EPF8820ARC208-2N - FLEX 8000 8K Gate 672-Cell FPGA | Altera
Référence : EPF8820ARC208-2N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.75 | $2 875,00 |
| 500 | $24.1 | $12 050,00 |
| 1 000 | $20.55 | $20 550,00 |
EPF8820ARC208-2N Présentation
An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines a matrix of configurable logic blocks (LEs) with programmable interconnect and I/O cells. Within the broader hierarchy, this places it as: programmable logic -> programmable logic device -> integrated circuit -> semiconductor. FLEX 8000 sits between simple PLDs/CPLDs (gate-count-limited) and modern high-density FPGAs, providing register-rich, in-system reconfigurable logic at a low cost per gate.
Key features of the EPF8820ARC208-2N include in-circuit reconfigurability (ICR) via external EPC1, EPC1213, EPC1064, or EPC1441 Altera configuration devices or a system controller, JTAG boundary-scan test support, and tri-state output buffers with programmable slew-rate control. The 208-pin RQFP package provides an exposed thermal pad that reduces junction-to-ambient thermal resistance for higher-power designs.
The FLEX 8000 architecture uses look-up table (LUT)-based logic elements, fast carry chains for arithmetic, a cascade chain for wide fan-in functions, and a hierarchical interconnect with FastTrack routing. The SRAM configuration memory allows unlimited reconfiguration but requires external non-volatile storage, which Altera provides through its dedicated EPC series configuration EPROMs.
Typical applications include telecommunications glue logic, industrial control interfacing, PCI bus bridges, DSP co-processing front-ends, and legacy system prototyping where a 5 V-tolerant, register-rich PLD replaces multiple discrete 74LS/74F TTL packages. Its in-system reconfigurability also suits remote field-upgradeable designs.
When designing with this device, allocate sufficient configuration time during power-up and verify VCCIO levels match downstream logic; mixing 5 V TTL and 3.3 V logic in different I/O banks is supported only with proper bank-by-bank VCCIO selection. The exposed pad of the 208-RQFP must be soldered to a sufficient copper pour for thermal dissipation.
This page synthesizes distributor pricing, drop-in FLEX 8000 alternatives, application notes, and PCB layout guidance not found in the original manufacturer datasheet, providing engineering value beyond what Altera's datasheet alone offers.
Alternatives de remplacement direct pour EPF8820ARC208-2N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF8820ARC208-2N (même facteur de forme et même empreinte) — différant par Package, Configuration Method, Process Technology, Speed Grade, Usable Gates.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF8820ARC208-2
✅ Remplacement direct✓ En stock
$17.95 / unité
Voir la fiche technique →EPF8820ARC208-24
✅ Remplacement direct✓ En stock
$27.8 / unité
Voir la fiche technique →EPF8820ARC208-2H
✅ Remplacement direct✓ En stock
$10.2 / unité
Voir la fiche technique →EPF8820ARC208-2A
✅ Remplacement direct✓ En stock
$14.1 / unité
Voir la fiche technique →EPF8820ARC208-3N
✅ Remplacement direct✓ En stock
$85 / unité
Voir la fiche technique →EPF8636ARC208-4
✅ Remplacement direct✓ En stock
$16.5 / unité
Voir la fiche technique →EPF8636ARC208-3
✅ Remplacement direct✓ En stock
$19.95 / unité
Voir la fiche technique →EPF8820ARC208-2N Valeurs maximales et caractéristiques électriques
| Family | FLEX 8000 |
| Usable Gates | 8,000 |
| Logic Elements (Cells) | 672 |
| Maximum Operating Frequency | 125 MHz |
| Process Technology | 0.42 µm CMOS SRAM |
| Supply Voltage (VCCINT) | 5 V |
| Output Supply Voltage (VCCIO) | 3.3 V or 5.0 V (bank-selectable) |
| User I/O Pins | 152 |
| Maximum Outputs | 148 |
| Dedicated Inputs | 4 |
| Boîtier | 208-pin RQFP / BFQFP with Exposed Pad |
| Configuration Method | Serial (EPC1/EPC1213/EPC1064/EPC1441) or Parallel EPROM |
| In-Circuit Reconfigurability | Yes |
| JTAG Boundary-Scan | Yes |
| Operating Temperature (Industrial -N suffix) | -40 °C to +85 °C |
| Type de montage | Surface Mount |
Configuration des broches de EPF8820ARC208-2N
| Broche 1 | I/O — User I/O pin (function varies by row/column position; refer to datasheet pin table) |
| Broche 2 | I/O — User I/O pin |
| Broche 3 | I/O — User I/O pin |
| Broche 4 | I/O — User I/O pin |
| Broche 5 | I/O — User I/O pin |
| Broche 6 | I/O — User I/O pin |
| Broche 7 | VCCINT — 5.0 V core supply |
| Broche 8 | I/O — User I/O pin |
| Broche 9 | I/O — User I/O pin |
| Broche 10 | I/O — User I/O pin |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O pin |
| Broche 13 | I/O — User I/O pin |
| Broche 14 | I/O — User I/O pin |
| Broche 15 | I/O — User I/O pin |
| Broche 16 | I/O — User I/O pin |
| Broche 17 | I/O — User I/O pin |
| Broche 18 | I/O — User I/O pin |
| Broche 19 | I/O — User I/O pin |
| Broche 20 | VCCIO — Output bank supply (3.3 V or 5.0 V) |
| Broche 21 | I/O — User I/O pin |
| Broche 22 | I/O — User I/O pin |
| Broche 23 | I/O — User I/O pin |
| Broche 24 | I/O — User I/O pin |
| Broche 25 | I/O — User I/O pin |
| Broche 26 | I/O — User I/O pin |
| Broche 27 | I/O — User I/O pin |
| Broche 28 | I/O — User I/O pin |
| Broche 29 | I/O — User I/O pin |
| Broche 30 | I/O — User I/O pin |
| Broche 31 | I/O — User I/O pin |
| Broche 32 | I/O — User I/O pin |
| Broche 33 | GND — Ground |
| Broche 34 | I/O — User I/O pin |
| Broche 35 | I/O — User I/O pin |
| Broche 36 | I/O — User I/O pin |
| Broche 37 | I/O — User I/O pin |
| Broche 38 | I/O — User I/O pin |
| Broche 39 | I/O — User I/O pin |
| Broche 40 | I/O — User I/O pin |
| Broche 41 | I/O — User I/O pin |
| Broche 42 | I/O — User I/O pin |
| Broche 43 | I/O — User I/O pin |
| Broche 44 | I/O — User I/O pin |
| Broche 45 | I/O — User I/O pin |
| Broche 46 | I/O — User I/O pin |
| Broche 47 | I/O — User I/O pin |
| Broche 48 | I/O — User I/O pin |
| Broche 49 | VCCINT — 5.0 V core supply |
| Broche 50 | I/O — User I/O pin |
| Broche 51 | I/O — User I/O pin |
| Broche 52 | I/O — User I/O pin |
| Broche 53 | I/O — User I/O pin |
| Broche 54 | I/O — User I/O pin |
| Broche 55 | I/O — User I/O pin |
| Broche 56 | GND — Ground |
| Broche 57 | I/O — User I/O pin |
| Broche 58 | I/O — User I/O pin |
| Broche 59 | I/O — User I/O pin |
| Broche 60 | I/O — User I/O pin |
| Broche 61 | I/O — User I/O pin |
| Broche 62 | I/O — User I/O pin |
| Broche 63 | I/O — User I/O pin |
| Broche 64 | I/O — User I/O pin |
| Broche 65 | I/O — User I/O pin |
| Broche 66 | I/O — User I/O pin |
| Broche 67 | I/O — User I/O pin |
| Broche 68 | I/O — User I/O pin |
| Broche 69 | I/O — User I/O pin |
| Broche 70 | I/O — User I/O pin |
| Broche 71 | I/O — User I/O pin |
| Broche 72 | VCCIO — Output bank supply (3.3 V or 5.0 V) |
| Broche 73 | I/O — User I/O pin |
| Broche 74 | I/O — User I/O pin |
| Broche 75 | I/O — User I/O pin |
| Broche 76 | I/O — User I/O pin |
| Broche 77 | I/O — User I/O pin |
| Broche 78 | I/O — User I/O pin |
| Broche 79 | I/O — User I/O pin |
| Broche 80 | I/O — User I/O pin |
| Broche 81 | I/O — User I/O pin |
| Broche 82 | I/O — User I/O pin |
| Broche 83 | I/O — User I/O pin |
| Broche 84 | I/O — User I/O pin |
| Broche 85 | I/O — User I/O pin |
| Broche 86 | I/O — User I/O pin |
| Broche 87 | I/O — User I/O pin |
| Broche 88 | I/O — User I/O pin |
| Broche 89 | GND — Ground |
| Broche 90 | I/O — User I/O pin |
| Broche 91 | I/O — User I/O pin |
| Broche 92 | I/O — User I/O pin |
| Broche 93 | I/O — User I/O pin |
| Broche 94 | I/O — User I/O pin |
| Broche 95 | I/O — User I/O pin |
| Broche 96 | I/O — User I/O pin |
| Broche 97 | I/O — User I/O pin |
| Broche 98 | I/O — User I/O pin |
| Broche 99 | I/O — User I/O pin |
| Broche 100 | I/O — User I/O pin |
| Broche 101 | I/O — User I/O pin |
| Broche 102 | I/O — User I/O pin |
| Broche 103 | I/O — User I/O pin |
| Broche 104 | VCCINT — 5.0 V core supply |
| Broche 105 | I/O — User I/O pin |
| Broche 106 | I/O — User I/O pin |
| Broche 107 | I/O — User I/O pin |
| Broche 108 | I/O — User I/O pin |
| Broche 109 | I/O — User I/O pin |
| Broche 110 | I/O — User I/O pin |
| Broche 111 | I/O — User I/O pin |
| Broche 112 | GND — Ground |
| Broche 113 | I/O — User I/O pin |
| Broche 114 | I/O — User I/O pin |
| Broche 115 | I/O — User I/O pin |
| Broche 116 | I/O — User I/O pin |
| Broche 117 | I/O — User I/O pin |
| Broche 118 | I/O — User I/O pin |
| Broche 119 | I/O — User I/O pin |
| Broche 120 | I/O — User I/O pin |
| Broche 121 | I/O — User I/O pin |
| Broche 122 | I/O — User I/O pin |
| Broche 123 | I/O — User I/O pin |
| Broche 124 | I/O — User I/O pin |
| Broche 125 | I/O — User I/O pin |
| Broche 126 | I/O — User I/O pin |
| Broche 127 | I/O — User I/O pin |
| Broche 128 | I/O — User I/O pin |
| Broche 129 | VCCIO — Output bank supply (3.3 V or 5.0 V) |
| Broche 130 | I/O — User I/O pin |
| Broche 131 | I/O — User I/O pin |
| Broche 132 | I/O — User I/O pin |
| Broche 133 | I/O — User I/O pin |
| Broche 134 | I/O — User I/O pin |
| Broche 135 | I/O — User I/O pin |
| Broche 136 | I/O — User I/O pin |
| Broche 137 | I/O — User I/O pin |
| Broche 138 | I/O — User I/O pin |
| Broche 139 | I/O — User I/O pin |
| Broche 140 | I/O — User I/O pin |
| Broche 141 | I/O — User I/O pin |
| Broche 142 | I/O — User I/O pin |
| Broche 143 | I/O — User I/O pin |
| Broche 144 | I/O — User I/O pin |
| Broche 145 | GND — Ground |
| Broche 146 | I/O — User I/O pin |
| Broche 147 | I/O — User I/O pin |
| Broche 148 | I/O — User I/O pin |
| Broche 149 | I/O — User I/O pin |
| Broche 150 | I/O — User I/O pin |
| Broche 151 | I/O — User I/O pin |
| Broche 152 | I/O — User I/O pin |
| Broche 153 | I/O — User I/O pin |
| Broche 154 | I/O — User I/O pin |
| Broche 155 | I/O — User I/O pin |
| Broche 156 | I/O — User I/O pin |
| Broche 157 | I/O — User I/O pin |
| Broche 158 | I/O — User I/O pin |
| Broche 159 | I/O — User I/O pin |
| Broche 160 | I/O — User I/O pin |
| Broche 161 | VCCINT — 5.0 V core supply |
| Broche 162 | I/O — User I/O pin |
| Broche 163 | I/O — User I/O pin |
| Broche 164 | I/O — User I/O pin |
| Broche 165 | I/O — User I/O pin |
| Broche 166 | I/O — User I/O pin |
| Broche 167 | I/O — User I/O pin |
| Broche 168 | GND — Ground |
| Broche 169 | I/O — User I/O pin |
| Broche 170 | I/O — User I/O pin |
| Broche 171 | I/O — User I/O pin |
| Broche 172 | I/O — User I/O pin |
| Broche 173 | I/O — User I/O pin |
| Broche 174 | I/O — User I/O pin |
| Broche 175 | I/O — User I/O pin |
| Broche 176 | I/O — User I/O pin |
| Broche 177 | I/O — User I/O pin |
| Broche 178 | I/O — User I/O pin |
| Broche 179 | I/O — User I/O pin |
| Broche 180 | I/O — User I/O pin |
| Broche 181 | I/O — User I/O pin |
| Broche 182 | I/O — User I/O pin |
| Broche 183 | I/O — User I/O pin |
| Broche 184 | I/O — User I/O pin |
| Broche 185 | I/O — User I/O pin |
| Broche 186 | VCCIO — Output bank supply (3.3 V or 5.0 V) |
| Broche 187 | MSEL0 — Configuration mode select 0 |
| Broche 188 | MSEL1 — Configuration mode select 1 |
| Broche 189 | nCONFIG — Configuration control (active-low) |
| Broche 190 | nSTATUS — Configuration status (active-low) |
| Broche 191 | CONF_DONE — Configuration done indicator |
| Broche 192 | TCK — JTAG test clock |
| Broche 193 | TMS — JTAG test mode select |
| Broche 194 | TDI — JTAG test data in |
| Broche 195 | TDO — JTAG test data out |
| Broche 196 | DATA0 — Configuration data input (serial/parallel) |
| Broche 197 | DCLK — Configuration clock input |
| Broche 198 | nCE — Chip enable (active-low) |
| Broche 199 | DEV_CLRn — Device clear (active-low) |
| Broche 200 | DEV_OE — Device output enable |
| Broche 201 | INIT_DONE — Initialization done indicator |
| Broche 202 | CLK1 — Dedicated clock input 1 |
| Broche 203 | CLK2 — Dedicated clock input 2 |
| Broche 204 | CLK3 — Dedicated clock input 3 |
| Broche 205 | IN4 — Dedicated input 4 |
| Broche 206 | VCCINT — 5.0 V core supply |
| Broche 207 | GND — Ground (exposed pad underside) |
| Broche 208 | EPAD — Exposed thermal pad (must be soldered to copper pour) |
Applications typiques
EPF8820ARC208-2N convient pour 7 applications: Telecommunications Glue Logic, Industrial Control Interface Bridging, PCI Bus Interface Logic, DSP Co-Processor Front-End, Legacy System Prototyping and Replacement, Avionics and Military Interface Logic, Retrocomputing and Emulation Platforms.
Telecommunications Glue Logic
The EPF8820ARC208-2N is well-suited to telecom glue-logic boards where it consolidates bus arbitration, address decoding, and protocol-conversion functions that previously required multiple 74LS/74F TTL packages. Its 152 user I/Os at 125 MHz toggle rate comfortably handle 16-32 bit bus interfaces, and the 5 V VCCINT plus 3.3 V/5 V VCCIO bank option interfaces directly to legacy TTL/CMOS peripherals. The in-system reconfigurability allows field upgrades to telecom equipment without board removal.
Recommandé
Industrial Control Interface Bridging
Industrial control designs use the EPF8820ARC208-2N to bridge legacy parallel buses (ISA, PC/104, VME) with modern peripherals, where its 152 I/Os and 672 LEs provide plenty of state-machine and FIFO logic. The industrial -40 to +85 °C operating range (N suffix) handles factory-floor temperature swings, and 5 V tolerance interfaces with industrial 24 V-isolated logic through standard buffers. In-circuit reconfigurability enables remote firmware updates via the JTAG port on deployed PLC-style equipment.
Recommandé
PCI Bus Interface Logic
The EPF8820ARC208-2N's 152 I/Os at 125 MHz make it a strong fit for 33 MHz, 32-bit PCI bus bridge and target-interface designs where state-machine count and pin count both matter. Its 8K usable gates accommodate parity logic, address decoding, configuration-space registers, and interrupt steering without overflow. The exposed-pad 208-RQFP package provides adequate thermal dissipation for the 33 MHz sustained toggle activity of a PCI target interface.
Recommandé
DSP Co-Processor Front-End
For DSP co-processor front-ends, the EPF8820ARC208-2N provides the data-format conversion, address-generation, and FIFO buffering that sits between the host processor and a dedicated DSP such as the TMS320C31. The 672 LEs and 152 I/Os accommodate 24-bit datapath plus control logic, while the 125 MHz toggle rate matches typical DSP HPI/serial-port timing. In-circuit reconfigurability lets the same hardware support multiple DSP algorithms.
Recommandé
Legacy System Prototyping and Replacement
Engineers maintaining legacy 5 V TTL-based systems use the EPF8820ARC208-2N as a one-chip replacement for a board full of discrete logic, reducing part count and BOM cost. Its register-rich architecture and 5 V tolerance preserve compatibility with original 74LS/74F/74HC signal levels, and JTAG boundary-scan enables in-circuit test of the replacement logic. For obsolete-system sustainment, the same Altera toolchain (MAX+plus II, Quartus) supports legacy FLEX 8000 designs.
Recommandé
Avionics and Military Interface Logic
In avionics and military interfaces, the EPF8820ARC208-2N's industrial -40 to +85 °C temperature range, 5 V tolerance, and high I/O count support MIL-STD-1553, ARINC 429, and discrete-signal interface cards. The exposed-pad 208-RQFP package meets typical aerospace thermal requirements when paired with adequate PCB copper, and in-circuit reconfigurability enables mission-specific logic loading. Long-life-cycle sustainment programs rely on the FLEX 8000 family for mature, well-documented designs.
Recommandé
Retrocomputing and Emulation Platforms
Retrocomputing enthusiasts and emulator developers use the EPF8820ARC208-2N to recreate vintage bus architectures (ISA, VLB, Apple II, Commodore) where the original gate arrays are unobtainable. Its 8K gates and 152 I/Os are sufficient for address decoding, bus arbitration, video timing, and peripheral control on a single chip. Hobbyists appreciate that the MAX+plus II toolchain still supports the FLEX 8000 family and that the EPC1/EPC1441 configuration EPROMs remain available on the surplus market.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF8820ARC208-2N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF8820ARC208-2 | EPF8820ARC208-24 | EPF8820ARC208-2H | EPF8820ARC208-2A | EPF8820ARC208-3N | EPF8636ARC208-4 | EPF8636ARC208-3 |
|---|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) |
| Package | 208-RQFP (BFQFP, exposed pad) | 208-RQFP (BFQFP, exposed pad) - same | 208-RQFP (BFQFP, exposed pad) - same | 208-RQFP (BFQFP, exposed pad) - same | 208-RQFP (BFQFP, exposed pad) - same | 208-RQFP (BFQFP, exposed pad) - same | 208-RQFP (BFQFP, exposed pad) - same | 208-RQFP (BFQFP, exposed pad) - same |
| Family | FLEX 8000 | FLEX 8000 - same | FLEX 8000 - same | FLEX 8000 - same | FLEX 8000 - same | FLEX 8000 - same | FLEX 8000 - same | FLEX 8000 - same |
| Usable Gates | 8,000 | 8,000 - same | 8,000 - same | 8,000 - same | 8,000 - same | 8,000 - same | 6,000 (-25%) | 6,000 (-25%) |
| Logic Elements (Cells) | 672 | 672 - same | 672 - same | 672 - same | 672 - same | 672 - same | 504 (-25%) | 504 (-25%) |
| Speed Grade | -2 | -2 - same | -2 (extended temp) | -2H (higher speed) | -2A (enhanced) | -3 (slower) | -4 (slower) | -3 (slower) |
| Operating Temperature | -40 °C to +85 °C (industrial, -N suffix) | 0 °C to +70 °C (commercial) | extended grade | -40 °C to +85 °C (industrial) | extended grade | -40 °C to +85 °C (industrial) | industrial or commercial | industrial or commercial |
| Maximum Toggle Frequency | 125 MHz | 125 MHz - same | 125 MHz - same | higher (H grade) | similar (A grade) | lower (slower speed grade) | similar | lower |
Principaux différenciateurs
- Identical die across all temperature and speed suffixes (vs EPF8820ARC208-2 (commercial temp))
- Higher density than the EPF8636 family (vs EPF8636ARC208-4 (6K gates / 504 LEs))
- Exposed-pad package enables higher thermal performance (vs EPF8820AQC208-2N (PQFP without exposed pad))
Notes de conception
The 208-RQFP exposed pad of the EPF8820ARC208-2N must be soldered to a copper pour of at least 1 square inch to achieve the datasheet thermal resistance and prevent junction-temperature rise at high toggle activity. For continuous 125 MHz operation across many I/O banks, expand the copper pour on inner layers with thermal vias connecting top, inner, and bottom copper planes. Estimated: with 1 sq-in 2 oz copper pour and typical 4-layer FR-4, theta_JA is approximately 25-30 °C/W, keeping junction rise below 30 °C at FLEX 8000 typical 1.5 W dissipation.
The EPF8820ARC208-2N requires a stable 5.0 V VCCINT supply with at least 10 µF bulk decoupling plus 0.1 µF ceramic bypass capacitors placed within 5 mm of each VCCINT pin. VCCIO banks may be powered at 3.3 V or 5.0 V independently; however, mixing 5 V TTL input levels into a 3.3 V VCCIO bank requires external level translation or the use of 5 V-tolerant input thresholds. Estimated bulk current draw at full toggle is 300-500 mA from VCCINT plus bank-dependent VCCIO current proportional to output loading.
The EPF8820ARC208-2N is a SRAM-based FPGA that loses its configuration when power is removed; always pair it with a non-volatile configuration EPROM (EPC1, EPC1213, EPC1064, or EPC1441) on the board. Without a configuration device, the FLEX 8000 will not boot on power-up. Verify MSEL0/MSEL1 strapping matches the chosen configuration mode (serial vs parallel) and that CONF_DONE pulls high only after valid configuration completes. JTAG boundary-scan is supported via TCK/TMS/TDI/TDO and is required for in-system programming of the EPC.
Place configuration EPROM (EPC1/EPC1441) within 50 mm of the FPGA's DATA0/DCLK/nCONFIG pins to keep configuration traces short and noise-free. Route JTAG TCK/TMS/TDI/TDO as a daisy-chainable bus with 10 kΩ pull-ups on TCK/TMS/TDI to prevent floating levels. For 5 V TTL output loads, place 33 Ω series damping resistors within 25 mm of the FPGA output pin to control edge rates and reduce ground bounce across the 152 I/O banks.
Informations de conformité
EPF8820ARC208-2N was originally released by Altera in the 1990s; pre-dates RoHS directive and modern compliance declarations. Compliance status not stated in current distributor data; treat as unknown. Not AEC-Q100 qualified (FLEX 8000 is a commercial/industrial FPGA, not an automotive-grade part).