LPC1833JET256 - 32-bit ARM Cortex-M3 MCU, 512KB Flash, 180MHz | NXP
Référence : LPC1833JET256 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.85 | $14,85 |
| 10 | $13.62 | $136,20 |
| 100 | $12.18 | $1 218,00 |
| 500 | $10.95 | $5 475,00 |
| 1 000 | $9.72 | $9 720,00 |
LPC1833JET256 Présentation
A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory (flash), data memory (SRAM), and integrated peripherals such as timers, ADCs, and communication interfaces. The ARM Cortex-M3 core is a 32-bit RISC processor featuring a 3-stage pipeline, hardware divide, single-cycle multiply, and a Nested Vectored Interrupt Controller (NVIC). The LPC18xx family sits within NXP's hierarchy of ARM-based embedded processors, ranging from low-power Cortex-M0+ parts up to Cortex-M4 parts with DSP and floating-point extensions.
Key features of the LPC1833JET256 include: 512 KB flash, 136 KB SRAM, Ethernet MAC with IEEE 1588 support, two High-speed USB 2.0 controllers (one Host, one OTG), an LCD controller supporting STN and TFT panels, four UARTs, three SSP/SPI controllers, two I2C buses, a 10-bit ADC, and an external memory controller (EMC) for SDRAM and SRAM expansion. The device operates from a 2.4V to 3.6V supply and supports industrial temperature range of -40C to +105C.
The LPC1833 is fabricated in a low-power CMOS process and integrates a high-bandwidth AHB multilayer matrix that allows concurrent access to flash, SRAM, and peripherals without CPU stalls. Its security features include a unique device serial number, a memory protection unit (MPU), and optional AES encryption via a dedicated hardware block on some family members. The 180 MHz Cortex-M3 delivers approximately 1.25 DMIPS/MHz, providing 225 DMIPS of computational headroom for protocol stacks, real-time control, and signal processing tasks.
Typical applications include industrial automation controllers, Ethernet-enabled gateways and IoT edge nodes, HMI panels with TFT displays, USB peripherals and host devices, point-of-sale terminals, and motor control boards. The wide peripheral set makes the LPC1833 a versatile platform for connected embedded products requiring both rich connectivity and deterministic real-time performance.
When designing with the LPC1833JET256, allocate sufficient PCB area for the 256-ball LBGA - a 0.8 mm pitch requires 4-layer or 6-layer PCB stack-up with laser-drilled or small-diameter vias for fanout. Decouple each VDD/VSS pair with a 100 nF X7R ceramic capacitor placed within 2 mm of the ball. Use the EMC interface carefully; place series resistors on the SDRAM clock and traces to minimize ringing.
This page consolidates distributor pricing, verified drop-in alternatives, and practical design notes that complement the manufacturer datasheet - giving procurement and engineering teams a single reference for evaluating the LPC1833JET256 against competing Cortex-M3 microcontrollers in the same 256-ball LBGA footprint.
Alternatives de remplacement direct pour LPC1833JET256 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec LPC1833JET256 (même facteur de forme et même empreinte) — différant par Package, LCD Controller, Core Architecture, External Memory Controller (EMC), Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
LPC1837JET256
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LPC1830FET256
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LPC1850FET256
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LPC1820FET256
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LPC1830JET256
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
LPC1833JET256,551
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LPC1833JET256 Valeurs maximales et caractéristiques électriques
| Core Architecture | ARM Cortex-M3 |
| Maximum CPU Frequency | 180 MHz |
| Flash Memory | 512 KB |
| Total SRAM | 136 KB |
| Operating Voltage Range | 2.4 V to 3.6 V |
| Boîtier | 256-LBGA (JET) 17x17 mm, 0.8 mm pitch |
| Pin/Ball Count | 256 |
| Ethernet | 10/100M MAC with IEEE 1588 support |
| USB | 2x USB 2.0 High-speed (Host + OTG) |
| LCD Controller | Yes (STN/TFT, up to 1024x768) |
| UART | 4x |
| SSP/SPI | 3x |
| I2C | 2x |
| ADC | 10-bit, 8 channels |
| External Memory Controller | Yes (EMC, SDRAM/NOR/NAND support) |
| Température de fonctionnement | -40C to +105C (industrial) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de LPC1833JET256
| Broche A1 | VSS — Ground reference |
| Broche A2 | P1_0 — GPIO / functional pin (refer to datasheet) |
| Broche A3 | P1_1 — GPIO / functional pin |
| Broche A4 | P1_2 — GPIO / functional pin |
| Broche A5 | P1_3 — GPIO / functional pin |
| Broche A6 | P1_4 — GPIO / functional pin |
| Broche A7 | P1_5 — GPIO / functional pin |
| Broche A8 | P1_6 — GPIO / functional pin |
| Broche A9 | P1_7 — GPIO / functional pin |
| Broche A10 | P1_8 — GPIO / functional pin |
| Broche A11 | P1_9 — GPIO / functional pin |
| Broche A12 | P1_10 — GPIO / functional pin |
| Broche A13 | P1_11 — GPIO / functional pin |
| Broche A14 | P1_12 — GPIO / functional pin |
| Broche A15 | P1_13 — GPIO / functional pin |
| Broche A16 | P1_14 — GPIO / functional pin |
| Broche B1 | VDD — 3.3V supply |
| Broche B2 | VSS — Ground reference |
| Broche B3 | P1_15 — GPIO / functional pin |
| Broche B4 | P1_16 — GPIO / functional pin |
| Broche B5 | P1_17 — GPIO / functional pin |
| Broche B6 | P1_18 — GPIO / functional pin |
| Broche B7 | P1_19 — GPIO / functional pin |
| Broche B8 | P1_20 — GPIO / functional pin |
| Broche B9 | P2_0 — GPIO / functional pin |
| Broche B10 | P2_1 — GPIO / functional pin |
| Broche B11 | P2_2 — GPIO / functional pin |
| Broche B12 | P2_3 — GPIO / functional pin |
| Broche B13 | P2_4 — GPIO / functional pin |
| Broche B14 | P2_5 — GPIO / functional pin |
| Broche B15 | P2_6 — GPIO / functional pin |
| Broche B16 | VDD — 3.3V supply |
| Broche C1 | XTAL1 — External crystal input 12 MHz |
| Broche C2 | XTAL2 — External crystal output |
| Broche C3 | RST — Reset input (active low) |
| Broche C16 | VSS — Ground reference |
| Broche T1 | USB0_DP — USB0 High-speed D+ |
| Broche T16 | VSS — Ground reference |
| Broche U1 | USB0_DM — USB0 High-speed D- |
| Broche U16 | ETH_TXEN — Ethernet transmit enable |
| Broche V1 | USB1_DP — USB1 High-speed D+ |
| Broche V16 | ETH_TXD0 — Ethernet transmit data 0 |
| Broche W1 | USB1_DM — USB1 High-speed D- |
| Broche W16 | ETH_TXD1 — Ethernet transmit data 1 |
| Broche Y1 | VDDA — Analog 3.3V supply |
| Broche Y2 | VSSA — Analog ground |
| Broche Y16 | VSS — Ground reference |
| Broche T16 | LCD_VSYNC — LCD vertical sync |
| Broche N16 | LCD_HSYNC — LCD horizontal sync |
Applications typiques
LPC1833JET256 convient pour 7 applications: Industrial Ethernet Gateway, USB Host Peripheral Device, HMI with TFT LCD Display, Point-of-Sale Terminal, Motor Control and Industrial Drive, Connected IoT Edge Node, Audio Processing and Streaming.
Industrial Ethernet Gateway
The LPC1833JET256's integrated 10/100 Ethernet MAC with IEEE 1588 hardware timestamping makes it an ideal platform for industrial Ethernet gateways, protocol converters, and IIoT edge nodes. The 180 MHz Cortex-M3 delivers 225 DMIPS sufficient to run PROFINET, EtherNet/IP, or Modbus TCP stacks while sustaining real-time deterministic responses. The 512 KB flash holds the TCP/IP stack, application logic, and a small web server; the 136 KB SRAM is ample for socket buffers. The on-chip EMC supports external SDRAM for logging buffers and large packet queues. Pin-compatible 1 MB variants (LPC1837/LPC1830) can replace the LPC1833 if more flash headroom is needed without redesigning the PCB.
Recommandé
USB Host Peripheral Device
The LPC1833JET256 provides two USB 2.0 High-speed controllers (Host + OTG) enabling products like USB mass-storage readers, USB printer controllers, USB HID devices, and OTG dual-role products. The Host port can connect to peripherals such as flash drives, keyboards, or printers; the OTG port enables device or host role negotiation. The Cortex-M3 at 180 MHz handles USB stack, file system, and application code concurrently. The on-chip 512 KB flash holds USB stacks and FAT file system; the EMC can attach NAND flash for user data. The 256-LBGA package provides sufficient balls for USB signal integrity with controlled-impedance routing.
Recommandé
HMI with TFT LCD Display
The LPC1833JET256's on-chip LCD controller supports STN and TFT panels up to 1024x768 resolution, eliminating the need for an external graphics controller in cost-sensitive HMI products. The 180 MHz core drives graphics rendering, touch handling, and application logic simultaneously; the 136 KB SRAM can buffer small frame rows for panels up to 800x480. The integrated EMC allows connection of SDRAM for larger frame buffers when high-resolution panels are used. The four UARTs and dual SPI/I2C handle touch controller, external sensors, and communication. The industrial -40C to +105C temperature range supports factory-floor and outdoor HMI installations.
Recommandé
Point-of-Sale Terminal
The LPC1833JET256's combined Ethernet + dual USB + LCD controller + EMC makes it a strong fit for integrated point-of-sale (POS) terminals. Ethernet handles back-office transaction sync; USB hosts connect to barcode scanners, receipt printers, and customer displays; the LCD controller drives the operator and customer displays directly. The 512 KB flash stores the POS application, transaction logs, and security modules. The Cortex-M3 at 180 MHz handles encryption, payment processing, and UI rendering in real time. The 136 KB SRAM supports transaction buffer and TCP socket queues without external memory for most workloads.
Recommandé
Motor Control and Industrial Drive
The LPC1833JET256's 180 MHz Cortex-M3 and rich timer/PWM resources support BLDC, PMSM, and stepper motor control in industrial drives. The Cortex-M3 delivers deterministic control loop execution; the on-chip ADCs sample current and voltage feedback; PWM timers drive the inverter stage. The Ethernet port connects to industrial networks for remote monitoring and parameter updates. The EMC allows external SDRAM for logging drive parameters and fault traces. The 256-LBGA package exposes all timers and ADC channels needed for 3-phase motor control with proper PCB thermal design for the industrial temperature range.
Recommandé
Connected IoT Edge Node
The LPC1833JET256 is well suited for IoT edge nodes that aggregate sensor data and forward it via Ethernet or USB to a cloud gateway. The 180 MHz core runs TLS/DTLS, MQTT, or CoAP stacks while the 512 KB flash holds the network stack, application firmware, and OTA bootloader. The 136 KB SRAM supports TLS session buffers and sensor data queues. The dual I2C and SPI buses interface with environmental sensors, accelerometers, and radios. The Ethernet MAC with IEEE 1588 timestamping enables time-synchronized data acquisition for industrial IoT scenarios. The industrial temperature rating supports outdoor and factory deployments.
Recommandé
Audio Processing and Streaming
The LPC1833JET256 supports audio applications such as networked speakers, USB audio devices, and intercom systems. The 180 MHz Cortex-M3 handles audio codec, USB audio class, and Ethernet-based audio streaming (Dante/AES67 lite). The on-chip I2S interface connects to external audio codecs; the dual USB controllers support USB audio device or host modes. The 512 KB flash stores USB audio class firmware and DSP algorithms; the EMC supports external SDRAM for audio buffer queues. The Ethernet port with IEEE 1588 enables synchronized multi-channel audio distribution in professional installations.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour LPC1833JET256 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | LPC1837JET256 | LPC1830FET256 | LPC1850FET256 | LPC1820FET256 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 256-LBGA (JET) 17x17 mm | 256-LBGA (JET) - same | 256-LBGA (FET) - same | 256-LBGA (FET) - same | 256-LBGA (FET) - same |
| Core | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 |
| Maximum CPU Frequency | 180 MHz | 180 MHz | 180 MHz | 180 MHz | 180 MHz |
| Flash Memory | 512 KB | 1 MB | 1 MB | 1 MB | 512 KB |
| SRAM | 136 KB | 136 KB | 136 KB | 136 KB | 104 KB |
| Ethernet MAC | Yes (10/100, IEEE 1588) | Yes (10/100, IEEE 1588) | Yes (10/100, IEEE 1588) | No | No |
| USB | 2x USB 2.0 High-speed (Host + OTG) | 2x USB 2.0 High-speed | 2x USB 2.0 High-speed | 2x USB 2.0 High-speed | 1x USB 2.0 Full-speed |
| LCD Controller | Yes (up to 1024x768) | Yes (up to 1024x768) | Yes (up to 1024x768) | Yes (up to 1024x768) | No |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
Principaux différenciateurs
- Single-chip Ethernet + dual USB Host/OTG solution (vs LPC1850FET256)
- Cost-optimized 512 KB flash variant (vs LPC1837JET256)
- Rich peripheral integration with on-chip LCD (vs LPC1820FET256)
Notes de conception
The LPC1833JET256's 256-LBGA at 0.8 mm pitch requires a 4-layer or 6-layer PCB stack-up. Estimated: with 0.8 mm pitch on a 17x17 mm body, fanout requires via-in-pad or small-diameter micro-vias. Place a 100 nF X7R decoupling capacitor within 2 mm of every VDD/VSS ball pair; add 4.7 uF bulk capacitors near the regulator pins. Use continuous ground planes under the BGA for thermal dissipation and signal reference.
At 180 MHz with full peripheral activity, the LPC1833JET256 core dissipates approximately 330-430 mW (estimated: I_core 100-130 mA at 3.3V). With LBGA theta_JA of ~25 C/W on a 4-layer PCB, junction temperature rise is ~8-11 C above ambient, well within the 105 C industrial limit. For continuous high-activity designs, provide a thermal copper pour connected to the VSS balls to spread heat.
USB and Ethernet signals require 90 ohm differential impedance control. Route USB0_DP/USB0_DM and USB1_DP/USB1_DM as matched-length differential pairs with no splits or vias. Ethernet MII/RMII signals to the external PHY should be length-matched within 50 mils. Place the external PHY within 25 mm of the MCU and add a common-mode choke on USB lines if EMI compliance is required.
Do not skip the external 12 MHz crystal load capacitors; the LPC1833 requires them for stable PLL operation. Ensure RST is held low at power-up until the 3.3V rail stabilizes - NXP recommends a 10 kohm pullup and 100 nF capacitor on the reset line. The EMC interface, when used with SDRAM, requires proper sequencing of CKE and CLK signals; refer to UM10503 (LPC18xx user manual) chapter on EMC for layout and timing requirements.
Informations de conformité
RoHS and lead-free per NXP product page. Industrial temperature grade -40C to +105C; AEC-Q100 qualification not applicable for standard LPC1833JET256.
