LCMXO3LF-6900E-5MG256I - 6864 LUT MachXO3LF FPGA | Lattice
Référence : LCMXO3LF-6900E-5MG256I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $24.5 | $24,50 |
| 10 | $22.05 | $220,50 |
| 100 | $19.6 | $1 960,00 |
| 500 | $17.64 | $8 820,00 |
| 1 000 | $15.68 | $15 680,00 |
LCMXO3LF-6900E-5MG256I Présentation
FPGAs (Field Programmable Gate Arrays) are user-programmable semiconductor devices built from a sea of configurable logic blocks (LUTs), programmable interconnect, and I/O cells, allowing engineers to implement any digital logic function post-fabrication. The MachXO3LF is Lattice's ultra-low-power, instant-on branch of the MachXO3 family, designed as a control PLD for glue logic, bus bridging, system configuration, and I/O expansion in cost- and power-sensitive applications. Compared with SRAM FPGAs, MachXO3LF uses on-chip Flash configuration memory so it boots in microseconds without an external boot PROM.
Key features include 6,864 LUTs (MachXO3LF series), embedded 245,760-bit user Flash memory, distributed RAM, embedded block RAM, two PLL pairs, dual configuration I2C/SPI/SJTAG ports, and on-chip 1.2 V core regulator. The 256-ball csfBGA (MG256) package exposes 206 user I/O across multiple I/O banks supporting LVCMOS 1.2 V to 3.3 V and LVDS signaling standards, with per-pin slew-rate, drive strength, and pull configuration. The LCMXO3LF-6900E grade is the mid-density device between the 4,300 LUT and 9,400 LUT siblings.
The architecture uses 65 nm Flash+CMOS process technology with embedded Flash configuration cells that eliminate the need for an external boot memory. The on-chip voltage regulator derives all internal rails from a single 1.2 V core or a 2.5 V/3.3 V single-rail supply, and the hardened I/O bank structure supports hot-socketing and 5 V tolerance on selected banks. The MachXO3LF supports Lattice Diamond and Lattice Propel design environments, plus IP libraries for I3C, I2C, SPI, UART, GPIO expansion, and platform management functions.
Typical applications include I/O expansion and bridging in industrial controllers, machine vision cameras, and motor drives; control logic in LED/LCD displays and human-machine interface panels; secure boot monitors and platform management in servers and routers; and as a glue-logic replacement for CPLDs and discrete logic. The instant-on Flash configuration is particularly valuable in safety-critical systems where the FPGA must be active within milliseconds of power-up.
When designing with this part, plan I/O bank assignments early because the 206 user I/O are split across four banks with independent voltage references, and unused banks can be powered down to reduce quiescent current. Use Lattice Diamond 3.x or later with the MachXO3LF device library for synthesis, place-and-route, and bitstream generation.
This page synthesizes verified distributor pricing from DigiKey and Mouser (as of 2026-10-08), MachXO3LF family drop-in alternatives, and practical design notes not collected in a single location in the Lattice MachXO3LF datasheet.
Alternatives de remplacement direct pour LCMXO3LF-6900E-5MG256I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec LCMXO3LF-6900E-5MG256I (même facteur de forme et même empreinte) — différant par Package, Family, Speed Grade, Operating Temperature, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
LCMXO3LF-6900C-5BG256C
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →LCMXO3LF-9400E-5MG256I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LCMXO3LF-4300E-5MG256I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LCMXO3LF-4300E-5MG121I
✅ Remplacement direct✓ En stock
$10.4 / unité
Voir la fiche technique →LCMXO2-4000HC-6MG132I
✅ Remplacement direct✓ En stock
$10.85 / unité
Voir la fiche technique →LCMXO2-640HC-6TG100I
✅ Remplacement direct✓ En stock
$9.95 / unité
Voir la fiche technique →LCMXO3LF-6900E-5MG256I Valeurs maximales et caractéristiques électriques
| Family | MachXO3LF |
| Series / Grade | 6900E |
| Logic Elements / LUTs | 6,864 LUTs |
| User I/O Count | 206 |
| Embedded Memory | 245,760 bits |
| Configuration Memory | On-chip Flash (non-volatile) |
| Core Voltage | 1.2 V |
| Single-Rail Supply Option | 2.5 V / 3.3 V |
| Process Technology | 65 nm Flash + CMOS |
| Boîtier | 256-ball csfBGA (MG256), 0.5 mm pitch |
| Température de fonctionnement | -40C to +100C (Industrial) |
| Speed Grade | -5 |
| I/O Banks | Multiple banks (LVCMOS 1.2 V - 3.3 V, LVDS) |
| Configuration Interfaces | I2C / SPI / Slave JTAG |
| PLLs | 2 PLL pairs |
| Statut RoHS | Compliant |
| Type de montage | Surface Mount (BGA) |
Guide de configuration des broches du LCMXO3LF-6900E-5MG256I 256-ball csfbga (mg256), 0.5 mm pitch
Configuration des broches du LCMXO3LF-6900E-5MG256I (boîtier 256-ball csfbga (mg256), 0.5 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour LCMXO3LF-6900E-5MG256I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
LCMXO3LF-6900E-5MG256I convient pour 6 applications: Industrial I/O Expansion and Bus Bridging, Server Platform Management and Secure Boot, Motor Control Gate-Driver Logic, LED Display and Human-Machine Interface, Machine Vision Camera Interface, Automotive Infotainment and Body Electronics.
Industrial I/O Expansion and Bus Bridging
The LCMXO3LF-6900E-5MG256I excels in industrial I/O expansion and bus bridging because its 206 user I/O and 6,864 LUTs easily handle multi-protocol glue logic. The 245,760 bits of embedded memory buffer protocol conversion packets, while the on-chip Flash configuration eliminates the boot PROM that legacy CPLD designs still require, cutting BOM cost in PLC backplanes and distributed I/O blocks. It bridges SPI to I2C, UART to SPI, and parallel FPGA buses to serial transceivers without external logic, and the -40C to +100C industrial grade withstands factory-floor temperatures.
Recommandé
Server Platform Management and Secure Boot
The LCMXO3LF-6900E-5MG256I is well suited for server platform management because its on-chip Flash configuration provides an instant-on, tamper-resistant boot controller within microseconds of power-up. Its 6,864 LUTs implement PMBus controllers, fan-tach monitors, and secure boot monitors that authenticate the main host CPU's firmware before releasing reset. The 206 user I/O connect to voltage rails, temperature sensors, and reset sequencers across a server board, while 1.2 V core voltage plus optional 2.5/3.3 V single-rail supply simplifies the auxiliary power tree. The hardened I/O banks support 5 V tolerance on selected banks.
Recommandé
Motor Control Gate-Driver Logic
The LCMXO3LF-6900E-5MG256I generates PWM and dead-time control logic for three-phase motor drives because its 6,864 LUTs and 2 PLL pairs synthesize the high-resolution PWM and quadrature encoder interfaces required for FOC algorithms. The 206 user I/O drive gate-driver enable, fault, and brake lines for multi-axis servo drives, and the on-chip Flash configuration eliminates the boot PROM that protects against controller hang on power-up. The -40C to +100C industrial range handles the elevated ambient temperature inside a motor-control cabinet.
Recommandé
LED Display and Human-Machine Interface
The LCMXO3LF-6900E-5MG256I drives large LED walls and HMI panels because its 206 user I/O scan-matrix keyboards, multiplex LED arrays, and TFT backlights without external scan logic. The 245,760 bits of embedded memory buffer display refresh and debounce state, while 2 PLL pairs synthesize the pixel clock for LVDS display interfaces. The on-chip Flash configuration means the panel powers on to a known good state, eliminating boot-time artifacts in commercial signage. The 1.2 V core reduces panel power consumption.
Recommandé
Machine Vision Camera Interface
The LCMXO3LF-6900E-5MG256I bridges image-sensor data lanes to host processors in machine-vision cameras because its 206 user I/O handle MIPI-CSI lane aggregation, GPIO triggers, and lens-control PWM. The 245,760 bits of embedded memory buffer line-scan data while 2 PLL pairs generate the MIPI byte clock from an external oscillator. The non-volatile Flash configuration lets the camera boot into calibration state instantly, supporting vision-guided robotics with sub-100 ms boot budgets. The industrial -40C to +100C range tolerates enclosed camera housings.
Recommandé
Automotive Infotainment and Body Electronics
The LCMXO3LF-6900E-5MG256I glues together infotainment and body-electronics domains because its on-chip Flash configuration survives automotive power-down transients without re-flashing. The 6,864 LUTs run CAN/LIN gateways, RGB-LED controllers, and audio-routing logic, while 206 user I/O connect to body-control modules, HMI touchscreens, and rear-seat displays. The -40C to +100C industrial range is well within the body-electronics thermal envelope, though the automotive-grade LCMXO3LFP version should be selected for AEC-Q100 designs. The 1.2 V core plus 3.3 V single-rail simplifies the always-on power tree.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour LCMXO3LF-6900E-5MG256I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | LCMXO3LF-6900C-5BG256C | LCMXO3LF-9400E-5MG256I | LCMXO3LF-4300E-5MG256I | LCMXO2-4000HC-6MG132I | LCMXO2-640HC-6TG100I |
|---|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | 256-ball csfBGA (MG256) | 256-ball csfBGA (BG256) | 256-ball csfBGA (MG256) | 256-ball csfBGA (MG256) | 132-ball csfBGA (MG132) | 100-pin TQFP (TG100) |
| Family / Series | MachXO3LF / 6900E | MachXO3LF / 6900C | MachXO3LF / 9400E | MachXO3LF / 4300E | MachXO2 / 4000HC | MachXO2 / 640HC |
| Logic Capacity (LUTs) | 6,864 | 6,864 | 9,400 | 4,300 | 4,320 | 640 |
| User I/O Count | 206 | 206 | 206 | 206 | 105 | 78 |
| Core Voltage | 1.2 V (single-rail 2.5 V / 3.3 V option) | 1.2 V (single-rail 2.5 V / 3.3 V option) | 1.2 V (single-rail 2.5 V / 3.3 V option) | 1.2 V (single-rail 2.5 V / 3.3 V option) | 1.2 V / 2.5 V - 3.3 V | 1.2 V / 2.5 V - 3.3 V |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Embedded Memory | 245,760 bits | 245,760 bits | 331,776 bits | 92,160 bits | 92,160 bits | 18,432 bits |
| Configuration Memory | On-chip Flash (non-volatile) | On-chip Flash (non-volatile) | On-chip Flash (non-volatile) | On-chip Flash (non-volatile) | On-chip Flash (non-volatile) | On-chip Flash (non-volatile) |
| Approx. Unit Price (USD, qty-1, as of 2026-10-08) | $24.50 | ~$21.00 | ~$32.00 | ~$16.00 | ~$13.50 | ~$7.50 |
Principaux différenciateurs
- On-chip Flash configuration eliminates external boot PROM (vs SRAM-based competitors (e.g., Lattice ECP5 series in lower densities))
- Single-rail supply option reduces power-tree complexity (vs SRAM FPGAs requiring 1.0 V + 1.8 V + 2.5 V rails)
- Mid-density 6,864 LUT position in the ultra-low-power family (vs LCMXO3LF-4300E-5MG256I (4,300 LUTs) and LCMXO3LF-9400E-5MG256I (9,400 LUTs))
Notes de conception
Estimated: at typical industrial operating conditions (3.3 V single-rail supply, 25% toggle rate, all 206 I/O driving 10 pF loads at 50 MHz) the LCMXO3LF-6900E-5MG256I dissipates approximately 0.6 W - 1.0 W. The 256-ball csfBGA package has a theta-JA of approximately 28 C/W with a 4-layer JEDEC test board, giving a junction temperature rise of 17 - 28 C above ambient. A thermal relief copper pour under the BGA is recommended for enclosed enclosures where ambient may approach +85 C, though external heatsinking is generally not required.
The 256-ball csfBGA package uses 0.5 mm pitch, which requires laser-drilled microvias and 4-layer (or finer) PCB stack-up for reliable assembly. Per the Lattice MachXO3LF hardware reference, place 0.1 uF + 10 uF decoupling capacitors within 3 mm of every VCC/VCCAUX pair, with the smallest value nearest the ball. Use length-matched differential pairs for LVDS pairs (within 0.13 mm), and keep all configuration-mode strapping resistors within 25 mm of their respective balls to avoid spurious mode selection at power-up.
Three common design pitfalls for LCMXO3LF-6900E-5MG256I: (1) Assuming the 256-ball csfBGA pinout matches the 484-ball csfBGA - they do not, even within the same family; (2) Forgetting that the -5 speed grade is the slowest in the MachXO3LF family and may not meet 200 MHz+ timing budgets; (3) Driving 5 V signals into LVCMOS33 banks without verifying the bank's VCCIO - some banks support 5 V tolerance, others do not. Always cross-reference the bank's VCCIO with the I/O standard table in the Lattice MachXO3LF datasheet before layout finalization.
Place the MachXO3LF-6900E close to the I/O connectors and high-speed buses it interfaces with to keep signal-integrity paths short. Route configuration interfaces (I2C, SPI, JTAG) on a separate layer from the user I/O, and provide a 4.7 kohm pull-up on the I2C SDA/SCL lines per the Lattice MachXO3 hardware checklist. Keep the external configuration Flash (if used for dual-boot) within 25 mm of the SPI/I2C balls, and add a ground guard ring around the BGA to reduce EMI coupling to adjacent analog/RF traces.
Informations de conformité
RoHS compliant per Lattice product page. The LCMXO3LF-6900E is not AEC-Q100 qualified; AEC-Q100 qualified variants ship with the LCMXO3LFP prefix. Reach and conflict-minerals compliance confirmed via Lattice supplier declarations.
