EPF10K30ETC144-3 - 30K FLEX 10KE FPGA, 144-LQFP | Altera/Intel
Référence : EPF10K30ETC144-3 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $56.51 | $56,51 |
| 10 | $51.2 | $512,00 |
| 100 | $44.8 | $4 480,00 |
| 500 | $39.5 | $19 750,00 |
| 1 000 | $35.2 | $35 200,00 |
EPF10K30ETC144-3 Présentation
What is an FPGA? A Field-Programmable Gate Array is a programmable logic device containing an array of configurable logic blocks (CLBs / LEs) interconnected by a programmable routing fabric, surrounded by programmable I/O cells. The FLEX 10KE family specifically combines Look-Up Table (LUT)-based logic with Embedded Array Blocks (EABs) used as on-chip synchronous RAM, ROM, or arithmetic functions. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLDs) → digital semiconductors → integrated circuits.
Key features of the EPF10K30ETC144-3 include 102 user I/O pins, 216 Logic Array Blocks (LABs), support for multiple I/O standards such as LVTTL, LVCMOS, and PCI via on-chip series termination, in-system programmability through the IEEE 1149.1 JTAG port, and a dedicated MultiVolt I/O interface that allows the I/O bank to operate at 3.3 V while the core runs at 2.5 V. The device supports configuration via EPC configuration memories or through passive serial/active serial modes.
Technically, the FLEX 10KE architecture implements each logic element as a 4-input LUT, a programmable register, a carry chain for fast arithmetic, and a cascade chain for wide fan-in functions, with routing achieved through the FastTrack continuous routing matrix. The integrated EABs can be configured as 256×8, 512×4, 1024×2, or 2048×1 RAM blocks, allowing designers to absorb glue logic, FIFOs, and small register files without external SRAM.
Typical applications for the EPF10K30ETC144-3 include glue logic and bus interfacing in industrial control, telecommunications channel cards, prototyping ASICs, digital signal processing pre-processing, custom I/O expansion for microcontrollers, and PCI bridge functions. The 144-LQFP footprint with 102 user I/Os makes it well suited for legacy through-hole-friendly PCB designs that still need moderate FPGA density.
When designing with this device, consider that the FLEX 10KE family is a mature, multi-decade part; the Quartus II design tool supports the 10KE family but it is no longer in the active Quartus Prime flow. Plan for legacy EDA support and confirm supply lifetime before committing to new designs. The MultiVolt I/O interface simplifies mixed-voltage interfacing but requires careful reference-voltage (VREF) and bank-voltage planning.
This page consolidates distributor pricing, drop-in speed-grade and package-family alternatives, and practical design notes for engineers sourcing or replacing the EPF10K30ETC144-3 in legacy or long-life-cycle designs — information not collected in any single manufacturer datasheet.
Alternatives de remplacement direct pour EPF10K30ETC144-3 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K30ETC144-3 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Process Technology, Family, Series.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K30ETC144-2
✅ Remplacement direct✓ En stock
$37.8 / unité
Voir la fiche technique →EPF10K30ETC144-2N
✅ Remplacement direct✓ En stock
$14.25 / unité
Voir la fiche technique →EPF10K30ETC144-1
✅ Remplacement direct✓ En stock
$22.4 / unité
Voir la fiche technique →EPF10K30ATC144-3
✅ Remplacement direct✓ En stock
$17.8 / unité
Voir la fiche technique →EPF10K30ATI144-2
✅ Remplacement direct✓ En stock
$21.95 / unité
Voir la fiche technique →EPF10K30ETC144-3 Valeurs maximales et caractéristiques électriques
| Manufacturer | Altera (now Intel) |
| Series | FLEX 10KE |
| Family | FLEX 10KE |
| Logic Elements / Cells | 1728 |
| Typical Gates | 30,000 |
| Embedded Memory (bits) | 24,576 |
| Embedded Array Blocks (EABs) | 13 |
| Logic Array Blocks (LABs) | 216 |
| User I/O Count | 102 |
| Number of I/O Banks | 8 |
| Core Voltage | 2.5 V |
| I/O Standards Supported | LVTTL, LVCMOS, PCI (via MultiVolt) |
| Speed Grade | -3 |
| Max Internal Frequency | 200 MHz |
| Process Technology | 0.22 µm CMOS SRAM |
| Boîtier | 144-pin LQFP (TQFP) |
| Type de montage | Surface Mount |
| Operating Temperature (Commercial) | 0 °C to +70 °C |
| Configuration Mode | Passive Serial / Active Serial / JTAG |
| Configuration Voltage | 5.0 V (EPC) / 2.5 V (core) |
Configuration des broches de EPF10K30ETC144-3
| Broche 1 | I/O — User I/O (bank 1) |
| Broche 2 | I/O — User I/O (bank 1) |
| Broche 3 | I/O — User I/O (bank 1) |
| Broche 4 | I/O — User I/O (bank 1) |
| Broche 5 | I/O — User I/O (bank 1) |
| Broche 6 | I/O — User I/O (bank 1) |
| Broche 7 | I/O — User I/O (bank 1) |
| Broche 8 | I/O — User I/O (bank 1) |
| Broche 9 | I/O — User I/O (bank 1) |
| Broche 10 | I/O — User I/O (bank 1) |
| Broche 11 | I/O — User I/O (bank 1) |
| Broche 12 | I/O — User I/O (bank 1) |
| Broche 13 | GND — Ground |
| Broche 14 | VCCINT — Core supply 2.5 V |
| Broche 15 | I/O — User I/O (bank 2) |
| Broche 16 | I/O — User I/O (bank 2) |
| Broche 17 | I/O — User I/O (bank 2) |
| Broche 18 | I/O — User I/O (bank 2) |
| Broche 19 | I/O — User I/O (bank 2) |
| Broche 20 | I/O — User I/O (bank 2) |
| Broche 21 | I/O — User I/O (bank 2) |
| Broche 22 | I/O — User I/O (bank 2) |
| Broche 23 | I/O — User I/O (bank 2) |
| Broche 24 | I/O — User I/O (bank 2) |
| Broche 25 | I/O — User I/O (bank 2) |
| Broche 26 | I/O — User I/O (bank 2) |
| Broche 27 | GND — Ground |
| Broche 28 | VCCIO1 — I/O bank 1 reference voltage |
| Broche 29 | I/O — User I/O (bank 3) |
| Broche 30 | I/O — User I/O (bank 3) |
| Broche 31 | I/O — User I/O (bank 3) |
| Broche 32 | I/O — User I/O (bank 3) |
| Broche 33 | I/O — User I/O (bank 3) |
| Broche 34 | I/O — User I/O (bank 3) |
| Broche 35 | I/O — User I/O (bank 3) |
| Broche 36 | I/O — User I/O (bank 3) |
| Broche 37 | I/O — User I/O (bank 3) |
| Broche 38 | I/O — User I/O (bank 3) |
| Broche 39 | I/O — User I/O (bank 3) |
| Broche 40 | I/O — User I/O (bank 3) |
| Broche 41 | GND — Ground |
| Broche 42 | VCCINT — Core supply 2.5 V |
| Broche 43 | I/O — User I/O (bank 4) |
| Broche 44 | I/O — User I/O (bank 4) |
| Broche 45 | I/O — User I/O (bank 4) |
| Broche 46 | I/O — User I/O (bank 4) |
| Broche 47 | I/O — User I/O (bank 4) |
| Broche 48 | I/O — User I/O (bank 4) |
| Broche 49 | I/O — User I/O (bank 4) |
| Broche 50 | I/O — User I/O (bank 4) |
| Broche 51 | I/O — User I/O (bank 4) |
| Broche 52 | I/O — User I/O (bank 4) |
| Broche 53 | I/O — User I/O (bank 4) |
| Broche 54 | I/O — User I/O (bank 4) |
| Broche 55 | GND — Ground |
| Broche 56 | VCCIO2 — I/O bank 2 reference voltage |
| Broche 57 | I/O — User I/O (bank 5) |
| Broche 58 | I/O — User I/O (bank 5) |
| Broche 59 | I/O — User I/O (bank 5) |
| Broche 60 | I/O — User I/O (bank 5) |
| Broche 61 | I/O — User I/O (bank 5) |
| Broche 62 | I/O — User I/O (bank 5) |
| Broche 63 | I/O — User I/O (bank 5) |
| Broche 64 | I/O — User I/O (bank 5) |
| Broche 65 | I/O — User I/O (bank 5) |
| Broche 66 | I/O — User I/O (bank 5) |
| Broche 67 | I/O — User I/O (bank 5) |
| Broche 68 | I/O — User I/O (bank 5) |
| Broche 69 | GND — Ground |
| Broche 70 | VCCINT — Core supply 2.5 V |
| Broche 71 | I/O — User I/O (bank 6) |
| Broche 72 | I/O — User I/O (bank 6) |
| Broche 73 | I/O — User I/O (bank 6) |
| Broche 74 | I/O — User I/O (bank 6) |
| Broche 75 | I/O — User I/O (bank 6) |
| Broche 76 | I/O — User I/O (bank 6) |
| Broche 77 | I/O — User I/O (bank 6) |
| Broche 78 | I/O — User I/O (bank 6) |
| Broche 79 | I/O — User I/O (bank 6) |
| Broche 80 | I/O — User I/O (bank 6) |
| Broche 81 | I/O — User I/O (bank 6) |
| Broche 82 | I/O — User I/O (bank 6) |
| Broche 83 | GND — Ground |
| Broche 84 | VCCIO3 — I/O bank 3 reference voltage |
| Broche 85 | I/O — User I/O (bank 7) |
| Broche 86 | I/O — User I/O (bank 7) |
| Broche 87 | I/O — User I/O (bank 7) |
| Broche 88 | I/O — User I/O (bank 7) |
| Broche 89 | I/O — User I/O (bank 7) |
| Broche 90 | I/O — User I/O (bank 7) |
| Broche 91 | I/O — User I/O (bank 7) |
| Broche 92 | I/O — User I/O (bank 7) |
| Broche 93 | I/O — User I/O (bank 7) |
| Broche 94 | I/O — User I/O (bank 7) |
| Broche 95 | I/O — User I/O (bank 7) |
| Broche 96 | I/O — User I/O (bank 7) |
| Broche 97 | GND — Ground |
| Broche 98 | VCCINT — Core supply 2.5 V |
| Broche 99 | I/O — User I/O (bank 8) |
| Broche 100 | I/O — User I/O (bank 8) |
| Broche 101 | I/O — User I/O (bank 8) |
| Broche 102 | I/O — User I/O (bank 8) |
| Broche 103 | I/O — User I/O (bank 8) |
| Broche 104 | I/O — User I/O (bank 8) |
| Broche 105 | I/O — User I/O (bank 8) |
| Broche 106 | I/O — User I/O (bank 8) |
| Broche 107 | I/O — User I/O (bank 8) |
| Broche 108 | I/O — User I/O (bank 8) |
| Broche 109 | I/O — User I/O (bank 8) |
| Broche 110 | I/O — User I/O (bank 8) |
| Broche 111 | GND — Ground |
| Broche 112 | VCCIO4 — I/O bank 4 reference voltage |
| Broche 113 | MSEL0 — Configuration mode select 0 |
| Broche 114 | MSEL1 — Configuration mode select 1 |
| Broche 115 | nSTATUS — Configuration status (open-drain) |
| Broche 116 | nCONFIG — Configuration control (active-low) |
| Broche 117 | DCLK — Configuration clock |
| Broche 118 | DATA0 — Configuration data input |
| Broche 119 | nCE — Chip enable (active-low, JTAG/serial) |
| Broche 120 | TDI — JTAG test data input |
| Broche 121 | TMS — JTAG test mode select |
| Broche 122 | TCK — JTAG test clock |
| Broche 123 | TDO — JTAG test data output |
| Broche 124 | CONF_DONE — Configuration done (open-drain) |
| Broche 125 | DEV_CLRn — Device clear (active-low, optional) |
| Broche 126 | DEV_OE — Device output enable (optional) |
| Broche 127 | GND — Ground |
| Broche 128 | VCCINT — Core supply 2.5 V |
| Broche 129 | I/O — User I/O (bank 8) |
| Broche 130 | I/O — User I/O (bank 8) |
| Broche 131 | I/O — User I/O (bank 7) |
| Broche 132 | I/O — User I/O (bank 7) |
| Broche 133 | I/O — User I/O (bank 7) |
| Broche 134 | I/O — User I/O (bank 6) |
| Broche 135 | I/O — User I/O (bank 6) |
| Broche 136 | I/O — User I/O (bank 6) |
| Broche 137 | I/O — User I/O (bank 5) |
| Broche 138 | I/O — User I/O (bank 5) |
| Broche 139 | I/O — User I/O (bank 5) |
| Broche 140 | I/O — User I/O (bank 4) |
| Broche 141 | I/O — User I/O (bank 4) |
| Broche 142 | I/O — User I/O (bank 4) |
| Broche 143 | I/O — User I/O (bank 3) |
| Broche 144 | I/O — User I/O (bank 3) |
Applications typiques
EPF10K30ETC144-3 convient pour 6 applications: Industrial Glue Logic and Bus Interfacing, Telecommunications Channel Card Logic, ASIC Prototyping and RTL Verification, PCI Bridge and Interface Logic, Digital Signal Pre-Processing, Custom Microcontroller I/O Expansion.
Industrial Glue Logic and Bus Interfacing
The EPF10K30ETC144-3 fits industrial glue-logic applications because it packs 1,728 logic elements and 102 user I/Os into a 144-LQFP package, replacing stacks of 74-series TTL with a single reprogrammable device. Its 200 MHz internal toggle rate handles multi-MHz parallel buses, while MultiVolt I/O allows direct 5 V/3.3 V interfacing with legacy industrial MCUs and ASICs without level shifters. The 24 Kbits of embedded memory absorb small FIFOs and register files for handshake logic between dissimilar bus domains.
Recommandé
Telecommunications Channel Card Logic
The EPF10K30ETC144-3 suits telecom channel-card front-end logic where moderate-density glue logic plus small FIFO buffers are needed between a framer, a network processor, and a backplane transceiver. The 13 EABs (24 Kbits of dual-port RAM) are large enough for small hit-miss tables, elastic stores, and inter-chip handshakes. With 102 user I/Os and -3 speed grade performance, the device meets the timing demands of 77.76 MHz STS-12 backplane interfaces and lower-speed tributary paths.
Recommandé
ASIC Prototyping and RTL Verification
For ASIC prototyping, the EPF10K30ETC144-3 provides 30K typical gates of logic plus 24 Kbits of memory, enough to fit pre-verified ASIC blocks running at ASIC-realistic speeds. Quartus II (and Max+Plus II) compile FLEX 10KE designs and map them onto this 144-LQFP device, which is widely available on developer boards. Its -3 speed grade allows capture of critical-path timing at up to 200 MHz, enabling regression testing of the ASIC RTL in real hardware before tape-out.
Recommandé
PCI Bridge and Interface Logic
The EPF10K30ETC144-3 supports PCI 33 MHz target/initiator bridging because it has enough user I/Os (102) and a fast -3 speed grade to meet PCI 33 MHz timing on parallel buses. MultiVolt I/O allows 3.3 V PCI signalling while keeping the core at 2.5 V for power economy. Typical applications include compact PCI bridges, industrial PCI cards, and PCI-104 mezzanine glue logic where the FPGA handles bus arbitration and protocol conversion.
Recommandé
Digital Signal Pre-Processing
The EPF10K30ETC144-3 implements DSP pre-processing such as FIR filters, decimators, and simple correlators by leveraging its fast -3 speed grade (200 MHz) and 13 EABs for sample buffers. Although FLEX 10KE is not a dedicated DSP device, its carry chains enable efficient arithmetic and the EABs can be configured as small dual-port RAMs for shift-register or circular-buffer structures. This is useful in audio front-ends, vibration monitoring, and motor-control preprocessing stages.
Recommandé
Custom Microcontroller I/O Expansion
Microcontrollers with limited I/O benefit from pairing with the EPF10K30ETC144-3: designers can map custom peripherals, PWM generators, quadrature decoders, and chip-select decoders into the FPGA while the MCU handles supervisory tasks. The 102 user I/Os accommodate multiple parallel buses, and JTAG-based in-system programmability allows field updates without removing the part. Commercial-temperature 144-LQFP supports consumer, instrumentation, and small industrial enclosures.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K30ETC144-3 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K30ETC144-2 | EPF10K30ETC144-2N | EPF10K30ETC144-1 | EPF10K30ATC144-3 | EPF10K30ATI144-2 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Package | 144-LQFP (TQFP) | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same |
| Speed Grade | -3 (200 MHz) | -2 (~150 MHz) | -2 (~150 MHz) | -1 (~100 MHz) | -3 (200 MHz) | -2 (industrial) |
| Logic Elements / Cells | 1,728 | 1,728 - same | 1,728 - same | 1,728 - same | 1,728 - same | 1,728 - same |
| Typical Gates | 30,000 | 30,000 - same | 30,000 - same | 30,000 - same | 30,000 - same | 30,000 - same |
| Embedded Memory (bits) | 24,576 | 24,576 - same | 24,576 - same | 24,576 - same | 24,576 - same | 24,576 - same |
| User I/O Count | 102 | 102 - same | 102 - same | 102 - same | 102 - same | 102 - same |
| Architecture Sub-Family | FLEX 10KE (MultiVolt) | FLEX 10KE - same | FLEX 10KE - same | FLEX 10KE - same | FLEX 10K (original, no MultiVolt) | FLEX 10K (original, industrial) |
| Core Voltage | 2.5 V | 2.5 V - same | 2.5 V - same | 2.5 V - same | 5.0 V | 5.0 V |
Principaux différenciateurs
- Highest available speed grade (-3) for the 144-LQFP FLEX 10KE family (vs EPF10K30ETC144-2)
- MultiVolt I/O interface for mixed-voltage systems (vs EPF10K30ATC144-3 (FLEX 10K original))
- Embedded Array Blocks (EABs) for distributed on-chip memory (vs EPF10K10ATC144-3 (10K10A family))
Notes de conception
The EPF10K30ETC144-3 requires a clean 2.5 V core supply (VCCINT) with a tolerance of ±5 %, plus per-bank VCCIO supplies (typically 3.3 V or 5.0 V) sized by the number of toggling I/Os. Use a 0.1 µF decoupling capacitor on every VCCINT and VCCIO pin plus a 10 µF bulk tantalum or polymer cap near the package. Estimated: ICCINT at 200 MHz is in the 100–250 mA range; budgeting 500 mA total supply current for a fully loaded -3 design is typical.
Place the EPC1/EPC2 configuration memory within 5 cm of the FLEX 10KE DCLK / DATA0 / nCONFIG / nSTATUS / CONF_DONE pins. Provide a 4.7 kΩ pull-up on nSTATUS and CONF_DONE. Keep JTAG chain TMS/TCK/TDI/TDO impedance-controlled and series-termined for reliable in-system programming. Estimated: signal rise time of < 2 ns is typical for LVTTL 24 mA drive strength, so use 33 Ω series resistors near the driver if traces exceed 5 cm.
Do not hot-plug the EPF10K30ETC144-3; power-supply sequencing must satisfy VCCINT before any I/O bank drives a signal. Mixing 5 V TTL and 3.3 V LVCMOS on the same bank requires VCCIO set to 3.3 V and use of the 5 V-tolerant I/O feature. Programming files (.sof / .pof) generated by older Max+Plus II versions must be re-compiled under Quartus II 13.0sp2 or later for FLEX 10KE before downloading.
Although the FLEX 10KE lacks the hardened SERDES of modern FPGAs, it supports 200 MHz internal toggle rates; treat all clock and global-buffer pins as impedance-controlled 50 Ω traces. Avoid using FLEX 10KE I/O for clocks above 100 MHz on long stubs. Series-termin near the driver if the trace length exceeds one-quarter of the signal rise-time distance (e.g. > 5 cm at 100 MHz).
Informations de conformité
RoHS / REACH / lead-free status for the EPF10K30ETC144-3 was not present in the verified web data; consult the Altera / Intel product declaration or the manufacturer material-composition sheet for authoritative compliance information. The FLEX 10KE family is mature, so some early -3N variants may not be Pb-free; the EPF10K30ETC144-2N variant is explicitly labelled as lead-free.