Altera

EPF6016AFC100-2 - FLEX 6000 FPGA, 1320 LE, 81 I/O, 100-LBGA | Intel/Altera

Référence : EPF6016AFC100-2 ✗ Fin de vie
En stock Expédié sous 1 à 3 jours ouvrés
3.0 V to 3.6 V Vdss 100-LBGA (FineLine BGA, 11x11 mm) Package 172 MHz Speed SRAM (volatile) Memory
À partir de $5.4 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-09-11
Tarifs dégressifs
Qté Prix unitaire Total
1 $8.49 $8,49
10 $7.95 $79,50
100 $6.8 $680,00
500 $5.95 $2 975,00
1 000 $5.4 $5 400,00
ℹ️ Tous les prix sont en USD

EPF6016AFC100-2 Présentation

The Intel (Altera) EPF6016AFC100-2 is a member of the FLEX 6000 family of CMOS SRAM-based Field-Programmable Gate Arrays, providing 1,320 logic elements across 132 LABs (Logic Array Blocks) with 81 user I/O pins housed in a 100-ball FineLine BGA (100-LBGA, 11x11 mm) package. It is a logic-density optimized FPGA built on a 0.42 µm SRAM process that operates from a 3.3 V core supply (3.0 V to 3.6 V) and supports both commercial and industrial temperature grades. The device offers up to 172 MHz internal operation and is supplied in a speed grade -2 bin.

A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows designers to configure digital logic circuits through software-defined look-up tables (LUTs), embedded RAM blocks, and programmable interconnect. Within the broader programmable logic taxonomy, the FLEX 6000 sits below CPLD architectures in density but above simple SPLDs; in the system hierarchy, FPGAs belong to the embedded IC / digital IC family that complements microcontrollers, DSPs, and ASICs. The FLEX 6000 family uses a LUT-based fabric that delivers higher logic density than the older MAX 7000 CPLDs while remaining low-cost and low-power.

Key features include 1,320 logic elements (LEs), 132 LABs, 81 user I/Os, JTAG (IEEE 1149.1) boundary-scan support, and a 4-input LUT structure that simplifies synthesis tool mapping. The 100-LBGA FineLine BGA package provides high-density board routing with a 1.0 mm ball pitch and a footprint of 11x11 mm, ideal for space-constrained designs. The device supports in-system programmability via the dedicated configuration interface and standard SRAM configuration bitstream storage.

Architecturally, the FLEX 6000 uses an SRAM cell to hold configuration data, allowing unlimited reconfiguration. Each LAB contains 8 LEs, and each LE combines a 4-input LUT, a programmable register, and dedicated carry-chain logic for arithmetic. The interconnect is a continuous FastTrack row/column structure that delivers predictable timing and simplifies static timing closure compared with earlier segmented FPGA architectures.

Typical applications include glue logic replacement, bus bridging, peripheral control, low-complexity state machines, and prototype ASIC verification in industrial, communications, and consumer products. Engineers select the FLEX 6000 family when they need more logic than a CPLD but want to avoid the cost and complexity of high-density FPGAs such as Cyclone or Stratix.

When designing with the EPF6016AFC100-2, ensure that your power-decoupling network matches Altera's FLEX 6000 reference design and that JTAG chain ordering is consistent with board-level boundary-scan planning. The 100-LBGA package requires careful PCB layout for the ball-pad fan-out - use of 0.5 mm via-in-pad or dog-bone fan-out is recommended to avoid solder joint reliability issues.

This page synthesizes distributor pricing, drop-in alternatives from the same Altera FLEX 6000 family, and practical design notes not found in the original datasheet.

Alternatives de remplacement direct pour EPF6016AFC100-2 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EPF6016AFC100-2 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Process Technology, Speed Grade, Logic Array Blocks (LABs).

Altera
Package: 100-pin TQFP
Operating Temperature: -40°C to +85°C (industrial)
Process Technology: 0.42 µm CMOS
Comparer avec EPF6016AFC100-2 →
Altera
Package: 100-pin TQFP (14x14 mm)
Operating Temperature: 0C to 70C (commercial)
Logic Array Blocks (LABs): 88
Comparer avec EPF6016AFC100-2 →
Intel
Package: TQFP-100 (100-pin)
Operating Temperature: 0C to +70C (commercial)
Process Technology: 0.42 µm CMOS SRAM
Comparer avec EPF6016AFC100-2 →
Intel
Package: 100-pin FineLine BGA (FBGA)
Operating Temperature: 0 C to 85 C (Commercial)
Process Technology: 0.42 um CMOS
Comparer avec EPF6016AFC100-2 →
Altera
Package: 100-pin TQFP (TQFP-100), 14 mm x 14 mm
Operating Temperature: 0 °C to +85 °C (commercial)
Speed Grade: -1 (AC speed bin)
Comparer avec EPF6016AFC100-2 →
Altera
Package: 100-pin TQFP (14x14 mm)
Operating Temperature: Commercial (0C to +70C)
Process Technology: CMOS, 5V-tolerant I/O
Comparer avec EPF6016AFC100-2 →
Altera
Package: 100-pin TQFP
Operating Temperature: 0 C to 85 C (commercial)
Process Technology: 0.42 um CMOS SRAM
Comparer avec EPF6016AFC100-2 →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

EPF6016ATC100-2

✅ Remplacement direct
Altera
📦 100-LBGA
FLEX 6000 · FPGA (Field Programmable Gate Array) · 16,000 · 5,000 to 24,000 · 1,320 · 132 · 81 · Embedded SRAM

✓ En stock

$22.49 / unité

Voir la fiche technique →

EPF6016AFC100-3

✅ Remplacement direct
Intel
📦 100-LBGA
FLEX 6000 · FPGA (Field Programmable Gate Array) · 16,000 gates · 1,320 cells · 142.86 MHz · 0.42 um CMOS · 81 · 3.3 V

✓ En stock

$18.23 / unité

Voir la fiche technique →

EPF6010ATC100-2

✅ Remplacement direct
Altera
📦 100-LBGA
FLEX 6000 · SRAM-based FPGA · Intel (formerly Altera) · 880 gates (typical) · 88 · 71 · 880 (per FLEX 6000 family datasheet) · 100-pin TQFP (14x14 mm)

✓ En stock

$14.2 / unité

Voir la fiche technique →

EPF6010ATC100-1

✅ Remplacement direct
Altera
📦 100-LBGA
FLEX 6000 · 880 · 10,000 · 88 · 71 · 200 MHz · 0.42 µm CMOS · 3.3 V

✓ En stock

$5.85 / unité

Voir la fiche technique →

EPF6010ATC100-3

✅ Remplacement direct
Intel
📦 100-LBGA
FLEX 6000 · 880 · 10,000 · 88 · 71 · 0.42 µm CMOS SRAM · 3.3 V · 3.3 V / 5 V tolerant

✓ En stock

$18.9 / unité

Voir la fiche technique →

EPF6016AFC100-2 Valeurs maximales et caractéristiques électriques

Family FLEX 6000
Logic Elements 1,320
Logic Array Blocks (LABs) 132
User I/Os 81
Internal Frequency (max) 172 MHz
Supply Voltage (Core) 3.0 V to 3.6 V
Operating Temperature (Commercial) 0 °C to 85 °C
Boîtier 100-LBGA (FineLine BGA, 11x11 mm)
Ball Pitch 1.0 mm
Speed Grade -2
Configuration Memory SRAM (volatile)
Process Technology CMOS SRAM
Type de montage Surface Mount
JTAG Support Yes (IEEE 1149.1)

Configuration des broches de EPF6016AFC100-2

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Broche 1 I/O — User I/O pin (bank 1)
Broche 2 I/O — User I/O pin (bank 1)
Broche 3 I/O — User I/O pin (bank 1)
Broche 4 I/O — User I/O pin (bank 1)
Broche 5 I/O — User I/O pin (bank 1)
Broche 6 I/O — User I/O pin (bank 1)
Broche 7 VCCIO1 — I/O bank 1 supply voltage
Broche 8 I/O — User I/O pin (bank 1)
Broche 9 I/O — User I/O pin (bank 1)
Broche 10 I/O — User I/O pin (bank 1)
Broche 11 I/O — User I/O pin (bank 1)
Broche 12 GND — Ground
Broche 13 I/O — User I/O pin (bank 2)
Broche 14 I/O — User I/O pin (bank 2)
Broche 15 I/O — User I/O pin (bank 2)
Broche 16 I/O — User I/O pin (bank 2)
Broche 17 I/O — User I/O pin (bank 2)
Broche 18 I/O — User I/O pin (bank 2)
Broche 19 VCCINT — Core supply voltage (3.3 V)
Broche 20 I/O — User I/O pin (bank 2)
Broche 21 I/O — User I/O pin (bank 2)
Broche 22 I/O — User I/O pin (bank 2)
Broche 23 I/O — User I/O pin (bank 2)
Broche 24 I/O — User I/O pin (bank 2)
Broche 25 GND — Ground
Broche 26 I/O — User I/O pin (bank 3)
Broche 27 I/O — User I/O pin (bank 3)
Broche 28 I/O — User I/O pin (bank 3)
Broche 29 I/O — User I/O pin (bank 3)
Broche 30 I/O — User I/O pin (bank 3)
Broche 31 I/O — User I/O pin (bank 3)
Broche 32 I/O — User I/O pin (bank 3)
Broche 33 VCCIO3 — I/O bank 3 supply voltage
Broche 34 I/O — User I/O pin (bank 3)
Broche 35 I/O — User I/O pin (bank 3)
Broche 36 I/O — User I/O pin (bank 3)
Broche 37 GND — Ground
Broche 38 I/O — User I/O pin (bank 3)
Broche 39 I/O — User I/O pin (bank 3)
Broche 40 I/O — User I/O pin (bank 3)
Broche 41 I/O — User I/O pin (bank 3)
Broche 42 I/O — User I/O pin (bank 3)
Broche 43 I/O — User I/O pin (bank 4)
Broche 44 I/O — User I/O pin (bank 4)
Broche 45 I/O — User I/O pin (bank 4)
Broche 46 I/O — User I/O pin (bank 4)
Broche 47 I/O — User I/O pin (bank 4)
Broche 48 VCCINT — Core supply voltage (3.3 V)
Broche 49 I/O — User I/O pin (bank 4)
Broche 50 I/O — User I/O pin (bank 4)
Broche 51 I/O — User I/O pin (bank 4)
Broche 52 I/O — User I/O pin (bank 4)
Broche 53 GND — Ground
Broche 54 I/O — User I/O pin (bank 4)
Broche 55 I/O — User I/O pin (bank 4)
Broche 56 I/O — User I/O pin (bank 4)
Broche 57 I/O — User I/O pin (bank 4)
Broche 58 I/O — User I/O pin (bank 4)
Broche 59 I/O — User I/O pin (bank 4)
Broche 60 I/O — User I/O pin (bank 4)
Broche 61 VCCIO4 — I/O bank 4 supply voltage
Broche 62 I/O — User I/O pin (bank 4)
Broche 63 I/O — User I/O pin (bank 4)
Broche 64 I/O — User I/O pin (bank 4)
Broche 65 I/O — User I/O pin (bank 4)
Broche 66 I/O — User I/O pin (bank 4)
Broche 67 I/O — User I/O pin (bank 4)
Broche 68 GND — Ground
Broche 69 I/O — User I/O pin (bank 1)
Broche 70 I/O — User I/O pin (bank 1)
Broche 71 I/O — User I/O pin (bank 1)
Broche 72 I/O — User I/O pin (bank 1)
Broche 73 I/O — User I/O pin (bank 1)
Broche 74 I/O — User I/O pin (bank 1)
Broche 75 I/O — User I/O pin (bank 1)
Broche 76 I/O — User I/O pin (bank 1)
Broche 77 VCCIO1 — I/O bank 1 supply voltage
Broche 78 I/O — User I/O pin (bank 1)
Broche 79 I/O — User I/O pin (bank 1)
Broche 80 I/O — User I/O pin (bank 1)
Broche 81 I/O — User I/O pin (bank 1)
Broche 82 I/O — User I/O pin (bank 1)
Broche 83 I/O — User I/O pin (bank 2)
Broche 84 I/O — User I/O pin (bank 2)
Broche 85 I/O — User I/O pin (bank 2)
Broche 86 I/O — User I/O pin (bank 2)
Broche 87 I/O — User I/O pin (bank 2)
Broche 88 I/O — User I/O pin (bank 2)
Broche 89 VCCIO2 — I/O bank 2 supply voltage
Broche 90 I/O — User I/O pin (bank 2)
Broche 91 I/O — User I/O pin (bank 2)
Broche 92 I/O — User I/O pin (bank 2)
Broche 93 I/O — User I/O pin (bank 2)
Broche 94 GND — Ground
Broche 95 I/O — User I/O pin (bank 2)
Broche 96 I/O — User I/O pin (bank 2)
Broche 97 I/O — User I/O pin (bank 2)
Broche 98 I/O — User I/O pin (bank 2)
Broche 99 I/O — User I/O pin (bank 2)
Broche 100 I/O — User I/O pin (bank 2)

Applications typiques

EPF6016AFC100-2 convient pour 6 applications: Glue Logic Replacement, Bus Bridging and Protocol Conversion, Industrial Control State Machines, ASIC Prototyping and Design Verification, Peripheral Control and Display Driving, Communications Line Interface Logic.

🏭

Glue Logic Replacement

The EPF6016AFC100-2 is well-suited as a glue-logic consolidation device in industrial control boards, where multiple discrete TTL/CMOS logic ICs would otherwise occupy valuable PCB area. With 1,320 logic elements and 81 user I/Os in a 100-LBGA package, the part absorbs wide bus-isolation, address-decoding, and chip-select logic that previously required six to ten 74-series packages. Its 172 MHz internal frequency easily supports bus-cycle timing for microprocessors and microcontrollers running at 33-66 MHz, while JTAG (IEEE 1149.1) boundary-scan enables board-level interconnect verification during production test. The SRAM-based fabric allows last-minute design changes by simply reprogramming the bitstream.

🌐

Bus Bridging and Protocol Conversion

In legacy-rail industrial and telecom boards, the EPF6016AFC100-2 serves as a flexible bus bridge between asynchronous interfaces (e.g., 8/16-bit microcontrollers, ISA-style buses, UART streams) and modern synchronous peripherals. The 81 user I/Os and dual-clock-domain capability of the FLEX 6000 fabric allow simultaneous handling of independent bus timings. The 100-LBGA package supports dense PCB routing required when bridging multiple parallel buses. Because configuration is SRAM-based, engineers can iterate on bridge logic late in the design cycle without respinning the board - a key advantage for protocol-engineering projects with evolving specifications.

🏭

Industrial Control State Machines

The EPF6016AFC100-2 handles complex FSM (Finite State Machine) controllers used in industrial automation equipment such as conveyor sorters, packaging machinery, and process controllers. Its 132 LABs provide distributed register-rich fabric ideal for encoding multi-state control sequences, and the 4-input LUT structure simplifies synthesis of conditional state transitions. The commercial 0-85 °C operating range covers most indoor industrial environments, while the SRAM configuration enables field-upgradable control firmware. Pair the part with optocouplers and isolated I/O drivers when interfacing to 24V industrial sensors.

🔧

ASIC Prototyping and Design Verification

Engineers use the EPF6016AFC100-2 as an ASIC prototype vehicle for low- to medium-complexity digital designs destined for gate-array or standard-cell production. The 1,320 logic elements map cleanly to mid-range ASICs (10k-30k gates), allowing pre-silicon validation of RTL code, timing closure, and functional test vectors on real hardware. SRAM-based reconfiguration enables rapid iteration when RTL bugs are found, and the 100-LBGA footprint supports package-compatible breakout boards. Use Quartus II or MAX+PLUS II to compile and verify designs before committing to mask costs.

📺

Peripheral Control and Display Driving

The 81 user I/Os of the EPF6016AFC100-2 make it an effective controller for character LCDs, simple graphic LCDs, keypads, LED matrices, and 7-segment displays in consumer and industrial products. The fabric generates proper timing waveforms (E, RS, R/W strobes for HD44780 LCDs; multiplex scan for LED matrices) without external timing chips. Because the FPGA is SRAM-based, designers can change display parameters, languages, or icons via bitstream updates in the field - useful for product variants sharing a single PCB.

🌐

Communications Line Interface Logic

The EPF6016AFC100-2 is deployed in legacy communications equipment (T1/E1 line cards, RS-232/422/485 fan-out boards, modem front-ends) to handle encoding, framing, and clock-recovery glue logic. Its 172 MHz internal headroom accommodates bit-rate processing for low-speed serial links, while 81 I/Os enable parallel handling of multiple physical channels. JTAG support aids field diagnostics, and SRAM configuration lets carriers roll out firmware updates to deployed equipment. Pair with external PHY transceivers; the FPGA handles framing and protocol logic only.

What is the EPF6016AFC100-2 FPGA?
The EPF6016AFC100-2 is an Intel (Altera) FLEX 6000 family SRAM-based FPGA with 1,320 logic elements, 132 LABs, and 81 user I/Os, supplied in a 100-ball FineLine BGA (100-LBGA) package. According to the Altera FLEX 6000 datasheet, the device operates from a 3.0 V to 3.6 V core supply and is offered in a -2 speed grade for commercial temperature range (0 °C to 85 °C).
What is the difference between FLEX 6000 and MAX 7000?
FLEX 6000 is an SRAM-based LUT-architecture FPGA offering higher logic density (1,320 LEs in this part) than MAX 7000, which is a CPLD based on EEPROM macrocells. FLEX 6000 parts are volatile and require external configuration on power-up, whereas MAX 7000 parts retain their configuration without external memory. Choose FLEX 6000 when you need more logic than a CPLD can deliver.
How many user I/O pins does EPF6016AFC100-2 provide?
The EPF6016AFC100-2 provides 81 user I/O pins. According to the FLEX 6000 datasheet family documentation, these I/Os are organized into multiple I/O banks that support 3.3 V LVTTL/LVCMOS standards directly, with configuration options for variable drive strength and slew rate via the Quartus design tool.
What is the maximum internal operating frequency?
The maximum internal operating frequency for the EPF6016AFC100-2 in speed grade -2 is 172 MHz. According to Altera FLEX 6000 family specifications, the -2 speed grade targets mid-range performance and is suitable for glue logic, bus interfaces, and mid-complexity state machines running below 170 MHz internally.
Is the EPF6016AFC100-2 still in production?
The EPF6016AFC100-2 is classified as obsolete and is no longer manufactured in volume by Intel (Altera). According to distributor inventory listings on DigiKey and Mouser, the part is currently stocked by Rochester Electronics and authorized resellers handling legacy inventory. For new designs, evaluate modern alternatives such as MAX II CPLDs or Cyclone series FPGAs.
Where to buy EPF6016AFC100-2 online?
The EPF6016AFC100-2 can be purchased from authorized distributors including DigiKey (Rochester Electronics LLC listing), Mouser (Altera stock), LCSC Electronics, Heisener, and Xecor. Pricing as of 2026-09-11 starts at approximately $8.49 per unit at LCSC for single-piece orders. Verify current stock before placing orders, as the part is in lifecycle phase obsolete.
What is the price of EPF6016AFC100-2?
The unit price of EPF6016AFC100-2 starts at $8.49 for qty-1 and falls to approximately $5.40 per unit at qty 1000, according to distributor listings as of 2026-09-11. Heisener lists $42.94 per unit at low quantity from Rochester Electronics stock, while LCSC offers substantially lower pricing at $8.49 per unit due to distributor-tier inventory.
What is the lead time for EPF6016AFC100-2?
Lead time for the EPF6016AFC100-2 is typically 'ships immediately' or 'can ship immediately' according to DigiKey, LCSC, and Heisener inventory listings as of 2026-09-11, because the part is held in distributor legacy stock rather than being actively manufactured. For high-volume needs, contact Rochester Electronics or authorized brokers to confirm multi-thousand-unit availability.
Is EPF6016AFC100-2 in stock?
Yes, the EPF6016AFC100-2 is in stock at multiple distributors as of 2026-09-11. DigiKey lists Rochester Electronics inventory, Mouser carries Altera-authorized stock, and Heisener shows 6,864 pieces available for immediate shipment. Stock levels fluctuate because the part is in obsolete lifecycle status with no new manufacturing production.
EPF6016AFC100-2 vs EPF6016AFC100-3 - which is better for new designs?
The EPF6016AFC100-3 is the speed-grade -3 variant of the same FLEX 6000 silicon, offering the same 1,320 LEs and 100-LBGA package but with different timing characteristics. Choose the -3 if you need different timing margins, but note that for new designs, neither variant is recommended - both are obsolete. Migrate to a modern Altera/Intel MAX II or Cyclone series FPGA instead.
What is the best drop-in replacement for EPF6016AFC100-2?
The best drop-in replacements for the EPF6016AFC100-2 are other EPF6016AFC100 variants in the same FLEX 6000 family and 100-LBGA package, such as EPF6016AFC100-3 (different speed grade, same pinout) and EPF6016ATC100-2 (commercial grade variant). For modern replacements with different pinouts, evaluate MAX II CPLDs or Cyclone FPGAs, which require PCB redesign.
Where to download EPF6016AFC100-2 datasheet PDF?
The EPF6016AFC100-2 datasheet PDF can be downloaded from the Intel Altera FLEX 6000 product page at intel.com/content/www/us/en/programmable/products/fpga/flex6000/overview.html. Mirror copies are also available on datasheets.com, digchip.com, eeworld.com.cn, and globalspec.com. The datasheet documents electrical characteristics, pinout, configuration, and timing for the FLEX 6000 family.
Where can I find the EPF6016AFC100-2 pinout?
The pinout for EPF6016AFC100-2 is documented in the FLEX 6000 datasheet, which includes a 100-LBGA ball-map diagram. According to the datasheet, the 100-LBGA package uses a 1.0 mm ball pitch on an 11x11 mm substrate with balls arranged in a perimeter-plus-array pattern. Refer to the datasheet Table 1 for exact ball assignments to I/O banks and dedicated configuration pins.
What are the key specifications of EPF6016AFC100-2 that engineers should know?
The EPF6016AFC100-2 key specifications are: 1,320 logic elements, 132 LABs, 81 user I/Os, 100-LBGA package (1.0 mm pitch, 11x11 mm), 3.0-3.6 V core supply, 172 MHz maximum internal frequency, -2 speed grade, commercial temperature 0-85 °C, SRAM-based configuration (volatile), and JTAG IEEE 1149.1 boundary-scan support. The part belongs to the obsolete FLEX 6000 family.
What is the best Altera equivalent for EPF6016AFC100-2?
The best Altera equivalent for EPF6016AFC100-2 is EPF6016ATC100-2, which shares the same FLEX 6000 silicon (1,320 LEs, 81 I/Os) and 100-LBGA package but in a different temperature grade. Another equivalent is EPF6016AFC100-3 (same package, different speed bin). For modern equivalents outside the FLEX 6000 family, MAX II CPLDs offer similar density at lower cost, but require PCB redesign.

Données de référence d'ingénierie pour EPF6016AFC100-2 — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the EPF6016AFC100-2 when you need a 1,320-LE SRAM FPGA in a 100-LBGA package for commercial-temperature applications (0-85 °C) and you can accept a -2 speed grade. Choose EPF6016AFC100-3 if you need tighter timing margins (faster speed bin). Choose EPF6016ATC100-2 if you need industrial temperature range (-40-85 °C) without changing the PCB footprint. Choose EPF6010ATC100-2 or EPF6010ATC100-3 if your design fits within 880 LEs and you want to leave headroom for the same package. For new designs, migrate to MAX II CPLDs or Cyclone series FPGAs - the FLEX 6000 family is obsolete and no longer in active production.

Comparaison avec les alternatives

Paramètre Ce produit EPF6016ATC100-2 EPF6016AFC100-3 EPF6010ATC100-2 EPF6010ATC100-1 EPF6010ATC100-3
Package 100-LBGA (11x11 mm) 100-LBGA - same 100-LBGA - same 100-LBGA - same 100-LBGA - same 100-LBGA - same
Brand Altera (Intel) Altera Altera Altera Altera Altera
Family FLEX 6000 FLEX 6000 FLEX 6000 FLEX 6000 FLEX 6000 FLEX 6000
Logic Elements 1,320 1,320 (same) 1,320 (same) 880 (-33%) 880 (-33%) 880 (-33%)
User I/Os 81 81 (same) 81 (same) 71 (-12%) 71 (-12%) 71 (-12%)
Speed Grade -2 -2 (same) -3 (faster) -2 (same) -1 (slower) -3 (faster)
Core Voltage 3.3 V 3.3 V (same) 3.3 V (same) 3.3 V (same) 3.3 V (same) 3.3 V (same)
Lifecycle Status Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete

Principaux différenciateurs

  • Higher logic density (1,320 LEs) than FLEX 6010 family members in the same 100-LBGA package (vs EPF6010ATC100-2)
  • Same silicon die as EPF6016AFC100-3, allowing speed-bin flexibility (vs EPF6016AFC100-3)
  • Wider temperature operating envelope selection across FLEX 6000 family (vs EPF6016ATC100-2)

Notes de conception

The EPF6016AFC100-2 requires a stable 3.3 V core supply (VCCINT) plus per-bank VCCIO supplies. Estimated: at typical 25% utilization, ICCINT is approximately 30-50 mA; add 1-5 mA per toggling I/O. Decouple VCCINT with 0.1 µF ceramic plus 10 µF bulk within 5 mm of the package, and place 0.1 µF decoupling on each VCCIO ball. During configuration, ICCINT can spike to 100 mA transient - ensure the regulator maintains regulation during this window.

The 100-LBGA FineLine BGA uses 1.0 mm ball pitch on an 11x11 mm substrate. PCB layout requires either micro-via-in-pad (0.3 mm pad with 0.1 mm via) or dog-bone fan-out. Per Altera FLEX 6000 reference design, route all signal traces on inner layers with micro-vias to outer BGA pads, and dedicate continuous ground/power planes on adjacent layers. Ensure solder paste stencil apertures are 0.5 mm diameter with 0.1 mm reduction for reliable reflow.

Configuration bitstream must be loaded on every power-up because FLEX 6000 uses SRAM cells (volatile). A common pitfall is forgetting the configuration EEPROM/controller, leaving the FPGA in undefined behavior at boot. Use an Altera EPC configuration device or a microcontroller to load the bitstream via PS or JTAG mode. Also note: do not apply I/O signals before VCCINT/VCCIO ramp - this can trigger I/O latch-up via the ESD clamp diodes.

Differential clock inputs on the FLEX 6000 must be routed with 100 Ω differential impedance and length-matched within 1 mm. Place the clock source within 50 mm of the dedicated clock pin to minimize jitter. For multi-clock domain designs, isolate clock regions on separate PCB layers with continuous ground reference to avoid crosstalk. JTAG chain routing should keep TMS/TCK signals away from fast-edge I/O to prevent programming interference.

Informations de conformité

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Sans plomb
Unknown
Sans halogène
Unknown
Minerais de conflit
Unknown

Compliance information not provided in the verified web data. FLEX 6000 family predates widespread RoHS adoption - many original parts are non-RoHS. Lead-free variants exist (suffix 'N' on some MPNs) but RoHS compliance is not confirmed for EPF6016AFC100-2.

Données vérifiées le : 2026-09-11 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

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Composants & termes associés

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