EPF6016AQC208-3 - FLEX 6000 16K Gates FPGA 208-PQFP | Intel / Altera
Référence : EPF6016AQC208-3 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $32.75 | $327,50 |
| 100 | $27.1 | $2 710,00 |
| 500 | $22.4 | $11 200,00 |
| 1 000 | $19.2 | $19 200,00 |
EPF6016AQC208-3 Présentation
An FPGA (Field Programmable Gate Array) is a programmable logic device (PLD) containing an array of configurable logic blocks (CLBs / LEs / LABs) interconnected by a programmable routing fabric. FPGAs sit in the broader taxonomy of digital logic IC -> programmable logic -> PLD -> FPGA, and are used to implement arbitrary digital circuits without ASIC NRE. The FLEX 6000 family is Altera's classic low-cost, 5 V-tolerant family historically used for glue logic, bus interface bridging, and state-machine replacement.
Key features of the EPF6016AQC208-3 include 1,320 logic elements organized as 132 Logic Array Blocks (LABs), 171 user I/O pins, built-in SRAM configuration memory, JTAG-based in-system programmability via the IEEE 1149.1 boundary-scan interface, and a typical internal operating frequency up to approximately 142.86 MHz. The "-3" speed grade designates the faster of the speed bins offered in this package, while "AQC208" indicates the 208-pin plastic QFP industrial-grade package.
The architecture combines four-input look-up tables (LUTs) inside each LE, dedicated carry chains for fast arithmetic, and a hierarchical FastTrack interconnect for predictable timing. The 3.3 V core with 5 V tolerant I/O allows direct interface to TTL/CMOS peripherals common in legacy industrial designs, while configuration can be loaded via passive serial, passive parallel synchronous, passive parallel asynchronous, or JTAG modes from a serial PROM or microprocessor.
Typical applications include industrial control glue logic, legacy peripheral bus bridges (PCI, ISA, VME), ASIC prototyping, telecommunications line cards, and digital signal processing front-end control. The combination of 171 I/O and 16K gates makes it well suited to systems that need to aggregate many slow-speed parallel interfaces around a host processor.
When designing with this device, allow adequate decoupling on every VCCINT/VCCIO pin pair and follow Altera's PQFP PCB layout guidelines for high-pin-count QFP packages. Because configuration memory is volatile SRAM, the FPGA must be reconfigured at every power-up by a configuration PROM or an external controller.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the original manufacturer datasheet alone.
Alternatives de remplacement direct pour EPF6016AQC208-3 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF6016AQC208-3 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Process Technology, Configuration Memory, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF6016AQC208-3N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$31.2 / unité
Voir la fiche technique →EPF6016AQC208-2
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$19.4 / unité
Voir la fiche technique →EPF6016AQC208-2N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$13.85 / unité
Voir la fiche technique →EPF6016AQC208-1
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$42.1 / unité
Voir la fiche technique →EPF6024AQC208-3N
✅ Remplacement direct✓ En stock
$23.9 / unité
Voir la fiche technique →EPF6016AQC208-3 Valeurs maximales et caractéristiques électriques
| Series | FLEX 6000 |
| Family | FLEX 6000 (SRAM-based FPGA) |
| Typical Gates | 16,000 |
| Logic Elements | 1,320 |
| Logic Array Blocks (LABs) | 132 |
| User I/O Pins | 171 |
| Internal Frequency (max) | 142.86 MHz |
| Supply Voltage - Core | 3.3 V |
| I/O Supply Voltage | 3.3 V (5 V tolerant inputs) |
| Process Technology | 0.35 um CMOS, 5 V tolerant |
| Configuration Memory | Volatile SRAM (external configuration device required) |
| Boîtier / Format | 208-BFQFP (PQFP, 28x28 mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0 C to +85 C (Commercial) |
| Speed Grade | -3 |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) |
Configuration des broches de EPF6016AQC208-3
| Broche 1 | I/O — User I/O (bank 1) |
| Broche 2 | I/O — User I/O (bank 1) |
| Broche 3 | I/O — User I/O (bank 1) |
| Broche 4 | VCCIO1 — I/O bank 1 supply (3.3 V) |
| Broche 5 | I/O — User I/O (bank 1) |
| Broche 6 | I/O — User I/O (bank 1) |
| Broche 7 | GND — Ground |
| Broche 8 | I/O — User I/O (bank 1) |
| Broche 9 | I/O — User I/O (bank 1) |
| Broche 10 | VCCINT — Core supply (3.3 V) |
| Broche 11 | I/O — User I/O (bank 1) |
| Broche 12 | I/O — User I/O (bank 1) |
| Broche 13 | I/O — User I/O (bank 1) |
| Broche 14 | I/O — User I/O (bank 1) |
| Broche 15 | I/O — User I/O (bank 1) |
| Broche 16 | GND — Ground |
| Broche 17 | I/O — User I/O (bank 1) |
| Broche 18 | I/O — User I/O (bank 1) |
| Broche 19 | VCCIO1 — I/O bank 1 supply (3.3 V) |
| Broche 20 | I/O — User I/O (bank 1) |
| Broche 21 | I/O — User I/O (bank 1) |
| Broche 22 | I/O — User I/O (bank 1) |
| Broche 23 | I/O — User I/O (bank 1) |
| Broche 24 | GND — Ground |
| Broche 25 | I/O — User I/O (bank 1) |
| Broche 26 | I/O — User I/O (bank 1) |
| Broche 27 | I/O — User I/O (bank 1) |
| Broche 28 | I/O — User I/O (bank 1) |
| Broche 29 | VCCIO1 — I/O bank 1 supply (3.3 V) |
| Broche 30 | I/O — User I/O (bank 1) |
| Broche 31 | I/O — User I/O (bank 1) |
| Broche 32 | GND — Ground |
| Broche 33 | I/O — User I/O (bank 1) |
| Broche 34 | I/O — User I/O (bank 1) |
| Broche 35 | I/O — User I/O (bank 1) |
| Broche 36 | VCCINT — Core supply (3.3 V) |
| Broche 37 | I/O — User I/O (bank 1) |
| Broche 38 | I/O — User I/O (bank 1) |
| Broche 39 | I/O — User I/O (bank 1) |
| Broche 40 | I/O — User I/O (bank 1) |
| Broche 41 | I/O — User I/O (bank 1) |
| Broche 42 | GND — Ground |
| Broche 43 | I/O — User I/O (bank 1) |
| Broche 44 | I/O — User I/O (bank 1) |
| Broche 45 | VCCIO2 — I/O bank 2 supply (3.3 V) |
| Broche 46 | I/O — User I/O (bank 2) |
| Broche 47 | I/O — User I/O (bank 2) |
| Broche 48 | I/O — User I/O (bank 2) |
| Broche 49 | I/O — User I/O (bank 2) |
| Broche 50 | GND — Ground |
| Broche 51 | I/O — User I/O (bank 2) |
| Broche 52 | I/O — User I/O (bank 2) |
| Broche 53 | VCCINT — Core supply (3.3 V) |
| Broche 54 | I/O — User I/O (bank 2) |
| Broche 55 | I/O — User I/O (bank 2) |
| Broche 56 | I/O — User I/O (bank 2) |
| Broche 57 | I/O — User I/O (bank 2) |
| Broche 58 | I/O — User I/O (bank 2) |
| Broche 59 | GND — Ground |
| Broche 60 | I/O — User I/O (bank 2) |
| Broche 61 | I/O — User I/O (bank 2) |
| Broche 62 | VCCIO2 — I/O bank 2 supply (3.3 V) |
| Broche 63 | I/O — User I/O (bank 2) |
| Broche 64 | I/O — User I/O (bank 2) |
| Broche 65 | I/O — User I/O (bank 2) |
| Broche 66 | I/O — User I/O (bank 2) |
| Broche 67 | GND — Ground |
| Broche 68 | I/O — User I/O (bank 2) |
| Broche 69 | I/O — User I/O (bank 2) |
| Broche 70 | VCCINT — Core supply (3.3 V) |
| Broche 71 | I/O — User I/O (bank 2) |
| Broche 72 | I/O — User I/O (bank 2) |
| Broche 73 | I/O — User I/O (bank 2) |
| Broche 74 | I/O — User I/O (bank 2) |
| Broche 75 | I/O — User I/O (bank 2) |
| Broche 76 | GND — Ground |
| Broche 77 | I/O — User I/O (bank 2) |
| Broche 78 | I/O — User I/O (bank 2) |
| Broche 79 | VCCIO2 — I/O bank 2 supply (3.3 V) |
| Broche 80 | I/O — User I/O (bank 2) |
| Broche 81 | I/O — User I/O (bank 2) |
| Broche 82 | I/O — User I/O (bank 2) |
| Broche 83 | I/O — User I/O (bank 2) |
| Broche 84 | GND — Ground |
| Broche 85 | I/O — User I/O (bank 2) |
| Broche 86 | I/O — User I/O (bank 2) |
| Broche 87 | VCCINT — Core supply (3.3 V) |
| Broche 88 | I/O — User I/O (bank 2) |
| Broche 89 | I/O — User I/O (bank 2) |
| Broche 90 | I/O — User I/O (bank 2) |
| Broche 91 | I/O — User I/O (bank 2) |
| Broche 92 | I/O — User I/O (bank 2) |
| Broche 93 | GND — Ground |
| Broche 94 | I/O — User I/O (bank 2) |
| Broche 95 | I/O — User I/O (bank 2) |
| Broche 96 | VCCIO2 — I/O bank 2 supply (3.3 V) |
| Broche 97 | I/O — User I/O (bank 2) |
| Broche 98 | I/O — User I/O (bank 2) |
| Broche 99 | I/O — User I/O (bank 2) |
| Broche 100 | I/O — User I/O (bank 2) |
| Broche 101 | GND — Ground |
| Broche 102 | I/O — User I/O (bank 3) |
| Broche 103 | I/O — User I/O (bank 3) |
| Broche 104 | VCCINT — Core supply (3.3 V) |
| Broche 105 | I/O — User I/O (bank 3) |
| Broche 106 | I/O — User I/O (bank 3) |
| Broche 107 | I/O — User I/O (bank 3) |
| Broche 108 | I/O — User I/O (bank 3) |
| Broche 109 | I/O — User I/O (bank 3) |
| Broche 110 | GND — Ground |
| Broche 111 | I/O — User I/O (bank 3) |
| Broche 112 | I/O — User I/O (bank 3) |
| Broche 113 | VCCIO3 — I/O bank 3 supply (3.3 V) |
| Broche 114 | I/O — User I/O (bank 3) |
| Broche 115 | I/O — User I/O (bank 3) |
| Broche 116 | I/O — User I/O (bank 3) |
| Broche 117 | I/O — User I/O (bank 3) |
| Broche 118 | GND — Ground |
| Broche 119 | I/O — User I/O (bank 3) |
| Broche 120 | I/O — User I/O (bank 3) |
| Broche 121 | VCCINT — Core supply (3.3 V) |
| Broche 122 | I/O — User I/O (bank 3) |
| Broche 123 | I/O — User I/O (bank 3) |
| Broche 124 | I/O — User I/O (bank 3) |
| Broche 125 | I/O — User I/O (bank 3) |
| Broche 126 | I/O — User I/O (bank 3) |
| Broche 127 | GND — Ground |
| Broche 128 | I/O — User I/O (bank 3) |
| Broche 129 | I/O — User I/O (bank 3) |
| Broche 130 | VCCIO3 — I/O bank 3 supply (3.3 V) |
| Broche 131 | I/O — User I/O (bank 3) |
| Broche 132 | I/O — User I/O (bank 3) |
| Broche 133 | I/O — User I/O (bank 3) |
| Broche 134 | I/O — User I/O (bank 3) |
| Broche 135 | GND — Ground |
| Broche 136 | I/O — User I/O (bank 3) |
| Broche 137 | I/O — User I/O (bank 3) |
| Broche 138 | VCCINT — Core supply (3.3 V) |
| Broche 139 | I/O — User I/O (bank 3) |
| Broche 140 | I/O — User I/O (bank 3) |
| Broche 141 | I/O — User I/O (bank 3) |
| Broche 142 | I/O — User I/O (bank 3) |
| Broche 143 | I/O — User I/O (bank 3) |
| Broche 144 | GND — Ground |
| Broche 145 | I/O — User I/O (bank 4) |
| Broche 146 | I/O — User I/O (bank 4) |
| Broche 147 | VCCIO4 — I/O bank 4 supply (3.3 V) |
| Broche 148 | I/O — User I/O (bank 4) |
| Broche 149 | I/O — User I/O (bank 4) |
| Broche 150 | I/O — User I/O (bank 4) |
| Broche 151 | I/O — User I/O (bank 4) |
| Broche 152 | GND — Ground |
| Broche 153 | I/O — User I/O (bank 4) |
| Broche 154 | I/O — User I/O (bank 4) |
| Broche 155 | VCCINT — Core supply (3.3 V) |
| Broche 156 | I/O — User I/O (bank 4) |
| Broche 157 | I/O — User I/O (bank 4) |
| Broche 158 | I/O — User I/O (bank 4) |
| Broche 159 | I/O — User I/O (bank 4) |
| Broche 160 | I/O — User I/O (bank 4) |
| Broche 161 | GND — Ground |
| Broche 162 | I/O — User I/O (bank 4) |
| Broche 163 | I/O — User I/O (bank 4) |
| Broche 164 | VCCIO4 — I/O bank 4 supply (3.3 V) |
| Broche 165 | I/O — User I/O (bank 4) |
| Broche 166 | I/O — User I/O (bank 4) |
| Broche 167 | I/O — User I/O (bank 4) |
| Broche 168 | I/O — User I/O (bank 4) |
| Broche 169 | GND — Ground |
| Broche 170 | I/O — User I/O (bank 4) |
| Broche 171 | I/O — User I/O (bank 4) |
| Broche 172 | VCCINT — Core supply (3.3 V) |
| Broche 173 | I/O — User I/O (bank 4) |
| Broche 174 | I/O — User I/O (bank 4) |
| Broche 175 | I/O — User I/O (bank 4) |
| Broche 176 | I/O — User I/O (bank 4) |
| Broche 177 | I/O — User I/O (bank 4) |
| Broche 178 | GND — Ground |
| Broche 179 | I/O — User I/O (bank 4) |
| Broche 180 | I/O — User I/O (bank 4) |
| Broche 181 | VCCIO4 — I/O bank 4 supply (3.3 V) |
| Broche 182 | nCONFIG — Configuration start (active-low) |
| Broche 183 | MSEL0 — Configuration mode select 0 |
| Broche 184 | MSEL1 — Configuration mode select 1 |
| Broche 185 | nSTATUS — Configuration status (active-low) |
| Broche 186 | CONF_DONE — Configuration done (open-drain) |
| Broche 187 | TCK — JTAG test clock |
| Broche 188 | TMS — JTAG test mode select |
| Broche 189 | TDI — JTAG test data in |
| Broche 190 | TDO — JTAG test data out |
| Broche 191 | CLK0 — Global clock input 0 |
| Broche 192 | CLK1 — Global clock input 1 |
| Broche 193 | DEV_CLRn — Device-wide clear (active-low, optional) |
| Broche 194 | DEV_OE — Device-wide output enable (optional) |
| Broche 195 | GND — Ground |
| Broche 196 | VCCINT — Core supply (3.3 V) |
| Broche 197 | I/O — User I/O (bank 1) |
| Broche 198 | I/O — User I/O (bank 1) |
| Broche 199 | I/O — User I/O (bank 1) |
| Broche 200 | I/O — User I/O (bank 1) |
| Broche 201 | GND — Ground |
| Broche 202 | I/O — User I/O (bank 1) |
| Broche 203 | I/O — User I/O (bank 1) |
| Broche 204 | VCCIO1 — I/O bank 1 supply (3.3 V) |
| Broche 205 | I/O — User I/O (bank 1) |
| Broche 206 | I/O — User I/O (bank 1) |
| Broche 207 | I/O — User I/O (bank 1) |
| Broche 208 | I/O — User I/O (bank 1) |
Applications typiques
EPF6016AQC208-3 convient pour 6 applications: Industrial Glue Logic and Bus Bridging, ASIC Prototyping and Design Validation, Telecommunications Line Cards, Legacy Peripheral Bus Bridges (PCI / ISA / VME), Test & Measurement Front-End Control, Legacy Avionics / Defense Subsystems.
Industrial Glue Logic and Bus Bridging
The EPF6016AQC208-3 is widely deployed in industrial controllers as high-pin-count glue logic, aggregating slow-speed parallel peripherals (parallel ADC/DAC, optocouplers, key-matrix, LCD) around a host MCU or DSP. Its 171 user I/O pins in the 208-PQFP package give designers enough headroom to consolidate discrete 74-series logic into a single programmable device. The FLEX 6000's 5 V tolerant inputs on a 3.3 V VCCIO rail allow direct interfacing to legacy 5 V TTL peripherals without level shifters, which simplifies the schematic and BOM. Because the design is re-synthesized rather than respun, late-stage bug fixes and feature additions are days instead of weeks.
Recommandé
ASIC Prototyping and Design Validation
Engineers use the EPF6016AQC208-3 to prototype ASICs and validate RTL before committing to mask costs. The 16K gates / 1,320 LEs are sufficient for medium-complexity control-plane blocks, custom state machines, and DSP pre-processing. Designers can iterate RTL, re-run Quartus II synthesis, and reconfigure the device in seconds via JTAG, dramatically shortening the prototype cycle. The 142.86 MHz typical Fmax of the -3 speed grade is adequate for most control-plane and bus-interface blocks, although compute-heavy datapaths typically migrate to a larger Cyclone / Cyclone II in production.
Recommandé
Telecommunications Line Cards
The EPF6016AQC208-3 has historically been used on telecom line cards for framing, channel-aggregation, and protocol-translation glue between TDM framers and a backplane ASIC. The 171 I/O and 3.3 V core with 5 V tolerant inputs let it bridge 5 V legacy framers to 3.3 V backplane ASICs without level shifters. Its SRAM-based configuration allows field firmware updates via JTAG for late-binding protocol changes (e.g., adding a new framing mode after deployment). For new designs, a Cyclone III / Cyclone IV equivalent in the same QFP family footprint is recommended for longevity.
Recommandé
Legacy Peripheral Bus Bridges (PCI / ISA / VME)
The FLEX 6000 series including the EPF6016AQC208-3 was a popular choice for PCI / ISA / VME bridge designs in the late 1990s and early 2000s, providing target or master logic for legacy parallel buses. The 171 user I/O pins are sufficient to implement 32-bit PCI plus side-band signals (REQn, GNTn, FRAME, IRDY, TRDY, etc.) inside a single device, eliminating multiple 74-series glue packages. Designers typically instantiate Altera's PCI megafunction plus a custom application layer. Note that 3.3 V PCI signaling requires the EPF6016A's VCCIO to be tied to 3.3 V; for 5 V PCI systems use an older FLEX 8000 or FLEX 10K.
Recommandé
Test & Measurement Front-End Control
In test-and-measurement instruments, the EPF6016AQC208-3 is used as a flexible front-end multiplexer / timing controller, routing analog signals to ADC channels and sequencing trigger events. Its high I/O count supports many parallel triggers and relay-drive lines, and its SRAM programmability lets manufacturers offer multiple instrument personalities from one hardware platform. The 5 V tolerant inputs accept TTL-level trigger inputs from external sensors, while the 3.3 V outputs cleanly drive modern low-voltage ADC digital inputs. For new designs the EP4CE6E22 or EP4CE10E22 (Cyclone IV) is recommended as a modern replacement.
Recommandé
Legacy Avionics / Defense Subsystems
The EPF6016AQC208-3 was specified into several long-lifecycle defense and avionics subsystems in the late 1990s, where its 5 V tolerance, PQFP ruggedness, and JTAG-based field reprogrammability are valued. Although the FLEX 6000 family is now discontinued, the EPF6016AQC208-3 and its RoHS / lead-free variants remain in the supply chain for sustainment programs that cannot redesign legacy boards. Designers of new programs should migrate to a modern Cyclone IV GX or Arria II GX with equivalent logic capacity and a long-term supply commitment.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF6016AQC208-3 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF6016AQC208-3N | EPF6016AQC208-2 | EPF6016AQC208-2N | EPF6016AQC208-1 | EPF6024AQC208-3N |
|---|---|---|---|---|---|---|
| Package | 208-PQFP (BFQFP) | 208-PQFP (BFQFP) - same | 208-PQFP (BFQFP) - same | 208-PQFP (BFQFP) - same | 208-PQFP (BFQFP) - same | 208-PQFP (BFQFP) - same |
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Family | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 |
| Typical Gates | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 | 24,000 |
| Logic Elements | 1,320 | 1,320 | 1,320 | 1,320 | 1,320 | 1,960 |
| User I/O Pins | 171 | 171 | 171 | 171 | 171 | 171 |
| Speed Grade | -3 (fastest) | -3 (fastest) | -2 (~85% Fmax) | -2 (~85% Fmax) | -1 (slowest, ~70% Fmax) | -3 |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Typical Fmax | 142.86 MHz | 142.86 MHz | ~120 MHz | ~120 MHz | ~100 MHz | 142.86 MHz |
Principaux différenciateurs
- Lead-free / RoHS finish variant for new-build compliance (vs EPF6016AQC208-3 (non-N))
- Same 208-PQFP footprint, 50% more logic for headroom (vs EPF6024AQC208-3N)
- Fastest -3 speed grade for 100+ MHz designs (vs EPF6016AQC208-2 / -2N)
- Pin-compatible 5 V tolerant I/O for legacy glue logic (vs Cyclone IV (EP4CE6E22))
Notes de conception
Estimated: at typical utilization (~80% LEs, 50% I/O toggling, 100 MHz operation), ICCINT is roughly 150-250 mA and ICCIO per bank is roughly 20-50 mA. Provide at least four 0.1 uF X7R decoupling capacitors near each VCCINT/VCCIO pin pair, plus a single 33 uF / 47 uF bulk tantalum or ceramic cap on each rail. Use a low-impedance 3.3 V plane rather than a thick trace to keep VCCINT within +/-5% under di/dt transients. Add a ferrite bead in series with VCCINT if the upstream switching regulator is also feeding other noisy loads on the same rail.
Estimated: with theta_JA of roughly 35 C/W for the 208-PQFP on a 4-layer 1-oz PCB and ambient of 70 C, full-rate operation of all 171 I/O at 100 MHz with 50 pF load can dissipate 1.0-1.4 W, pushing junction temperature near 110-120 C. For commercial-grade (0-85 C) designs this is acceptable margin, but derate the toggle rate or reduce load capacitance for industrial-temperature deployments. PQFP packages have a relatively high theta_JA compared to QFN/BGA equivalents - for thermal-constrained designs, consider a BGA variant (e.g., FLEX 6000 BGA) if your design can be migrated.
Follow Altera's PQFP layout guidelines: use 0.127 mm (5 mil) traces between PQFP leads, fan out to inner-layer power/ground planes within 6 mm of the package, and stitch the perimeter with a ground ring tied via 1.0 mm-pitch vias to the inner ground plane. Place configuration PROM (EPC2LC20) within 50 mm of the FPGA's DATA / DCLK pins to keep passive-serial configuration below the 200 MHz-DCLK upper limit. Keep JTAG chain signals (TCK/TMS/TDI/TDO) short and add 10 kohm pull-ups on TMS and TDI per the JTAG IEEE 1149.1 recommendation.
Three common pitfalls with this part: (1) Forgetting that configuration is volatile - the device must see a valid configuration stream at every POR, otherwise I/O pins stay tri-stated with weak pull-ups. Tie nCONFIG to VCC through a 10 kohm resistor and CONF_DONE to VCC through a 10 kohm pull-up per the reference schematic. (2) Driving 5 V signals into an output instead of an input - the output stage is 3.3 V and cannot source 5 V. (3) Choosing -1 / -2 speed grade when timing closure at 100 MHz+ requires -3; always run Quartus II slow-corner timing analysis at 85 C / worst-case process before locking the speed grade.
The 208-PQFP lead pitch is 0.5 mm; at 100 MHz single-ended LVCMOS, controlled-impedance traces are not strictly required but keep stubs under 15 mm and add 22-33 ohm series damping on heavily-loaded clocks. For LVTTL outputs driving long backplane traces, add a 33 ohm source-termination resistor at the FPGA pin. Differential signals (e.g., clock inputs to global CLK pins) should be length-matched within 5 mm and routed over a continuous ground reference plane to minimize jitter; the EPF6016A supports LVDS inputs on dedicated clock pins only.
Informations de conformité
RoHS / lead-free status depends on specific date code and suffix: original EPF6016AQC208-3 is typically SnPb finish; -3N suffix parts are lead-free matte-tin. AEC-Q100 is not applicable for FPGAs at this product class (industrial/commercial only). REACH compliance is unknown from current data.