LS1024ASE7MLA - QorIQ Layerscape Dual-Core ARM Cortex-A9 SoC | NXP
Référence : LS1024ASE7MLA ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $81.87 | $81,87 |
| 10 | $75.5 | $755,00 |
| 100 | $68.4 | $6 840,00 |
| 500 | $61.2 | $30 600,00 |
| 1 000 | $54.95 | $54 950,00 |
LS1024ASE7MLA Présentation
A QorIQ Layerscape communications processor is a multicore system-on-chip (SoC) that integrates CPU cores, networking accelerators, and security engines on a single die, sitting within the broader Layerscape SoC architecture, the QorIQ communications processor family, the NXP microprocessor product line, and the wider embedded processor semiconductor category. The LS1024A family targets connectivity and edge applications where packet processing throughput, VPN/SSL acceleration, and quality-of-service (QoS) hardware features are critical differentiators.
Key features of the LS1024ASE7MLA include dual 32-bit ARM Cortex-A9 cores at 1.2 GHz, integrated 16-channel VoIP/DECT/DPI engines, 32-bit architecture, support for DDR3 memory, Gigabit Ethernet (GbE), PCI Express, SATA, hardware-accelerated VPN/SSL, and integrated digital front-end (DFE) functions for broadband access. The commercial temperature grade (0 to 70 degrees C) and the 1.13 V core voltage operation are critical for cost-optimized, thermally constrained gateway designs. The 625-FCBGA flip-chip package with 0.8 mm ball pitch provides fine-pitch integration on a 21x21 mm substrate, allowing dense PCB layouts for compact networking appliances.
Typical applications include broadband home gateways, VoIP/ATA adapters, integrated access devices (IADs), IoT edge gateways, small office/home office (SOHO) routers, and entry-level network attached storage (NAS) appliances. The combination of dual-core ARM Cortex-A9 processing power and integrated connectivity peripherals reduces BOM cost and PCB area compared to multi-chip implementations.
Design consideration: proper thermal management is essential because the FCBGA package concentrates significant processing and I/O in a small area; the PCB substrate and heatsink selection must meet the operating temperature envelope. The dual-core ARM Cortex-A9 complex requires careful DDR3 PCB routing (controlled impedance, matched lengths) to maintain memory bandwidth. When migrating designs, note the family matrix (LS1024ASE7MLA is the commercial-temperature-grade variant).
This page synthesizes NXP distributor pricing, same-brand Layerscape drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour LS1024ASE7MLA — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec LS1024ASE7MLA (même facteur de forme et même empreinte) — différant par Mounting Type, Operating Temperature, Package, Series, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
LS1024ASN7MLA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LS1024ASE7MQA
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
LS1024ASE7PNA
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
LS1024ASE7MLA Valeurs maximales et caractéristiques électriques
| Series | QorIQ Layerscape LS1 (LS1024A) |
| Core Processor | ARM Cortex-A9 (dual-core) |
| Architecture | 32-bit |
| CPU Clock Speed | 1.2 GHz |
| Number of Cores | 2 |
| Core Voltage | 1.096 V to 1.164 V (nominal 1.13 V) |
| Température de fonctionnement | 0 C to +70 C (commercial) |
| Boîtier | 625-FCPBGA (21x21 mm, 0.8 mm pitch) |
| Type de montage | Surface Mount (flip-chip BGA) |
| Integrated Interfaces | GbE, PCIe, SATA, DDR3 |
| Integrated Engines | 16-channel VoIP, DECT, DPI |
| Memory Support | DDR3 |
| Hardware Acceleration | QoS, VPN, SSL, packet processing |
| Target Applications | Broadband home routers, VoIP gateways, IoT gateways, low-end NAS |
| Statut RoHS | Compliant |
Guide de configuration des broches du LS1024ASE7MLA 625-fcpbga (21x21 mm, 0.8 mm pitch)
Configuration des broches du LS1024ASE7MLA (boîtier 625-fcpbga (21x21 mm, 0.8 mm pitch)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour LS1024ASE7MLA.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
LS1024ASE7MLA convient pour 7 applications: Broadband Home Router / Residential Gateway, VoIP / ATA Gateway, IoT Edge Gateway, Small Office / Home Office (SOHO) Router, Low-End Network Attached Storage (NAS), Industrial IoT / Building Automation Gateway, Wireless AP / Mesh Router.
Broadband Home Router / Residential Gateway
The LS1024ASE7MLA's dual-core ARM Cortex-A9 at 1.2 GHz with integrated Gigabit Ethernet, hardware VPN/SSL acceleration, and 16-channel DPI/VoIP/DECT engines makes it a strong fit for broadband residential gateways. Placed at the heart of the gateway, it handles concurrent WAN-to-LAN forwarding, firewall/NAT, parental-control DPI, and DECT/VoIP voice stacks without overloading the CPU. Compared with single-core SoCs, the dual-core design reserves one core for data-path forwarding and the other for control-plane services (TR-069, web UI, voice DSP), which keeps latency low under heavy traffic. The commercial 0 to 70 C grade and integrated DDR3 controller reduce BOM cost.
Recommandé
VoIP / ATA Gateway
The LS1024ASE7MLA's integrated 16-channel VoIP engine and DECT baseband make it well-suited for VoIP ATA (Analog Telephone Adapter) and integrated access device designs. Placed on a mainboard with SLIC/SLAC chipsets, the LS1024A offloads RTP/RTCP packet processing, G.711/G.729 codec bridging, and DECT frame handling into dedicated hardware. This frees the ARM Cortex-A9 cores for provisioning, SIP signaling, and management plane tasks. Hardware QoS prioritizes voice packets above best-effort data, reducing jitter and packet loss on the home LAN.
Recommandé
IoT Edge Gateway
The LS1024ASE7MLA's dual-core ARM Cortex-A9 plus integrated GbE, PCIe, and SATA ports in a single 625-FCBGA package make it a compelling main processor for IoT edge gateways. The LS1024A aggregates sensor data from sub-GHz/Zigbee/BLE radios via PCIe or UART, runs MQTT/CoAP protocol translation on the Cortex-A9 cores, and forwards curated telemetry to the cloud. Hardware-accelerated VPN/SSL provides the secure-tunnel ingress needed for industrial IoT deployments. The 21x21 mm FCBGA package and commercial temperature range suit DIN-rail or wall-mount indoor installations.
Recommandé
Small Office / Home Office (SOHO) Router
The LS1024ASE7MLA delivers line-rate Gigabit routing for SOHO deployments with QoS hardware that prioritizes VPN traffic, voice, and video above bulk data transfers. Its dual-core ARM Cortex-A9 runs the embedded Linux network stack, manages web-based configuration pages, and supports advanced features like SPI firewall, IPsec/SSL VPN, and parental controls. The DDR3 controller sustains multi-gigabit throughput without buffering bottlenecks, while SATA enables an optional internal storage target. The integrated GbE MAC and minimal external component count reduce BOM for cost-sensitive SOHO SKUs.
Recommandé
Low-End Network Attached Storage (NAS)
The LS1024ASE7MLA's SATA interface, GbE port, and dual-core ARM Cortex-A9 compute make it suitable for entry-level 2-bay home NAS appliances. Placed on a custom motherboard, it manages RAID-1 mirroring across SATA disks, runs a lightweight Linux NAS distro (SMB/NFS/AFP), and serves media via DLNA or Plex. Hardware-accelerated AES/SHA offloads encrypted transfers, sustaining throughput on Gigabit Ethernet. The DDR3 controller with high memory bandwidth supports concurrent multiple-client streaming. Commercial temperature grade covers home-environments.
Recommandé
Industrial IoT / Building Automation Gateway
In building automation and industrial IoT deployments, the LS1024ASE7MLA acts as the protocol bridge converting between BACnet, Modbus, KNX, and modern cloud APIs. The dual-core Cortex-A9 isolates real-time industrial traffic from cloud-side TLS/JSON processing, while hardware VPN acceleration secures backhaul links. The integrated GbE and PCIe support high-bandwidth uplinks to camera or access-control sub-systems. With its commercial temperature envelope and integrated security engines, the LS1024ASE7MLA fits indoor cabinet or DIN-rail enclosures.
Recommandé
Wireless AP / Mesh Router
The LS1024ASE7MLA integrates seamlessly with 802.11ac/ax Wi-Fi companion radios over PCIe, providing dual-band wireless access point functionality for small-office and consumer mesh deployments. The dual-core Cortex-A9 runs 802.11s mesh routing, WPA3 authentication, and wireless packet steering without compromising wired-side throughput. Hardware QoS keeps latency low for real-time voice and gaming traffic, while the integrated DPI engine identifies per-application bandwidth usage for parental-control enforcement. The platform reduces the bill of materials compared to separate router-CPU + Wi-Fi-chipset designs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour LS1024ASE7MLA — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | LS1024ASN7MLA | LS1024ASE7MQA | LS1024ASE7PNA |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 625-FCPBGA (21x21 mm) | 625-FCPBGA (21x21 mm) - same | 625-FCPBGA (21x21 mm) - same | 625-FCPBGA (21x21 mm) - same |
| Series | QorIQ Layerscape LS1 (LS1024A) | QorIQ Layerscape LS1 (LS1024A) | QorIQ Layerscape LS1 (LS1024A) | QorIQ Layerscape LS1 (LS1024A) |
| CPU Architecture | ARM Cortex-A9 (dual-core, 32-bit) | ARM Cortex-A9 (dual-core, 32-bit) | ARM Cortex-A9 (dual-core, 32-bit) | ARM Cortex-A9 (dual-core, 32-bit) |
| CPU Clock | 1.2 GHz | 1.2 GHz | 1.2 GHz | 1.2 GHz |
| Core Voltage | 1.096 V to 1.164 V (1.13 V nominal) | 1.096 V to 1.164 V | 1.096 V to 1.164 V | 1.096 V to 1.164 V |
| Operating Temperature | 0 C to +70 C (commercial) | 0 C to +70 C (commercial) | 0 C to +70 C (commercial) | Extended temperature grade |
| Integrated Engines | 16-channel VoIP, DECT, DPI, VPN/SSL, QoS | 16-channel VoIP, DECT, DPI, VPN/SSL, QoS | 16-channel VoIP, DECT, DPI, VPN/SSL, QoS | 16-channel VoIP, DECT, DPI, VPN/SSL, QoS |
| Memory Interface | DDR3 | DDR3 | DDR3 | DDR3 |
| Networking Interfaces | GbE, PCIe, SATA | GbE, PCIe, SATA | GbE, PCIe, SATA | GbE, PCIe, SATA |
Principaux différenciateurs
- Integrated 16-channel VoIP/DECT/DPI engine (vs LS1024ASE7PNA extended-temperature variant)
- Hardware-accelerated VPN/SSL and QoS (vs MPC8545VJATGD)
- 21x21 mm flip-chip BGA with integrated peripherals (vs MPC8545 FCPBGA)
Notes de conception
The LS1024ASE7MLA concentrates dual Cortex-A9 cores plus GbE, PCIe, SATA, and VoIP/DECT engines in a 625-FCBGA 21x21 mm package at 1.13 V, generating significant power density. A 4-layer PCB with a continuous copper ground/power pour beneath the BGA footprint is required to spread heat; applications dissipating more than about 4 W should add a thermal interface material and a small heatsink. Review the NXP hardware design guide for the LS1024A thermal model and target junction-temperature envelopes.
DDR3 routing on the LS1024ASE7MLA requires controlled-impedance traces (typically 50 ohm single-ended, 100 ohm differential for clocks), length-matched address/command/clock within 50 mil, and matched-byte-lane byte-by-byte to maintain signal integrity. Reference NXP AN4806 'DDR3 Design Guide for QorIQ Devices' for escape-via count limits, ground via stitching, and VREF decoupling. DDR3 VTT termination (typically 0.75 V) and a robust decoupling network (220 uF bulk + 0.1 uF + 10 nF high-frequency bypass on each rail) are mandatory.
Generate the 1.13 V core rail with the NXP PF0100 or PF8100 PMIC; the LS1024ASE7MLA requires a tight 1.096 V to 1.164 V core supply tolerance for reliable Cortex-A9 operation at 1.2 GHz. Sequence core, then DDR3, then peripheral rails to comply with the LS1024A power-up/down specification; failing to sequence the rails can trigger latch-up. Place a 4.7 uF ceramic plus 0.1 uF decoupling network within 50 mil of each VDD pin cluster.
Avoid these pitfalls: (1) treating the LS1024ASE7MLA and MPC8545 as drop-in compatible - they use different CPU ISAs (ARM vs Power) and different toolchains, requiring a full software rebase; (2) routing PCIe lanes without proper 85-100 ohm differential impedance and AC coupling capacitors - PCIe Gen2 compliance failures trace back here; (3) ignoring the 625-FCBGA 0.8 mm ball pitch - PCB manufacturing requires laser-drilled microvias with 0.2 mm capture-pad pitch; (4) forgetting to enable the LS1024A's hardware-assisted packet parser - the CPU can saturate without it.
Informations de conformité
RoHS and lead-free compliance per NXP product page. Not AEC-Q100 qualified - the LS1024ASE7MLA is a commercial-grade communications processor for non-automotive use.
