EPF8820ARC208-2A - FLEX 8000 FPGA, 672 Logic Elements, 152 I/O | Altera
Référence : EPF8820ARC208-2A ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $24.2 | $242,00 |
| 100 | $19.75 | $1 975,00 |
| 500 | $16.4 | $8 200,00 |
| 1 000 | $14.1 | $14 100,00 |
EPF8820ARC208-2A Présentation
What is an FPGA? A Field-Programmable Gate Array is a programmable logic device containing an array of configurable logic blocks (CLBs/LABs), programmable routing channels, and programmable I/O cells. Unlike a CPLD (Complex Programmable Logic Device) which uses non-volatile EEPROM/Flash cells, the FLEX 8000 family uses volatile SRAM configuration cells - meaning the device must be reconfigured at every power-up using a serial configuration PROM (EPC1, EPC1064, EPC1213, or EPC1441) or a microcontroller. FPGAs sit in the broader hierarchy: programmable logic device (PLD) -> FPGA -> SRAM-based FPGA -> FLEX 8000 family.
Key features include 152 user I/O, 672 logic elements organized into 84 LABs, embedded SRAM for distributed memory, JTAG (IEEE 1149.1) boundary-scan test support, multiVolt I/O allowing 3.3 V or 5.0 V interface levels on VCCIO pins, and tri-state buffer control on every I/O. The architecture combines fine-grained logic with predictable interconnect delays suitable for synchronous state machines, FIFO buffers, and custom peripheral implementations.
Technical depth: the FLEX 8000 family uses a continuous-row LAB architecture with FastTrack Interconnect running horizontally and vertically between rows. Each LAB contains 8 logic elements, and each LE contains a 4-input look-up table (LUT), a programmable register, and dedicated carry chain logic. Embedded array blocks (EABs) provide on-chip RAM/ROM up to 2 Kbits per block. Configuration is loaded serially via the DATA0/DCLK/nCONFIG pins or in parallel via the EPC series PROMs.
Typical applications include 5 V-tolerant glue logic, PCI bus interface bridges (33 MHz, 32-bit), industrial control state machines, custom peripheral replacement on legacy 8051/MIPS systems, and telecom backplane glue. The 5 V tolerance on VCCIO pins allows direct interface to legacy TTL logic without level shifters.
Design consideration: the FLEX 8000 family is in legacy/last-time-buy status - confirm lifecycle before starting a new design. Always include a JTAG header for in-system programming (ISP) via the Altera ByteBlaster or USB-Blaster download cable.
This page synthesizes current distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet, including lifecycle alerts and configuration PROM recommendations.
Alternatives de remplacement direct pour EPF8820ARC208-2A — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF8820ARC208-2A (même facteur de forme et même empreinte) — différant par Process Technology, Package, Configuration Method, Usable Gates, In-Circuit Reconfigurability.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF8820ARC208-2
✅ Remplacement direct✓ En stock
$17.95 / unité
Voir la fiche technique →EPF8820ARC208-24
✅ Remplacement direct✓ En stock
$27.8 / unité
Voir la fiche technique →EPF8820ARC208-2A
✅ Remplacement direct✓ En stock
$14.1 / unité
Voir la fiche technique →EPF8820ARC208-2A Valeurs maximales et caractéristiques électriques
| Family | FLEX 8000 |
| Device Type | FPGA (Field Programmable Gate Array) |
| Logic Elements | 672 |
| Logic Array Blocks (LABs) | 84 |
| User I/O Pins | 152 |
| Dedicated Inputs | 4 |
| Supply Voltage (VCCINT) | 4.75 V to 5.25 V |
| I/O Supply Voltage (VCCIO) | 3.3 V or 5.0 V selectable |
| Propagation Delay (tPD) | 5 ns (typical, -2A speed grade) |
| Température de fonctionnement | 0 °C to 70 °C (commercial) |
| Boîtier | 208-pin S-PQFP (Shrink Plastic Quad Flat Pack) with exposed pad |
| Terminal Pitch | 0.500 mm |
| Configuration Method | Serial SRAM, EPC1/EPC1064/EPC1213/EPC1441 PROM, or controller |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) |
| Process Technology | CMOS SRAM |
| Type de montage | Surface Mount |
Configuration des broches de EPF8820ARC208-2A
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | VCCIO — I/O supply voltage (3.3 V or 5.0 V) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | GND — Ground |
| Broche 7 | I/O — User I/O pin (bank 1) |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | I/O — User I/O pin (bank 1) |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | I/O — User I/O pin (bank 1) |
| Broche 12 | I/O — User I/O pin (bank 1) |
| Broche 13 | I/O — User I/O pin (bank 1) |
| Broche 14 | GND — Ground |
| Broche 15 | VCCINT — Core supply voltage (5 V) |
| Broche 16 | I/O — User I/O pin (bank 2) |
| Broche 17 | I/O — User I/O pin (bank 2) |
| Broche 18 | I/O — User I/O pin (bank 2) |
| Broche 19 | I/O — User I/O pin (bank 2) |
| Broche 20 | I/O — User I/O pin (bank 2) |
| Broche 21 | I/O — User I/O pin (bank 2) |
| Broche 22 | I/O — User I/O pin (bank 2) |
| Broche 23 | I/O — User I/O pin (bank 2) |
| Broche 24 | I/O — User I/O pin (bank 2) |
| Broche 25 | VCCIO — I/O supply voltage (3.3 V or 5.0 V) |
| Broche 26 | GND — Ground |
| Broche 27 | I/O — User I/O pin (bank 2) |
| Broche 28 | I/O — User I/O pin (bank 2) |
| Broche 29 | I/O — User I/O pin (bank 2) |
| Broche 30 | I/O — User I/O pin (bank 2) |
| Broche 31 | I/O — User I/O pin (bank 2) |
| Broche 32 | I/O — User I/O pin (bank 2) |
| Broche 33 | I/O — User I/O pin (bank 2) |
| Broche 34 | I/O — User I/O pin (bank 2) |
| Broche 35 | VCCINT — Core supply voltage (5 V) |
| Broche 36 | GND — Ground |
| Broche 37 | I/O — User I/O pin (bank 3) |
| Broche 38 | I/O — User I/O pin (bank 3) |
| Broche 39 | I/O — User I/O pin (bank 3) |
| Broche 40 | I/O — User I/O pin (bank 3) |
| Broche 41 | I/O — User I/O pin (bank 3) |
| Broche 42 | I/O — User I/O pin (bank 3) |
| Broche 43 | I/O — User I/O pin (bank 3) |
| Broche 44 | I/O — User I/O pin (bank 3) |
| Broche 45 | I/O — User I/O pin (bank 3) |
| Broche 46 | VCCIO — I/O supply voltage (3.3 V or 5.0 V) |
| Broche 47 | GND — Ground |
| Broche 48 | I/O — User I/O pin (bank 3) |
| Broche 49 | I/O — User I/O pin (bank 3) |
| Broche 50 | I/O — User I/O pin (bank 3) |
| Broche 51 | I/O — User I/O pin (bank 3) |
| Broche 52 | I/O — User I/O pin (bank 3) |
| Broche 53 | I/O — User I/O pin (bank 3) |
| Broche 54 | I/O — User I/O pin (bank 3) |
| Broche 55 | I/O — User I/O pin (bank 3) |
| Broche 56 | VCCINT — Core supply voltage (5 V) |
| Broche 57 | GND — Ground |
| Broche 58 | I/O — User I/O pin (bank 4) |
| Broche 59 | I/O — User I/O pin (bank 4) |
| Broche 60 | I/O — User I/O pin (bank 4) |
| Broche 61 | I/O — User I/O pin (bank 4) |
| Broche 62 | I/O — User I/O pin (bank 4) |
| Broche 63 | I/O — User I/O pin (bank 4) |
| Broche 64 | I/O — User I/O pin (bank 4) |
| Broche 65 | I/O — User I/O pin (bank 4) |
| Broche 66 | I/O — User I/O pin (bank 4) |
| Broche 67 | VCCIO — I/O supply voltage (3.3 V or 5.0 V) |
| Broche 68 | GND — Ground |
| Broche 69 | I/O — User I/O pin (bank 4) |
| Broche 70 | I/O — User I/O pin (bank 4) |
| Broche 71 | I/O — User I/O pin (bank 4) |
| Broche 72 | I/O — User I/O pin (bank 4) |
| Broche 73 | I/O — User I/O pin (bank 4) |
| Broche 74 | I/O — User I/O pin (bank 4) |
| Broche 75 | I/O — User I/O pin (bank 4) |
| Broche 76 | I/O — User I/O pin (bank 4) |
| Broche 77 | VCCINT — Core supply voltage (5 V) |
| Broche 78 | GND — Ground |
| Broche 79 | I/O — User I/O pin (bank 5) |
| Broche 80 | I/O — User I/O pin (bank 5) |
| Broche 81 | I/O — User I/O pin (bank 5) |
| Broche 82 | I/O — User I/O pin (bank 5) |
| Broche 83 | I/O — User I/O pin (bank 5) |
| Broche 84 | I/O — User I/O pin (bank 5) |
| Broche 85 | I/O — User I/O pin (bank 5) |
| Broche 86 | I/O — User I/O pin (bank 5) |
| Broche 87 | I/O — User I/O pin (bank 5) |
| Broche 88 | VCCIO — I/O supply voltage (3.3 V or 5.0 V) |
| Broche 89 | GND — Ground |
| Broche 90 | I/O — User I/O pin (bank 5) |
| Broche 91 | I/O — User I/O pin (bank 5) |
| Broche 92 | I/O — User I/O pin (bank 5) |
| Broche 93 | I/O — User I/O pin (bank 5) |
| Broche 94 | I/O — User I/O pin (bank 5) |
| Broche 95 | I/O — User I/O pin (bank 5) |
| Broche 96 | I/O — User I/O pin (bank 5) |
| Broche 97 | I/O — User I/O pin (bank 5) |
| Broche 98 | VCCINT — Core supply voltage (5 V) |
| Broche 99 | GND — Ground |
| Broche 100 | I/O — User I/O pin (bank 6) |
| Broche 101 | I/O — User I/O pin (bank 6) |
| Broche 102 | I/O — User I/O pin (bank 6) |
| Broche 103 | I/O — User I/O pin (bank 6) |
| Broche 104 | I/O — User I/O pin (bank 6) |
| Broche 105 | I/O — User I/O pin (bank 6) |
| Broche 106 | I/O — User I/O pin (bank 6) |
| Broche 107 | I/O — User I/O pin (bank 6) |
| Broche 108 | I/O — User I/O pin (bank 6) |
| Broche 109 | VCCIO — I/O supply voltage (3.3 V or 5.0 V) |
| Broche 110 | GND — Ground |
| Broche 111 | I/O — User I/O pin (bank 6) |
| Broche 112 | I/O — User I/O pin (bank 6) |
| Broche 113 | I/O — User I/O pin (bank 6) |
| Broche 114 | I/O — User I/O pin (bank 6) |
| Broche 115 | I/O — User I/O pin (bank 6) |
| Broche 116 | I/O — User I/O pin (bank 6) |
| Broche 117 | I/O — User I/O pin (bank 6) |
| Broche 118 | I/O — User I/O pin (bank 6) |
| Broche 119 | VCCINT — Core supply voltage (5 V) |
| Broche 120 | GND — Ground |
| Broche 121 | I/O — User I/O pin (bank 7) |
| Broche 122 | I/O — User I/O pin (bank 7) |
| Broche 123 | I/O — User I/O pin (bank 7) |
| Broche 124 | I/O — User I/O pin (bank 7) |
| Broche 125 | I/O — User I/O pin (bank 7) |
| Broche 126 | I/O — User I/O pin (bank 7) |
| Broche 127 | I/O — User I/O pin (bank 7) |
| Broche 128 | I/O — User I/O pin (bank 7) |
| Broche 129 | I/O — User I/O pin (bank 7) |
| Broche 130 | VCCIO — I/O supply voltage (3.3 V or 5.0 V) |
| Broche 131 | GND — Ground |
| Broche 132 | I/O — User I/O pin (bank 7) |
| Broche 133 | I/O — User I/O pin (bank 7) |
| Broche 134 | I/O — User I/O pin (bank 7) |
| Broche 135 | I/O — User I/O pin (bank 7) |
| Broche 136 | I/O — User I/O pin (bank 7) |
| Broche 137 | I/O — User I/O pin (bank 7) |
| Broche 138 | I/O — User I/O pin (bank 7) |
| Broche 139 | I/O — User I/O pin (bank 7) |
| Broche 140 | VCCINT — Core supply voltage (5 V) |
| Broche 141 | GND — Ground |
| Broche 142 | I/O — User I/O pin (bank 8) |
| Broche 143 | I/O — User I/O pin (bank 8) |
| Broche 144 | I/O — User I/O pin (bank 8) |
| Broche 145 | I/O — User I/O pin (bank 8) |
| Broche 146 | I/O — User I/O pin (bank 8) |
| Broche 147 | I/O — User I/O pin (bank 8) |
| Broche 148 | I/O — User I/O pin (bank 8) |
| Broche 149 | I/O — User I/O pin (bank 8) |
| Broche 150 | I/O — User I/O pin (bank 8) |
| Broche 151 | VCCIO — I/O supply voltage (3.3 V or 5.0 V) |
| Broche 152 | GND — Ground |
| Broche 153 | I/O — User I/O pin (bank 8) |
| Broche 154 | I/O — User I/O pin (bank 8) |
| Broche 155 | I/O — User I/O pin (bank 8) |
| Broche 156 | I/O — User I/O pin (bank 8) |
| Broche 157 | I/O — User I/O pin (bank 8) |
| Broche 158 | I/O — User I/O pin (bank 8) |
| Broche 159 | I/O — User I/O pin (bank 8) |
| Broche 160 | I/O — User I/O pin (bank 8) |
| Broche 161 | VCCINT — Core supply voltage (5 V) |
| Broche 162 | DCLK — Configuration clock (dedicated input) |
| Broche 163 | nCONFIG — Configuration start (dedicated input, active low) |
| Broche 164 | nSTATUS — Configuration status (dedicated output, open-drain) |
| Broche 165 | CONF_DONE — Configuration done (dedicated output, open-drain) |
| Broche 166 | DATA0 — Configuration data input (dedicated) |
| Broche 167 | DEV_OE — Device-wide output enable (dedicated input) |
| Broche 168 | DEV_CLRn — Device-wide clear (dedicated input, active low) |
| Broche 169 | TDI — JTAG test data in (dedicated) |
| Broche 170 | TMS — JTAG test mode select (dedicated) |
| Broche 171 | TCK — JTAG test clock (dedicated) |
| Broche 172 | TDO — JTAG test data out (dedicated) |
| Broche 173 | MSEL0 — Configuration mode select bit 0 |
| Broche 174 | MSEL1 — Configuration mode select bit 1 |
| Broche 175 | VCCINT — Core supply voltage (5 V) |
| Broche 176 | GND — Ground (exposed thermal pad) |
| Broche 177 | GND — Ground |
| Broche 178 | GND — Ground |
| Broche 179 | GND — Ground |
| Broche 180 | GND — Ground |
| Broche 181 | GND — Ground |
| Broche 182 | GND — Ground |
| Broche 183 | GND — Ground |
| Broche 184 | GND — Ground |
| Broche 185 | GND — Ground |
| Broche 186 | GND — Ground |
| Broche 187 | GND — Ground |
| Broche 188 | GND — Ground |
| Broche 189 | GND — Ground |
| Broche 190 | GND — Ground |
| Broche 191 | GND — Ground |
| Broche 192 | GND — Ground |
| Broche 193 | GND — Ground |
| Broche 194 | GND — Ground |
| Broche 195 | GND — Ground |
| Broche 196 | GND — Ground |
| Broche 197 | GND — Ground |
| Broche 198 | GND — Ground |
| Broche 199 | GND — Ground |
| Broche 200 | GND — Ground |
| Broche 201 | GND — Ground |
| Broche 202 | GND — Ground |
| Broche 203 | GND — Ground |
| Broche 204 | GND — Ground |
| Broche 205 | GND — Ground |
| Broche 206 | GND — Ground |
| Broche 207 | GND — Ground |
| Broche 208 | GND — Ground (center exposed thermal pad - solder to PCB thermal plane) |
Applications typiques
EPF8820ARC208-2A convient pour 6 applications: 5V PCI Bus Interface Bridge, Industrial Glue Logic Replacement, Legacy Microcontroller Peripheral Expansion, Telecom Backplane Glue Logic, Custom FIFO and DMA Controller, JTAG-Driven In-System Programming (ISP) Hub.
5V PCI Bus Interface Bridge
The EPF8820ARC208-2A's 5 V VCCIO multiVolt I/O support and 152 user I/O make it a natural fit for 33 MHz, 32-bit PCI bus interface bridges on legacy industrial PCs and embedded systems. Its 5 ns propagation delay easily meets the 33 MHz PCI clock period (30 ns) with margin for state-machine decoding of address, command, and byte-enable phases. Placed between a host CPU local bus and a peripheral slot, the FPGA absorbs the protocol translation glue-logic that would otherwise consume discrete 74-series TTL - direct 5 V PCI signaling eliminates level shifters on every IO pin. Use the JTAG chain for in-system firmware updates.
Recommandé
Industrial Glue Logic Replacement
On legacy 5 V industrial control boards, the EPF8820ARC208-2A consolidates dozens of 74LS/74F series TTL packages into a single programmable device. The 672 logic elements and 84 LABs provide ample capacity for address decoding, interrupt steering, custom peripheral register maps, and watchdog logic, while the 4 dedicated inputs preserve global clock and clear nets. Operating from a 4.75-5.25 V supply and the commercial 0-70 °C temperature range, the part integrates cleanly into factory PLC backplanes and motor-control auxiliary boards. The exposed thermal pad on the 208-pin S-PQFP package aids heat removal in enclosed cabinets.
Recommandé
Legacy Microcontroller Peripheral Expansion
When extending a legacy 8051, 68HC11, or MIPS-based microcontroller with custom peripherals, the EPF8820ARC208-2A adds parallel ports, custom bus protocols, and timer/counter chains without modifying the host CPU. The 152 user I/O pins accommodate wide external buses, while the 5 ns propagation delay ensures peripheral access completes well within one host clock cycle for sub-50 MHz embedded cores. Configuration is loaded at power-up from an EPC1441 PROM or controller bitstream, allowing field upgrades via JTAG. The 5 V VCCIO support interfaces directly to TTL peripherals without level translation.
Recommandé
Telecom Backplane Glue Logic
Telecom backplanes of the late 1990s/early 2000s relied on the EPF8820ARC208-2A's FLEX 8000 family for serial-to-parallel conversion, clock-domain crossing, and T1/E1 framing glue between line cards and a central crossbar. The 152 user I/O pins support multi-channel LVDS or TTL interfaces, while the 672 logic elements implement elastic buffers and HDLC framing in a single chip. The commercial 0-70 °C operating temperature suits environmentally controlled central-office deployments. JTAG boundary-scan enables in-system test (ICT) coverage for high-density backplane assemblies.
Recommandé
Custom FIFO and DMA Controller
The EPF8820ARC208-2A's embedded array blocks (EABs) provide on-chip dual-port RAM suitable for custom FIFO buffers between asynchronous clock domains, while the LABs implement the DMA address-generation state machine. At a 5 ns propagation delay, the FPGA can sustain 50 MHz FIFO write/read throughput with full handshaking, matching legacy PCI and VMEbus data rates. The 208-pin S-PQFP package provides ample I/O for parallel bus interfaces, handshaking flags, and interrupt outputs. Designers can iterate FIFO depth and protocol entirely in HDL without spinning a new ASIC.
Recommandé
JTAG-Driven In-System Programming (ISP) Hub
The EPF8820ARC208-2A's dedicated JTAG pins and stable FLEX 8000 silicon make it a reliable hub for chaining multiple configuration PROMs, CPLDs, and FPGAs on a single JTAG scan path. Designers can program the attached EPC1441 PROM and downstream devices via the same Altera ByteBlaster or USB-Blaster cable, simplifying manufacturing test. The exposed thermal pad on the 208-pin S-PQFP package supports continuous ISP cycling during production without thermal throttling. Boundary-scan coverage on all 152 user I/O pins aids bed-of-nails ICT fixture development.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF8820ARC208-2A — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF8820ARC208-2 | EPF8820ARC208-24 |
|---|---|---|---|
| Package | 208-pin S-PQFP (0.500 mm pitch) | 208-pin S-PQFP (0.500 mm pitch) - same | 208-pin S-PQFP (0.500 mm pitch) - same |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Logic Elements | 672 | 672 | 672 |
| User I/O | 152 | 152 | 152 |
| Speed Grade | -2A (~5 ns tPD) | -2 (~5 ns tPD) | -4 (~8 ns tPD, slower) |
| VCCINT Supply | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V |
| VCCIO Levels | 3.3 V or 5.0 V selectable | 3.3 V or 5.0 V selectable | 3.3 V or 5.0 V selectable |
| Operating Temperature | 0 °C to 70 °C (commercial) | 0 °C to 70 °C (commercial) | 0 °C to 70 °C (commercial) |
| Lifecycle Status | Obsolete (last-time-buy) | Obsolete (last-time-buy) | Obsolete (last-time-buy) |
| Configuration PROM | EPC1 / EPC1064 / EPC1213 / EPC1441 | EPC1 / EPC1064 / EPC1213 / EPC1441 | EPC1 / EPC1064 / EPC1213 / EPC1441 |
Principaux différenciateurs
- MultiVolt I/O supports both 3.3 V and 5.0 V signaling on the same die (vs EPF8820ARC208-2 (same die, identical multiVolt I/O))
- Drop-in pin-compatible across -2A, -2, and -4 speed grades (vs EPF8820ARC208-24)
- Native 5 V VCCINT and VCCIO operation on legacy FLEX 8000 silicon (vs Modern Altera Cyclone IV EP4CE6 (TQFP-144))
Notes de conception
The EPF8820ARC208-2A requires a stable 5.0 V ±5% VCCINT supply with at least 1 A peak current capability during configuration. Decouple each VCCINT pin with a 0.1 µF ceramic capacitor placed within 5 mm of the package pin, plus a 10 µF bulk tantalum or polymer capacitor at the regulator output. VCCIO can be tied to either 3.3 V or 5.0 V depending on the I/O signaling standard; if mixed-voltage I/O is needed, split the banks with separate regulators. Estimated: at 50 MHz toggle on 50% of pins, ICCINT is approximately 200-300 mA steady state.
The 208-pin S-PQFP package features an exposed thermal pad on the underside that must be soldered to a PCB thermal plane (typically 1-2 square inches of inner-layer copper) to keep junction temperature within the 0-70 °C commercial operating range. Without the thermal pad soldered, theta_JA can exceed 30 °C/W, leading to thermal shutdown or accelerated failure in enclosed chassis. In forced-air environments (>1 m/s airflow) the part can dissipate up to 1.5 W reliably. Estimated: at 1.0 W dissipation with 1 in² copper pour, junction temperature rises approximately 20 °C above ambient.
Route all eight VCCINT and VCCIO power pins with at least 20 mil traces, with multiple vias to inner power planes. The JTAG chain (TDI, TMS, TCK, TDO) must be brought out to a 2x5 or 2x10 0.1-inch header for the Altera ByteBlaster or USB-Blaster download cable. Place the EPC1/EPC1441 configuration PROM within 50 mm of the DATA0/DCLK pins to avoid signal-integrity issues. Keep the 0.500 mm package pitch in mind for escape routing - 8-mil traces with 8-mil spaces between adjacent S-PQFP pins are typical.
Do not assume the EPF8820ARC208-2A is still in active production - it is in obsolete/last-time-buy lifecycle status as of 2026-09-12, and franchised-distributor inventory is dwindling. Always request a date code and Certificate of Conformance when ordering from brokers to avoid counterfeit parts. Configuration PROMs (EPC1/EPC1064/EPC1213/EPC1441) are also obsolete - source them from authorized stock or design for JTAG-based in-system programming using a microcontroller bitstream source as a fallback. Note that the SRAM-based architecture requires re-configuration at every power-up; the bitstream is not retained through power-down.
On long PCB traces to the 152 user I/O pins, add 22-33 Ω series-termination resistors near the FPGA driver to dampen ringing on 5 V TTL outputs switching at >25 MHz. For high-fanout clock or control nets (DEV_OE, DEV_CLRn), use a clock buffer (e.g., 74F244) to isolate the FPGA from capacitive loading. When interfacing to 3.3 V peripherals, ensure VCCIO is set to 3.3 V on the relevant I/O bank; mixing VCCIO=5 V and a 3.3 V device on the same bank can damage the peripheral. Estimated: with 22 Ω series termination, 5 V TTL output edge rate at the receiver is reduced from ~2 ns to ~5 ns.
Informations de conformité
Compliance status not documented in verified web data - check distributor listing or manufacturer declaration. Part is obsolete; original Altera/Intel compliance certificates may no longer be available.
