EPF6024AFC256-2AA - 24K Gates FLEX 6000 FPGA 256-BGA | Altera
Référence : EPF6024AFC256-2AA ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $35.2 | $352,00 |
| 100 | $31.8 | $3 180,00 |
| 500 | $28.4 | $14 200,00 |
| 1 000 | $25.6 | $25 600,00 |
EPF6024AFC256-2AA Présentation
An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor containing an array of programmable logic blocks, interconnect, and I/O cells that engineers can customize after manufacturing using HDL (Hardware Description Language) bitstreams. FPGAs occupy the middle ground between fixed-function ASICs and software-driven processors, offering parallel hardware execution, deterministic latency, and the ability to be reprogrammed in-circuit. Within the broader taxonomy, the EPF6024AFC256-2AA is a SRAM-based LUT (Look-Up Table) FPGA, the most flexible and re-programmable sub-class, sitting under programmable logic -> logic IC -> integrated circuit -> semiconductor.
Key parametric features of the EPF6024AFC256-2AA include 218 maximum user I/O pins (high I/O density for a low-cost device), 1,960 logic elements, an embedded array block for implementing wide combinational functions such as FIFOs and RAM, and in-system programmability through the IEEE 1149.1 (JTAG) interface and Altera's passive serial configuration mode. The device also supports 5-V tolerant I/O operation when configured for mixed-voltage system integration.
The FLEX 6000 architecture uses a continuous, uninterrupted routing fabric with no segmented long-line penalties, simplifying timing closure at frequencies up to 166.67 MHz. SRAM configuration cells allow unlimited re-programming cycles, which is essential for design iteration and field upgrades. The 0.42 micrometer process keeps per-unit cost low while delivering adequate performance for glue logic, bus bridging, and peripheral interfacing.
Typical applications include communications glue logic, industrial control interfaces, legacy peripheral bridging (PCI to ISA bridges), printer and image-processing controllers, and low-cost ASIC prototyping. The high I/O count makes the EPF6024AFC256-2AA particularly well suited to designs that aggregate many slow-speed signals.
When designing with this device, plan for a dedicated configuration EEPROM (such as the EPC2) and verify that your synthesis tool flow is still maintained; FLEX 6000 devices predate the Quartus Prime flow and are typically used with the legacy MAX+PLUS II or early Quartus toolchains.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EPF6024AFC256-2AA — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF6024AFC256-2AA (même facteur de forme et même empreinte) — différant par Process Technology, Operating Temperature, Package, Configuration Method, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF6024AFC256-1
✅ Remplacement direct✓ En stock
$24.95 / unité
Voir la fiche technique →EPF6024ABI256-2
✅ Remplacement direct✓ En stock
$16.95 / unité
Voir la fiche technique →EPF6024ABC256-2N
✅ Remplacement direct✓ En stock
$22.1 / unité
Voir la fiche technique →EPF6024ABC256-3
✅ Remplacement direct✓ En stock
$20.75 / unité
Voir la fiche technique →EPF6016AFC256-2
✅ Remplacement direct✓ En stock
$33.05 / unité
Voir la fiche technique →EPF6016AFC256-3
✅ Remplacement direct✓ En stock
$22.1 / unité
Voir la fiche technique →EPF6024AFC256-2AA Valeurs maximales et caractéristiques électriques
| Family | FLEX 6000 |
| Logic Elements / Cells | 1,960 |
| Equivalent Gates | 24,000 |
| Number of I/O | 218 (max user I/O) |
| Number of Logic Blocks / LABs | 16 LABs |
| Embedded Memory | via embedded array blocks (EAB) |
| Tension d'alimentation | 3.0 V to 3.6 V |
| Internal Frequency | 166.67 MHz (max) |
| Process Technology | 0.42 micrometer CMOS |
| Température de fonctionnement | 0 C to +85 C (commercial) |
| Boîtier | 256-BGA (FBGA, 17x17 mm) |
| Type de montage | Surface Mount |
| Configuration Mode | Passive Serial, JTAG (IEEE 1149.1) |
| Statut RoHS | unknown |
| RAM Bits | via EAB (Embedded Array Block) |
Guide de configuration des broches du EPF6024AFC256-2AA 256-bga (fbga, 17x17 mm)
Configuration des broches du EPF6024AFC256-2AA (boîtier 256-bga (fbga, 17x17 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EPF6024AFC256-2AA.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EPF6024AFC256-2AA convient pour 6 applications: Legacy Peripheral Bus Bridging, Industrial Control Interface Aggregation, ASIC Prototyping and Pre-Silicon Validation, Printer and Image-Processing Controllers, Communications Glue Logic and Protocol Conversion, Legacy Military and Aerospace Test Equipment.
Legacy Peripheral Bus Bridging
The EPF6024AFC256-2AA bridges legacy parallel buses (PCI to ISA, PC/104 to local bus, VME bridges) where 218 user I/O pins aggregate many slow-speed signals and 1,960 logic cells implement the state machine, address decode, and timing logic. The wide I/O count avoids external bus transceivers, and the FLEX 6000 routing fabric supports deterministic timing at PCI 33 MHz. Placed on the system motherboard between the legacy host bus and the peripheral connector, it replaces discrete 74-series glue logic and is preferred over CPLDs when bus widths exceed 64 bits. The 166.67 MHz internal headroom ensures 33 MHz bus cycles are easily closed.
Recommandé
Industrial Control Interface Aggregation
In industrial control systems, the EPF6024AFC256-2AA aggregates 32 to 128 discrete digital inputs and outputs from PLC backplanes, motor drives, and sensor arrays into a single programmable logic device. The 218 I/O pins and 3.3 V core with 5 V tolerant I/O banks let it interface directly to legacy 5 V industrial sensors while driving 3.3 V downstream processors. Its 0 C to +85 C operating range suits cabinet-mounted controllers, and 24K gates easily implement debouncing, PWM generation, and encoder decoding. FLEX 6000 SRAM configuration allows field firmware updates via JTAG without removing the controller from service.
Recommandé
ASIC Prototyping and Pre-Silicon Validation
The EPF6024AFC256-2AA serves as a pre-silicon prototyping vehicle for ASIC designs in the 10K-20K gate range, offering 1,960 logic cells and 218 I/O to model real ASIC behavior before committing to mask costs. Engineers map RTL to FLEX 6000 logic elements with Quartus II or MAX+PLUS II to validate state machines, bus protocols, and timing closure in real hardware. The SRAM-based configuration enables overnight design spins via JTAG, accelerating the verify-edit-recompile loop by orders of magnitude versus simulation alone. This approach reduces ASIC respin risk for low-volume communications and image-processing ASICs.
Recommandé
Printer and Image-Processing Controllers
The EPF6024AFC256-2AA is well suited to mid-range printer engines, scanner controllers, and image-processing pipelines where 1,960 logic cells handle pixel pipelines, color-space conversion, and motor-control state machines, while 218 I/O pins connect to image sensors, stepper drivers, and host interfaces. The FLEX 6000 architecture delivers deterministic pixel-rate timing critical for image-sensor synchronization and printer-engine paper-path control. Compared to a CPLD, the EPF6024AFC256-2AA provides sufficient logic to integrate multiple paper-path sensors and encoders into a single device, reducing BOM cost and PCB area in mid-volume office equipment.
Recommandé
Communications Glue Logic and Protocol Conversion
In telecom and datacom equipment, the EPF6024AFC256-2AA implements glue logic between network processors, PHY devices, and backplane SERDES, performing bus-width adaptation, parity generation, and protocol conversion (UART to HDLC, I2C to SPI bridging). The 218 I/O count accommodates 16-bit and 32-bit parallel interfaces common in legacy telecom backplanes, and the 166.67 MHz internal frequency supports 66 MHz PCI and proprietary backplane speeds. With 24K gates, the device integrates what would otherwise be three to four discrete 74FCT logic devices into a single reprogrammable part, easing board layout and field upgrades.
Recommandé
Legacy Military and Aerospace Test Equipment
Test equipment for legacy military and aerospace platforms often requires FLEX 6000 logic to maintain compatibility with deployed field systems whose bitstreams were generated for Altera MAX+PLUS II design files. The EPF6024AFC256-2AA replicates these bitstreams exactly when modern alternatives are not supported by the legacy test executive. Its 218 I/O pins and 1,960 logic cells match the signal count and processing power of the deployed units, and authorized aftermarket inventory (Rochester Electronics) supports long-term sustainment programs. The SRAM-based configuration also enables in-field firmware updates for test-program revisions.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF6024AFC256-2AA — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF6024AFC256-1 | EPF6024ABI256-2 | EPF6024ABC256-2N | EPF6024ABC256-3 | EPF6016AFC256-2 | EPF6016AFC256-3 |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 256-BGA (FBGA, 17x17 mm) | 256-BGA (FBGA, 17x17 mm) - same | 256-BGA (FBGA, 17x17 mm) - same | 256-BGA (FBGA, 17x17 mm) - same | 256-BGA (FBGA, 17x17 mm) - same | 256-BGA (FBGA, 17x17 mm) - same | 256-BGA (FBGA, 17x17 mm) - same |
| Logic Cells | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 | 1,320 (-33%) | 1,320 (-33%) |
| Equivalent Gates | 24,000 | 24,000 | 24,000 | 24,000 | 24,000 | 16,000 (-33%) | 16,000 (-33%) |
| User I/O | 218 | 218 | 218 | 218 | 218 | 218 | 218 |
| Operating Temperature | 0 C to +85 C (commercial) | 0 C to +85 C | -40 C to +85 C (industrial) | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C |
| Speed Grade | -2 | -1 (slower) | -2 | -2 (C grade) | -3 (C grade, faster) | -2 | -3 (faster) |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- 24K gates in the largest FLEX 6000 die with 218 user I/O (vs EPF6016AFC256-2)
- Industrial temperature grade option in identical package (vs EPF6024ABI256-2)
- Multiple speed grades available for design margin tuning (vs EPF6024AFC256-1 vs EPF6024ABC256-3)
Notes de conception
Estimated: the EPF6024AFC256-2AA core current draw scales with toggle rate; in a typical design with 50% utilization at 100 MHz, expect 200 to 400 mA of VCCINT (3.3 V) current plus I/O current proportional to switching frequency. Provide at least a 4-layer PCB with a dedicated VCC plane and place 0.1 microfarad X7R decoupling capacitors within 5 mm of every supply pin. Add bulk tantalum or polymer capacitors (100 to 470 microfarads) near the device to handle inrush during configuration. The 5 V tolerant I/O banks require VCCIO rails set to 3.3 V (5 V tolerant) or 2.5 V depending on peripheral interface.
The 256-FBGA package uses 1.0 mm ball pitch on a 17x17 mm body, which requires laser-drilled microvias or 0.5 mm via-in-pad technology on the PCB for reliable fan-out. Avoid placing decoupling capacitors on the BGA shadow if using 4-layer stack-up; route escape traces between the outer rows of balls on inner signal layers. Use a continuous ground plane on layer 2 directly under the BGA to minimize inductance and provide a thermal path. Estimated: with these layout practices, junction-to-ambient thermal resistance (theta_JA) is approximately 20 to 25 C/W with adequate copper pour.
Three pitfalls are common when bringing up FLEX 6000 designs. First, configuration requires an external EPC2 (or compatible) EEPROM in passive serial mode; do not assume JTAG-only configuration for production. Second, the Quartus II toolchain version must be <= v13.0 because later Quartus Prime releases have dropped FLEX 6000 device support; reverting toolchains on long-lived projects is a recurring pain point. Third, mixing 3.3 V and 5 V signaling requires explicit VCCIO bank configuration - if the I/O bank is left at the default 3.3 V, 5 V input signals will not be clamped and may damage the device. Always verify the bitstream is generated for the exact device suffix (AA, AB, AC) before programming.
Estimated: at typical 50% logic utilization and 100 MHz operation, the EPF6024AFC256-2AA dissipates approximately 1.0 to 1.5 W of core power. The 256-FBGA package exposes a thermal pad via the center balls that must be soldered to a copper pour for heat extraction. With 4-layer PCB and 25 by 25 mm copper heatsink area, theta_JA drops to roughly 15 C/W, supporting 85 C ambient operation with 0.5 C/W margin per watt. For enclosed industrial enclosures, derate ambient by 10 C and consider a clip-on heatsink on the package top surface.
Informations de conformité
EPF6024AFC256-2AA is a 1996-vintage device; original datasheet predates RoHS compliance documentation. RoHS/lead-free finish status must be verified per part marking on incoming inventory, as both SnPb and lead-free variants exist in the field. Not qualified to AEC-Q100; not recommended for automotive safety-critical applications.
