IRSM808-105MHTR - 10A 500V Half-Bridge IPM | Infineon
Référence : IRSM808-105MHTR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.12 | $4,12 |
| 10 | $3.78 | $37,80 |
| 100 | $3.21 | $321,00 |
| 500 | $2.86 | $1 430,00 |
| 1 000 | $2.54 | $2 540,00 |
| 3 000 | $2.31 | $6 930,00 |
IRSM808-105MHTR Présentation
An Intelligent Power Module (IPM) is an integrated power-electronics building block that combines the power semiconductor switches (typically IGBTs or power MOSFETs), their gate drivers, and protection features (short-circuit, under-voltage, over-temperature) into a single isolated package. IPMs sit hierarchically between discrete MOSFET/IGBT half-bridges (lower integration) and full motor-control SoCs (higher integration), giving designers a compact, drop-in power stage for variable-frequency drives. The IRSM808-105MHTR leverages Infineon's low-RDS(on) Trench FREDFET process to minimize conduction losses in the 500 V power stage.
Key specifications include a 500 V drain-source blocking voltage, 10 A continuous output current, integrated bootstrap diode for the high-side supply, and built-in over-current and thermal shutdown protection. The exposed top-side thermal pad provides a direct thermal path to the PCB copper or an optional heatsink, enabling compact designs without bulky external cooling hardware. Logic-level inputs accept 3.3 V or 5 V CMOS signals, simplifying interface to microcontrollers such as the XMC1000 or XMC4000 series.
The architecture uses Infineon's benchmark high-voltage level-shift and bootstrap gate-drive technology to control the high-side switch without requiring an isolated DC/DC converter. This reduces BOM count and PCB area while improving reliability. The integrated dead-time generation prevents cross-conduction of the low-side and high-side MOSFETs, a common failure mode in discrete half-bridge designs.
Typical applications include energy-efficient ceiling fans, refrigerator compressors, dishwasher circulation pumps, and small HVAC blowers - any appliance that benefits from variable-speed brushless DC or PMSM motor control. The 200 W rating covers most sub-1 HP residential appliance motors.
When designing with this IPM, place low-ESR ceramic bypass capacitors directly on the VCC and V+ pins to handle the gate-charge current spikes during switching. Ensure the exposed thermal pad has at least 1 square inch of copper pour and thermal vias to a second-layer inner plane for rated 10 A continuous operation.
This page synthesizes distributor pricing, drop-in alternatives, and practical PCB layout notes not found in the manufacturer datasheet summary.
Alternatives de remplacement direct pour IRSM808-105MHTR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec IRSM808-105MHTR (même facteur de forme et même empreinte) — différant par Dead-Time Generation, Gate Driver, MSL Level, Operating Temperature Range, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
IRSM808-105MH
✅ Remplacement direct✓ En stock
$2.65 / unité
Voir la fiche technique →IRSM808-204MH
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
IRSM807-105MH
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
IRSM808-105MHTR
✅ Remplacement direct✓ En stock
$2.31 / unité
Voir la fiche technique →IRSM808-105MHTR Valeurs maximales et caractéristiques électriques
| Topologie | Half-Bridge (High-Side + Low-Side) |
| Drain-Source Blocking Voltage (VDS) | 500 V |
| Continuous Output Current | 10 A |
| Continuous Motor Power | 200 W |
| Power Switch Technology | Trench FREDFET (low RDS(on) MOSFET) |
| Logic Supply Voltage (VCC) | 13.5 V to 16.5 V |
| Gate Driver | Integrated high-voltage level-shift HVIC |
| Bootstrap Diode | Integrated |
| Dead-Time Generation | Integrated (prevents cross-conduction) |
| Protection Features | Over-current, Under-voltage lockout (UVLO), Thermal shutdown |
| Logic Input Compatibility | 3.3 V / 5 V CMOS |
| Boîtier | 31-PQFN (8x9 mm) with exposed thermal pad |
| Type de montage | Surface Mount |
| Plage de température de fonctionnement | -40C to +125C (junction) |
| Isolation | Electrically isolated thermal pad (high-voltage creepage per IPM package) |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
| Statut RoHS | Compliant |
Guide de configuration des broches du IRSM808-105MHTR 31-pqfn (8x9 mm) with exposed thermal pad
Configuration des broches du IRSM808-105MHTR (boîtier 31-pqfn (8x9 mm) with exposed thermal pad). Ce composant de puissance comporte des bornes de grille, de drain et de source. Pour les boîtiers non polarisés, consultez la fiche technique du fabricant pour l'orientation exacte de la broche 1 et les détails de l'empreinte. Les applications courantes incluent la conception d'alimentations, la commande de moteurs et la commutation de charges.
Aucune donnée de brochage détaillée disponible pour IRSM808-105MHTR.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
IRSM808-105MHTR convient pour 6 applications: Energy-Efficient Ceiling Fans, Refrigerator Compressor Drives, Dishwasher Circulation Pumps, HVAC Blower Drives, Small Appliance Pumps ( Washing Machine Drain / Water Heater Recirc ), Range Hood and Exhaust Fans.
Energy-Efficient Ceiling Fans
The IRSM808-105MHTR fits energy-efficient ceiling fans because its 10 A continuous output and 200 W power rating cover the 30-80 W typical BLDC/PMSM motors used in residential fans. Its integrated Trench FREDFET half-bridge with 500 V blocking headroom supports universal-input rectified mains (110-220 VAC) without intermediate step-down. Compared to discrete MOSFET+driver designs, the IPM eliminates gate-driver timing skew and reduces PCB area by up to 60%, enabling the slimmer motor housings demanded by modern ceiling-fan designs. The 3.3 V logic inputs interface directly to low-cost MCUs such as the XMC1300, simplifying firmware-based sinusoidal FOC control for silent operation.
Recommandé
Refrigerator Compressor Drives
Variable-speed refrigerator compressors benefit from the IRSM808-105MHTR's 10 A / 500 V capability and integrated protection features. The over-current and thermal-shutdown functions guard against compressor stall conditions that would otherwise destroy discrete MOSFETs. The 31-PQFN package with exposed thermal pad couples heat directly to the refrigerator chassis, where ambient temperatures remain moderate. Compared to IGBT IPMs, the MOSFET-based IRSM808-105MHTR reduces switching losses by 30-50% at 20 kHz PWM, improving inverter efficiency by 1-2 percentage points - directly translating to lower electricity bills over the appliance's lifetime.
Recommandé
Dishwasher Circulation Pumps
Dishwasher circulation pumps require compact, sealed motor inverters that fit inside the pump housing. The IRSM808-105MHTR's 31-PQFN (8x9 mm) footprint and integrated thermal isolation allow the inverter PCB to be potted or sealed against moisture ingress. The 10 A rating covers pump motors up to 150 W, with the 500 V blocking voltage providing ample headroom for rectified 230 VAC mains. Its integrated bootstrap diode eliminates an external component, further improving long-term reliability in a humid environment. Compared to gate-driver-plus-discrete-MOSFET designs, the IPM solution halves the PCB area and simplifies UL/IEC 60730 Class B safety compliance.
Recommandé
HVAC Blower Drives
Residential HVAC blowers using PMSM or BLDC motors can use the IRSM808-105MHTR as a compact inverter stage. The 200 W continuous rating covers 1/4 HP blowers typical in furnace air handlers, and the IPM's integrated dead-time generation prevents the shoot-through currents that plague discrete designs. The 3.3 V CMOS logic inputs interface to HVAC controller boards that already carry microcontrollers for thermostat and safety functions. Compared to a discrete 500 V MOSFET + HVIC design, the IRSM808-105MHTR simplifies EMI compliance by minimizing parasitic gate-loop inductance, which is critical for HVAC products sold globally.
Recommandé
Small Appliance Pumps ( Washing Machine Drain / Water Heater Recirc )
Small appliance pumps under 200 W - such as washing machine drain pumps and water heater recirculation pumps - are a strong fit for the IRSM808-105MHTR. The integrated half-bridge delivers the 10 A needed for typical 100-150 W pump motors, and the IPM's built-in over-current protection guards against locked-rotor faults common in pump applications. The 31-PQFN package mounts to standard FR4 PCBs without a dedicated heatsink at <100 W, keeping BOM cost low. Compared to electromechanical relays and TRIAC-based speed controls, the IPM-based variable-frequency drive enables soft-start and soft-stop, eliminating water-hammer noise in pump plumbing.
Recommandé
Range Hood and Exhaust Fans
Range hoods and exhaust fans increasingly use variable-speed BLDC motors for quieter operation and better energy ratings. The IRSM808-105MHTR provides the 10 A / 500 V half-bridge stage needed for 50-150 W exhaust fans, with the IPM's integrated thermal shutdown protecting against the elevated temperatures inside a range hood enclosure. The 31-PQFN footprint allows the inverter PCB to fit alongside the LED lighting and capacitive-touch control board in slim hood designs. Compared to a discrete half-bridge, the IPM's factory-trimmed dead-time eliminates cross-conduction losses and improves EMI margins for residential compliance.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour IRSM808-105MHTR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | IRSM808-105MH | IRSM808-204MH | IRSM807-105MH |
|---|---|---|---|---|
| Package | 31-PQFN (8x9 mm) | 31-PQFN (8x9 mm) - same | 31-PQFN (8x9 mm) - same | 31-PQFN (8x9 mm) - same |
| Brand | Infineon | Infineon | Infineon | Infineon |
| Continuous Output Current | 10 A | 10 A | 20 A | 10 A |
| Drain-Source Voltage (VDS) | 500 V | 500 V | 500 V | 500 V |
| Continuous Motor Power | 200 W | 200 W | 400 W | 200 W |
| Power Switch Technology | Trench FREDFET MOSFET | Trench FREDFET MOSFET | Trench FREDFET MOSFET | Trench FREDFET MOSFET |
| Logic Supply Voltage (VCC) | 13.5 V to 16.5 V | 13.5 V to 16.5 V | 13.5 V to 16.5 V | 13.5 V to 16.5 V |
| Bootstrap Diode | Integrated | Integrated | Integrated | Integrated |
| Protection Features | OCP, UVLO, TSD | OCP, UVLO, TSD | OCP, UVLO, TSD | OCP, UVLO, TSD |
| Packaging Format | Tape & Reel | Tray | Tape & Reel | Tape & Reel / Tray |
Principaux différenciateurs
- Integrated half-bridge with HVIC driver in 31-PQFN (vs Discrete 500 V MOSFET + IR2104 gate driver)
- Trench FREDFET MOSFET (not IGBT) (vs IGBT-based 10 A / 600 V IPMs (e.g. IRAMS10UP60A))
- Integrated bootstrap diode (vs Discrete half-bridge IPMs without internal bootstrap)
Notes de conception
Estimated: at 10 A continuous drain current and a typical RDS(on) of 0.45 ohm for the Trench FREDFET (estimated from datasheet family), conduction loss per switch is approximately 22.5 W at full load, giving a total half-bridge dissipation around 45 W. The 31-PQFN package relies on the exposed top thermal pad; route at least 1 square inch of top-layer copper and thermal vias to an inner-plane copper pour to keep junction temperature below 125 C. At <100 W total dissipation, no external heatsink is required.
Place VCC bypass capacitors (1 uF X7R ceramic) within 5 mm of the VCC and GND pins to suppress gate-charge-induced voltage dips. The bootstrap capacitor (typically 1 uF X7R or higher) must be placed close to the VB and VS pins of the IPM with a short trace; long bootstrap traces cause high-side under-voltage faults at high duty cycle. Keep the high-voltage power traces (V+, V-, VOUT) short and wide (>=2 mm) to minimize parasitic inductance and ringing.
Do not exceed the 16.5 V VCC maximum; logic supplies above 18 V will trigger permanent gate-oxide damage. The high-side switch requires a refresh pulse of at least 10 us every 100 ms to maintain bootstrap capacitor charge in 100% duty-cycle operation - if your application holds the high-side FET continuously on, add a dedicated bootstrap refresh circuit. The exposed thermal pad must be soldered to the PCB copper; an unsoldered pad will cause thermal runaway within seconds at full load.
Keep the high-voltage power stage traces (V+, V-, VOUT) physically separated from the low-voltage logic traces (HIN, LIN, FAULT, VCC, GND) to meet IEC 60730 Class B clearance requirements. Use a creepage distance of at least 6 mm on the PCB between the high-voltage and low-voltage nets around the IPM package. The exposed thermal pad provides the high-voltage isolation; do not run low-voltage traces beneath the IPM footprint.
Informations de conformité
RoHS compliant per Infineon product page. MSL Level 3 per JEDEC J-STD-020. Not AEC-Q100 qualified - this is an appliance-grade IPM, not automotive grade. Designed to meet IEC 60730 Class B functional safety requirements for household appliance motor control.
