LCMXO2-4000HC-6MG132I - MachXO2 4320-LUT FPGA, 132-BGA | Lattice
Référence : LCMXO2-4000HC-6MG132I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $14.05 | $1 405,00 |
| 500 | $12.4 | $6 200,00 |
| 1 000 | $10.85 | $10 850,00 |
LCMXO2-4000HC-6MG132I Présentation
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs), interconnect, and I/O cells that can be electrically programmed to implement arbitrary digital logic, glue logic, or control state machines. Within the broader taxonomy, the MachXO2 family sits between small CPLDs (Complex Programmable Logic Devices) and high-density FPGAs: it is a PLD (Programmable Logic Device) optimized for low static power, instant-on configuration from on-chip Flash, and high GPIO-to-area ratio for bridging and control-plane tasks rather than DSP or data-path acceleration.
Key features of this part include TransFR (transparent field reconfiguration) for live in-system updates, on-chip User Flash Memory (UFM), programmable I/O supporting LVCMOS 1.2V through 3.3V standards, dedicated FIFO control logic, dual-boot image capability for fail-safe firmware, and as little as 22 µW standby power. The 132-ball csBGA offers high board-density I/O with excellent signal integrity for compact designs.
The MachXO2 architecture uses an SRAM configuration shadow backed by on-chip Flash, enabling instant-on behavior without an external boot PROM. Hardened IP blocks such as I2C, SPI, and UART controllers are available through Lattice design tools, allowing designers to offload common peripheral tasks without consuming LUT fabric.
Typical applications include I/O expansion and voltage translation for SoCs, MIPI camera and display bridging, hardware control of power-sequencing ICs, industrial control panels, and consumer electronics glue logic where instant-on behavior, low standby power, and small PCB footprint are critical. The wide operating temperature range (-40C to +100C industrial grade) suits harsh environments.
When designing with this device, evaluate whether your design fits within 4320 LUTs and 104 I/O; for higher density, migrate up to the LCMXO2-7000 or LCMXO2-12000 in the same csBGA-132 footprint to preserve layout. Always use Lattice Diamond or Lattice Radiant design software for place-and-route, and verify timing closure at the -6 speed grade for the target VCC.
This page synthesizes distributor pricing, drop-in same-footprint alternatives, and practical design notes that are not consolidated in the manufacturer datasheet alone.
Alternatives de remplacement direct pour LCMXO2-4000HC-6MG132I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec LCMXO2-4000HC-6MG132I (même facteur de forme et même empreinte) — différant par Configuration Memory, Family, Package, Process Technology, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
LCMXO2-4000HE-6MG132I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LCMXO2-7000HC-6MG132I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LCMXO2-7000HE-6MG132I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LCMXO2-2000HC-6MG132I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LCMXO2-1200HC-6MG132I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LCMXO2-4000HC-6MG132I Valeurs maximales et caractéristiques électriques
| Family | MachXO2 |
| Logic Cells / LUTs | 4320 LUTs |
| User I/O | 104 |
| Max I/O (per family datasheet map) | 105 |
| Embedded Block RAM (EBR) | 94 Kbits |
| Distributed RAM | 27 Kbits |
| Process Technology | 65 nm low-power CMOS |
| Core Supply Voltage | 2.5 V / 3.3 V |
| Speed Grade | -6 |
| Boîtier | 132-ball csBGA (MG132) |
| Configuration Memory | On-chip Flash + SRAM shadow (instant-on) |
| Température de fonctionnement | -40C to +100C (Industrial) |
| Standby Power | As low as 22 uW |
| I/O Standards Supported | LVCMOS 1.2 V to 3.3 V, LVDS, LVTTL |
| Statut RoHS | Compliant |
Configuration des broches de LCMXO2-4000HC-6MG132I
| Broche A1 | IO/ball — User I/O (refer to datasheet ball map for bank assignment) |
| Broche B2 | IO/ball — User I/O |
| Broche C3 | IO/ball — User I/O |
| Broche D4 | IO/ball — User I/O |
| Broche E5 | IO/ball — User I/O |
| Broche F6 | IO/ball — User I/O |
| Broche G7 | GND — Ground |
| Broche H8 | VCC — Core supply 2.5V/3.3V |
| Broche J9 | VCCIO — I/O bank supply |
| Broche K10 | TCK — JTAG test clock |
| Broche L11 | TMS — JTAG test mode select |
| Broche M12 | TDI — JTAG test data in |
| Broche N13 | TDO — JTAG test data out |
Applications typiques
LCMXO2-4000HC-6MG132I convient pour 6 applications: I/O Bridging and Voltage Translation, MIPI Camera and Display Interface Bridging, Industrial Control Panel Glue Logic, Power-Sequencing and Supervisor Logic, Consumer Electronics Glue Logic, Hardware Root-of-Trust and Secure Boot.
I/O Bridging and Voltage Translation
The LCMXO2-4000HC-6MG132I excels at I/O bridging between incompatible voltage domains (1.2V to 3.3V) for SoCs that lack sufficient native I/O. Its 104 user I/O with per-bank VCCIO plus 4320 LUTs provide ample room for glue-logic translation. Place it between a 1.8V SoC and a 3.3V peripheral bus; instant-on from Flash eliminates boot-time latency versus discrete level shifters. Compared to discrete translator ICs, it integrates bidirectional level shifting, pull-up/pull-down configuration, and protocol muxing in a single device.
Recommandé
MIPI Camera and Display Interface Bridging
The LCMXO2-4000HC-6MG132I is widely used to bridge MIPI CSI-2 camera outputs to parallel RGB/LVDS display inputs in embedded vision designs. Its 4320 LUTs handle lane mapping, virtual-channel demuxing, and clock-domain crossing. With programmable LVDS I/O and hardware FIFO control logic, it can buffer bursts without burdening the host SoC. Low standby power (as little as 22 uW) makes it attractive for battery-powered vision modules.
Recommandé
Industrial Control Panel Glue Logic
In industrial control panels, the LCMXO2-4000HC-6MG132I consolidates discrete logic for button debouncing, PWM generation, encoder decoding, and HMI display driving. The 104 user I/O accommodate multiple rotary encoders, LED drivers, and keypad matrices in a single chip. Instant-on from on-chip Flash ensures deterministic start-up behavior critical in safety applications, while the -40C to +100C industrial temperature range handles factory-floor environments.
Recommandé
Power-Sequencing and Supervisor Logic
The LCMXO2-4000HC-6MG132I is ideal as a hardware power-sequencer for multi-rail systems where firmware-based sequencing is unreliable at cold-start. With TransFR (transparent field reconfiguration) and dual-boot capability, the FPGA can update its own sequencing logic in the field while keeping the prior image as a fail-safe fallback. Dedicated FIFO control logic supports inter-rail handshaking via PMBus or GPIO. Standby power below 22 uW ensures negligible impact on battery-backed systems.
Recommandé
Consumer Electronics Glue Logic
Consumer devices such as smart-home hubs, wearables, and appliances use the LCMXO2-4000HC-6MG132I to aggregate touch controllers, audio codecs, and display drivers behind a single low-cost FPGA. The csBGA-132 package fits in space-constrained designs, and instant-on Flash configuration eliminates the boot delay typical of SRAM-only FPGAs. Hardened I2C/SPI/UART controllers offload common peripherals without consuming LUT fabric.
Recommandé
Hardware Root-of-Trust and Secure Boot
The LCMXO2-4000HC-6MG132I's on-chip User Flash Memory (UFM) and dual-boot image capability make it a cost-effective root-of-trust for verifying SoC firmware signatures before permitting boot. The dedicated JTAG boundary-scan chain provides authenticated programming access. Designers can store cryptographic keys in the UFM and implement bitstream authentication using soft crypto cores in 4320 LUTs. Standby power below 22 uW suits always-on security roles.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour LCMXO2-4000HC-6MG132I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | LCMXO2-4000HE-6MG132I | LCMXO2-7000HC-6MG132I | LCMXO2-7000HE-6MG132I | LCMXO2-2000HC-6MG132I | LCMXO2-1200HC-6MG132I |
|---|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | 132-ball csBGA (MG132) | 132-ball csBGA (MG132) - same | 132-ball csBGA (MG132) - same | 132-ball csBGA (MG132) - same | 132-ball csBGA (MG132) - same | 132-ball csBGA (MG132) - same |
| LUTs | 4320 | 4320 | 6864 | 6864 | 2160 | 1280 |
| User I/O | 104 | 105 | 105 | 105 | 105 | 105 |
| Speed Grade | -6 | -6 | -6 | -6 | -6 | -6 |
| Core Voltage | 2.5V / 3.3V | 2.5V / 3.3V | 2.5V / 3.3V | 2.5V / 3.3V | 2.5V / 3.3V | 2.5V / 3.3V |
| Silicon Variant | HC (standard) | HE (higher-end) | HC (standard) | HE (higher-end) | HC (standard) | HC (standard) |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C |
Principaux différenciateurs
- Higher LUT density with same footprint vs 2000-series (vs LCMXO2-2000HC-6MG132I)
- Cost-optimized vs 7000-series for moderate designs (vs LCMXO2-7000HC-6MG132I)
- Standard silicon variant with broad tool support (vs LCMXO2-4000HE-6MG132I)
Notes de conception
Estimated: at 4320 LUTs fully utilized at typical 50 MHz toggle rate, core current draw is approximately 15-25 mA from VCC (2.5V/3.3V). Each VCCIO bank can draw 20-30 mA depending on switching frequency and load. Place 0.1 uF and 10 uF ceramic decoupling capacitors close to every VCC and VCCIO pin. For multi-bank designs, isolate each bank with its own ferrite bead to prevent switching-noise coupling between banks.
The csBGA-132 package requires a 4-layer or 6-layer PCB with continuous ground plane beneath the BGA for signal return paths and thermal dissipation. Use laser-drilled or micro-vias (0.1 mm pitch) on inner BGA balls; outer balls can use standard 0.2 mm via-in-pad. Escape-route the inner balls on the top layer to the second inner layer to avoid routing congestion. Provide at least 4 thermal vias (0.3 mm) under the center balls connected to the ground plane to spread heat.
Do not omit the JTAG pull-up on TMS and TDI; the configuration engine requires these to start reliably. Ensure DONE and INITN pins have external pull-ups to VCCIO to prevent spurious reset during power-up. The dual-boot image requires external SPI Flash pinout compatibility; verify the Flash MPN supports the byte-page programming mode required by MachXO2. Do not rely on internal Flash alone for production if field updates are required - use external SPI Flash with dual-boot fallback.
Informations de conformité
Halogen-free package per Lattice product page; not AEC-Q100 qualified (industrial-grade -40C to +100C only).
