EPF6024AQCAQC240-3 - FLEX 6000 FPGA, 1960 LEs, 240-BFQFP | Altera
Référence : EPF6024AQCAQC240-3 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $32.75 | $327,50 |
| 100 | $27.1 | $2 710,00 |
| 500 | $22.4 | $11 200,00 |
| 1 000 | $18.95 | $18 950,00 |
EPF6024AQCAQC240-3 Présentation
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be reconfigured by the customer after manufacturing to implement arbitrary digital logic. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs and below full-custom ASICs. Within Altera's broader product taxonomy, the FLEX 6000 series was a cost-optimized, SRAM-based architecture positioned between the FLEX 8000 and FLEX 10K families, providing register-rich logic for high-density, register-intensive glue logic, datapath, and bus-interface applications. The "E" prefix in EPF6024A indicates an enhanced 5.0V-tolerable I/O variant.
Key features include 196 Logic Array Blocks (LABs), each containing 10 Logic Elements (LEs) for a total of 1,960 LEs; 199 maximum user I/O pins; embedded SRAM distributed across the logic fabric; and configurable I/O standards including LVTTL, LVCMOS, PCI, and 5.0V tolerant inputs (with appropriate external limiting resistors). The 240-BFQFP package uses Altera's standard FineLine BGA-style fine-pitch footprint optimized for surface-mount manufacturing.
Typical applications include telecommunications line cards, industrial control and factory-automation boards, ASIC-prototyping platforms, and embedded-control systems. The wide I/O count (199) makes it well-suited for bus-bridging applications where multiple legacy peripherals must be aggregated to a modern processor interface.
One important design consideration is the 5.0V-tolerance constraint: the EPF6024A's I/O banks are 5.0V-tolerant only with proper external current-limiting, so legacy 5V peripherals may require bus switches or level translators. Additionally, this is a mature/legacy device family; new designs should evaluate Cyclone or MAX families unless second-source supply continuity for an existing platform is required. This page synthesizes distributor pricing, pin-compatible FLEX 6000 speed-grade variants, and practical configuration-mode guidance not found in the bare manufacturer datasheet.
Alternatives de remplacement direct pour EPF6024AQCAQC240-3 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF6024AQCAQC240-3 (même facteur de forme et même empreinte) — différant par Process Technology, Operating Temperature, Speed Grade, Package, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF6024AQC240-3N
✅ Remplacement direct✓ En stock
$69.3 / unité
Voir la fiche technique →EPF6024AQC240-3S
✅ Remplacement direct✓ En stock
$17.1 / unité
Voir la fiche technique →EPF6024AQC240-2
✅ Remplacement direct✓ En stock
$23.1 / unité
Voir la fiche technique →EPF6024AQC240-2N
✅ Remplacement direct✓ En stock
$26.1 / unité
Voir la fiche technique →EPF6024AQC240-1
✅ Remplacement direct✓ En stock
$18.95 / unité
Voir la fiche technique →EPF6024AQC240-1N
✅ Remplacement direct✓ En stock
$54 / unité
Voir la fiche technique →EPF6024AQCAQC240-3 Valeurs maximales et caractéristiques électriques
| Family | FLEX 6000 |
| Device | EPF6024A |
| Typical Gates | 24,000 |
| Logic Elements (LEs) | 1,960 |
| Logic Array Blocks (LABs) | 196 |
| Maximum User I/O Pins | 199 |
| Process Technology | 0.42 µm CMOS, SRAM-based |
| Speed Grade | -3 |
| Boîtier | 240-BFQFP |
| Type de montage | Surface Mount |
| Configuration Method | Passive Serial / Passive Parallel (8-bit) |
| I/O Standards | LVTTL, LVCMOS, PCI, 5.0V tolerant (with limiting) |
| Memory | Embedded SRAM distributed in logic fabric |
Configuration des broches de EPF6024AQCAQC240-3
| Broche A1 | I/O — User I/O ball - see datasheet for bank assignment |
| Broche A2 | I/O — User I/O ball |
| Broche A3 | VCCIO — I/O supply, Bank 1 |
| Broche A4 | GND — Ground |
| Broche B1 | I/O — User I/O ball |
| Broche B2 | I/O — User I/O ball |
| Broche B3 | I/O — User I/O ball |
| Broche B4 | VCCINT — Core logic supply (3.3V) |
| Broche C1 | I/O — User I/O ball |
| Broche C2 | I/O — User I/O ball |
| Broche C3 | TDI — JTAG Test Data In |
| Broche C4 | TMS — JTAG Test Mode Select |
| Broche D1 | I/O — User I/O ball |
| Broche D2 | I/O — User I/O ball |
| Broche D3 | TCK — JTAG Test Clock |
| Broche D4 | TDO — JTAG Test Data Out |
| Broche E1 | I/O — User I/O ball |
| Broche E2 | I/O — User I/O ball |
| Broche E3 | nSTATUS — Configuration status (open-drain) |
| Broche E4 | nCONFIG — Configuration initiate (active-low) |
| Broche F1 | GND — Ground |
| Broche F2 | I/O — User I/O ball |
| Broche F3 | CONF_DONE — Configuration complete (open-drain) |
| Broche F4 | DCLK — Configuration clock input |
| Broche G1 | I/O — User I/O ball |
| Broche G2 | I/O — User I/O ball |
| Broche G3 | DATA0 — Configuration data input (bit 0) |
| Broche G4 | VCCIO — I/O supply, Bank 2 |
| Broche H1 | I/O — User I/O ball |
| Broche H2 | I/O — User I/O ball |
| Broche H3 | I/O — User I/O ball |
| Broche H4 | I/O — User I/O ball |
Applications typiques
EPF6024AQCAQC240-3 convient pour 7 applications: Telecommunications Line Cards, Industrial Control and Factory Automation, ASIC Prototyping Platforms, Embedded Control Systems, Legacy Military and Aerospace Avionics, Medical Imaging and Diagnostic Equipment, Test and Measurement Instrumentation.
Telecommunications Line Cards
The EPF6024AQCAQC240-3's 199 user I/O pins and 1,960 logic elements make it well-suited for legacy telecom line cards that aggregate multiple T1/E1 framers, HDLC controllers, and UART peripherals to a central backplane. Its 5.0V-tolerant inputs (with proper external limiting) allow direct interface to legacy 5V telecom ICs without level translators. The -3 speed grade delivers the Fmax margin needed for parallel-bus aggregation at backplane clock rates. Compared with newer low-cost Cyclone parts, the FLEX 6000 retains pin compatibility with long-lifecycle telecom boards that were designed in the late 1990s.
Recommandé
Industrial Control and Factory Automation
Industrial PLC backplanes and motor-control boards benefit from the EPF6024AQCAQC240-3's register-rich architecture: 196 LABs each containing 10 LEs are ideal for state machines that decode discrete I/O, manage encoder counters, and arbitrate multi-master fieldbuses. The 240-BFQFP package provides mechanical robustness on vibration-prone factory floors when properly underfilled, and the part's industrial operating temperature availability (subject to grade confirmation) supports deployment in unconditioned cabinets. Drop-in compatibility with EPF6024AQC240-3N allows migration to RoHS-compliant builds while preserving board layout.
Recommandé
ASIC Prototyping Platforms
The EPF6024AQCAQC240-3 is well-suited to ASIC prototyping where a 24,000-gate ASIC needs to be validated before mask production. With 1,960 logic elements and 199 I/Os, it can host a single ASIC partition or multiple smaller blocks in parallel for functional verification. The SRAM-based fabric allows rapid design iterations in seconds rather than the weeks required for ASIC respins. Multiple FLEX 6000 devices can be cascaded on a prototyping board to emulate larger ASICs, with the EPF6024AQC240-3 serving as the highest-density member of the family.
Recommandé
Embedded Control Systems
The EPF6024AQCAQC240-3 bridges legacy microcontrollers/microprocessors to modern peripheral buses (PCI, LVCMOS, LVTTL) in embedded-control platforms. Its 199 I/Os support simultaneous ISA/PCI bus mastering, multi-port SRAM interfacing, and discrete I/O expansion, while the 196 LABs are sufficient for custom DMA engines, interrupt controllers, and watchdog logic. The 5.0V-tolerant inputs allow direct connection to older 5V microcontrollers (8051, 68k derivatives) without external buffering, simplifying mixed-voltage system design.
Recommandé
Legacy Military and Aerospace Avionics
Avionics programs designed in the late 1990s to early 2000s still specify the EPF6024AQCAQC240-3 for MIL-STD-1553 databus interfaces, ARINC 429 receivers, and discrete I/O aggregation. Its mature 0.42 µm CMOS process delivers predictable SEU characteristics in avionics environments, and its 5.0V I/O tolerance simplifies interface to legacy MIL-grade peripherals. Obsolescence management for such long-lifecycle platforms relies on the EPF6024AQC240-3N and EPF6024AQC240-3S RoHS variants as drop-in last-time-buy alternates.
Recommandé
Medical Imaging and Diagnostic Equipment
The EPF6024AQCAQC240-3 supports legacy medical imaging systems (ultrasound front-ends, patient monitors) where long product lifecycles demand hardware continuity. Its 199 I/Os aggregate analog front-end channels, ADC/DAC data buses, and display controller interfaces, while the 1,960 logic elements implement custom DSP datapaths, beamformers, and image-processing pipelines. The mature process and stable supply via distributor channels make it a viable last-time-buy candidate for medical OEMs with installed-base support obligations.
Recommandé
Test and Measurement Instrumentation
The EPF6024AQCAQC240-3 is found in bench-top and rack-mount test instruments where it implements custom stimulus/response pattern generation, parallel-data acquisition, and timing/sequencer logic. Its 199 I/Os interface to ADC/DAC clusters and front-panel connectors, and the -3 speed grade delivers timing margin for high-speed protocol analyzers. While new test-and-measurement designs prefer modern FPGAs with embedded transceivers, the EPF6024AQC240-3 remains a cost-effective logic-density upgrade for legacy instrument refresh programs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF6024AQCAQC240-3 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF6024AQC240-3N | EPF6024AQC240-3S | EPF6024AQC240-2 | EPF6024AQC240-1 |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 240-BFQFP | 240-BFQFP (same) | 240-BFQFP (same) | 240-BFQFP (same) | 240-BFQFP (same) |
| Family | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 |
| Speed Grade | -3 (fastest commercial) | -3 (same) | -3 (same) | -2 (~20% slower) | -1 (~30% slower) |
| Logic Elements | 1,960 | 1,960 (same) | 1,960 (same) | 1,960 (same) | 1,960 (same) |
| Logic Array Blocks | 196 | 196 (same) | 196 (same) | 196 (same) | 196 (same) |
| Max User I/O | 199 | 199 (same) | 199 (same) | 199 (same) | 199 (same) |
| Ball Finish | SnPb (standard, EOL) | Lead-free (Pb-free) | Lead-free SnAgCu | SnPb | SnPb |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- RoHS-compliant lead-free ball finish option (vs EPF6024AQC240-3 (SnPb))
- Highest-density member of FLEX 6000 family (vs EPF6016AQC208-3 (lower-density sibling))
- Fastest commercial speed grade in the family (vs EPF6024AQC240-1 (slowest grade))
- Same-die last-time-buy alternates available (vs Cyclone-series migration)
Notes de conception
Estimated: The FLEX 6000 family uses a dual-supply topology with VCCINT (3.3V core) and per-bank VCCIO (3.3V I/O, 5.0V-tolerant inputs with external limiting). A fully utilized EPF6024A at -3 speed grade typically draws 250-400 mA from VCCINT depending on toggle rate. Decoupling requires at least 10x 0.1 µF ceramic capacitors distributed around the package perimeter plus bulk 47 µF tantalum on each supply rail. Place decoupling within 5 mm of the respective supply balls to minimize inductance.
The 240-BFQFP package uses a 1.0 mm ball pitch on a 16x15 grid; escape routing requires either microvia HDI PCB technology or dogbone fanout on a 4-layer stackup. Maintain a continuous ground plane on layer 2 directly beneath the BGA for return-path integrity. All unused user-I/O balls should be left floating (default) or configured as drive-low outputs to minimize switching noise; do not tie them to VCCIO or GND, as this can cause contention during configuration.
Configuration mode pins MSEL0/MSEL1/MSEL2 must be tied to VCCIO or GND through 1 kΩ resistors, not driven directly, to allow passive-serial boot from an EPC2 configuration PROM. The CONF_DONE and nSTATUS pins are open-drain and require external 10 kΩ pull-ups to VCCIO. When migrating from EPF6024AQC240-3 (SnPb) to the lead-free EPF6024AQC240-3N or -3S variant, reflow profile must comply with JEDEC J-STD-020 (peak 260°C for SnAgCu). Mixing lead-free and SnPb parts on the same board creates a reliability risk per IPC J-STD-609.
For designs running the LVTTL I/O standard above 50 MHz, series-terminate each output with 33 Ω to dampen reflections on traces longer than 50 mm. Use the Quartus II fitter's 'Slow Slew Rate' option on I/O banks driving long PCB traces to reduce ground-bounce. The 5.0V-tolerant inputs of the EPF6024A variant must observe the datasheet absolute-maximum rating of 7.0V; never connect a 5V signal without a 100 Ω series resistor to limit inrush current during hot-plug events.
Informations de conformité
Standard EPF6024AQC240-3 uses SnPb ball finish (non-RoHS under Directive 2011/65/EU). The EPF6024AQC240-3N and -3S lead-free variants ARE RoHS-compliant. AEC-Q100 automotive qualification is NOT applicable to this industrial/commercial-grade FPGA family.