latter is non-RoHS and may fail regulatory compliance for new builds. Ensure the Quartus II / MAX+PLUS II bitstream matches the silicon revision before loading via JTAG. SRAM-based configuration is volatile - the FPGA will lose its design at every power-down and requires a valid configuration bitstream at every POR (power-on reset).

The 208-RQFP package dissipates up to approximately 1.5 W under heavy utilization. Estimate: at VCCINT = 5 V and 300 mA core current, P_dissipation ≈ 1.5 W; junction-to-ambient thermal resistance (theta_JA) is around 30 °C/W for this package, giving a 45 °C rise above ambient. Provide forced-air cooling if operating near 70 °C ambient or in enclosed industrial cabinets.

Informations de conformité

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Sans plomb
Yes
Sans halogène
Unknown
Minerais de conflit
Unknown

RoHS compliance is uncertain for this legacy part - the -N suffix typically indicates lead-free terminal finish, but formal RoHS/REACH certification is not documented in available sources. Not applicable for AEC-Q100 (commercial-grade, not automotive). Halogen-free and conflict-minerals status are unknown; verify with manufacturer documentation before committing to compliance-sensitive applications.

Données vérifiées le : 2026-09-11 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

EPF10K40RC208-3N EPF10K40RC208-3N datasheet Intel Altera Flex 10K FPGA Flex 10K 40K gates 5V 208-RQFP EPF10K40RC208-3N pinout EPF10K40 vs EPF10K30AQC240 EPF10K40RC208-3N drop-in replacement Flex 10K configuration PROM EPC2 buy EPF10K40RC208-3N obsolete FPGA EPF10K40RC208-3N lead-free RoHS what is Flex 10K family EPF10K40RC208-3N vs Cyclone IV

Composants & termes associés

Intel Altera EPF10K40RC208-3N EPF10K40RC208-3 Flex 10K FPGA Field-Programmable Gate Array PLD Programmable Logic Device 208-RQFP Power QFP RQFP-208 MultiVolt I/O Embedded Array Block EAB Look-Up Table LUT Logic Element JTAG Quartus II MAX+PLUS II configuration PROM EPC2 SRAM configuration RoHS
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