LFE2-6E-7F256C - 6000-LUT FPGA, 190 I/O, 256-BGA | Lattice
Référence : LFE2-6E-7F256C ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
LFE2-6E-7F256C Présentation
An FPGA is a semiconductor whose digital logic and interconnects are configured after manufacture. In the broader hierarchy, an FPGA is a programmable logic device and therefore a type of semiconductor IC. ECP2 devices combine LUT-based logic, programmable routing, block RAM, DSP capability, and user I/O in one package. This combination allows designers to implement control logic, interface bridges, packet processing, signal conditioning, and embedded data pipelines without relying on a custom ASIC.
Verified distributor data identifies this device as an ECP2 FPGA with 6000 cells, 190 I/O, and a 256-BGA package. The LFE2-6E-7F256C also appears in comparison data as a 420 MHz, 6000-cell PBGA256 device measuring 17 x 17 mm. Its 190 available I/O support substantial board-level connectivity, while the ECP2 architecture provides a practical balance between logic density, programmable functionality, and device integration. The suffix C denotes a commercial-temperature ordering code in the supplied comparison data, but the complete temperature range is not available in the provided sources.
Typical applications include industrial automation, communications infrastructure, embedded control, video and image processing, data acquisition, and DSP-assisted signal processing. Its 190 I/O are useful when an interface must connect multiple buses, counters, memory devices, converters, or control peripherals. Its 6000-cell capacity is suitable for parallel datapaths and moderate protocol stacks, although design headroom should be checked against routing, timing, RAM, DSP, and pin-assignment requirements before committing to a production build.
For reliable implementation, use the manufacturer pin table and package information rather than generic BGA assumptions. Decoupling, bank-supply requirements, configuration pins, clock topology, I/O standards, and unused-ball treatment must follow the LatticeECP2/M Family Data Sheet. A programmable device also depends on a valid bitstream, correct configuration clocking, and a suitable Lattice programming interface.
This page consolidates the supplied distributor listings, package information, and cross-reference evidence. It separates verified values from unavailable electrical details and does not infer pricing, lifecycle, pinout, or compliance claims that were not established by the source data.
Engineers should evaluate the LFE2-6E-7F256C when a 6000-cell FPGA, 190 I/O, 420 MHz-class performance, and 256-BGA integration align with the design. Confirm timing closure, memory and DSP availability, package ball assignments, and supply status in the official documentation before hardware release.
Alternatives de remplacement direct pour LFE2-6E-7F256C — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
LFE2-6E-7FN256C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LFXP6E-3FN256I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LFE2-6E-7F256C Valeurs maximales et caractéristiques électriques
| Device Type | ECP2 field-programmable gate array (FPGA) IC |
| Logic Cell Count | 6000 cells |
| LUT Count | 6000 LUTs |
| Maximum Operating Frequency | 420 MHz |
| User I/O Count | 190 I/O |
| DSP Capability | DSP |
| Core Supply Voltage | 1.2 V |
| Logic Cell Count from Distributor Listing | 56320 |
| Boîtier | 256-BGA |
| Package Family | FBGA-256 |
| Package Type | PBGA256 |
| Package Dimensions | 17 x 17 mm |
| Ordering Code | LFE2-6E-7F256C |
| Speed Designation | -7 |
| Lead-Free Status | Lead free |
| Type de montage | Surface mount |
Guide de configuration des broches du LFE2-6E-7F256C 17 x 17 mm
Configuration des broches du LFE2-6E-7F256C (boîtier 17 x 17 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour LFE2-6E-7F256C.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
LFE2-6E-7F256C convient pour 6 applications: Industrial Automation Control, Embedded Communications Interface, Data Acquisition and Signal Conditioning, DSP-Assisted Signal Processing, Embedded Video and Image Processing, Programmable Test and Measurement.
Industrial Automation Control
The LFE2-6E-7F256C fits industrial automation control when a programmable device must combine sequencing, interface logic, and moderate parallel connectivity. Its 6000 logic cells can host control state machines, timing blocks, fault handling, and data-conditioning functions, while 190 I/O provide connections to sensors, actuators, counters, and isolation or level-shifting devices. The listed 420 MHz operating frequency supports demanding control and datapath timing, but the final design must verify clock domains, I/O standards, and timing closure. The commercial C ordering code and lead-free package are useful for production planning, although the supplied data does not confirm industrial temperature or qualification requirements. Engineers should reserve the ECP2 architecture for logic that benefits from programmable updates, field reconfiguration, or integration that would be cumbersome with separate fixed-function ICs.
Recommandé
Embedded Communications Interface
The LFE2-6E-7F256C is suitable for embedded communications interfaces that require parallel buses, protocol framing, buffering, and programmable routing in one device. Its 190 I/O can support address and data lines, control signals, clocks, status indicators, and multiple external transceivers. The 6000-cell capacity allows designers to implement framing logic, packet filters, FIFOs, and timing constraints without a separate high-performance microcontroller for every protocol function. The listed 420 MHz maximum frequency is useful for clocked datapaths, although actual throughput depends on I/O standards, routing, and timing margins. A complete design should include a stable reference clock, configuration memory or programming path, reset strategy, and protocol-specific test patterns before production release.
Recommandé
Data Acquisition and Signal Conditioning
The LFE2-6E-7F256C can serve as the digital backbone for data-acquisition and signal-conditioning systems that need programmable capture, filtering, and packet formation. The 6000 logic cells are appropriate for parallel ADC interfaces, digital filtering, event counters, trigger logic, and data packing, while the 190 I/O provide substantial connectivity to converters and memory devices. Its DSP capability and 420 MHz listed frequency make it a credible fit for pipelines that require deterministic parallel processing. Designers should verify converter interface voltage, sampling-clock jitter, I/O timing, and FPGA resource utilization rather than assuming analog and digital functions share the same rail. The BGA package also demands careful escape routing and power distribution to maintain signal integrity during high-speed capture.
Recommandé
DSP-Assisted Signal Processing
The LFE2-6E-7F256C is appropriate for DSP-assisted signal processing when a design needs programmable multiply-accumulate and parallel logic resources. The supplied listings identify DSP capability and 6000 LUTs, enabling compact implementations of filters, correlation, modulation, digital predistortion, or fixed-point control pipelines. The listed 420 MHz operation can support demanding synchronous datapaths, but the realized throughput depends on the ECP2 DSP architecture, clocking scheme, and timing closure. Engineers should map each arithmetic operation to available DSP and LUT resources, preserve timing budgets for multi-cycle paths, and avoid assuming that all 6000 cells are interchangeable with DSP blocks. The 190 I/O helps expose processed data, test points, or control channels, while the 256-BGA package supports compact integration.
Recommandé
Embedded Video and Image Processing
The LFE2-6E-7F256C can support embedded video or image-processing subsystems where parallel pixels, timing signals, and programmable control must be combined in a compact FPGA. The 6000 cells are useful for line buffers, pixel formatting, thresholding, color mapping, synchronization, and interface adaptation, while 190 I/O can connect image sensors, display controllers, memory interfaces, and status logic. The listed 420 MHz frequency and DSP capability make the device suitable for timing-sensitive parallel pipelines, although actual image throughput must be calculated from pixel width, frame rate, memory bandwidth, and clocking. Designers should validate memory interface timing, I/O standards, and BGA signal integrity early. This FPGA is best positioned as a dedicated subprocessor rather than a replacement for a larger frame-buffer FPGA.
Recommandé
Programmable Test and Measurement
The LFE2-6E-7F256C is useful in programmable test and measurement equipment because its LUT resources and 190 I/O can combine acquisition sequencing, timing generation, pattern logic, and communication control. The device can coordinate ADC or DAC channels, generate precise control signals, and perform real-time calculations without a separate fixed-function controller for every channel. The listed 420 MHz operation supports high-rate synchronous processing, while DSP capability can accelerate filters, transforms, or calibration routines. Designers must budget FPGA logic, RAM, DSP, clock, and I/O resources against the instrument specification, and must verify analog interface timing separately from the core frequency. The 256-BGA footprint is appropriate for a dense instrument PCB, but its power, via, and thermal layout should be reviewed before release.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour LFE2-6E-7F256C — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | LFE2-6E-7FN256C | LFXP6E-3FN256I |
|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Device Family | LatticeECP2 | LatticeECP2 | LatticeXP |
| Logic Cells or LUTs | 6000 cells/LUTs | 6000 cells/LUTs | 6000 cells |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V |
| Package | 256-BGA | 256-BGA | 256-FBGA |
Principaux différenciateurs
- Higher listed operating frequency than the cross-reference LatticeXP candidate (vs LFXP6E-3FN256I)
- ECP2 family alignment for the replacement candidate (vs LFE2-6E-7FN256C)
- Verified lead-free package indication (vs LFXP6E-3FN256I)
Notes de conception
Do not power the LFE2-6E-7F256C from the single 1.2 V listing alone. The ECP2 device may require separately planned core and I/O-bank supplies, and the supplied data does not provide complete rail values or current limits. Follow the manufacturer power table for the exact package and speed grade, place decoupling capacitors close to their associated balls, and provide adequate via distribution beneath high-current BGA power connections.
Design the 256-BGA escape-routing strategy before committing to component placement. Because the verified source does not provide the full ball map or recommended land pattern, use the official package drawing rather than inferred 256-ball coordinates. Keep high-speed clock and data routes short, provide adequate return-path continuity, and separate sensitive configuration and clock inputs from noisy power-converter regions where the layout rules permit.
A shared 256-BGA package does not by itself prove that a replacement is drop-in compatible. For LFE2-6E-7FN256C or LFXP6E-3FN256I, verify the complete ball assignment, I/O bank map, supply requirements, configuration pins, speed grade, and lifecycle status. The alternative records are retained because the supplied web data shows related packages and capacity, but exact pin equivalence remains a manufacturing validation item.
Treat the listed 420 MHz maximum operating frequency as a device capability, not a guaranteed system result. Constrain clock and high-fanout nets, validate source-synchronous interfaces, and use the selected I/O standard with the correct bank voltage. For communications, acquisition, or video designs, add timing-budget analysis and board-level signal-integrity checks before increasing clock rates or expanding interface width.
Informations de conformité
The supplied cross-reference snippet explicitly labels LFE2-6E-7F256C as lead free. No verified RoHS, REACH, AEC-Q100, halogen-free, or conflict-minerals statement was supplied.
