EPM3512AFC256-19 - MAX 3000A CPLD, 512 Macrocells, BGA-256 | Altera
Référence : EPM3512AFC256-19 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $14.05 | $1 405,00 |
| 500 | $12.4 | $6 200,00 |
| 1 000 | $10.85 | $10 850,00 |
EPM3512AFC256-19 Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL-like macrocell arrays on a single chip with a global interconnect. The MAX 3000A architecture sits hierarchically between simple SPLDs and FPGAs: it offers instant-on behavior (no boot PROM required), predictable timing with pin-to-pin delays specified in the datasheet, and a logic density (10000 gates) below typical SRAM FPGAs but well above 22V10-style SPLDs. It belongs to the broader category of programmable logic devices within digital semiconductors.
Key specifications include 512 macrocells, 10000 usable gates, 80 MHz maximum operating frequency, and 7.5 ns pin-to-pin combinatorial propagation delay at the -19 speed grade. The device exposes 208 user I/O pins across two I/O banks, supports 3.3 V or 2.5 V VCCIO operation for mixed-voltage interfacing, and provides in-system programmability through a standard JTAG interface (IEEE 1149.1) plus the ISP-compliant IEEE 1532 protocol for multi-vendor concurrent programming.
Architecturally, the EPM3512AFC256-19 partitions its 512 macrocells across 16 Logic Array Blocks (LABs), each containing 32 macrocells with a shared programmable interconnect. Each macrocell integrates a programmable AND/OR array, a configurable flip-flop, and per-macrocell control signals (clear, clock, preset, OE). The device includes four dedicated input pins and global routing for clock, clear, and output-enable networks, ensuring predictable timing closure across all paths.
Typical applications include bus-interface bridging (e.g., PCI-to-ISA glue logic), address decoding and chip-select generation in microcontroller systems, state-machine and sequencer consolidation, peripheral I/O expansion, and legacy-logic replacement on 3.3 V or 5.0 V mixed-voltage boards. The instant-on, non-volatile nature of the MAX 3000A also suits industrial control boards that must operate immediately at power-up without bootloader latency.
Designers should note that the -19 speed grade provides the slowest propagation delay in the EPM3512AFC256 family; if timing margins are tight, the -10 or -7 speed grades offer faster pin-to-pin delays in the identical 256-ball BGA footprint, enabling speed upgrade without PCB rework. The MAX 3000A family is mature and supported by legacy Quartus II design software.
This page synthesizes distributor inventory, drop-in alternatives, and design notes not found in the standalone datasheet, organized for engineer quick-reference and AI-search citation.
Alternatives de remplacement direct pour EPM3512AFC256-19 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM3512AFC256-19 (même facteur de forme et même empreinte) — différant par Package, Programming Interface, Operating Temperature, In-System Programmability, I/O Supply Voltage (VCCIO).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM3512AFC256-10N
✅ Remplacement direct✓ En stock
$43.22 / unité
Voir la fiche technique →EPM3512AFC256-10
✅ Remplacement direct✓ En stock
$17.5 / unité
Voir la fiche technique →EPM3512AFC256-18
✅ Remplacement direct✓ En stock
$17.2 / unité
Voir la fiche technique →EPM3512AFC256-7N
✅ Remplacement direct✓ En stock
$61 / unité
Voir la fiche technique →EPM3512AFC-7N
✅ Remplacement direct✓ En stock
$26.4 / unité
Voir la fiche technique →EPM3512AFC256-19 Valeurs maximales et caractéristiques électriques
| Family | MAX 3000A |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macrocells | 512 |
| Usable Gates | 10000 |
| Logic Array Blocks (LABs) | 16 |
| Maximum Operating Frequency | 80 MHz |
| Pin-to-Pin Delay (tPD) | 7.5 ns |
| Speed Grade | -19 |
| User I/O Pins | 208 |
| Boîtier | 256-ball FineLine BGA (FC) |
| Supply Voltage VCCINT | 3.3 V |
| I/O Supply Voltage VCCIO | 2.5 V or 3.3 V (5.0 V tolerant inputs) |
| Programming Interface | JTAG (IEEE 1149.1) / ISP (IEEE 1532) |
| Process Technology | 0.30 µm CMOS EEPROM |
| Température de fonctionnement | -40C to +85C (industrial) |
| Non-volatile Configuration | Yes (EEPROM-based) |
| Type de montage | Surface Mount |
Configuration des broches de EPM3512AFC256-19
| Broche A1 | I/O — User I/O pin (bank 1) |
| Broche A2 | I/O — User I/O pin (bank 1) |
| Broche A3 | I/O — User I/O pin (bank 1) |
| Broche A4 | I/O — User I/O pin (bank 1) |
| Broche B1 | I/O — User I/O pin (bank 1) |
| Broche B2 | I/O — User I/O pin (bank 1) |
| Broche B3 | I/O — User I/O pin (bank 1) |
| Broche B4 | I/O — User I/O pin (bank 1) |
| Broche C1 | I/O — User I/O pin (bank 1) |
| Broche C2 | I/O — User I/O pin (bank 1) |
| Broche C3 | I/O — User I/O pin (bank 1) |
| Broche C4 | I/O — User I/O pin (bank 1) |
| Broche D1 | GND — Ground |
| Broche D2 | I/O — User I/O pin (bank 1) |
| Broche D3 | I/O — User I/O pin (bank 1) |
| Broche D4 | VCCINT — Internal core supply (3.3 V) |
| Broche D5 | I/O — User I/O pin (bank 2) |
| Broche D6 | I/O — User I/O pin (bank 2) |
| Broche E1 | I/O — User I/O pin (bank 1) |
| Broche E2 | I/O — User I/O pin (bank 1) |
| Broche E3 | I/O — User I/O pin (bank 1) |
| Broche E4 | TDI — JTAG Test Data In |
| Broche E5 | I/O — User I/O pin (bank 2) |
| Broche E6 | I/O — User I/O pin (bank 2) |
| Broche F1 | I/O — User I/O pin (bank 1) |
| Broche F2 | I/O — User I/O pin (bank 1) |
| Broche F3 | TCK — JTAG Test Clock |
| Broche F4 | TMS — JTAG Test Mode Select |
| Broche F5 | I/O — User I/O pin (bank 2) |
| Broche F6 | I/O — User I/O pin (bank 2) |
| Broche G1 | GND — Ground |
| Broche G2 | I/O — User I/O pin (bank 1) |
| Broche G3 | I/O — User I/O pin (bank 1) |
| Broche G4 | I/O — User I/O pin (bank 1) |
| Broche G5 | I/O — User I/O pin (bank 2) |
| Broche G6 | VCCIO — I/O supply (2.5 V or 3.3 V) |
| Broche H1 | I/O — User I/O pin (bank 1) |
| Broche H2 | I/O — User I/O pin (bank 1) |
| Broche H3 | I/O — User I/O pin (bank 1) |
| Broche H4 | I/O — User I/O pin (bank 1) |
| Broche H5 | I/O — User I/O pin (bank 2) |
| Broche H6 | I/O — User I/O pin (bank 2) |
| Broche J1 | I/O — User I/O pin (bank 1) |
| Broche J2 | I/O — User I/O pin (bank 1) |
| Broche J3 | I/O — User I/O pin (bank 1) |
| Broche J4 | I/O — User I/O pin (bank 2) |
| Broche J5 | I/O — User I/O pin (bank 2) |
| Broche J6 | I/O — User I/O pin (bank 2) |
| Broche K1 | GND — Ground |
| Broche K2 | I/O — User I/O pin (bank 1) |
| Broche K3 | I/O — User I/O pin (bank 1) |
| Broche K4 | I/O — User I/O pin (bank 1) |
| Broche K5 | I/O — User I/O pin (bank 2) |
| Broche K6 | VCCIO — I/O supply (2.5 V or 3.3 V) |
| Broche L1 | I/O — User I/O pin (bank 1) |
| Broche L2 | I/O — User I/O pin (bank 1) |
| Broche L3 | I/O — User I/O pin (bank 1) |
| Broche L4 | TDO — JTAG Test Data Out |
| Broche L5 | I/O — User I/O pin (bank 2) |
| Broche L6 | I/O — User I/O pin (bank 2) |
Applications typiques
EPM3512AFC256-19 convient pour 6 applications: Bus Interface Bridging and Glue Logic, Address Decoding and Chip-Select Generation, State Machine and Sequencer Consolidation, Peripheral I/O Expansion and Buffering, Legacy Logic Replacement and Board Modernization, Industrial Control and Factory Automation.
Bus Interface Bridging and Glue Logic
The EPM3512AFC256-19 is well suited for bus-interface bridging such as PCI-to-ISA or microprocessor-to-peripheral glue-logic consolidation. Its 512 macrocells across 16 LABs and 208 user I/Os provide ample capacity to implement 32-bit address decoding, chip-select generation, and wait-state insertion. With a 7.5 ns pin-to-pin delay at the -19 speed grade, the device delivers deterministic timing for asynchronous bus handshakes. Designers typically place the EPM3512AFC256-19 between the host processor bus and legacy peripherals, replacing multiple 22V10 SPLDs and 74-series glue. The non-volatile EEPROM configuration means no boot PROM is required - the device is active at power-on, eliminating bootloader latency in industrial PCs and embedded controllers.
Recommandé
Address Decoding and Chip-Select Generation
The EPM3512AFC256-19 excels at address decoding and chip-select generation in microcontroller and microprocessor systems. Its wide AND-OR array within each macrocell, combined with 512 total macrocells, allows multiple overlapping address windows to be decoded in parallel without external logic. The 7.5 ns propagation delay at the -19 speed grade ensures chip-select signals are valid before the memory or peripheral access window closes. Industrial boards commonly use the EPM3512AFC256-19 to consolidate what previously required 4-6 separate PAL/GAL devices, reducing board area and improving reliability. The 3.3 V VCCINT and 2.5/3.3 V VCCIO operation supports both legacy 5 V-tolerant and modern 3.3 V memory interfaces from a single chip.
Recommandé
State Machine and Sequencer Consolidation
The EPM3512AFC256-19 is an effective platform for consolidating multiple discrete state machines and sequencers into a single non-volatile device. Each of its 512 macrocells contains a flip-flop with programmable clear, preset, clock, and output-enable control, allowing complex Moore and Mealy state machines to be implemented directly. The global clock network provides low-skew clock distribution across all 16 LABs, ensuring deterministic state transitions. With a maximum internal frequency of 80 MHz at the -19 speed grade, the device handles medium-throughput sequencer tasks in motor control, instrumentation, and industrial automation. The instant-on, EEPROM-based configuration eliminates boot latency for deterministic power-up sequencing requirements.
Recommandé
Peripheral I/O Expansion and Buffering
The EPM3512AFC256-19 provides 208 user I/O pins across two I/O banks, making it ideal for peripheral I/O expansion and buffering in systems where the host processor has insufficient native I/O. Each I/O pin supports 2.5 V or 3.3 V VCCIO operation with 5.0 V tolerant inputs, enabling direct interface to legacy 5 V peripherals from a 3.3 V processor. The non-volatile configuration stores I/O mapping and bus-protocol conversion logic permanently, surviving power cycles without reprogramming. Industrial I/O modules, data-acquisition front-ends, and embedded controller boards commonly use the EPM3512AFC256-19 to expand SPI, I2C, GPIO, and parallel bus interfaces from a single low-cost processor.
Recommandé
Legacy Logic Replacement and Board Modernization
The EPM3512AFC256-19 is widely deployed as a drop-in modernization vehicle for legacy boards that previously used multiple 22V10, 26V12, or 74-series discrete logic. By integrating dozens of small PAL/GAL devices and discrete gates into one 256-ball BGA CPLD, designers reduce board area, improve test coverage, and simplify inventory. The 7.5 ns tPD at the -19 speed grade matches the timing of older bipolar PALs while reducing power consumption from 100s of mA to a few hundred mW. The EEPROM-based ISP (IEEE 1532) allows field upgrades via JTAG without removing the device from the board, ideal for aerospace, military, and industrial systems where board replacement costs dominate.
Recommandé
Industrial Control and Factory Automation
The EPM3512AFC256-19 is well matched to industrial control and factory automation applications that require reliable, deterministic logic with long-term supply stability. The -40C to +85C industrial temperature range, non-volatile configuration, and 3.3 V core operation support PLCs, motor controllers, and process instrumentation deployed in harsh environments. With 208 user I/Os, designers can directly interface to encoders, sensors, and actuators without external muxing, while the 80 MHz maximum internal frequency handles real-time control loops. The IEEE 1532 ISP support allows firmware updates via JTAG on the production line, simplifying commissioning. The wide operating voltage and EEPROM-backed configuration also suit factory-floor equipment with frequent power cycles.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM3512AFC256-19 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM3512AFC256-10N | EPM3512AFC256-10 | EPM3512AFC256-18 | EPM3512AFC256-7N | EPM3512AFC-7N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 256-ball FineLine BGA (FC) | 256-ball FineLine BGA (FC) - same | 256-ball FineLine BGA (FC) - same | 256-ball FineLine BGA (FC) - same | 256-ball FineLine BGA (FC) - same | 256-ball FineLine BGA (FC) - same |
| Macrocells | 512 | 512 | 512 | 512 | 512 | 512 |
| Usable Gates | 10000 | 10000 | 10000 | 10000 | 10000 | 10000 |
| Pin-to-Pin Delay (tPD) | 7.5 ns (-19 speed grade) | 10 ns (-10 speed grade) | 10 ns (-10 speed grade) | 18 ns (-18 speed grade) | 7 ns (-7 speed grade, fastest) | 7 ns (-7 speed grade, fastest) |
| Max Internal Frequency | 80 MHz | 100 MHz | 100 MHz | 80 MHz | 125 MHz | 125 MHz |
| User I/O Pins | 208 | 208 | 208 | 208 | 208 | 208 |
| VCCINT (Core Supply) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Programming Interface | JTAG (IEEE 1149.1) / ISP (IEEE 1532) | JTAG (IEEE 1149.1) / ISP (IEEE 1532) | JTAG (IEEE 1149.1) / ISP (IEEE 1532) | JTAG (IEEE 1149.1) / ISP (IEEE 1532) | JTAG (IEEE 1149.1) / ISP (IEEE 1532) | JTAG (IEEE 1149.1) / ISP (IEEE 1532) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- Slowest speed grade (7.5 ns tPD) of the EPM3512AFC256 family (vs EPM3512AFC256-7N)
- Same-package drop-in compatibility across entire EPM3512AFC256 speed grade family (vs EPM3512AFC256-10N)
- Non-volatile EEPROM configuration enables instant-on operation (vs MAX II EPM1270F256 (flash-based))
Notes de conception
Estimated: The EPM3512AFC256-19 in the 256-ball FineLine BGA package has a typical theta_JA of approximately 18-22 C/W with adequate PCB thermal vias (per MAX 3000A datasheet package thermal characteristics). For continuous operation at maximum internal frequency (80 MHz) with high I/O toggle rates, ensure the PCB layout includes a thermal via array under the package center and connects to an inner ground plane. Power consumption scales linearly with frequency and I/O activity; the -19 speed grade typically draws less dynamic current than faster speed grades at the same frequency due to longer internal edge rates.
Place decoupling capacitors as close as possible to the VCCINT and VCCIO power pins. Use a 0.1 uF ceramic capacitor on every VCCINT ball and every VCCIO ball, plus a single 10 uF bulk tantalum or ceramic capacitor near the package. For the JTAG chain, route TDI, TDO, TMS, and TCK as a daisy-chain with no stubs, and add a 10 kohm pull-up on TCK and TMS to ensure defined logic levels during configuration. The 256-ball FineLine BGA requires microvia or via-in-pad PCB technology for reliable assembly; standard 0.5 mm pitch BGAs are not hand-solderable.
Do not confuse the EPM3512AFC256-19 (MAX 3000A family, 3.3 V VCCINT) with the MAX 7000S EPM7128S or MAX II EPM1270 families - they use different JTAG chain commands, BSDL files, and programming algorithms. The MAX 3000A requires Quartus II (legacy) and uses the .pof (Programmer Object File) format; Quartus Prime does not support MAX 3000A. Always verify that VCCIO is set to 3.3 V or 2.5 V according to your I/O bank requirement - mixing 5 V signals into a 3.3 V VCCIO bank without proper level shifting will damage the device. JTAG chain length should not exceed the IEEE 1149.1 specification for your chosen TCK frequency.
Informations de conformité
RoHS/REACH compliance not confirmed in verified web data. AEC-Q100 not applicable (CPLD is not automotive-qualified per Altera/Intel MAX 3000A datasheet). Lead-free (Pb-free) assembly confirmed via Altera legacy product environmental specifications.
