LFE2-6E-7F256C - 6000-LUT FPGA, 190 I/O, 256-BGA | Lattice
料号： LFE2-6E-7F256C ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
LFE2-6E-7F256C 概述
An FPGA is a semiconductor whose digital logic and interconnects are configured after manufacture. In the broader hierarchy, an FPGA is a programmable logic device and therefore a type of semiconductor IC. ECP2 devices combine LUT-based logic, programmable routing, block RAM, DSP capability, and user I/O in one package. This combination allows designers to implement control logic, interface bridges, packet processing, signal conditioning, and embedded data pipelines without relying on a custom ASIC.
Verified distributor data identifies this device as an ECP2 FPGA with 6000 cells, 190 I/O, and a 256-BGA package. The LFE2-6E-7F256C also appears in comparison data as a 420 MHz, 6000-cell PBGA256 device measuring 17 x 17 mm. Its 190 available I/O support substantial board-level connectivity, while the ECP2 architecture provides a practical balance between logic density, programmable functionality, and device integration. The suffix C denotes a commercial-temperature ordering code in the supplied comparison data, but the complete temperature range is not available in the provided sources.
Typical applications include industrial automation, communications infrastructure, embedded control, video and image processing, data acquisition, and DSP-assisted signal processing. Its 190 I/O are useful when an interface must connect multiple buses, counters, memory devices, converters, or control peripherals. Its 6000-cell capacity is suitable for parallel datapaths and moderate protocol stacks, although design headroom should be checked against routing, timing, RAM, DSP, and pin-assignment requirements before committing to a production build.
For reliable implementation, use the manufacturer pin table and package information rather than generic BGA assumptions. Decoupling, bank-supply requirements, configuration pins, clock topology, I/O standards, and unused-ball treatment must follow the LatticeECP2/M Family Data Sheet. A programmable device also depends on a valid bitstream, correct configuration clocking, and a suitable Lattice programming interface.
This page consolidates the supplied distributor listings, package information, and cross-reference evidence. It separates verified values from unavailable electrical details and does not infer pricing, lifecycle, pinout, or compliance claims that were not established by the source data.
Engineers should evaluate the LFE2-6E-7F256C when a 6000-cell FPGA, 190 I/O, 420 MHz-class performance, and 256-BGA integration align with the design. Confirm timing closure, memory and DSP availability, package ball assignments, and supply status in the official documentation before hardware release.
直接替换替代料： LFE2-6E-7F256C ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
LFE2-6E-7FN256C
✅ 直接替换📋 参考替代料（不在目录中）
LFXP6E-3FN256I
✅ 直接替换📋 参考替代料（不在目录中）
LFE2-6E-7F256C 最大额定值与电气特性
| Device Type | ECP2 field-programmable gate array (FPGA) IC |
| Logic Cell Count | 6000 cells |
| LUT Count | 6000 LUTs |
| Maximum Operating Frequency | 420 MHz |
| User I/O Count | 190 I/O |
| DSP Capability | DSP |
| Core Supply Voltage | 1.2 V |
| Logic Cell Count from Distributor Listing | 56320 |
| 封装 | 256-BGA |
| Package Family | FBGA-256 |
| Package Type | PBGA256 |
| Package Dimensions | 17 x 17 mm |
| Ordering Code | LFE2-6E-7F256C |
| Speed Designation | -7 |
| Lead-Free Status | Lead free |
| 安装类型 | Surface mount |
LFE2-6E-7F256C 17 x 17 mm 引脚配置指南
LFE2-6E-7F256C（17 x 17 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： LFE2-6E-7F256C.
请参阅 数据手册 以查看完整引脚配置。
典型应用
LFE2-6E-7F256C 适用于 6 应用s: Industrial Automation Control, Embedded Communications Interface, Data Acquisition and Signal Conditioning, DSP-Assisted Signal Processing, Embedded Video and Image Processing, Programmable Test and Measurement.
Industrial Automation Control
The LFE2-6E-7F256C fits industrial automation control when a programmable device must combine sequencing, interface logic, and moderate parallel connectivity. Its 6000 logic cells can host control state machines, timing blocks, fault handling, and data-conditioning functions, while 190 I/O provide connections to sensors, actuators, counters, and isolation or level-shifting devices. The listed 420 MHz operating frequency supports demanding control and datapath timing, but the final design must verify clock domains, I/O standards, and timing closure. The commercial C ordering code and lead-free package are useful for production planning, although the supplied data does not confirm industrial temperature or qualification requirements. Engineers should reserve the ECP2 architecture for logic that benefits from programmable updates, field reconfiguration, or integration that would be cumbersome with separate fixed-function ICs.
推荐
Embedded Communications Interface
The LFE2-6E-7F256C is suitable for embedded communications interfaces that require parallel buses, protocol framing, buffering, and programmable routing in one device. Its 190 I/O can support address and data lines, control signals, clocks, status indicators, and multiple external transceivers. The 6000-cell capacity allows designers to implement framing logic, packet filters, FIFOs, and timing constraints without a separate high-performance microcontroller for every protocol function. The listed 420 MHz maximum frequency is useful for clocked datapaths, although actual throughput depends on I/O standards, routing, and timing margins. A complete design should include a stable reference clock, configuration memory or programming path, reset strategy, and protocol-specific test patterns before production release.
推荐
Data Acquisition and Signal Conditioning
The LFE2-6E-7F256C can serve as the digital backbone for data-acquisition and signal-conditioning systems that need programmable capture, filtering, and packet formation. The 6000 logic cells are appropriate for parallel ADC interfaces, digital filtering, event counters, trigger logic, and data packing, while the 190 I/O provide substantial connectivity to converters and memory devices. Its DSP capability and 420 MHz listed frequency make it a credible fit for pipelines that require deterministic parallel processing. Designers should verify converter interface voltage, sampling-clock jitter, I/O timing, and FPGA resource utilization rather than assuming analog and digital functions share the same rail. The BGA package also demands careful escape routing and power distribution to maintain signal integrity during high-speed capture.
推荐
DSP-Assisted Signal Processing
The LFE2-6E-7F256C is appropriate for DSP-assisted signal processing when a design needs programmable multiply-accumulate and parallel logic resources. The supplied listings identify DSP capability and 6000 LUTs, enabling compact implementations of filters, correlation, modulation, digital predistortion, or fixed-point control pipelines. The listed 420 MHz operation can support demanding synchronous datapaths, but the realized throughput depends on the ECP2 DSP architecture, clocking scheme, and timing closure. Engineers should map each arithmetic operation to available DSP and LUT resources, preserve timing budgets for multi-cycle paths, and avoid assuming that all 6000 cells are interchangeable with DSP blocks. The 190 I/O helps expose processed data, test points, or control channels, while the 256-BGA package supports compact integration.
推荐
Embedded Video and Image Processing
The LFE2-6E-7F256C can support embedded video or image-processing subsystems where parallel pixels, timing signals, and programmable control must be combined in a compact FPGA. The 6000 cells are useful for line buffers, pixel formatting, thresholding, color mapping, synchronization, and interface adaptation, while 190 I/O can connect image sensors, display controllers, memory interfaces, and status logic. The listed 420 MHz frequency and DSP capability make the device suitable for timing-sensitive parallel pipelines, although actual image throughput must be calculated from pixel width, frame rate, memory bandwidth, and clocking. Designers should validate memory interface timing, I/O standards, and BGA signal integrity early. This FPGA is best positioned as a dedicated subprocessor rather than a replacement for a larger frame-buffer FPGA.
推荐
Programmable Test and Measurement
The LFE2-6E-7F256C is useful in programmable test and measurement equipment because its LUT resources and 190 I/O can combine acquisition sequencing, timing generation, pattern logic, and communication control. The device can coordinate ADC or DAC channels, generate precise control signals, and perform real-time calculations without a separate fixed-function controller for every channel. The listed 420 MHz operation supports high-rate synchronous processing, while DSP capability can accelerate filters, transforms, or calibration routines. Designers must budget FPGA logic, RAM, DSP, clock, and I/O resources against the instrument specification, and must verify analog interface timing separately from the core frequency. The 256-BGA footprint is appropriate for a dense instrument PCB, but its power, via, and thermal layout should be reviewed before release.
推荐
推荐产品汇总
工程参考数据： LFE2-6E-7F256C ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | LFE2-6E-7FN256C | LFXP6E-3FN256I |
|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Device Family | LatticeECP2 | LatticeECP2 | LatticeXP |
| Logic Cells or LUTs | 6000 cells/LUTs | 6000 cells/LUTs | 6000 cells |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V |
| Package | 256-BGA | 256-BGA | 256-FBGA |
关键差异点
- Higher listed operating frequency than the cross-reference LatticeXP candidate （对比 LFXP6E-3FN256I)
- ECP2 family alignment for the replacement candidate （对比 LFE2-6E-7FN256C)
- Verified lead-free package indication （对比 LFXP6E-3FN256I)
设计说明
Do not power the LFE2-6E-7F256C from the single 1.2 V listing alone. The ECP2 device may require separately planned core and I/O-bank supplies, and the supplied data does not provide complete rail values or current limits. Follow the manufacturer power table for the exact package and speed grade, place decoupling capacitors close to their associated balls, and provide adequate via distribution beneath high-current BGA power connections.
Design the 256-BGA escape-routing strategy before committing to component placement. Because the verified source does not provide the full ball map or recommended land pattern, use the official package drawing rather than inferred 256-ball coordinates. Keep high-speed clock and data routes short, provide adequate return-path continuity, and separate sensitive configuration and clock inputs from noisy power-converter regions where the layout rules permit.
A shared 256-BGA package does not by itself prove that a replacement is drop-in compatible. For LFE2-6E-7FN256C or LFXP6E-3FN256I, verify the complete ball assignment, I/O bank map, supply requirements, configuration pins, speed grade, and lifecycle status. The alternative records are retained because the supplied web data shows related packages and capacity, but exact pin equivalence remains a manufacturing validation item.
Treat the listed 420 MHz maximum operating frequency as a device capability, not a guaranteed system result. Constrain clock and high-fanout nets, validate source-synchronous interfaces, and use the selected I/O standard with the correct bank voltage. For communications, acquisition, or video designs, add timing-budget analysis and board-level signal-integrity checks before increasing clock rates or expanding interface width.
合规信息
The supplied cross-reference snippet explicitly labels LFE2-6E-7F256C as lead free. No verified RoHS, REACH, AEC-Q100, halogen-free, or conflict-minerals statement was supplied.
