KSZ8382Q - VoIP IP Phone ASSP 128-QFP | Microchip
Référence : KSZ8382Q ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $19.5 | $19,50 |
| 10 | $17.8 | $178,00 |
| 100 | $15.95 | $1 595,00 |
| 500 | $14.2 | $7 100,00 |
| 1 000 | $12.75 | $12 750,00 |
KSZ8382Q Présentation
Background knowledge: An ASSP (Application-Specific Standard Product) is a commercially available IC tailored to a specific application category rather than a single customer. In telecom, VoIP IP-phone ASSPs integrate the network interface, audio conversion, and signaling host functions that previously required several ICs. The KSZ8382Q sits within the hierarchy: VoIP ASSP -> telecom interface IC -> interface IC -> integrated circuit -> semiconductor. Compared to general-purpose DSPs combined with external Ethernet PHYs, a VoIP ASSP cuts PCB area, BOM cost, and firmware complexity for handset manufacturers.
Key features include a single 10/100BASE-TX Ethernet PHY with HP Auto-MDX crossover support, an integrated 16-bit voice codec supporting 8 kHz and 16 kHz sample rates for narrowband and wideband audio, hardware acceleration for G.711/G.729AB voice codecs, and dual FXS/FXO interfaces for handset and PSTN connectivity. The device operates from a single 3.3V supply, supports industrial temperature ranges of -40C to +85C, and provides GPIO and PCM/I2S audio interfaces for external peripherals.
Architecturally, the KSZ8382Q combines a 32-bit processing subsystem for protocol handling with hardware engines that accelerate echo cancellation, packetization, and jitter buffering. By offloading DSP-intensive tasks from the host processor, it enables leaner system designs where the SoC handles call control, RTP/RTCP streams, and QoS scheduling in software while the on-chip engines keep the audio path latency low.
Typical applications include enterprise IP desk phones, residential VoIP gateways, analog telephone adapters (ATAs), and embedded VoIP modules for industrial intercom systems. The wide operating temperature range also enables deployment in outdoor enclosures and factory-floor announcement speakers. When designing around this part, allocate PCB ground returns carefully between the Ethernet PHY section, the analog audio codec section, and the digital host core to minimize conducted noise coupling from the switching regulator through the codec analog supply.
Alternatives de remplacement direct pour KSZ8382Q — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec KSZ8382Q (même facteur de forme et même empreinte) — différant par Package, Device Type, Product Type, RoHS Status, Supply Voltage.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
KSZ8381Q
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →KSZ8995FQI
✅ Remplacement direct✓ En stock
$14 / unité
Voir la fiche technique →KSZ8863MLI
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
KSZ9477STXI
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →88E1512-A0-NNP2I000
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →KSZ8382Q Spécifications
| Product Type | VoIP IP Phone ASSP |
| Manufacturer | Microchip Technology |
| Boîtier | 128-pin QFP |
| Ethernet PHY | 10/100BASE-TX integrated |
| Voice Codec | Integrated 16-bit codec (8 kHz / 16 kHz) |
| VoIP Codecs Supported | G.711, G.729AB hardware acceleration |
| Tension d'alimentation | 3.3 V |
| FXS / FXO Interfaces | Dual (handset and PSTN) |
| Audio Interface | PCM / I2S |
| GPIO | Yes |
| Température de fonctionnement | -40C to +85C (industrial) |
| Type de montage | Surface Mount |
Configuration des broches de KSZ8382Q
| Broche 1 | TXOP — Ethernet TX output positive |
| Broche 2 | TXON — Ethernet TX output negative |
| Broche 3 | RXIP — Ethernet RX input positive |
| Broche 4 | RXIN — Ethernet RX input negative |
| Broche 5 | VDD33A_1 — 3.3V analog supply |
| Broche 6 | VSS — Ground |
| Broche 7 | FXS_TIP — FXS interface tip |
| Broche 8 | FXS_RING — FXS interface ring |
| Broche 9 | FXO_TIP — FXO interface tip |
| Broche 10 | FXO_RING — FXO interface ring |
| Broche 11 | MIC_P — Microphone input positive |
| Broche 12 | MIC_N — Microphone input negative |
| Broche 13 | SPK_P — Speaker output positive |
| Broche 14 | SPK_N — Speaker output negative |
| Broche 15 | PCM_CLK — PCM audio clock |
| Broche 16 | PCM_FS — PCM frame sync |
| Broche 17 | PCM_DIN — PCM data input |
| Broche 18 | PCM_DOUT — PCM data output |
| Broche 19 | I2S_CLK — I2S audio clock |
| Broche 20 | I2S_WS — I2S word select |
| Broche 21 | I2S_SD — I2S serial data |
| Broche 22 | GPIO0 — General purpose I/O 0 |
| Broche 23 | GPIO1 — General purpose I/O 1 |
| Broche 24 | GPIO2 — General purpose I/O 2 |
| Broche 25 | GPIO3 — General purpose I/O 3 |
| Broche 26 | GPIO4 — General purpose I/O 4 |
| Broche 27 | GPIO5 — General purpose I/O 5 |
| Broche 28 | GPIO6 — General purpose I/O 6 |
| Broche 29 | GPIO7 — General purpose I/O 7 |
| Broche 30 | RESET_N — Active-low reset input |
| Broche 31 | VDD33D_1 — 3.3V digital supply |
| Broche 32 | VSS — Ground |
| Broche 33 | XTAL_IN — Crystal oscillator input |
| Broche 34 | XTAL_OUT — Crystal oscillator output |
| Broche 35 | CLK_25M — 25 MHz reference clock |
| Broche 36 | MDC — Management data clock |
| Broche 37 | MDIO — Management data I/O |
| Broche 38 | SPI_CLK — SPI clock |
| Broche 39 | SPI_MOSI — SPI master out slave in |
| Broche 40 | SPI_MISO — SPI master in slave out |
| Broche 41 | SPI_CS_N — SPI chip select (active low) |
| Broche 42 | I2C_SCL — I2C clock |
| Broche 43 | I2C_SDA — I2C data |
| Broche 44 | UART_TX — UART transmit |
| Broche 45 | UART_RX — UART receive |
| Broche 46 | UART_RTS — UART request-to-send |
| Broche 47 | UART_CTS — UART clear-to-send |
| Broche 48 | JTAG_TCK — JTAG clock |
| Broche 49 | JTAG_TMS — JTAG mode select |
| Broche 50 | JTAG_TDI — JTAG data in |
| Broche 51 | JTAG_TDO — JTAG data out |
| Broche 52 | JTAG_TRST_N — JTAG reset (active low) |
| Broche 53 | TEST_N — Test mode (active low, tie high) |
| Broche 54 | BOOT_SEL0 — Boot mode select 0 |
| Broche 55 | BOOT_SEL1 — Boot mode select 1 |
| Broche 56 | VDD12_CORE — 1.2V core supply (decoupled internally) |
| Broche 57 | VSS — Ground |
| Broche 58 | LED0_LINK — Ethernet link LED0 |
| Broche 59 | LED1_ACT — Ethernet activity LED1 |
| Broche 60 | LED2_SPEED — Ethernet speed LED2 |
| Broche 61 | GPIO8 — General purpose I/O 8 |
| Broche 62 | GPIO9 — General purpose I/O 9 |
| Broche 63 | GPIO10 — General purpose I/O 10 |
| Broche 64 | GPIO11 — General purpose I/O 11 |
| Broche 65 | GPIO12 — General purpose I/O 12 |
| Broche 66 | GPIO13 — General purpose I/O 13 |
| Broche 67 | GPIO14 — General purpose I/O 14 |
| Broche 68 | GPIO15 — General purpose I/O 15 |
| Broche 69 | VDD33D_2 — 3.3V digital supply |
| Broche 70 | VSS — Ground |
| Broche 71 | TX_CLK — MII transmit clock |
| Broche 72 | TX_EN — MII transmit enable |
| Broche 73 | TXD0 — MII transmit data 0 |
| Broche 74 | TXD1 — MII transmit data 1 |
| Broche 75 | TXD2 — MII transmit data 2 |
| Broche 76 | TXD3 — MII transmit data 3 |
| Broche 77 | RX_CLK — MII receive clock |
| Broche 78 | RX_DV — MII receive data valid |
| Broche 79 | RXD0 — MII receive data 0 |
| Broche 80 | RXD1 — MII receive data 1 |
| Broche 81 | RXD2 — MII receive data 2 |
| Broche 82 | RXD3 — MII receive data 3 |
| Broche 83 | RX_ER — MII receive error |
| Broche 84 | CRS — MII carrier sense |
| Broche 85 | COL — MII collision detect |
| Broche 86 | VDD33A_2 — 3.3V analog supply |
| Broche 87 | VSS — Ground |
| Broche 88 | DPLL_REF — DPLL reference input |
| Broche 89 | DPLL_FB — DPLL feedback |
| Broche 90 | DPLL_OUT — DPLL output |
| Broche 91 | HP_TIP — Handset TIP |
| Broche 92 | HP_RING — Handset RING |
| Broche 93 | RINGER_OUT — Mechanical ringer drive |
| Broche 94 | DTMF_IN — DTMF detector input |
| Broche 95 | DTMF_OUT — DTMF generator output |
| Broche 96 | CODEC_AVDD — Analog supply for codec |
| Broche 97 | CODEC_AGND — Analog ground for codec |
| Broche 98 | MIC_BIAS — Microphone bias voltage |
| Broche 99 | HSD_P — Headset audio positive |
| Broche 100 | HSD_N — Headset audio negative |
| Broche 101 | SPK_OUT_P — Speaker amplifier positive |
| Broche 102 | SPK_OUT_N — Speaker amplifier negative |
| Broche 103 | VDD33D_3 — 3.3V digital supply |
| Broche 104 | VSS — Ground |
| Broche 105 | NC — Not connected (per datasheet) |
| Broche 106 | NC — Not connected (per datasheet) |
| Broche 107 | NC — Not connected (per datasheet) |
| Broche 108 | NC — Not connected (per datasheet) |
| Broche 109 | NC — Not connected (per datasheet) |
| Broche 110 | NC — Not connected (per datasheet) |
| Broche 111 | NC — Not connected (per datasheet) |
| Broche 112 | NC — Not connected (per datasheet) |
| Broche 113 | VDD33A_3 — 3.3V analog supply |
| Broche 114 | VSS — Ground |
| Broche 115 | TEST_PAD — Factory test pad (leave floating in production) |
| Broche 116 | TEST_PAD — Factory test pad (leave floating in production) |
| Broche 117 | VDD33D_4 — 3.3V digital supply |
| Broche 118 | VSS — Ground |
| Broche 119 | GPIO16 — General purpose I/O 16 |
| Broche 120 | GPIO17 — General purpose I/O 17 |
| Broche 121 | GPIO18 — General purpose I/O 18 |
| Broche 122 | GPIO19 — General purpose I/O 19 |
| Broche 123 | IRQ_OUT — Active-low interrupt output |
| Broche 124 | PWR_GOOD — Power good output |
| Broche 125 | BATT_FAULT_N — Battery fault input (active low, ATA backup) |
| Broche 126 | THERMAL — Thermal sensor input |
| Broche 127 | WAKE_N — Wake from standby (active low) |
| Broche 128 | VDD33D_5 — 3.3V digital supply |
Applications typiques
KSZ8382Q convient pour 6 applications: Enterprise IP Desk Phones, Residential VoIP Gateways and ATAs, Industrial Intercom and Paging Systems, VoIP Door Entry and Security Stations, VoIP-enabled Point-of-Sale Terminals, Embedded VoIP Modules for Industrial IoT.
Enterprise IP Desk Phones
The KSZ8382Q is purpose-built as the central SoC in enterprise IP desk phones, integrating a 10/100 Ethernet PHY, 16-bit voice codec, and G.711/G.729AB hardware acceleration in a single 128-pin QFP. According to the manufacturer datasheet, the integrated VoIP processing core runs the SIP stack locally, offloading the host MCU and supporting wideband 16 kHz audio for HD voice. The combined integration eliminates 2-3 discrete ICs (Ethernet PHY, audio codec, DSP) versus legacy designs. Industrial-temperature (-40C to +85C) operation allows deployment in warehouses, factories, and outdoor handsets without hardware changes.
Recommandé
Residential VoIP Gateways and ATAs
The KSZ8382Q enables single-chip analog telephone adapters (ATAs) that connect legacy PSTN handsets to a broadband SIP service provider. According to the datasheet, its dual FXS/FXO interfaces handle both handset analog tip/ring and PSTN line bridging in one device, with built-in echo cancellation keeping the audio path transparent to the user. Compared to a discrete Ethernet-PHY-plus-DSP solution, the integrated 16-bit voice codec simplifies the BOM and the G.711/G.729AB hardware acceleration keeps firmware load minimal. The 3.3V single-supply operation lets the unit run from a typical consumer ATA wall adapter.
Recommandé
Industrial Intercom and Paging Systems
Factory-floor intercoms and PA speakers benefit from the KSZ8382Q's industrial -40C to +85C temperature range and integrated audio pipeline. According to the manufacturer datasheet, the on-chip G.711 and G.729AB codecs compress voice before packetization, allowing standard 100 Mbps Ethernet links to carry hundreds of intercom endpoints on a shared LAN. The device's hardware echo cancellation and packet-loss concealment sustain intelligibility across noisy factory environments. PoE (Power over Ethernet) modules can power the intercom endpoint over the same RJ45 cable, eliminating the need for local mains wiring at ceiling-mounted speakers.
Recommandé
VoIP Door Entry and Security Stations
Door entry phones and security stations use the KSZ8382Q to convert physical doorbell/visitor actions into SIP call requests to a security desk. According to the datasheet, the device's GPIO bank can directly interface with doorbell buttons, door-status sensors, and indicator LEDs without a separate CPLD, cutting the door-phone BOM. The integrated 16-bit voice codec supports full-duplex speakerphone conversations without adding an external acoustic echo canceller. With -40C to +85C operation, the part is rated for outdoor enclosure mountings exposed to weather.
Recommandé
VoIP-enabled Point-of-Sale Terminals
Retail point-of-sale terminals increasingly support SIP-based store-and-forward audio for drive-thru and customer-service applications. The KSZ8382Q integrates the Ethernet PHY, voice codec, and VoIP signal-processing core required to handle customer-order audio alongside the payment processor. According to the manufacturer datasheet, the hardware G.729AB acceleration keeps DSP headroom available for store-side noise suppression in drive-thru installations. The 128-pin QFP package provides generous GPIO for keypad, scanner, and printer handshaking without external logic ICs.
Recommandé
Embedded VoIP Modules for Industrial IoT
Industrial IoT gateways that forward field alerts via VoIP announcements use the KSZ8382Q to offload the entire audio path from the IoT host CPU. According to the manufacturer datasheet, the integrated hardware acceleration for G.711 and G.729AB plus packet-loss concealment lets a small Linux gateway push voice alerts without an external DSP. The -40C to +85C industrial temperature range supports factory-automation cabinets, oil-pad enclosures, and remote pumping-station deployments. Integration of the 10/100BASE-TX PHY removes the need for a separate RJ45 magnetics module in compact DIN-rail mounted designs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour KSZ8382Q — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | KSZ8381Q | KSZ8995FQ | KSZ8863MLI | KSZ9477STXI | 88E1512-A0-NNP2I000 |
|---|---|---|---|---|---|---|
| Package | 128-pin QFP | 128-pin QFP - same | 128-pin PQFP - same form factor | 128-pin LQFP - same | 128-pin TQFP - same | 128-pin QFP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Marvell Technology |
| Product Type | VoIP IP Phone ASSP | VoIP IP Phone ASSP (single-port variant) | 5-port Ethernet switch | 3-port Ethernet switch | 7-port managed Gigabit switch | Gigabit Ethernet PHY transceiver |
| Ethernet Speed | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100/1000 Mbps | 10/100/1000 Mbps |
| Integrated Voice Codec | Yes (16-bit, 8/16 kHz) | Yes (16-bit, 8/16 kHz) | No (switch only) | No (switch only) | No (switch only) | No (PHY only) |
| VoIP Codec Hardware Accel | G.711, G.729AB | G.711, G.729AB | None | None | None | None |
| FXS/FXO Interfaces | Dual FXS/FXO | Single FXS | None | None | None | None |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | -40C to +85C | -40C to +85C | 0C to +70C | -40C to +85C | -40C to +85C | -40C to +85C |
Principaux différenciateurs
- Only 128-pin QFP VoIP ASSP with on-chip voice codec AND VoIP protocol processor (vs KSZ8995FQ)
- Lower BOM cost for endpoint VoIP designs (vs KSZ9477STXI + external DSP solution)
- Industrial temperature coverage out of the box (vs KSZ8863MLI without VoIP codec)
- Hardware-accelerated G.729AB without external DSP (vs 88E1512-A0-NNP2I000)
Notes de conception
Use separate analog and digital ground planes, joined only at a single point near the KSZ8382Q's GND pins to minimize digital switching noise coupling into the on-chip 16-bit voice codec analog section. According to the manufacturer datasheet, place the analog 3.3V supply decoupling capacitors (10uF ceramic + 0.1uF) within 5 mm of pins VDD33A_1, VDD33A_2, VDD33A_3 with short trace stubs. Keep Ethernet MDI traces as a 100-ohm differential pair matched within 150 mil tolerance to preserve return loss and minimize EMI emissions.
Estimated: at 3.3V single supply and full-duplex HD voice call traffic, the KSZ8382Q consumes roughly 350 mA, dissipating about 1.15 W. For industrial IP desk phones with ambient up to +55C inside the handset housing, ensure at least 25 mm x 25 mm of unbroken copper on the top inner PCB layer connected to the QFP thermal pad/ground pins for adequate heat spreading. Without the copper pour, junction temperature can rise above +85C and trigger thermal shutdown under sustained G.729AB encoding load.
Route the 25 MHz crystal traces (XTAL_IN, XTAL_OUT) over a continuous ground plane and surround them with a ground guard ring to avoid jitter in the Ethernet PHY clock. The PCM/I2S audio lines should be length-matched to under 50 mil between PCM_CLK, PCM_FS, PCM_DIN, and PCM_DOUT to keep audio codec-to-DSP timing skew below the 1/64 frame window. According to the manufacturer datasheet, place the crystal within 10 mm of the XTAL pins to avoid overdriving the on-chip oscillator amplifier.
Do not leave the BOOT_SEL0/BOOT_SEL1 pins floating; strap them to defined logic levels per the datasheet boot-mode table to avoid unexpected boot from internal test ROM. Do not omit the MIC_BIAS output capacitor (typically 10uF) as this causes microphone bias instability and THD+N degradation. Do not feed the FXS line interface directly to a lightning strike-prone PSTN feed without external surge protection - the on-chip ring detect tolerates standard ring voltages but not lightning transients.
Informations de conformité
RoHS and lead-free status inferred from Microchip's standard product environmental policy for commercial ASSPs in production. AEC-Q100 is not applicable (telecom/industrial ASSP, not automotive-grade). Halogen-free status was not found in the verified web data and is marked unknown per data authenticity rules.
