IRSM808-105MHTR - 10A 500V Half-Bridge IPM | Infineon
MPN: IRSM808-105MHTR β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.12 | $4.12 |
| 10 | $3.78 | $37.80 |
| 100 | $3.21 | $321.00 |
| 500 | $2.86 | $1,430.00 |
| 1,000 | $2.54 | $2,540.00 |
| 3,000 | $2.31 | $6,930.00 |
IRSM808-105MHTR Overview
An Intelligent Power Module (IPM) is an integrated power-electronics building block that combines the power semiconductor switches (typically IGBTs or power MOSFETs), their gate drivers, and protection features (short-circuit, under-voltage, over-temperature) into a single isolated package. IPMs sit hierarchically between discrete MOSFET/IGBT half-bridges (lower integration) and full motor-control SoCs (higher integration), giving designers a compact, drop-in power stage for variable-frequency drives. The IRSM808-105MHTR leverages Infineon's low-RDS(on) Trench FREDFET process to minimize conduction losses in the 500 V power stage.
Key specifications include a 500 V drain-source blocking voltage, 10 A continuous output current, integrated bootstrap diode for the high-side supply, and built-in over-current and thermal shutdown protection. The exposed top-side thermal pad provides a direct thermal path to the PCB copper or an optional heatsink, enabling compact designs without bulky external cooling hardware. Logic-level inputs accept 3.3 V or 5 V CMOS signals, simplifying interface to microcontrollers such as the XMC1000 or XMC4000 series.
The architecture uses Infineon's benchmark high-voltage level-shift and bootstrap gate-drive technology to control the high-side switch without requiring an isolated DC/DC converter. This reduces BOM count and PCB area while improving reliability. The integrated dead-time generation prevents cross-conduction of the low-side and high-side MOSFETs, a common failure mode in discrete half-bridge designs.
Typical applications include energy-efficient ceiling fans, refrigerator compressors, dishwasher circulation pumps, and small HVAC blowers - any appliance that benefits from variable-speed brushless DC or PMSM motor control. The 200 W rating covers most sub-1 HP residential appliance motors.
When designing with this IPM, place low-ESR ceramic bypass capacitors directly on the VCC and V+ pins to handle the gate-charge current spikes during switching. Ensure the exposed thermal pad has at least 1 square inch of copper pour and thermal vias to a second-layer inner plane for rated 10 A continuous operation.
This page synthesizes distributor pricing, drop-in alternatives, and practical PCB layout notes not found in the manufacturer datasheet summary.
Drop-in alternatives for IRSM808-105MHTR β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with IRSM808-105MHTR (same form factor and footprint) β differing in Dead-Time Generation, Gate Driver, MSL Level, Operating Temperature Range, Package.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
IRSM808-105MH
β Drop-Inβ In Stock
$2.65 / Unit
View Datasheet βIRSM808-204MH
β Drop-Inπ Reference alternative (not in catalog)
IRSM807-105MH
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
IRSM808-105MHTR
β Drop-Inβ In Stock
$2.31 / Unit
View Datasheet βIRSM808-105MHTR Maximum Ratings & Electrical Characteristics
| Topology | Half-Bridge (High-Side + Low-Side) |
| Drain-Source Blocking Voltage (VDS) | 500 V |
| Continuous Output Current | 10 A |
| Continuous Motor Power | 200 W |
| Power Switch Technology | Trench FREDFET (low RDS(on) MOSFET) |
| Logic Supply Voltage (VCC) | 13.5 V to 16.5 V |
| Gate Driver | Integrated high-voltage level-shift HVIC |
| Bootstrap Diode | Integrated |
| Dead-Time Generation | Integrated (prevents cross-conduction) |
| Protection Features | Over-current, Under-voltage lockout (UVLO), Thermal shutdown |
| Logic Input Compatibility | 3.3 V / 5 V CMOS |
| Package | 31-PQFN (8x9 mm) with exposed thermal pad |
| Mounting Type | Surface Mount |
| Operating Temperature Range | -40C to +125C (junction) |
| Isolation | Electrically isolated thermal pad (high-voltage creepage per IPM package) |
| MSL Level | 3 (per JEDEC J-STD-020) |
| RoHS Status | Compliant |
IRSM808-105MHTR 31-pqfn (8x9 mm) with exposed thermal pad Pin Configuration Guide
Pin configuration for IRSM808-105MHTR (31-pqfn (8x9 mm) with exposed thermal pad package). This power device features gate, drain, and source terminals. For non-polarized packages, refer to the manufacturer datasheet for exact pin 1 orientation and footprint details. Common applications include power supply design, motor driving, and load switching.
No detailed pinout data available for IRSM808-105MHTR.
Refer to the datasheet for full pin configuration.
Typical Applications
IRSM808-105MHTR is suitable for 6 applications: Energy-Efficient Ceiling Fans, Refrigerator Compressor Drives, Dishwasher Circulation Pumps, HVAC Blower Drives, Small Appliance Pumps ( Washing Machine Drain / Water Heater Recirc ), Range Hood and Exhaust Fans.
Energy-Efficient Ceiling Fans
The IRSM808-105MHTR fits energy-efficient ceiling fans because its 10 A continuous output and 200 W power rating cover the 30-80 W typical BLDC/PMSM motors used in residential fans. Its integrated Trench FREDFET half-bridge with 500 V blocking headroom supports universal-input rectified mains (110-220 VAC) without intermediate step-down. Compared to discrete MOSFET+driver designs, the IPM eliminates gate-driver timing skew and reduces PCB area by up to 60%, enabling the slimmer motor housings demanded by modern ceiling-fan designs. The 3.3 V logic inputs interface directly to low-cost MCUs such as the XMC1300, simplifying firmware-based sinusoidal FOC control for silent operation.
Recommended
Refrigerator Compressor Drives
Variable-speed refrigerator compressors benefit from the IRSM808-105MHTR's 10 A / 500 V capability and integrated protection features. The over-current and thermal-shutdown functions guard against compressor stall conditions that would otherwise destroy discrete MOSFETs. The 31-PQFN package with exposed thermal pad couples heat directly to the refrigerator chassis, where ambient temperatures remain moderate. Compared to IGBT IPMs, the MOSFET-based IRSM808-105MHTR reduces switching losses by 30-50% at 20 kHz PWM, improving inverter efficiency by 1-2 percentage points - directly translating to lower electricity bills over the appliance's lifetime.
Recommended
Dishwasher Circulation Pumps
Dishwasher circulation pumps require compact, sealed motor inverters that fit inside the pump housing. The IRSM808-105MHTR's 31-PQFN (8x9 mm) footprint and integrated thermal isolation allow the inverter PCB to be potted or sealed against moisture ingress. The 10 A rating covers pump motors up to 150 W, with the 500 V blocking voltage providing ample headroom for rectified 230 VAC mains. Its integrated bootstrap diode eliminates an external component, further improving long-term reliability in a humid environment. Compared to gate-driver-plus-discrete-MOSFET designs, the IPM solution halves the PCB area and simplifies UL/IEC 60730 Class B safety compliance.
Recommended
HVAC Blower Drives
Residential HVAC blowers using PMSM or BLDC motors can use the IRSM808-105MHTR as a compact inverter stage. The 200 W continuous rating covers 1/4 HP blowers typical in furnace air handlers, and the IPM's integrated dead-time generation prevents the shoot-through currents that plague discrete designs. The 3.3 V CMOS logic inputs interface to HVAC controller boards that already carry microcontrollers for thermostat and safety functions. Compared to a discrete 500 V MOSFET + HVIC design, the IRSM808-105MHTR simplifies EMI compliance by minimizing parasitic gate-loop inductance, which is critical for HVAC products sold globally.
Recommended
Small Appliance Pumps ( Washing Machine Drain / Water Heater Recirc )
Small appliance pumps under 200 W - such as washing machine drain pumps and water heater recirculation pumps - are a strong fit for the IRSM808-105MHTR. The integrated half-bridge delivers the 10 A needed for typical 100-150 W pump motors, and the IPM's built-in over-current protection guards against locked-rotor faults common in pump applications. The 31-PQFN package mounts to standard FR4 PCBs without a dedicated heatsink at <100 W, keeping BOM cost low. Compared to electromechanical relays and TRIAC-based speed controls, the IPM-based variable-frequency drive enables soft-start and soft-stop, eliminating water-hammer noise in pump plumbing.
Recommended
Range Hood and Exhaust Fans
Range hoods and exhaust fans increasingly use variable-speed BLDC motors for quieter operation and better energy ratings. The IRSM808-105MHTR provides the 10 A / 500 V half-bridge stage needed for 50-150 W exhaust fans, with the IPM's integrated thermal shutdown protecting against the elevated temperatures inside a range hood enclosure. The 31-PQFN footprint allows the inverter PCB to fit alongside the LED lighting and capacitive-touch control board in slim hood designs. Compared to a discrete half-bridge, the IPM's factory-trimmed dead-time eliminates cross-conduction losses and improves EMI margins for residential compliance.
Recommended
Recommended Products Summary
Engineering reference data for IRSM808-105MHTR β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | IRSM808-105MH | IRSM808-204MH | IRSM807-105MH |
|---|---|---|---|---|
| Package | 31-PQFN (8x9 mm) | 31-PQFN (8x9 mm) - same | 31-PQFN (8x9 mm) - same | 31-PQFN (8x9 mm) - same |
| Brand | Infineon | Infineon | Infineon | Infineon |
| Continuous Output Current | 10 A | 10 A | 20 A | 10 A |
| Drain-Source Voltage (VDS) | 500 V | 500 V | 500 V | 500 V |
| Continuous Motor Power | 200 W | 200 W | 400 W | 200 W |
| Power Switch Technology | Trench FREDFET MOSFET | Trench FREDFET MOSFET | Trench FREDFET MOSFET | Trench FREDFET MOSFET |
| Logic Supply Voltage (VCC) | 13.5 V to 16.5 V | 13.5 V to 16.5 V | 13.5 V to 16.5 V | 13.5 V to 16.5 V |
| Bootstrap Diode | Integrated | Integrated | Integrated | Integrated |
| Protection Features | OCP, UVLO, TSD | OCP, UVLO, TSD | OCP, UVLO, TSD | OCP, UVLO, TSD |
| Packaging Format | Tape & Reel | Tray | Tape & Reel | Tape & Reel / Tray |
Key Differentiators
- Integrated half-bridge with HVIC driver in 31-PQFN (vs Discrete 500 V MOSFET + IR2104 gate driver)
- Trench FREDFET MOSFET (not IGBT) (vs IGBT-based 10 A / 600 V IPMs (e.g. IRAMS10UP60A))
- Integrated bootstrap diode (vs Discrete half-bridge IPMs without internal bootstrap)
Design Notes
Estimated: at 10 A continuous drain current and a typical RDS(on) of 0.45 ohm for the Trench FREDFET (estimated from datasheet family), conduction loss per switch is approximately 22.5 W at full load, giving a total half-bridge dissipation around 45 W. The 31-PQFN package relies on the exposed top thermal pad; route at least 1 square inch of top-layer copper and thermal vias to an inner-plane copper pour to keep junction temperature below 125 C. At <100 W total dissipation, no external heatsink is required.
Place VCC bypass capacitors (1 uF X7R ceramic) within 5 mm of the VCC and GND pins to suppress gate-charge-induced voltage dips. The bootstrap capacitor (typically 1 uF X7R or higher) must be placed close to the VB and VS pins of the IPM with a short trace; long bootstrap traces cause high-side under-voltage faults at high duty cycle. Keep the high-voltage power traces (V+, V-, VOUT) short and wide (>=2 mm) to minimize parasitic inductance and ringing.
Do not exceed the 16.5 V VCC maximum; logic supplies above 18 V will trigger permanent gate-oxide damage. The high-side switch requires a refresh pulse of at least 10 us every 100 ms to maintain bootstrap capacitor charge in 100% duty-cycle operation - if your application holds the high-side FET continuously on, add a dedicated bootstrap refresh circuit. The exposed thermal pad must be soldered to the PCB copper; an unsoldered pad will cause thermal runaway within seconds at full load.
Keep the high-voltage power stage traces (V+, V-, VOUT) physically separated from the low-voltage logic traces (HIN, LIN, FAULT, VCC, GND) to meet IEC 60730 Class B clearance requirements. Use a creepage distance of at least 6 mm on the PCB between the high-voltage and low-voltage nets around the IPM package. The exposed thermal pad provides the high-voltage isolation; do not run low-voltage traces beneath the IPM footprint.
Compliance Information
RoHS compliant per Infineon product page. MSL Level 3 per JEDEC J-STD-020. Not AEC-Q100 qualified - this is an appliance-grade IPM, not automotive grade. Designed to meet IEC 60730 Class B functional safety requirements for household appliance motor control.
