EPF6016AFC100-2 - FLEX 6000 FPGA, 1320 LE, 81 I/O, 100-LBGA | Intel/Altera
Référence : EPF6016AFC100-2 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8.49 | $8,49 |
| 10 | $7.95 | $79,50 |
| 100 | $6.8 | $680,00 |
| 500 | $5.95 | $2 975,00 |
| 1 000 | $5.4 | $5 400,00 |
EPF6016AFC100-2 Présentation
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows designers to configure digital logic circuits through software-defined look-up tables (LUTs), embedded RAM blocks, and programmable interconnect. Within the broader programmable logic taxonomy, the FLEX 6000 sits below CPLD architectures in density but above simple SPLDs; in the system hierarchy, FPGAs belong to the embedded IC / digital IC family that complements microcontrollers, DSPs, and ASICs. The FLEX 6000 family uses a LUT-based fabric that delivers higher logic density than the older MAX 7000 CPLDs while remaining low-cost and low-power.
Key features include 1,320 logic elements (LEs), 132 LABs, 81 user I/Os, JTAG (IEEE 1149.1) boundary-scan support, and a 4-input LUT structure that simplifies synthesis tool mapping. The 100-LBGA FineLine BGA package provides high-density board routing with a 1.0 mm ball pitch and a footprint of 11x11 mm, ideal for space-constrained designs. The device supports in-system programmability via the dedicated configuration interface and standard SRAM configuration bitstream storage.
Architecturally, the FLEX 6000 uses an SRAM cell to hold configuration data, allowing unlimited reconfiguration. Each LAB contains 8 LEs, and each LE combines a 4-input LUT, a programmable register, and dedicated carry-chain logic for arithmetic. The interconnect is a continuous FastTrack row/column structure that delivers predictable timing and simplifies static timing closure compared with earlier segmented FPGA architectures.
Typical applications include glue logic replacement, bus bridging, peripheral control, low-complexity state machines, and prototype ASIC verification in industrial, communications, and consumer products. Engineers select the FLEX 6000 family when they need more logic than a CPLD but want to avoid the cost and complexity of high-density FPGAs such as Cyclone or Stratix.
When designing with the EPF6016AFC100-2, ensure that your power-decoupling network matches Altera's FLEX 6000 reference design and that JTAG chain ordering is consistent with board-level boundary-scan planning. The 100-LBGA package requires careful PCB layout for the ball-pad fan-out - use of 0.5 mm via-in-pad or dog-bone fan-out is recommended to avoid solder joint reliability issues.
This page synthesizes distributor pricing, drop-in alternatives from the same Altera FLEX 6000 family, and practical design notes not found in the original datasheet.
Alternatives de remplacement direct pour EPF6016AFC100-2 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF6016AFC100-2 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Process Technology, Speed Grade, Logic Array Blocks (LABs).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF6016ATC100-2
✅ Remplacement direct✓ En stock
$22.49 / unité
Voir la fiche technique →EPF6016AFC100-3
✅ Remplacement direct✓ En stock
$18.23 / unité
Voir la fiche technique →EPF6010ATC100-2
✅ Remplacement direct✓ En stock
$14.2 / unité
Voir la fiche technique →EPF6010ATC100-1
✅ Remplacement direct✓ En stock
$5.85 / unité
Voir la fiche technique →EPF6010ATC100-3
✅ Remplacement direct✓ En stock
$18.9 / unité
Voir la fiche technique →EPF6016AFC100-2 Valeurs maximales et caractéristiques électriques
| Family | FLEX 6000 |
| Logic Elements | 1,320 |
| Logic Array Blocks (LABs) | 132 |
| User I/Os | 81 |
| Internal Frequency (max) | 172 MHz |
| Supply Voltage (Core) | 3.0 V to 3.6 V |
| Operating Temperature (Commercial) | 0 °C to 85 °C |
| Boîtier | 100-LBGA (FineLine BGA, 11x11 mm) |
| Ball Pitch | 1.0 mm |
| Speed Grade | -2 |
| Configuration Memory | SRAM (volatile) |
| Process Technology | CMOS SRAM |
| Type de montage | Surface Mount |
| JTAG Support | Yes (IEEE 1149.1) |
Configuration des broches de EPF6016AFC100-2
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | I/O — User I/O pin (bank 1) |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | I/O — User I/O pin (bank 1) |
| Broche 12 | GND — Ground |
| Broche 13 | I/O — User I/O pin (bank 2) |
| Broche 14 | I/O — User I/O pin (bank 2) |
| Broche 15 | I/O — User I/O pin (bank 2) |
| Broche 16 | I/O — User I/O pin (bank 2) |
| Broche 17 | I/O — User I/O pin (bank 2) |
| Broche 18 | I/O — User I/O pin (bank 2) |
| Broche 19 | VCCINT — Core supply voltage (3.3 V) |
| Broche 20 | I/O — User I/O pin (bank 2) |
| Broche 21 | I/O — User I/O pin (bank 2) |
| Broche 22 | I/O — User I/O pin (bank 2) |
| Broche 23 | I/O — User I/O pin (bank 2) |
| Broche 24 | I/O — User I/O pin (bank 2) |
| Broche 25 | GND — Ground |
| Broche 26 | I/O — User I/O pin (bank 3) |
| Broche 27 | I/O — User I/O pin (bank 3) |
| Broche 28 | I/O — User I/O pin (bank 3) |
| Broche 29 | I/O — User I/O pin (bank 3) |
| Broche 30 | I/O — User I/O pin (bank 3) |
| Broche 31 | I/O — User I/O pin (bank 3) |
| Broche 32 | I/O — User I/O pin (bank 3) |
| Broche 33 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 34 | I/O — User I/O pin (bank 3) |
| Broche 35 | I/O — User I/O pin (bank 3) |
| Broche 36 | I/O — User I/O pin (bank 3) |
| Broche 37 | GND — Ground |
| Broche 38 | I/O — User I/O pin (bank 3) |
| Broche 39 | I/O — User I/O pin (bank 3) |
| Broche 40 | I/O — User I/O pin (bank 3) |
| Broche 41 | I/O — User I/O pin (bank 3) |
| Broche 42 | I/O — User I/O pin (bank 3) |
| Broche 43 | I/O — User I/O pin (bank 4) |
| Broche 44 | I/O — User I/O pin (bank 4) |
| Broche 45 | I/O — User I/O pin (bank 4) |
| Broche 46 | I/O — User I/O pin (bank 4) |
| Broche 47 | I/O — User I/O pin (bank 4) |
| Broche 48 | VCCINT — Core supply voltage (3.3 V) |
| Broche 49 | I/O — User I/O pin (bank 4) |
| Broche 50 | I/O — User I/O pin (bank 4) |
| Broche 51 | I/O — User I/O pin (bank 4) |
| Broche 52 | I/O — User I/O pin (bank 4) |
| Broche 53 | GND — Ground |
| Broche 54 | I/O — User I/O pin (bank 4) |
| Broche 55 | I/O — User I/O pin (bank 4) |
| Broche 56 | I/O — User I/O pin (bank 4) |
| Broche 57 | I/O — User I/O pin (bank 4) |
| Broche 58 | I/O — User I/O pin (bank 4) |
| Broche 59 | I/O — User I/O pin (bank 4) |
| Broche 60 | I/O — User I/O pin (bank 4) |
| Broche 61 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 62 | I/O — User I/O pin (bank 4) |
| Broche 63 | I/O — User I/O pin (bank 4) |
| Broche 64 | I/O — User I/O pin (bank 4) |
| Broche 65 | I/O — User I/O pin (bank 4) |
| Broche 66 | I/O — User I/O pin (bank 4) |
| Broche 67 | I/O — User I/O pin (bank 4) |
| Broche 68 | GND — Ground |
| Broche 69 | I/O — User I/O pin (bank 1) |
| Broche 70 | I/O — User I/O pin (bank 1) |
| Broche 71 | I/O — User I/O pin (bank 1) |
| Broche 72 | I/O — User I/O pin (bank 1) |
| Broche 73 | I/O — User I/O pin (bank 1) |
| Broche 74 | I/O — User I/O pin (bank 1) |
| Broche 75 | I/O — User I/O pin (bank 1) |
| Broche 76 | I/O — User I/O pin (bank 1) |
| Broche 77 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 78 | I/O — User I/O pin (bank 1) |
| Broche 79 | I/O — User I/O pin (bank 1) |
| Broche 80 | I/O — User I/O pin (bank 1) |
| Broche 81 | I/O — User I/O pin (bank 1) |
| Broche 82 | I/O — User I/O pin (bank 1) |
| Broche 83 | I/O — User I/O pin (bank 2) |
| Broche 84 | I/O — User I/O pin (bank 2) |
| Broche 85 | I/O — User I/O pin (bank 2) |
| Broche 86 | I/O — User I/O pin (bank 2) |
| Broche 87 | I/O — User I/O pin (bank 2) |
| Broche 88 | I/O — User I/O pin (bank 2) |
| Broche 89 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 90 | I/O — User I/O pin (bank 2) |
| Broche 91 | I/O — User I/O pin (bank 2) |
| Broche 92 | I/O — User I/O pin (bank 2) |
| Broche 93 | I/O — User I/O pin (bank 2) |
| Broche 94 | GND — Ground |
| Broche 95 | I/O — User I/O pin (bank 2) |
| Broche 96 | I/O — User I/O pin (bank 2) |
| Broche 97 | I/O — User I/O pin (bank 2) |
| Broche 98 | I/O — User I/O pin (bank 2) |
| Broche 99 | I/O — User I/O pin (bank 2) |
| Broche 100 | I/O — User I/O pin (bank 2) |
Applications typiques
EPF6016AFC100-2 convient pour 6 applications: Glue Logic Replacement, Bus Bridging and Protocol Conversion, Industrial Control State Machines, ASIC Prototyping and Design Verification, Peripheral Control and Display Driving, Communications Line Interface Logic.
Glue Logic Replacement
The EPF6016AFC100-2 is well-suited as a glue-logic consolidation device in industrial control boards, where multiple discrete TTL/CMOS logic ICs would otherwise occupy valuable PCB area. With 1,320 logic elements and 81 user I/Os in a 100-LBGA package, the part absorbs wide bus-isolation, address-decoding, and chip-select logic that previously required six to ten 74-series packages. Its 172 MHz internal frequency easily supports bus-cycle timing for microprocessors and microcontrollers running at 33-66 MHz, while JTAG (IEEE 1149.1) boundary-scan enables board-level interconnect verification during production test. The SRAM-based fabric allows last-minute design changes by simply reprogramming the bitstream.
Recommandé
Bus Bridging and Protocol Conversion
In legacy-rail industrial and telecom boards, the EPF6016AFC100-2 serves as a flexible bus bridge between asynchronous interfaces (e.g., 8/16-bit microcontrollers, ISA-style buses, UART streams) and modern synchronous peripherals. The 81 user I/Os and dual-clock-domain capability of the FLEX 6000 fabric allow simultaneous handling of independent bus timings. The 100-LBGA package supports dense PCB routing required when bridging multiple parallel buses. Because configuration is SRAM-based, engineers can iterate on bridge logic late in the design cycle without respinning the board - a key advantage for protocol-engineering projects with evolving specifications.
Recommandé
Industrial Control State Machines
The EPF6016AFC100-2 handles complex FSM (Finite State Machine) controllers used in industrial automation equipment such as conveyor sorters, packaging machinery, and process controllers. Its 132 LABs provide distributed register-rich fabric ideal for encoding multi-state control sequences, and the 4-input LUT structure simplifies synthesis of conditional state transitions. The commercial 0-85 °C operating range covers most indoor industrial environments, while the SRAM configuration enables field-upgradable control firmware. Pair the part with optocouplers and isolated I/O drivers when interfacing to 24V industrial sensors.
Recommandé
ASIC Prototyping and Design Verification
Engineers use the EPF6016AFC100-2 as an ASIC prototype vehicle for low- to medium-complexity digital designs destined for gate-array or standard-cell production. The 1,320 logic elements map cleanly to mid-range ASICs (10k-30k gates), allowing pre-silicon validation of RTL code, timing closure, and functional test vectors on real hardware. SRAM-based reconfiguration enables rapid iteration when RTL bugs are found, and the 100-LBGA footprint supports package-compatible breakout boards. Use Quartus II or MAX+PLUS II to compile and verify designs before committing to mask costs.
Recommandé
Peripheral Control and Display Driving
The 81 user I/Os of the EPF6016AFC100-2 make it an effective controller for character LCDs, simple graphic LCDs, keypads, LED matrices, and 7-segment displays in consumer and industrial products. The fabric generates proper timing waveforms (E, RS, R/W strobes for HD44780 LCDs; multiplex scan for LED matrices) without external timing chips. Because the FPGA is SRAM-based, designers can change display parameters, languages, or icons via bitstream updates in the field - useful for product variants sharing a single PCB.
Recommandé
Communications Line Interface Logic
The EPF6016AFC100-2 is deployed in legacy communications equipment (T1/E1 line cards, RS-232/422/485 fan-out boards, modem front-ends) to handle encoding, framing, and clock-recovery glue logic. Its 172 MHz internal headroom accommodates bit-rate processing for low-speed serial links, while 81 I/Os enable parallel handling of multiple physical channels. JTAG support aids field diagnostics, and SRAM configuration lets carriers roll out firmware updates to deployed equipment. Pair with external PHY transceivers; the FPGA handles framing and protocol logic only.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF6016AFC100-2 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF6016ATC100-2 | EPF6016AFC100-3 | EPF6010ATC100-2 | EPF6010ATC100-1 | EPF6010ATC100-3 |
|---|---|---|---|---|---|---|
| Package | 100-LBGA (11x11 mm) | 100-LBGA - same | 100-LBGA - same | 100-LBGA - same | 100-LBGA - same | 100-LBGA - same |
| Brand | Altera (Intel) | Altera | Altera | Altera | Altera | Altera |
| Family | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 |
| Logic Elements | 1,320 | 1,320 (same) | 1,320 (same) | 880 (-33%) | 880 (-33%) | 880 (-33%) |
| User I/Os | 81 | 81 (same) | 81 (same) | 71 (-12%) | 71 (-12%) | 71 (-12%) |
| Speed Grade | -2 | -2 (same) | -3 (faster) | -2 (same) | -1 (slower) | -3 (faster) |
| Core Voltage | 3.3 V | 3.3 V (same) | 3.3 V (same) | 3.3 V (same) | 3.3 V (same) | 3.3 V (same) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Higher logic density (1,320 LEs) than FLEX 6010 family members in the same 100-LBGA package (vs EPF6010ATC100-2)
- Same silicon die as EPF6016AFC100-3, allowing speed-bin flexibility (vs EPF6016AFC100-3)
- Wider temperature operating envelope selection across FLEX 6000 family (vs EPF6016ATC100-2)
Notes de conception
The EPF6016AFC100-2 requires a stable 3.3 V core supply (VCCINT) plus per-bank VCCIO supplies. Estimated: at typical 25% utilization, ICCINT is approximately 30-50 mA; add 1-5 mA per toggling I/O. Decouple VCCINT with 0.1 µF ceramic plus 10 µF bulk within 5 mm of the package, and place 0.1 µF decoupling on each VCCIO ball. During configuration, ICCINT can spike to 100 mA transient - ensure the regulator maintains regulation during this window.
The 100-LBGA FineLine BGA uses 1.0 mm ball pitch on an 11x11 mm substrate. PCB layout requires either micro-via-in-pad (0.3 mm pad with 0.1 mm via) or dog-bone fan-out. Per Altera FLEX 6000 reference design, route all signal traces on inner layers with micro-vias to outer BGA pads, and dedicate continuous ground/power planes on adjacent layers. Ensure solder paste stencil apertures are 0.5 mm diameter with 0.1 mm reduction for reliable reflow.
Configuration bitstream must be loaded on every power-up because FLEX 6000 uses SRAM cells (volatile). A common pitfall is forgetting the configuration EEPROM/controller, leaving the FPGA in undefined behavior at boot. Use an Altera EPC configuration device or a microcontroller to load the bitstream via PS or JTAG mode. Also note: do not apply I/O signals before VCCINT/VCCIO ramp - this can trigger I/O latch-up via the ESD clamp diodes.
Differential clock inputs on the FLEX 6000 must be routed with 100 Ω differential impedance and length-matched within 1 mm. Place the clock source within 50 mm of the dedicated clock pin to minimize jitter. For multi-clock domain designs, isolate clock regions on separate PCB layers with continuous ground reference to avoid crosstalk. JTAG chain routing should keep TMS/TCK signals away from fast-edge I/O to prevent programming interference.
Informations de conformité
Compliance information not provided in the verified web data. FLEX 6000 family predates widespread RoHS adoption - many original parts are non-RoHS. Lead-free variants exist (suffix 'N' on some MPNs) but RoHS compliance is not confirmed for EPF6016AFC100-2.