LPC5526JBD64Y - 150MHz Cortex-M33 MCU 256KB | NXP
Référence : LPC5526JBD64Y ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.28 | $5,28 |
| 10 | $4.79 | $47,90 |
| 100 | $4.25 | $425,00 |
| 500 | $3.86 | $1 930,00 |
| 1 000 | $3.52 | $3 520,00 |
LPC5526JBD64Y Présentation
A microcontroller (MCU) is a single-chip embedded computer that integrates a processor core, memory, and peripherals such as UART, SPI, I2C, and USB onto one die. MCUs sit at the device level of the embedded hierarchy - below SoCs and application processors but above simple logic ICs - and are the workhorses of industrial control, IoT nodes, and consumer appliances. The LPC5526 belongs to general-purpose flash MCUs, specifically the Arm Cortex-M class of 32-bit embedded processors.
Key features of the LPC5526JBD64Y include the Arm Cortex-M33 core (r0p3) with a Memory Protection Unit (MPU), a built-in Nested Vectored Interrupt Controller (NVIC), and a non-maskable interrupt (NMI) input with selectable sources. The family leverages a cost-effective 40-nm NVM process technology and is part of NXP's EdgeVerse edge computing platform. Flexcomm serial connectivity supports I2C, SDIO, SPI, and UART/USART, alongside USB. The CASPER hardware co-processor accelerates cryptographic arithmetic, a family hallmark that offloads security workloads from the CPU.
A major strength of the LPC552x/S2x family is pin-, software-, and peripheral-compatibility across members, allowing developers to scale memory and performance without board redesign. The 150 MHz core clock delivers roughly double the throughput of mainstream Cortex-M4 parts at similar power, and the Cortex-M33 TrustZone-capable architecture future-proofs security-sensitive designs.
Typical applications include industrial automation and motor control, IoT edge nodes with secure connectivity, and consumer appliances requiring USB device connectivity. The Flexcomm architecture lets each serial block be dynamically assigned as UART, SPI, or I2C, reducing external component count.
For design, budget the 150 MHz core current against your supply rail and use NXP's MCUXpresso Config Tools for pin muxing and clock setup before PCB routing.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet, as of 2026-10-12.
Alternatives de remplacement direct pour LPC5526JBD64Y — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
LPC55S26JBD64
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
LPC5524JBD64
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
LPC55S24JBD64
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
LPC5516JBD64
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
LPC55S16JBD64
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
LPC5526JBD64Y Valeurs maximales et caractéristiques électriques
| Core Processor | ARM Cortex-M33 (r0p3) |
| Core Size | 32-Bit |
| Fréquence d'horloge maximale | 150 MHz |
| Flash Memory | 256 KB (256K x 8) |
| SRAM | 256 KB |
| Connectivity | Flexcomm, I2C, SDIO, SPI, UART/USART, USB |
| Cryptography Co-Processor | CASPER |
| Memory Protection Unit | Yes (MPU) |
| Interrupt Controller | NVIC built into Cortex-M33 |
| NMI Input | Yes, with selectable sources |
| Boîtier | 64-HTQFP (10 x 10 mm) |
| Terminal Form | Gull Wing |
| Type de montage | Surface Mount |
| Temperature Grade | Industrial |
| Process Technology | 40-nm NVM |
| Platform | NXP EdgeVerse edge computing platform |
Guide de configuration des broches du LPC5526JBD64Y 64-htqfp (10 x 10 mm)
Configuration des broches du LPC5526JBD64Y (boîtier 64-htqfp (10 x 10 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour LPC5526JBD64Y.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
LPC5526JBD64Y convient pour 6 applications: Industrial Automation and Motor Control, Secure IoT Edge Nodes, USB-Connected Devices, Data Acquisition and Sensor Systems, Consumer Appliances and White Goods, Test and Measurement Instrumentation.
Industrial Automation and Motor Control
The LPC5526JBD64Y fits industrial automation because its 150 MHz Cortex-M33 core closes current and velocity control loops with substantial headroom, while the NVIC delivers deterministic interrupt latency for PWM-critical timing. Flexcomm serial blocks provide the SPI and UART links to gate drivers, encoders, and industrial sensors, and the industrial temperature grade tolerates cabinet environments. Deployed between a current-sense amplifier and a three-phase inverter, the MCU runs field-oriented control in software with margin; the trade-off is that precision PWM resolution and timer features should be verified against the datasheet for your switching frequency before layout freeze.
Recommandé
Secure IoT Edge Nodes
As part of NXP's EdgeVerse platform, the LPC5526JBD64Y is aimed at IoT edge computing where local preprocessing reduces cloud traffic. The CASPER cryptographic co-processor offloads elliptic-curve arithmetic from the CPU, the Cortex-M33 architecture provides the TrustZone-class isolation model, and 256 KB flash plus 256 KB SRAM host a TLS stack alongside application code. A typical node pairs the MCU with a Wi-Fi or Ethernet module over Flexcomm UART/SPI, using the SRAM as communication buffers; the 150 MHz clock lets the device run sensor-fusion or anomaly detection locally without external accelerators, keeping BOM cost and power low.
Recommandé
USB-Connected Devices
With on-chip USB support among its Flexcomm connectivity options, the LPC5526JBD64Y suits USB device and bridge applications such as test instruments, data loggers, and programmer pods. The 256 KB flash stores USB descriptors, class drivers, and application firmware together, while the 256 KB SRAM sustains double-buffered endpoints for sustained throughput. Connected to a host PC through the USB PHY pins, the MCU can stream sensor data at high rates under interrupt control; developers should confirm the exact USB speed class (full/high speed) supported by this ordering code in the NXP datasheet before committing to a throughput specification.
Recommandé
Data Acquisition and Sensor Systems
The LPC5526JBD64Y works well as the host controller in multi-channel data acquisition systems, coordinating external ADCs over Flexcomm SPI at high clock rates while the 256 KB SRAM buffers sample blocks for decimation or FFT processing. Its 150 MHz core performs real-time filtering and feature extraction locally, and the NMI input with selectable sources gives a hardwired safety path for over-range events. In a typical chain the MCU clocks an ADC via SPI, processes samples in SRAM, and ships results over UART, SDIO, or USB; verifying ADC interface timing margins against the datasheet's SPI timing parameters is the key design step.
Recommandé
Consumer Appliances and White Goods
For appliances, the LPC5526JBD64Y provides enough processing power for user-interface handling, sensor fusion, and communication in one chip: 150 MHz execution covers UI plus control tasks concurrently, Flexcomm I2C/SPI connects touch, display, and sensor peripherals, and 256 KB flash accommodates firmware with room for OTA-friendly dual-image schemes. Cost-sensitive appliance designs benefit from the 40-nm NVM process economics and the family's pin compatibility, which lets one PCB platform span product tiers by swapping to lower-clock LPC5516-class parts. USB or UART links to Wi-Fi modules add connectivity without a second MCU.
Recommandé
Test and Measurement Instrumentation
In bench and embedded instrumentation, the LPC5526JBD64Y serves as the system controller managing front-end configuration, calibration, and communication. The 150 MHz Cortex-M33 with MPU supports structured firmware with memory-region protection between measurement and communication tasks, while Flexcomm's reconfigurable UART/SPI/I2C blocks adapt to different instrument daughter-cards on one PCB. With 256 KB flash, the instrument stores calibration tables and multiple measurement profiles in firmware; results stream to a PC over USB. The main design consideration is analog-domain isolation - keep the MCU's digital switching away from precision front-end grounds per NXP layout guidance.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour LPC5526JBD64Y — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | LPC55S26JBD64 | LPC5524JBD64 | LPC5516JBD64 | LPC55S16JBD64 |
|---|---|---|---|---|---|
| Package | 64-HTQFP (10x10 mm) | 64-HTQFP (10x10 mm) - same | 64-HTQFP (10x10 mm) - same | 64-HTQFP (10x10 mm) - same | 64-HTQFP (10x10 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | Arm Cortex-M33 (r0p3) | Arm Cortex-M33 | Arm Cortex-M33 | Arm Cortex-M33 | Arm Cortex-M33 |
| Max Clock Frequency | 150 MHz | 150 MHz | 150 MHz | 100 MHz | 100 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| Security Features | Cortex-M33 baseline (TrustZone-class architecture) | Enhanced (S-series secure boot/key storage) | Baseline | Baseline | Enhanced (S-series) |
| Lifecycle Status | Active | Active | Active | Active | Active |
Principaux différenciateurs
- Full 150 MHz core clock in this memory tier (vs LPC5516JBD64)
- Cost-optimized standard variant for non-secure designs (vs LPC55S26JBD64)
- CASPER crypto acceleration standard on the 552x tier (vs LPC5516JBD64)
Notes de conception
The LPC5526JBD64Y operates from a single low-voltage supply with internal LDOs per NXP LPC552x family design; provide clean 3.3 V at the main rail plus adequate decoupling (100 nF ceramic per power pin pair plus bulk 10 uF). Estimated: at 150 MHz the core draws current in the tens-of-mA range per typical family figures - size your regulator budget accordingly, and place the VDD core decoupling network within 2 mm of the HTQFP pins to minimize transient droop during flash write operations.
The 64-pin HTQFP (0.5 mm pitch) requires careful gull-wing pad geometry per IPC-type standard land patterns. Route the SWD debug pins (SWDIO/SWCLK) to a 10-pin header even in production boards - recovery without them requires desoldering. Keep crystal/load capacitors close to the oscillator pins with a guard ground ring; use MCUXpresso Config Tools to resolve pin-mux conflicts before routing since Flexcomm functions share many balls on this 64-pin device.
Do not exceed the datasheet absolute maximum ratings on 5 V-tolerant claims - verify each pin's 5 V tolerance individually in the NXP datasheet before interfacing to legacy 5 V logic. Second, the Cortex-M33 r0p3 core carries published errata; download the current errata sheet with the datasheet from nxp.com and review workarounds before freezing code. Third, when using CASPER for crypto, reserve the associated RAM region explicitly - overlaps cause silent computation corruption.
At 150 MHz core operation with fast GPIO toggling, series-terminate (22-33 ohm) long clock and SPI traces to control overshoot; keep SPI to external ADCs under 20 cm or simulate the stub. Estimated: a 100 MHz-class SPI edge with 30 cm unterminated trace shows reflections approaching full logic swing, corrupting sampling windows on high-speed ADC interfaces.
Informations de conformité
NXP's LPC5526JBD64 product page lists a dedicated Environmental Quality section with compliance data, but the specific RoHS/REACH certificate values were not present in the provided verified web data. Consult the NXP product page or request an NXP material declaration sheet.
