KMC7448THX1400ND - 1.4GHz PowerPC G4 MPU 360-FCCBGA | NXP
Référence : KMC7448THX1400ND ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $598.22 | $598,22 |
| 10 | $580 | $5 800,00 |
| 100 | $555 | $55 500,00 |
| 500 | $520 | $260 000,00 |
| 1 000 | $488 | $488 000,00 |
KMC7448THX1400ND Présentation
A microprocessor (MPU) is a single-chip CPU that integrates the central processing unit, cache, memory management unit and on-chip peripherals onto a single die; the PowerPC G4 architecture builds on this base with AltiVec/VMX SIMD extensions and superscalar out-of-order execution. The MPC74xx family sits within NXP/Freescale's high-performance PowerPC microprocessor hierarchy, above the MPC7xx line and aligned with infrastructure, networking and aerospace applications that benefit from mature PowerPC software ecosystems.
Key features of the KMC7448THX1400ND include: 1.4 GHz core clock, 32-bit PowerPC architecture with AltiVec-compatible SIMD unit, 1.15 V core VDD, on-chip L1/L2 caches, integrated MMU and the standard PowerPC bus interface. The 360-FCCBGA package exposes the full PowerPC address/data bus plus JTAG, system management and interrupt pins, allowing direct attachment to platform ASICs and DDR memory bridges without external glue logic.
Typical applications include industrial control and automation systems, aerospace and defense embedded computing platforms, networking and telecommunications infrastructure, and military-grade single-board computers. The wide industrial temperature window and long-life-cycle PowerPC toolchain support position this part for programs requiring 10+ years of supply continuity rather than the latest-edge consumer silicon.
When designing with this part, ensure the 360-ball FCCBGA land pattern is routed with the controlled-impedance, matched-length layers specified in the NXP hardware design guide, and provide low-inductance decoupling within 100 mils of each VDD/VSS pair. Designers should also verify the host firmware supports PowerPC little-/big-endian boot and the platform's boot ROM vector configuration.
This page synthesizes distributor pricing, real-time stock signals and drop-in alternatives from the same MPC74xx family, plus practical thermal and signal-integrity notes not found in the standalone datasheet.
Alternatives de remplacement direct pour KMC7448THX1400ND — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC7448THX1400ND
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
KMC7448HX1267ND
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
KMC7448VU1700LD
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC7448VS1420LC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
KMC755CVT400LE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
KMC7448THX1400ND Valeurs maximales et caractéristiques électriques
| Processor Type | MPC74xx PowerPC G4 32-Bit |
| Core Architecture | PowerPC with AltiVec/VMX SIMD extension |
| Core Clock Speed | 1.4 GHz |
| Operating Voltage (Core) | 1.15 V |
| Number of Cores | 1 |
| Largeur du bus de données | 32-Bit |
| Boîtier / Format | 360-FCCBGA (25 x 25 mm) |
| Type de montage | Surface Mount (BGA) |
| Température de fonctionnement | -40C to +105C |
| On-Chip Cache | L1 I/D + L2 (PowerPC integrated) |
| MMU | Yes (PowerPC hardware MMU) |
| JTAG Boundary Scan | Yes (per IEEE 1149.1, standard for the family) |
| Statut RoHS | Compliant (per distributor listing) |
| Lead-Free | Yes |
| Statut du cycle de vie | End-of-Life (per NXP MC7448 product page) |
Guide de configuration des broches du KMC7448THX1400ND 360-fccbga (25 x 25 mm)
Configuration des broches du KMC7448THX1400ND (boîtier 360-fccbga (25 x 25 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour KMC7448THX1400ND.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
KMC7448THX1400ND convient pour 6 applications: Aerospace and Defense Embedded Computing, Industrial Control and Automation Platforms, Networking and Telecommunications Infrastructure, Military-Grade Single-Board Computers, Medical Imaging and Diagnostic Systems, Print and Imaging Pipeline Controllers.
Aerospace and Defense Embedded Computing
Defense avionics and rugged ground vehicles rely on PowerPC G4 class MPUs for deterministic 32-bit processing under harsh thermal conditions. The KMC7448THX1400ND's 1.4 GHz core, AltiVec/VMX SIMD and -40C to +105C industrial temperature window align directly with conduction-cooled VME/VPX cards and MIL-STD-810G chassis. Placed as the application CPU on a VPX payload board with DDR bridge ASIC, it executes radar signal preprocessing and crypto offload at lower power than higher-clock parts while preserving long-term supply for >10 year programs. The 360-FCCBGA package supports the fine-pitch routing needed for tight VPX layouts.
Recommandé
Industrial Control and Automation Platforms
Programmable logic controllers, robotic CNC controllers and substation automation equipment favor mature PowerPC silicon because the GCC/Linux and Wind River toolchains are still actively maintained. The KMC7448THX1400ND's 32-bit PowerPC G4 core, integrated MMU and on-chip L2 cache deliver deterministic real-time response for EtherCAT/MotionBus loops. Routed on a custom ATX/ETX baseboard with 360-FCCBGA land pattern, it delivers 1.4 GHz headroom for SCADA HMI rendering while sharing firmware with the lower-speed KMC7448HX1267ND when designs need thermal margin.
Recommandé
Networking and Telecommunications Infrastructure
Carrier-grade routers, ATCA blades and 3G/4G base-station controllers historically used PowerPC G4 processors for packet inspection and protocol termination. The KMC7448THX1400ND delivers 1.4 GHz processing across 32-bit PowerPC ISA with AltiVec acceleration that boosts IPsec/AES packet throughput. Mounted on an ATCA front board alongside a switch ASIC, it allows line-rate forwarding at multi-gigabit rates while keeping the firmware base on a familiar PowerPC ABI. The industrial temperature rating also tolerates outdoor PoE cabinet environments.
Recommandé
Military-Grade Single-Board Computers
Rugged VPX and VME single-board computers (SBCs) require long-life MPUs with extended-temperature screening, which is exactly where the KMC7448THX1400ND was positioned. Its 360-FCCBGA package is mounted on a VPX backplane with controlled-impedance 100-ohm differential pairs and matched-length address/data routing per the MPC7448 hardware design guide. This gives system integrators a 1.4 GHz PowerPC core that can host Curtiss-Wright/Concurrent VxWorks or LynxOS-178 MILS environments for command-and-control payloads, with the -40C to +105C window matching MIL-STD-810G thermal envelopes.
Recommandé
Medical Imaging and Diagnostic Systems
MRI/X-ray imaging controllers and portable ultrasound head-ends benefit from the deterministic PowerPC G4 architecture for real-time beamforming and image reconstruction. The KMC7448THX1400ND's 1.4 GHz core plus AltiVec SIMD accelerate FFT and convolution kernels on patient scans, while its industrial temperature range and BGA package suit the sealed enclosures of cart-based systems. Placed on a custom ATX medical board with isolated power and DICOM networking, it gives OEMs a long-term-stable compute engine in a market that prioritizes supply continuity over leading-edge process nodes.
Recommandé
Print and Imaging Pipeline Controllers
High-end production printers and industrial copiers embed PowerPC controllers for page-rendering, color matching and raster image processing. The KMC7448THX1400ND provides the 1.4 GHz throughput and AltiVec SIMD needed to rasterize 1200 dpi pages at full engine speed. Mounted on the main controller PCB alongside DRAM and image-pipeline ASICs, it allows page pipelines to feed laser engines with zero stalling under burst load. Its 360-FCCBGA land pattern is well-supported in long-life industrial printer architectures that lock firmware revisions for years.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour KMC7448THX1400ND — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC7448THX1400ND | KMC7448HX1267ND | KMC7448VU1700LD | MC7448VS1420LC | KMC755CVT400LE |
|---|---|---|---|---|---|---|
| Package | 360-FCCBGA (25x25) | 360-FCCBGA - same | 360-BGA - same | 360-FCCBGA - same | 360-FCCBGA - same | 360-FCBGA - same footprint family |
| Brand | NXP Semiconductors (Freescale) | NXP Semiconductors | NXP Semiconductors (Freescale) | NXP Semiconductors (Freescale) | NXP Semiconductors | NXP Semiconductors (Freescale) |
| Core Clock Speed | 1.4 GHz | 1.4 GHz | 1.267 GHz (-9.5%) | 1.7 GHz (+21%) | 1.42 GHz (+1.4%) | 400 MHz (-71%) |
| Core Voltage | 1.15 V | 1.15 V | 1.15 V | 1.3 V | 1.15 V | 1.8 V |
| Architecture | PowerPC G4 (MPC7448) | PowerPC G4 (MPC7448) | PowerPC G4 (MPC7448) | PowerPC G4 (MPC7448) | PowerPC G4 (MPC7448) | PowerPC G3 (MPC755) |
| Lifecycle Status | End-of-Life | End-of-Life | End-of-Life (per distributor listing) | End-of-Life | End-of-Life | End-of-Life |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) | Surface Mount (BGA) | Surface Mount (BGA) | Surface Mount (BGA) | Surface Mount (BGA) |
Principaux différenciateurs
- Balanced 1.4 GHz speed/power curve (vs KMC7448VU1700LD (1.7 GHz))
- Industrial-temperature screening vs commercial grade (vs KMC7448HX1267ND (1.267 GHz))
- Latest PowerPC G4 MPC7448 family (vs KMC755CVT400LE (MPC755 G3))
Notes de conception
Estimated: at 1.4 GHz core clock the MPC7448 die draws roughly 5-7 W typical from the 1.15 V rail. Without airflow or a heat-spreader attach, the 360-FCCBGA theta_J-A can quickly reach safe limits in the -40C to +105C industrial window, so pairing the BGA with a copper-invar lid and TIM is essential for avionics chassis. Validate with a Tcase-to-ambient of 45-50C as the derating target.
BGA escape routing must use a stack-up with continuous reference planes on layers 2 and (N-1); route matched-length 50 ohm traces for the 32-bit data bus, with skew control on the source-synchronous clock. Place at least 4 low-ESL 0402/0201 ceramic bypass caps within 100 mils of each VDD/VSS ball pair, with one 10 uF bulk cap near the BGA perimeter for mid-frequency decoupling.
Verify JTAG TAP ordering against the MPC7448 BSDL file before board bring-up - the JTAG 1149.1 chain must include (and only include) the MPU before system ASICs. Cold-joint risk: 360-FCCBGA requires pre-bake at 125C for >=24 hours per JEDEC J-STD-033, and assembly lines must support X-ray inspection to confirm BGA ball coplanarity before reflow.
Estimated: the PowerPC G4 address/data bus drives edges as fast as 1 ns/V into a parallel termination scheme; with the 32-bit bus operating at 133-200 MHz, apply series terminators on the MPU-to-DDR-bridge nets to suppress under/overshoot. Maintain 100 ohm differential impedance on the GTL+ reference clock traces and length-match clock to within +/- 25 ps across all loads.
Informations de conformité
RoHS compliance asserted on distributor listings (DigiKey, Mouser); full material declaration download from NXP product page was not enumerated in the provided web data, so REACH, halogen-free and conflict-mineral entries are 'unknown' per Data Authenticity Rule 14. AEC-Q100 is not applicable to MPUs not specifically qualified for automotive electronics.
