LPC4313JET100E - Dual-Core 204 MHz MCU | NXP
Référence : LPC4313JET100E ✓ ActifLPC4313JET100E Présentation
A microcontroller is a programmable integrated circuit containing a processor core, memory, and peripherals on one package. In the embedded-device hierarchy, the LPC4313JET100E belongs to the Arm Cortex-M MCU family and combines general-purpose control, communications connectivity, and real-time peripheral support. Its dual-core architecture can separate application code, communications handling, and background tasks without requiring a separate controller.
The NXP product page highlights 512 KB of flash, 136 KB of SRAM, Ethernet, two high-speed USB ports, LCD connectivity, and EMC features. The Cortex-M0 coprocessor is code- and tool-compatible upward with the Cortex-M4 core and can reach 204 MHz, making it useful for transferring selected tasks away from the main core. The family also includes configurable timers, SGPIO, and a quad SPI Flash Interface for external memory and storage expansion.
The LPC43xx architecture is designed for embedded systems requiring more connectivity and parallel processing than a basic microcontroller. Ethernet and dual high-speed USB support reduce the need for external communication controllers in gateways, industrial equipment, human-machine interfaces, and connected control systems. The 100-ball TFBGA-100 package also supports dense routing of the high-speed and display interfaces, although its fine pitch requires careful PCB layout and inspection.
Typical applications include industrial Ethernet controllers, USB-connected data acquisition equipment, human-machine interface panels, communications gateways, and embedded motor-control systems. The principal design advantage is flexible workload allocation between the Cortex-M4 and Cortex-M0 cores, while the principal integration challenge is laying out a 9 mm by 9 mm ball-grid-array footprint with controlled power, clock, and high-speed signal routing.
Use the NXP pin-description table and reference schematic when assigning PCB tracks and power domains. Place decoupling capacitors close to the supply balls, route Ethernet and USB differential pairs as controlled-impedance nets, and validate the Cortex-M4 and Cortex-M0 clock, reset, and boot configuration before committing the layout.
This page consolidates the key NXP product characteristics, drop-in family alternatives, application guidance, package considerations, and design checks needed to evaluate the LPC4313JET100E for an embedded system.
Alternatives de remplacement direct pour LPC4313JET100E — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec LPC4313JET100E (même facteur de forme et même empreinte) — différant par LCD Support, Package.
LPC4320JET100
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
LPC4320FET100,551
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LPC4333JET100E
✅ Remplacement direct ⚠️ Spécifications non vérifiéesContactez-nous pour le prix
Voir la fiche technique →LPC4350JET100
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
LPC4353JET100
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
LPC4313JET100E Valeurs maximales et caractéristiques électriques
| Product Type | 32-bit dual-core microcontroller |
| Processor Cores | Arm Cortex-M4 and Arm Cortex-M0 |
| Maximum Processor Frequency | 204 MHz |
| Embedded Flash Memory | 512 KB |
| On-Chip SRAM | 136 KB |
| Ethernet Interface | 1 Ethernet interface |
| High-Speed USB Interfaces | 2 high-speed USB interfaces |
| External Serial Flash Interface | Quad SPI Flash Interface (SPIFI) |
| Configurable Timer | State Configurable Timer (SCT) |
| Serial GPIO Interface | Serial General Purpose I/O (SGPIO) |
| LCD Support | Supported |
| EMC Features | EMC features specified for the LPC43xx family |
| Boîtier | 100-ball TFBGA, 9 mm x 9 mm |
| Type de montage | Surface mount |
| Statut RoHS | unknown |
| REACH Status | unknown |
| AEC-Q100 Qualification | unknown |
Guide de configuration des broches du LPC4313JET100E 100-ball tfbga, 9 mm x 9 mm
Configuration des broches du LPC4313JET100E (boîtier 100-ball tfbga, 9 mm x 9 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour LPC4313JET100E.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
LPC4313JET100E convient pour 6 applications: Industrial Ethernet Controller, USB Data Acquisition System, Human-Machine Interface Panel, Connected Communications Gateway, Industrial Monitoring and Control, High-Speed USB Test and Control Unit.
Industrial Ethernet Controller
The LPC4313JET100E fits an industrial Ethernet controller because its 204 MHz Cortex-M4 core can run communication protocols while the Cortex-M0 coprocessor handles control tasks. Integrated Ethernet, 512 KB of flash, and 136 KB of SRAM reduce the need for a separate communications processor. Place the MCU beside the Ethernet PHY and maintain controlled-impedance differential routing. Confirm isolation, surge protection, magnetics, and industrial EMC requirements in the final reference design.
Recommandé
USB Data Acquisition System
The LPC4313JET100E can serve as the host or control processor in a USB data acquisition system because it provides two high-speed USB interfaces, a 204 MHz Cortex-M4 core, and 136 KB of SRAM. The Cortex-M0 coprocessor can manage sampling triggers, status handling, or low-level control independently of the main data path. USB differential pairs require short, symmetrical routing with a continuous ground reference, while the analog front end must be isolated appropriately from the digital supply domains.
Recommandé
Human-Machine Interface Panel
The LPC4313JET100E is suitable for a human-machine interface panel because the LPC43xx family supports LCD connectivity alongside Ethernet and USB. Its Cortex-M4/M0 architecture allows graphics or user-interface logic to run on the main core while the coprocessor handles buttons, indicators, timers, or communications. The 100-ball TFBGA provides a high pin count for display and control signals, but designers should use short display traces, separate analog and digital supply filtering, and an EMC-conscious enclosure and return-path strategy.
Recommandé
Connected Communications Gateway
The LPC4313JET100E fits a connected gateway where Ethernet, two high-speed USB ports, and external flash are more useful than a single-interface MCU. Its 512 KB of internal flash supports boot code, protocol stacks, and application firmware, while the quad SPI Flash Interface can extend nonvolatile storage for logs, assets, or firmware images. Place SPI flash and its decoupling close to the device, preserve signal integrity on USB and Ethernet, and plan firmware updates for both internal and external memory.
Recommandé
Industrial Monitoring and Control
The LPC4313JET100E can serve as the central controller in an industrial monitoring system by combining a 204 MHz Cortex-M4 core, a Cortex-M0 coprocessor, Ethernet, USB, and programmable timers. The main core can process data and manage communications while the coprocessor handles periodic sampling or deterministic control functions. Use the State Configurable Timer and SGPIO for suitable peripheral functions, isolate field-side interfaces, and validate timing margins across temperature and operating-voltage conditions.
Recommandé
High-Speed USB Test and Control Unit
The LPC4313JET100E supports a USB-connected test and control unit by combining two high-speed USB interfaces with 204 MHz processing and 136 KB of SRAM. One USB interface can serve a host connection while the other connects a target or peripheral, and the dual-core architecture can divide protocol handling from real-time acquisition. Route both USB interfaces as controlled-impedance differential pairs, keep return paths continuous under connector and cable events, and include boot and recovery paths for field maintenance.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour LPC4313JET100E — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | LPC4320JET100 | LPC4320FET100,551 | LPC4333JET100 | LPC4350JET100 | LPC4353JET100 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 100-ball TFBGA (9 mm x 9 mm) | 100-ball TFBGA (9 mm x 9 mm) | 100-ball TFBGA (9 mm x 9 mm) | 100-ball TFBGA (9 mm x 9 mm) | 100-ball TFBGA (9 mm x 9 mm) | 100-ball TFBGA (9 mm x 9 mm) |
Principaux différenciateurs
- Integrated dual-core Arm architecture (vs LPC4320JET100)
- Substantial integrated memory for connected embedded systems (vs LPC4350JET100)
- Dual high-speed USB plus Ethernet connectivity (vs LPC4353JET100)
- External storage and configurable peripheral support (vs LPC4333JET100)
Notes de conception
Treat the 100-ball TFBGA as a fine-pitch routing problem. Use the NXP land pattern and pin table, apply symmetric fanout where practical, provide direct return-path vias near high-speed transitions, and route Ethernet and USB differential pairs as coupled traces with the impedance required by the selected PCB stack-up. Do not substitute a generic BGA footprint without checking ball-to-pad orientation and pad dimensions.
Partition the supply network according to the manufacturer power-ball requirements and place the specified bypass capacitors immediately adjacent to their supply balls. Separate noisy digital activity from sensitive analog and communication sections, provide clean local return paths, and inspect the board for exposed copper that could increase EMI coupling. Verify startup current, Ethernet PHY demand, USB bus-power limits, and regulator headroom under worst-case conditions.
Plan clock, reset, boot, and debug access before placing the MCU. Keep the Cortex-M4 and Cortex-M0 clock distribution symmetric where the reference design specifies matched routing, preserve short return paths beneath clock traces, and make boot configuration readable and serviceable. If the design uses the quad SPI Flash Interface, place the external flash close to the SPIFI pins to minimize loop area and support predictable flash timing.
Validate Ethernet and both high-speed USB interfaces with the final stack-up, connectors, protection components, and enclosure. Maintain continuous reference planes, avoid stubs and unnecessary test pads on high-speed nets, and include the correct series-termination strategy in the reference design. EMC testing should cover powered cables and accessories because connector transitions can dominate radiated emissions even when the MCU layout itself is compliant.
Informations de conformité
The manufacturer product listing does not establish the requested compliance and qualification statuses. Obtain the current LPC4313JET100E product data sheet and NXP compliance declarations before making environmental or automotive claims.
