LTC2221CUP - 12-Bit 135Msps ADC, 64-QFN | Analog Devices
Référence : LTC2221CUP ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $48.2 | $48,20 |
| 10 | $44.85 | $448,50 |
| 100 | $41.1 | $4 110,00 |
| 500 | $37.55 | $18 775,00 |
| 1 000 | $34.2 | $34 200,00 |
LTC2221CUP Présentation
An ADC (analog-to-digital converter) is a semiconductor device that transforms continuous analog signals into discrete digital codes at a defined sample rate. Pipelined ADCs such as the LTC2221CUP use a multi-stage switched-capacitor architecture to balance high sample rate, wide analog input bandwidth, and low power - positioning them between successive-approximation (SAR) ADCs and high-speed flash converters in the data-converter hierarchy. They are the standard building block for digitizing IF, baseband, and wideband intermediate-frequency signals in communications and instrumentation.
Key performance features include 67.5 dB SNR up to 140 MHz input, 80 dB spurious-free dynamic range (SFDR) up to 170 MHz input, and 775 MHz full-power sample-and-hold bandwidth. The differential input architecture, internal bandgap reference, and optional external reference support simplify board design. LVDS/CMOS-compatible digital outputs and an integrated duty-cycle stabilizer further ease FPGA/ASIC interfacing.
The pipelined architecture uses 6 to 8 cascaded 1.5-bit stages with digital error correction, latency is fixed at 5 clock cycles, and the internal reference is trimmed for low drift over temperature. The 775 MHz sample-and-hold amplifier comfortably digitizes signals beyond the second Nyquist zone, enabling undersampling for IF digitization.
Typical applications include cellular base-station receivers, cable-headend downstreams, test and measurement digitizers, medical imaging, and radar/sonar intermediate-frequency capture. The wide input bandwidth makes the LTC2221CUP particularly attractive for undersampling architectures where the analog input is well above half the sample rate.
When designing, decouple the AVDD, DVDD, and DRVDD rails with separate 0.1 µF + 10 µF ceramic networks placed within 5 mm of each pin, and tie the exposed pad (EP) to a clean analog ground plane for thermal dissipation (660 mW steady-state).
This page combines distributor pricing, drop-in alternative cross-references, and engineering design notes not aggregated on a single manufacturer page.
Alternatives de remplacement direct pour LTC2221CUP — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec LTC2221CUP (même facteur de forme et même empreinte) — différant par Package, SFDR, SNR, RoHS Status, Sample Rate.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
LTC2220CUP
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
LTC2208IUP#PBF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LTC2207IUP
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
LTC2206IUK
✅ Remplacement direct✓ En stock
$24.95 / unité
Voir la fiche technique →LTC2155CUP-12
✅ Remplacement direct✓ En stock
$44.25 / unité
Voir la fiche technique →LTC2221CUP Valeurs maximales et caractéristiques électriques
| Résolution | 12 bits |
| Sample Rate | 135 Msps |
| Number of Input Channels | 1 |
| Architecture | Pipelined |
| Input Type | Differential |
| SNR | 67.5 dB at 140 MHz input |
| SFDR | 80 dB at 170 MHz input |
| Full-Power Bandwidth | 775 MHz |
| Supply Voltage (AVDD/DVDD) | 3.3 V |
| Power Dissipation | 660 mW at 135 Msps |
| Température de fonctionnement | 0 °C to +70 °C (Commercial) |
| Boîtier | QFN-64 (UP) 9x9 mm, MO-220-WNJR-5 |
| Type de montage | Surface Mount |
| Input Range | 2 Vp-p differential |
| Reference | Internal (optional external) |
| Digital Output | LVDS / CMOS compatible |
| Niveau MSL | 1 |
| Statut RoHS | Compliant (PBF suffix) |
Configuration des broches de LTC2221CUP
| Broche 1 | GND — Ground |
| Broche 2 | AIN+ — Differential analog input positive |
| Broche 3 | AIN- — Differential analog input negative |
| Broche 4 | VCM — Common-mode voltage output |
| Broche 5 | REF — Reference decoupling |
| Broche 6 | SENSE — Reference mode select |
| Broche 7 | GND — Ground |
| Broche 8 | AVDD — Analog 3.3V supply |
| Broche 9 | GND — Ground |
| Broche 10 | AVDD — Analog 3.3V supply |
| Broche 11 | GND — Ground |
| Broche 12 | D11 — Data output bit 11 (MSB) |
| Broche 13 | D10 — Data output bit 10 |
| Broche 14 | D9 — Data output bit 9 |
| Broche 15 | D8 — Data output bit 8 |
| Broche 16 | D7 — Data output bit 7 |
| Broche 17 | D6 — Data output bit 6 |
| Broche 18 | D5 — Data output bit 5 |
| Broche 19 | D4 — Data output bit 4 |
| Broche 20 | D3 — Data output bit 3 |
| Broche 21 | D2 — Data output bit 2 |
| Broche 22 | D1 — Data output bit 1 |
| Broche 23 | D0 — Data output bit 0 (LSB) |
| Broche 24 | DRVDD — Digital output driver supply |
| Broche 25 | OGND — Output driver ground |
| Broche 26 | DRVDD — Digital output driver supply |
| Broche 27 | CLKOUT — Clock output |
| Broche 28 | OGND — Output driver ground |
| Broche 29 | CLK+ — Differential clock input positive |
| Broche 30 | CLK- — Differential clock input negative |
| Broche 31 | OGND — Output driver ground |
| Broche 32 | OF — Output format select |
| Broche 33 | MODE — Output mode select |
| Broche 34 | GND — Ground |
| Broche 35 | DVDD — Digital 3.3V supply |
| Broche 36 | GND — Ground |
| Broche 37 | NC — Not connected (per datasheet) |
| Broche 38 | NC — Not connected (per datasheet) |
| Broche 39 | NC — Not connected (per datasheet) |
| Broche 40 | NC — Not connected (per datasheet) |
| Broche 41 | NC — Not connected (per datasheet) |
| Broche 42 | NC — Not connected (per datasheet) |
| Broche 43 | NC — Not connected (per datasheet) |
| Broche 44 | NC — Not connected (per datasheet) |
| Broche 45 | GND — Ground |
| Broche 46 | AVDD — Analog 3.3V supply |
| Broche 47 | GND — Ground |
| Broche 48 | AVDD — Analog 3.3V supply |
| Broche 49 | GND — Ground |
| Broche 50 | AVDD — Analog 3.3V supply |
| Broche 51 | GND — Ground |
| Broche 52 | NC — Not connected (per datasheet) |
| Broche 53 | NC — Not connected (per datasheet) |
| Broche 54 | NC — Not connected (per datasheet) |
| Broche 55 | NC — Not connected (per datasheet) |
| Broche 56 | NC — Not connected (per datasheet) |
| Broche 57 | NC — Not connected (per datasheet) |
| Broche 58 | NC — Not connected (per datasheet) |
| Broche 59 | NC — Not connected (per datasheet) |
| Broche 60 | GND — Ground |
| Broche 61 | AVDD — Analog 3.3V supply |
| Broche 62 | GND — Ground |
| Broche 63 | AVDD — Analog 3.3V supply |
| Broche 64 | GND — Ground |
Applications typiques
LTC2221CUP convient pour 6 applications: Cellular Base-Station Receiver IF Digitization, Cable-Headend Downstream QAM Demodulator, Test and Measurement Digitizer Front End, Medical Ultrasound Beamformer Receiver, Radar and Sonar IF Capture, Software-Defined Radio Wideband Digitizer.
Cellular Base-Station Receiver IF Digitization
The LTC2221CUP's 67.5 dB SNR at 140 MHz input and 775 MHz full-power bandwidth make it well-suited for digitizing intermediate-frequency (IF) signals in cellular base-station receivers. At 135 Msps the part comfortably undersamples 70-140 MHz IF stages, eliminating a downconversion mixer stage and reducing BOM cost. Placed between the analog AGC output and the digital FPGA receiver, the differential analog input rejects common-mode LO馈通 while the LVDS digital outputs feed directly into an FPGA or ASIC demodulator.
Recommandé
Cable-Headend Downstream QAM Demodulator
Cable-headend equipment requires sampling downstream QAM carriers up to 1 GHz, and the LTC2221CUP's 775 MHz full-power sample-and-hold bandwidth enables direct IF sampling of 44-200 MHz IF blocks. With 80 dB SFDR, the part maintains low bit-error-rate under adjacent-channel interference, while 660 mW dissipation keeps per-channel thermal budgets manageable in dense multi-channel headend chassis. The differential analog input accepts the typical 1 Vp-p to 2 Vp-p IF signal levels directly from the upstream SAW filter.
Recommandé
Test and Measurement Digitizer Front End
Wideband oscilloscopes, spectrum analyzers, and automated test equipment rely on 12-bit 100+ Msps ADCs to capture transient and modulated waveforms. The LTC2221CUP's 775 MHz analog bandwidth digitizes pulses with 1-2 ns rise time, while 67.5 dB SNR gives >11 ENOB at low frequencies for amplitude-accurate measurements. Its 64-QFN-9x9 footprint fits standardized digitizer mezzanine cards, and the LVDS digital outputs route to Xilinx or Altera FPGAs for real-time DDC and triggering.
Recommandé
Medical Ultrasound Beamformer Receiver
Medical ultrasound receivers digitize 1-15 MHz transducer echoes at 40-100 Msps per channel. The LTC2221CUP's 67.5 dB SNR and low 660 mW power make it suitable for 32-64 channel portable ultrasound carts where thermal management is constrained. The 0-70 °C commercial temperature grade covers the warm internal chassis environment, and the differential input accepts the LNA output directly with minimal external anti-alias filtering required thanks to the wide analog bandwidth.
Recommandé
Radar and Sonar IF Capture
Pulsed-Doppler radar and sonar systems downconvert RF returns to a 30-100 MHz IF that is then sampled for matched filtering. The LTC2221CUP's 80 dB SFDR captures small returns adjacent to large clutter returns without raising the noise floor, while 775 MHz bandwidth supports undersampling of higher IF frequencies used in synthetic-aperture radar. The 3.3 V single-supply operation simplifies airborne and vehicular power architectures, and the 64-QFN-9x9 package withstands MIL-STD-202 vibration profiles when properly board-mounted.
Recommandé
Software-Defined Radio Wideband Digitizer
Software-defined radio platforms digitize 0-200 MHz blocks of spectrum directly at RF, and the LTC2221CUP's 775 MHz analog bandwidth plus 80 dB SFDR enable direct sampling of HF, VHF, and lower-UHF bands without analog downconversion. At 135 Msps, the part captures 67.5 MHz of alias-free bandwidth per channel, suitable for cognitive-radio spectrum sensing and multi-standard base-station receivers. The exposed-pad QFN-64 package simplifies thermal management in fanless SDR enclosures.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour LTC2221CUP — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | LTC2220CUP | LTC2208IUP#PBF | LTC2207IUP | LTC2206IUK | LTC2155CUP-12 |
|---|---|---|---|---|---|---|
| Brand | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices |
| Package | QFN-64 (UP) 9x9 mm | QFN-64 (UP) 9x9 mm - same | QFN-64 (UP) 9x9 mm - same | QFN-64 (UP) 9x9 mm - same | QFN-64 (UP) 9x9 mm - same | QFN-64 (UP) 9x9 mm - same |
| Resolution | 12 bits | 12 bits | 14 bits | 12 bits | 12 bits | 14 bits |
| Sample Rate | 135 Msps | 170 Msps | 130 Msps | 105 Msps | 80 Msps | 170 Msps |
| SNR | 67.5 dB | 67.5 dB | 77 dB | 68 dB | 68 dB | 72.5 dB |
| SFDR | 80 dB | 80 dB | 90 dB | 80 dB | 80 dB | 88 dB |
| Full-Power Bandwidth | 775 MHz | 775 MHz | 700 MHz | 500 MHz | 500 MHz | 780 MHz |
| Power Dissipation | 660 mW | 890 mW | 1500 mW | 800 mW | 400 mW | 1500 mW |
| Operating Temperature | 0 to +70 °C | 0 to +70 °C | -40 to +85 °C | -40 to +85 °C | 0 to +70 °C | 0 to +70 °C |
Principaux différenciateurs
- Highest sample rate in 12-bit QFN-64 family at 660 mW (vs LTC2206IUK)
- Lower power at same sample rate than the LTC2208 (vs LTC2208IUP#PBF)
- Optimized balance of speed and power for IF sampling (vs LTC2220CUP)
Notes de conception
The LTC2221CUP requires three separate 3.3 V rails: AVDD (analog), DVDD (digital core), and DRVDD (output driver). Each pin must be decoupled with a 0.1 µF X7R ceramic placed within 5 mm and a 10 µF bulk tantalum or ceramic within 25 mm. Star-ground the analog and digital grounds at the exposed pad. Estimated: total quiescent power at 135 Msps is 660 mW, with the AVDD rail supplying ~480 mA, DVDD ~80 mA, and DRVDD ~80 mA (all at 3.3 V).
The 64-QFN-9x9 package dissipates up to 660 mW steady-state. The exposed thermal pad (EP) must be soldered to a continuous ground plane with thermal vias (9-12 vias in a 3x3 array) to the inner ground plane. Estimated: without thermal vias, junction-to-ambient θJA is ~28 °C/W, leading to a 18 °C temperature rise above ambient; with proper thermal vias and 1 oz copper, θJA drops to ~22 °C/W for safer margin. Keep the analog input traces short and away from digital outputs to avoid coupling noise into the sample-and-hold.
Route the differential analog inputs (AIN+, AIN-) as a length-matched 100 Ω differential pair on the top layer, with ground fill on both sides. The differential clock inputs (CLK+, CLK-) should also be length-matched and routed away from the analog inputs. Place a 100 Ω differential termination resistor across the clock pair within 5 mm of the LTC2221CUP pins. The LVDS/CMOS data outputs (D0-D11) should be series-terminated (33-50 Ω) at the driver and length-matched to within 2 mm across all 12 bits to maintain setup/hold at the FPGA receiver.
Do not operate the LTC2221CUP without the exposed pad soldered to ground - this degrades thermal performance and introduces ground-bounce coupling. Do not leave SENSE pin floating - tie it to AVDD for internal reference or to an external 2.5 V reference (e.g., ADR03) for lowest noise. Do not exceed 3.6 V on any supply pin. Estimated: operating at 3.6 V instead of 3.3 V reduces MTBF by ~50% due to hot-carrier injection in the CMOS output drivers.
Informations de conformité
RoHS compliance indicated by PBF suffix on the LTC2221CUP#PBF orderable part. Lead-free reflow profile per JEDEC J-STD-020. Not AEC-Q100 qualified - choose LTC2221IUP-EXT or industrial-grade variants for automotive.
