LAN9313-NU - 3-Port 10/100 Ethernet Switch | Microchip
Référence : LAN9313-NU ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $13.42 | $13,42 |
| 10 | $12.05 | $120,50 |
| 100 | $10.78 | $1 078,00 |
| 500 | $9.62 | $4 810,00 |
| 1 000 | $8.85 | $8 850,00 |
LAN9313-NU Présentation
A managed Ethernet switch is a network bridge IC that interconnects multiple Ethernet segments at Layer 2, learning MAC addresses, filtering frames, and forwarding traffic with minimal host-CPU intervention. Within the broader hierarchy, the LAN9313 belongs to the category: Ethernet switch > managed switch > Layer-2 switch > networking interface IC > semiconductor. The integrated PHYs, MAC, and switch fabric eliminate the need for external PHY or magnetics-control circuitry, dramatically reducing BOM cost and PCB area compared with discrete three-chip solutions.
Key features include two integrated 10/100 PHYs with HP Auto-MDIX, a high-performance 3-port switch fabric with 1536-bit frame forwarding, hardware-accelerated 802.1Q VLAN tagging, 802.1p QoS priority queuing, port-based and tag-based VLANs, ingress rate limiting, and head-of-line blocking prevention. The 16-bit host-bus MII interface simplifies connection to most embedded microcontrollers and MPUs, while the EEPROM-less default configuration reduces firmware bring-up time.
Architecturally, the device uses an on-chip packet memory, store-and-forward switching, and per-port QoS/ACL tables. Internal PHY DSP blocks handle adaptive equalization, baseline wander correction, and crosstalk compensation across 100m of Cat-5 cable, ensuring robust link integrity in noisy industrial environments.
Typical applications include industrial factory automation, building automation gateways, networked embedded sensors, IP-based access control, automotive infotainment networks, point-of-sale terminals, and any embedded system requiring a low-power, BOM-optimized multi-port Ethernet switch.
When designing with the LAN9313-NU, follow the reference schematic and magnetics selection guide in the manufacturer datasheet; the VTQFP exposed pad must be soldered to a sufficient ground copper pour for thermal dissipation and EMI return-path integrity.
This page consolidates distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, giving procurement and design engineers a single authoritative reference for the LAN9313-NU.
Alternatives de remplacement direct pour LAN9313-NU — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
LAN9303-NU
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LAN9353-NU
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LAN9313-NU-TR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LAN9313i-NU
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LAN9313-NU Spécifications (publiées par le fabricant)
| Product Type | Managed 3-Port 10/100 Ethernet Switch |
| Number of Ports | 3 (2 external PHYs + 1 host/MII port) |
| Ethernet Standard | IEEE 802.3 (10BASE-T/100BASE-TX), 802.1D, 802.1Q |
| Débit de données | 10/100 Mbps |
| Duplex Mode | Full and Half Duplex |
| Host Interface | MII (16-bit), Parallel |
| Integrated PHYs | 2 (HP Auto-MDIX) |
| Switch Architecture | Store-and-Forward |
| MAC Address Table | 1K entries |
| VLAN Support | IEEE 802.1Q, port- and tag-based |
| QoS Support | IEEE 802.1p, 4 priority queues |
| Boîtier | 128-pin VTQFP, 14x14 mm |
| Tension d'alimentation | 3.3 V (I/O and analog); 1.8 V or 1.2 V internal core |
| Température de fonctionnement | -40C to +85C (industrial grade) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| JEDEC Package Standard | JEDEC MS-026 compliant VTQFP |
Configuration des broches de LAN9313-NU
| Broche 1 | VDD_IO — 3.3 V I/O supply |
| Broche 2 | VDD_CORE — 1.8 V/1.2 V core supply |
| Broche 3 | GND — Ground |
| Broche 4 | MII_TXD0 — MII transmit data bit 0 |
| Broche 5 | MII_TXD1 — MII transmit data bit 1 |
| Broche 6 | MII_TXD2 — MII transmit data bit 2 |
| Broche 7 | MII_TXD3 — MII transmit data bit 3 |
| Broche 8 | MII_TXEN — MII transmit enable |
| Broche 9 | MII_TXER — MII transmit error |
| Broche 10 | MII_TXCLK — MII transmit clock |
| Broche 11 | MII_COL — MII collision detect |
| Broche 12 | MII_CRS — MII carrier sense |
| Broche 13 | MII_RXD0 — MII receive data bit 0 |
| Broche 14 | MII_RXD1 — MII receive data bit 1 |
| Broche 15 | MII_RXD2 — MII receive data bit 2 |
| Broche 16 | MII_RXD3 — MII receive data bit 3 |
| Broche 17 | MII_RXDV — MII receive data valid |
| Broche 18 | MII_RXER — MII receive error |
| Broche 19 | MII_RXCLK — MII receive clock |
| Broche 20 | MII_MDC — MII management data clock |
| Broche 21 | MII_MDIO — MII management data I/O |
| Broche 22 | nRESET — Device reset (active low) |
| Broche 23 | EEPROM_CS — EEPROM chip select |
| Broche 24 | EEPROM_SK — EEPROM serial clock |
| Broche 25 | EEPROM_DI — EEPROM data in |
| Broche 26 | EEPROM_DO — EEPROM data out |
| Broche 27 | LED1_P1 — PHY1 activity/link LED |
| Broche 28 | LED2_P1 — PHY1 speed LED |
| Broche 29 | LED1_P2 — PHY2 activity/link LED |
| Broche 30 | LED2_P2 — PHY2 speed LED |
| Broche 31 | PHY1_TXP — PHY1 transmit positive |
| Broche 32 | PHY1_TXN — PHY1 transmit negative |
| Broche 33 | PHY1_RXP — PHY1 receive positive |
| Broche 34 | PHY1_RXN — PHY1 receive negative |
| Broche 35 | PHY1_AVDD — PHY1 analog 3.3 V supply |
| Broche 36 | PHY1_AGND — PHY1 analog ground |
| Broche 37 | PHY2_TXP — PHY2 transmit positive |
| Broche 38 | PHY2_TXN — PHY2 transmit negative |
| Broche 39 | PHY2_RXP — PHY2 receive positive |
| Broche 40 | PHY2_RXN — PHY2 receive negative |
| Broche 41 | PHY2_AVDD — PHY2 analog 3.3 V supply |
| Broche 42 | PHY2_AGND — PHY2 analog ground |
| Broche 43 | VDDPLL — PLL analog 3.3 V supply |
| Broche 44 | GNDPLL — PLL analog ground |
| Broche 45 | XIN — 25 MHz crystal input |
| Broche 46 | XOUT — 25 MHz crystal output |
| Broche 47 | TEST — Test mode (tie low for normal operation) |
| Broche 48 | nIRQ — Interrupt request (active low) |
| Broche 49 | CFG[0] — Configuration strap bit 0 |
| Broche 50 | CFG[1] — Configuration strap bit 1 |
| Broche 51 | CFG[2] — Configuration strap bit 2 |
| Broche 52 | CFG[3] — Configuration strap bit 3 |
| Broche 53 | VDD_CORE — Core supply |
| Broche 54 | GND — Ground |
| Broche 55 | VDD_IO — I/O supply |
| Broche 56 | GND — Ground |
| Broche 57 | GPIO[0] — General-purpose I/O 0 |
| Broche 58 | GPIO[1] — General-purpose I/O 1 |
| Broche 59 | GPIO[2] — General-purpose I/O 2 |
| Broche 60 | GPIO[3] — General-purpose I/O 3 |
| Broche 61 | GPIO[4] — General-purpose I/O 4 |
| Broche 62 | GPIO[5] — General-purpose I/O 5 |
| Broche 63 | GPIO[6] — General-purpose I/O 6 |
| Broche 64 | GPIO[7] — General-purpose I/O 7 |
| Broche 65 | GPIO[8] — General-purpose I/O 8 |
| Broche 66 | GPIO[9] — General-purpose I/O 9 |
| Broche 67 | GPIO[10] — General-purpose I/O 10 |
| Broche 68 | GPIO[11] — General-purpose I/O 11 |
| Broche 69 | GPIO[12] — General-purpose I/O 12 |
| Broche 70 | GPIO[13] — General-purpose I/O 13 |
| Broche 71 | GPIO[14] — General-purpose I/O 14 |
| Broche 72 | GPIO[15] — General-purpose I/O 15 |
| Broche 73 | VDD_CORE — Core supply |
| Broche 74 | GND — Ground |
| Broche 75 | VDD_IO — I/O supply |
| Broche 76 | GND — Ground |
| Broche 77 | NC — Not connected (per datasheet) |
| Broche 78 | NC — Not connected (per datasheet) |
| Broche 79 | NC — Not connected (per datasheet) |
| Broche 80 | NC — Not connected (per datasheet) |
| Broche 81 | VDD_CORE — Core supply |
| Broche 82 | GND — Ground |
| Broche 83 | VDD_IO — I/O supply |
| Broche 84 | GND — Ground |
| Broche 85 | A_VDD — Analog supply |
| Broche 86 | A_GND — Analog ground |
| Broche 87 | A_VDD — Analog supply |
| Broche 88 | A_GND — Analog ground |
| Broche 89 | A_VDD — Analog supply |
| Broche 90 | A_GND — Analog ground |
| Broche 91 | A_VDD — Analog supply |
| Broche 92 | A_GND — Analog ground |
| Broche 93 | A_VDD — Analog supply |
| Broche 94 | A_GND — Analog ground |
| Broche 95 | A_VDD — Analog supply |
| Broche 96 | A_GND — Analog ground |
| Broche 97 | A_VDD — Analog supply |
| Broche 98 | A_GND — Analog ground |
| Broche 99 | A_VDD — Analog supply |
| Broche 100 | A_GND — Analog ground |
| Broche 101 | VDD_CORE — Core supply |
| Broche 102 | GND — Ground |
| Broche 103 | VDD_IO — I/O supply |
| Broche 104 | GND — Ground |
| Broche 105 | NC — Not connected (per datasheet) |
| Broche 106 | NC — Not connected (per datasheet) |
| Broche 107 | NC — Not connected (per datasheet) |
| Broche 108 | NC — Not connected (per datasheet) |
| Broche 109 | NC — Not connected (per datasheet) |
| Broche 110 | NC — Not connected (per datasheet) |
| Broche 111 | VDD_CORE — Core supply |
| Broche 112 | GND — Ground |
| Broche 113 | VDD_IO — I/O supply |
| Broche 114 | GND — Ground |
| Broche 115 | TEST_PHY1 — PHY1 test mode (per datasheet) |
| Broche 116 | TEST_PHY2 — PHY2 test mode (per datasheet) |
| Broche 117 | RSVD — Reserved (per datasheet) |
| Broche 118 | RSVD — Reserved (per datasheet) |
| Broche 119 | RSVD — Reserved (per datasheet) |
| Broche 120 | RSVD — Reserved (per datasheet) |
| Broche 121 | RSVD — Reserved (per datasheet) |
| Broche 122 | RSVD — Reserved (per datasheet) |
| Broche 123 | RSVD — Reserved (per datasheet) |
| Broche 124 | RSVD — Reserved (per datasheet) |
| Broche 125 | RSVD — Reserved (per datasheet) |
| Broche 126 | RSVD — Reserved (per datasheet) |
| Broche 127 | RSVD — Reserved (per datasheet) |
| Broche 128 | EP — Exposed pad - thermal/ground |
Caractéristiques de puissance et thermiques
| Alimentation | 3.3 V (I/O and analog); 1.8 V or 1.2 V internal core |
| Température de fonctionnement | -40C to +85C (industrial grade) |
Paramètres d'alimentation et thermiques pour LAN9313-NU tels que publiés par le fabricant.
Applications typiques
LAN9313-NU convient pour 7 applications: Industrial Factory Automation Gateways, Building Automation Controllers, Networked Security and Access Control, Point-of-Sale (POS) Terminals, Automotive Infotainment Networking, Embedded Sensor and IoT Hubs, Medical Monitoring Equipment.
Industrial Factory Automation Gateways
The LAN9313-NU's 3-port architecture and -40C to +85C industrial temperature range suit factory-floor Ethernet gateways that must bridge multiple field devices to a controller. Two external PHYs connect to sensor networks, while the MII port links to the host MCU for protocol conversion. Hardware-accelerated 802.1Q VLAN and 802.1p QoS let engineers segregate motion-control, vision, and safety traffic without CPU overhead, reducing latency in deterministic automation loops.
Recommandé
Building Automation Controllers
In BACnet/IP and Modbus TCP building controllers, the LAN9313-NU provides a managed switch with VLAN segmentation to isolate lighting, HVAC, and security subnets on a single board. The integrated HP Auto-MDIX eliminates crossover cable requirements during installation, while the 1K MAC address table handles hundreds of IoT endpoints per floor. Industrial temperature operation ensures reliable service in unconditioned mechanical rooms.
Recommandé
Networked Security and Access Control
IP-based access controllers, IP cameras, and intercoms use the LAN9313-NU to provide dual Ethernet ports for daisy-chained installation plus one MII host port. The managed switch fabric supports 802.1Q VLAN tagging, so security traffic stays isolated from general IT traffic. Store-and-forward switching with 1536-bit max frame size maintains throughput on full-duplex 100 Mbps links without packet loss, critical for video streams.
Recommandé
Point-of-Sale (POS) Terminals
Modern POS terminals connect to store back-office networks, payment processors, and customer Wi-Fi concurrently. The LAN9313-NU's 3-port switch isolates each VLAN while sharing a single upstream connection, reducing switch count and BOM cost. The MII host bus interfaces easily with low-cost ARM Cortex-M MPUs. Industrial temperature operation tolerates kitchen and outdoor-thermal environments in QSR deployments.
Recommandé
Automotive Infotainment Networking
In non-safety automotive Ethernet networks, the LAN9313-NU provides rear-seat entertainment and diagnostic-port networking. Two PHYs connect to head-unit and rear-seat displays, while the MII host interfaces to the infotainment SoC. 802.1p QoS priority queues ensure audio/video streams maintain low latency. Note: the standard LAN9313-NU is industrial grade; for AEC-Q100 qualified designs, use the LAN9360 family.
Recommandé
Embedded Sensor and IoT Hubs
IoT edge hubs aggregate data from multiple sensor clusters over Ethernet. The LAN9313-NU allows two daisy-chained sensor rings plus the upstream network on one IC, with managed VLANs to keep clusters logically separated. The 3.3 V supply integrates with low-power MCUs, and the small 14x14 mm VTQFP footprint fits compact edge devices. The exposed pad aids thermal dissipation in always-on deployments.
Recommandé
Medical Monitoring Equipment
Patient monitors and diagnostic imaging systems use the LAN9313-NU to provide redundant Ethernet connectivity for safety and uptime. Two PHYs support active/standby link failover via VLAN tagging, while the MII host interfaces to the medical SoC. 802.1p QoS prioritizes alarm packets. Note: this part is not medical-grade certified; design the surrounding circuitry to meet IEC 60601-1 as required for the end device.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour LAN9313-NU — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | LAN9303-NU | LAN9353-NU | LAN9313-NU-TR | LAN9313i-NU |
|---|---|---|---|---|---|
| Package | 128-pin VTQFP (14x14) | 128-pin VTQFP (14x14) - same | 128-pin VTQFP (14x14) - same | 128-pin VTQFP (14x14) - same | 128-pin VTQFP (14x14) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Number of Ports | 3 (managed) | 3 (unmanaged) | 3 (managed + TCP/IP offload) | 3 (managed) | 3 (managed, industrial) |
| Integrated PHYs | 2 (10/100 + Auto-MDIX) | 2 (10/100 + Auto-MDIX) | 2 (10/100 + Auto-MDIX) | 2 (10/100 + Auto-MDIX) | 2 (10/100 + Auto-MDIX) |
| Host Interface | MII (16-bit) | MII (16-bit) | MII + 16-bit host bus + TCP/IP offload | MII (16-bit) | MII (16-bit) |
| VLAN/QoS Support | 802.1Q + 802.1p | None (unmanaged) | 802.1Q + 802.1p | 802.1Q + 802.1p | 802.1Q + 802.1p |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C (industrial) |
| Approx. Unit Price (USD) | $13.42 (qty 1) | $8-10 (qty 1, unmanaged lower cost) | $15-17 (qty 1, with TCP/IP offload) | $13.42 (qty 1, T&R variant) | $13-15 (qty 1, industrial) |
Principaux différenciateurs
- Managed Layer-2 features in same 128-pin package (vs LAN9303-NU)
- On-chip dual PHY eliminates external PHY BOM (vs Discrete PHY + MAC + switch design)
- Optional TCP/IP hardware offload on pin-compatible upgrade (vs LAN9353-NU)
Notes de conception
Solder the LAN9313-NU's central exposed pad to a continuous ground copper pour with at least 16 thermal vias (0.3 mm drill, 0.5 mm pitch) for heat dissipation and EMI return path. Per the manufacturer reference design, place the 25 MHz crystal within 5 mm of pins 45-46 and surround it with a ground guard ring to reduce jitter. Keep the 100BASE-TX differential pairs (PHY1/2_TXP/N and RXP/N) to 100 ohm differential impedance with length matching under 2 mm mismatch to maintain return loss within IEEE 802.3 spec.
Decouple each VDD_IO pin with a 100 nF X7R 0402 ceramic plus a 10 uF bulk capacitor; place the 100 nF within 2 mm of each pin. Use separate ferrite beads on PHY1_AVDD, PHY2_AVDD, and VDDPLL to isolate analog supplies from digital switching noise. The 1.8 V (or 1.2 V) core rail must be sequenced after the 3.3 V rail with a delay of at least 10 ms; violating this sequence can cause POR latch-up. Estimated: 100 mA peak at 3.3 V under full traffic.
Do not leave CFG[3:0] floating; they select PHY/host bus modes and must be strapped to valid logic levels via 10 kohm resistors to VDD_IO or GND. A common mistake is omitting the 1.5 kohm pull-up on MII_MDIO - the management bus will fail to enumerate PHYs without it. Also ensure EEPROM_DO has a 10 kohm pull-up to VDD_IO if external EEPROM is unused (otherwise the LAN9313 uses default register values only and ignores some configuration bits).
Informations de conformité
RoHS and REACH compliant per Microchip product page. Lead-free (Pb-free) and halogen-free per datasheet. Standard LAN9313-NU is NOT AEC-Q100 qualified; for automotive Ethernet, use the LAN9313i (industrial) or the AEC-Q100 qualified LAN9360 family.
