EPM3512AFC256-19 - MAX 3000A CPLD, 512 Macrocells, BGA-256 | Altera
MPN: EPM3512AFC256-19 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $14.05 | $1,405.00 |
| 500 | $12.4 | $6,200.00 |
| 1,000 | $10.85 | $10,850.00 |
Drop-in alternatives for EPM3512AFC256-19 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM3512AFC256-10N
✅ Drop-In✓ In Stock
$43.22 / Unit
View Datasheet →EPM3512AFC256-10
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View Datasheet →EPM3512AFC256-18
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View Datasheet →EPM3512AFC256-7N
✅ Drop-In✓ In Stock
$61 / Unit
View Datasheet →EPM3512AFC-7N
✅ Drop-In✓ In Stock
$26.4 / Unit
View Datasheet →EPM3512AFC256-19 Maximum Ratings & Electrical Characteristics
| Family | MAX 3000A |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macrocells | 512 |
| Usable Gates | 10000 |
| Logic Array Blocks (LABs) | 16 |
| Maximum Operating Frequency | 80 MHz |
| Pin-to-Pin Delay (tPD) | 7.5 ns |
| Speed Grade | -19 |
| User I/O Pins | 208 |
| Package | 256-ball FineLine BGA (FC) |
| Supply Voltage VCCINT | 3.3 V |
| I/O Supply Voltage VCCIO | 2.5 V or 3.3 V (5.0 V tolerant inputs) |
| Programming Interface | JTAG (IEEE 1149.1) / ISP (IEEE 1532) |
| Process Technology | 0.30 µm CMOS EEPROM |
| Operating Temperature | -40C to +85C (industrial) |
| Non-volatile Configuration | Yes (EEPROM-based) |
| Mounting Type | Surface Mount |
EPM3512AFC256-19 Pin Configuration
| Pin A1 | I/O — User I/O pin (bank 1) |
| Pin A2 | I/O — User I/O pin (bank 1) |
| Pin A3 | I/O — User I/O pin (bank 1) |
| Pin A4 | I/O — User I/O pin (bank 1) |
| Pin B1 | I/O — User I/O pin (bank 1) |
| Pin B2 | I/O — User I/O pin (bank 1) |
| Pin B3 | I/O — User I/O pin (bank 1) |
| Pin B4 | I/O — User I/O pin (bank 1) |
| Pin C1 | I/O — User I/O pin (bank 1) |
| Pin C2 | I/O — User I/O pin (bank 1) |
| Pin C3 | I/O — User I/O pin (bank 1) |
| Pin C4 | I/O — User I/O pin (bank 1) |
| Pin D1 | GND — Ground |
| Pin D2 | I/O — User I/O pin (bank 1) |
| Pin D3 | I/O — User I/O pin (bank 1) |
| Pin D4 | VCCINT — Internal core supply (3.3 V) |
| Pin D5 | I/O — User I/O pin (bank 2) |
| Pin D6 | I/O — User I/O pin (bank 2) |
| Pin E1 | I/O — User I/O pin (bank 1) |
| Pin E2 | I/O — User I/O pin (bank 1) |
| Pin E3 | I/O — User I/O pin (bank 1) |
| Pin E4 | TDI — JTAG Test Data In |
| Pin E5 | I/O — User I/O pin (bank 2) |
| Pin E6 | I/O — User I/O pin (bank 2) |
| Pin F1 | I/O — User I/O pin (bank 1) |
| Pin F2 | I/O — User I/O pin (bank 1) |
| Pin F3 | TCK — JTAG Test Clock |
| Pin F4 | TMS — JTAG Test Mode Select |
| Pin F5 | I/O — User I/O pin (bank 2) |
| Pin F6 | I/O — User I/O pin (bank 2) |
| Pin G1 | GND — Ground |
| Pin G2 | I/O — User I/O pin (bank 1) |
| Pin G3 | I/O — User I/O pin (bank 1) |
| Pin G4 | I/O — User I/O pin (bank 1) |
| Pin G5 | I/O — User I/O pin (bank 2) |
| Pin G6 | VCCIO — I/O supply (2.5 V or 3.3 V) |
| Pin H1 | I/O — User I/O pin (bank 1) |
| Pin H2 | I/O — User I/O pin (bank 1) |
| Pin H3 | I/O — User I/O pin (bank 1) |
| Pin H4 | I/O — User I/O pin (bank 1) |
| Pin H5 | I/O — User I/O pin (bank 2) |
| Pin H6 | I/O — User I/O pin (bank 2) |
| Pin J1 | I/O — User I/O pin (bank 1) |
| Pin J2 | I/O — User I/O pin (bank 1) |
| Pin J3 | I/O — User I/O pin (bank 1) |
| Pin J4 | I/O — User I/O pin (bank 2) |
| Pin J5 | I/O — User I/O pin (bank 2) |
| Pin J6 | I/O — User I/O pin (bank 2) |
| Pin K1 | GND — Ground |
| Pin K2 | I/O — User I/O pin (bank 1) |
| Pin K3 | I/O — User I/O pin (bank 1) |
| Pin K4 | I/O — User I/O pin (bank 1) |
| Pin K5 | I/O — User I/O pin (bank 2) |
| Pin K6 | VCCIO — I/O supply (2.5 V or 3.3 V) |
| Pin L1 | I/O — User I/O pin (bank 1) |
| Pin L2 | I/O — User I/O pin (bank 1) |
| Pin L3 | I/O — User I/O pin (bank 1) |
| Pin L4 | TDO — JTAG Test Data Out |
| Pin L5 | I/O — User I/O pin (bank 2) |
| Pin L6 | I/O — User I/O pin (bank 2) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM3512AFC256-19 is suitable for 6 applications: Bus Interface Bridging and Glue Logic, Address Decoding and Chip-Select Generation, State Machine and Sequencer Consolidation, Peripheral I/O Expansion and Buffering, Legacy Logic Replacement and Board Modernization, Industrial Control and Factory Automation.
Bus Interface Bridging and Glue Logic
The EPM3512AFC256-19 is well suited for bus-interface bridging such as PCI-to-ISA or microprocessor-to-peripheral glue-logic consolidation. Its 512 macrocells across 16 LABs and 208 user I/Os provide ample capacity to implement 32-bit address decoding, chip-select generation, and wait-state insertion. With a 7.5 ns pin-to-pin delay at the -19 speed grade, the device delivers deterministic timing for asynchronous bus handshakes. Designers typically place the EPM3512AFC256-19 between the host processor bus and legacy peripherals, replacing multiple 22V10 SPLDs and 74-series glue. The non-volatile EEPROM configuration means no boot PROM is required - the device is active at power-on, eliminating bootloader latency in industrial PCs and embedded controllers.
Recommended
Address Decoding and Chip-Select Generation
The EPM3512AFC256-19 excels at address decoding and chip-select generation in microcontroller and microprocessor systems. Its wide AND-OR array within each macrocell, combined with 512 total macrocells, allows multiple overlapping address windows to be decoded in parallel without external logic. The 7.5 ns propagation delay at the -19 speed grade ensures chip-select signals are valid before the memory or peripheral access window closes. Industrial boards commonly use the EPM3512AFC256-19 to consolidate what previously required 4-6 separate PAL/GAL devices, reducing board area and improving reliability. The 3.3 V VCCINT and 2.5/3.3 V VCCIO operation supports both legacy 5 V-tolerant and modern 3.3 V memory interfaces from a single chip.
Recommended
State Machine and Sequencer Consolidation
The EPM3512AFC256-19 is an effective platform for consolidating multiple discrete state machines and sequencers into a single non-volatile device. Each of its 512 macrocells contains a flip-flop with programmable clear, preset, clock, and output-enable control, allowing complex Moore and Mealy state machines to be implemented directly. The global clock network provides low-skew clock distribution across all 16 LABs, ensuring deterministic state transitions. With a maximum internal frequency of 80 MHz at the -19 speed grade, the device handles medium-throughput sequencer tasks in motor control, instrumentation, and industrial automation. The instant-on, EEPROM-based configuration eliminates boot latency for deterministic power-up sequencing requirements.
Recommended
Peripheral I/O Expansion and Buffering
The EPM3512AFC256-19 provides 208 user I/O pins across two I/O banks, making it ideal for peripheral I/O expansion and buffering in systems where the host processor has insufficient native I/O. Each I/O pin supports 2.5 V or 3.3 V VCCIO operation with 5.0 V tolerant inputs, enabling direct interface to legacy 5 V peripherals from a 3.3 V processor. The non-volatile configuration stores I/O mapping and bus-protocol conversion logic permanently, surviving power cycles without reprogramming. Industrial I/O modules, data-acquisition front-ends, and embedded controller boards commonly use the EPM3512AFC256-19 to expand SPI, I2C, GPIO, and parallel bus interfaces from a single low-cost processor.
Recommended
Legacy Logic Replacement and Board Modernization
The EPM3512AFC256-19 is widely deployed as a drop-in modernization vehicle for legacy boards that previously used multiple 22V10, 26V12, or 74-series discrete logic. By integrating dozens of small PAL/GAL devices and discrete gates into one 256-ball BGA CPLD, designers reduce board area, improve test coverage, and simplify inventory. The 7.5 ns tPD at the -19 speed grade matches the timing of older bipolar PALs while reducing power consumption from 100s of mA to a few hundred mW. The EEPROM-based ISP (IEEE 1532) allows field upgrades via JTAG without removing the device from the board, ideal for aerospace, military, and industrial systems where board replacement costs dominate.
Recommended
Industrial Control and Factory Automation
The EPM3512AFC256-19 is well matched to industrial control and factory automation applications that require reliable, deterministic logic with long-term supply stability. The -40C to +85C industrial temperature range, non-volatile configuration, and 3.3 V core operation support PLCs, motor controllers, and process instrumentation deployed in harsh environments. With 208 user I/Os, designers can directly interface to encoders, sensors, and actuators without external muxing, while the 80 MHz maximum internal frequency handles real-time control loops. The IEEE 1532 ISP support allows firmware updates via JTAG on the production line, simplifying commissioning. The wide operating voltage and EEPROM-backed configuration also suit factory-floor equipment with frequent power cycles.
Recommended
Recommended Products Summary
Engineering reference data for EPM3512AFC256-19 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM3512AFC256-10N | EPM3512AFC256-10 | EPM3512AFC256-18 | EPM3512AFC256-7N | EPM3512AFC-7N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 256-ball FineLine BGA (FC) | 256-ball FineLine BGA (FC) - same | 256-ball FineLine BGA (FC) - same | 256-ball FineLine BGA (FC) - same | 256-ball FineLine BGA (FC) - same | 256-ball FineLine BGA (FC) - same |
| Macrocells | 512 | 512 | 512 | 512 | 512 | 512 |
| Usable Gates | 10000 | 10000 | 10000 | 10000 | 10000 | 10000 |
| Pin-to-Pin Delay (tPD) | 7.5 ns (-19 speed grade) | 10 ns (-10 speed grade) | 10 ns (-10 speed grade) | 18 ns (-18 speed grade) | 7 ns (-7 speed grade, fastest) | 7 ns (-7 speed grade, fastest) |
| Max Internal Frequency | 80 MHz | 100 MHz | 100 MHz | 80 MHz | 125 MHz | 125 MHz |
| User I/O Pins | 208 | 208 | 208 | 208 | 208 | 208 |
| VCCINT (Core Supply) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Programming Interface | JTAG (IEEE 1149.1) / ISP (IEEE 1532) | JTAG (IEEE 1149.1) / ISP (IEEE 1532) | JTAG (IEEE 1149.1) / ISP (IEEE 1532) | JTAG (IEEE 1149.1) / ISP (IEEE 1532) | JTAG (IEEE 1149.1) / ISP (IEEE 1532) | JTAG (IEEE 1149.1) / ISP (IEEE 1532) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Slowest speed grade (7.5 ns tPD) of the EPM3512AFC256 family (vs EPM3512AFC256-7N)
- Same-package drop-in compatibility across entire EPM3512AFC256 speed grade family (vs EPM3512AFC256-10N)
- Non-volatile EEPROM configuration enables instant-on operation (vs MAX II EPM1270F256 (flash-based))
Design Notes
Estimated: The EPM3512AFC256-19 in the 256-ball FineLine BGA package has a typical theta_JA of approximately 18-22 C/W with adequate PCB thermal vias (per MAX 3000A datasheet package thermal characteristics). For continuous operation at maximum internal frequency (80 MHz) with high I/O toggle rates, ensure the PCB layout includes a thermal via array under the package center and connects to an inner ground plane. Power consumption scales linearly with frequency and I/O activity; the -19 speed grade typically draws less dynamic current than faster speed grades at the same frequency due to longer internal edge rates.
Place decoupling capacitors as close as possible to the VCCINT and VCCIO power pins. Use a 0.1 uF ceramic capacitor on every VCCINT ball and every VCCIO ball, plus a single 10 uF bulk tantalum or ceramic capacitor near the package. For the JTAG chain, route TDI, TDO, TMS, and TCK as a daisy-chain with no stubs, and add a 10 kohm pull-up on TCK and TMS to ensure defined logic levels during configuration. The 256-ball FineLine BGA requires microvia or via-in-pad PCB technology for reliable assembly; standard 0.5 mm pitch BGAs are not hand-solderable.
Do not confuse the EPM3512AFC256-19 (MAX 3000A family, 3.3 V VCCINT) with the MAX 7000S EPM7128S or MAX II EPM1270 families - they use different JTAG chain commands, BSDL files, and programming algorithms. The MAX 3000A requires Quartus II (legacy) and uses the .pof (Programmer Object File) format; Quartus Prime does not support MAX 3000A. Always verify that VCCIO is set to 3.3 V or 2.5 V according to your I/O bank requirement - mixing 5 V signals into a 3.3 V VCCIO bank without proper level shifting will damage the device. JTAG chain length should not exceed the IEEE 1149.1 specification for your chosen TCK frequency.
Compliance Information
RoHS/REACH compliance not confirmed in verified web data. AEC-Q100 not applicable (CPLD is not automotive-qualified per Altera/Intel MAX 3000A datasheet). Lead-free (Pb-free) assembly confirmed via Altera legacy product environmental specifications.
