LTC2299CUP - Dual 14-Bit 80Msps Low Power 3V ADC | Analog Devices
Référence : LTC2299CUP ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $50.9 | $50,90 |
| 10 | $47.5 | $475,00 |
| 100 | $42.1 | $4 210,00 |
| 500 | $36.8 | $18 400,00 |
| 1 000 | $33.2 | $33 200,00 |
LTC2299CUP Présentation
A pipelined ADC is a successive-stage converter architecture in which coarse quantization, residue amplification, and fine quantization are pipelined across clocked analog stages. Each stage resolves a few bits and passes an amplified residue to the next, allowing conversion of one new sample per clock cycle at high sampling rates while keeping analog complexity per stage low. The dual 14-bit ADC category sits within the broader ADC taxonomy (flash -> pipelined -> successive-approximation -> sigma-delta), trading absolute single-shot latency for high sustained throughput - ideal for digitizing repetitive or continuous waveform content such as RF I/Q, ultrasound echo arrays, and baseband communications streams.
Key features include 80Msps guaranteed sampling rate, a flexible input range to 2V P-P (1V P-P or 2V P-P selectable), 110 dB channel-to-channel isolation at 100 MHz, multiplexed or separate data bus modes, and an optional internal dither circuit for improved SFDR when input tones fall close to Nyquist. The 64-QFN (9x9) exposed-pad package achieves low thermal resistance suitable for sustained multi-MHz dual-channel acquisition without external heatsinking.
Typical applications include cellular base-station receive paths, medical ultrasound imaging front ends, cable-headend QAM demodulation, broadband instrumentation, and radar IF sampling - any dual-channel system where 73 dB SNR and 90 dB SFDR at 70 MHz IF translate directly into usable dynamic range.
When designing with this device, observe the recommended 0.1 uF plus 2.2 uF analog supply bypassing and place them within millimeters of the supply pins; failure to do so will degrade SFDR and channel isolation. The exposed pad must be soldered to a continuous ground plane to achieve the rated thermal and RF performance.
Alternatives de remplacement direct pour LTC2299CUP — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec LTC2299CUP (même facteur de forme et même empreinte) — différant par RoHS Status, Package, SFDR, SNR, Resolution.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
LTC2299IUP
✅ Remplacement direct✓ En stock
$35.95 / unité
Voir la fiche technique →LTC2292CUP
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$13.42 / unité
Voir la fiche technique →LTC2287CUP
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$7.05 / unité
Voir la fiche technique →LTC2282CUP
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$18.5 / unité
Voir la fiche technique →LTC2280CUP
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$15.85 / unité
Voir la fiche technique →LTC2299CUP Valeurs maximales et caractéristiques électriques
| Résolution | 14 bit |
| Number of Channels | 2 (dual) |
| Fréquence d'échantillonnage | 80 Msps |
| Architecture | Pipelined |
| Tension d'alimentation | 2.7 V to 3.4 V (single 3 V) |
| Power Consumption | 444 mW (typical at 80 Msps) |
| SNR | 73 dB at 70 MHz input |
| SFDR | 90 dB at 70 MHz input |
| Channel Isolation | 110 dB at 100 MHz |
| Input Range | 1 V P-P or 2 V P-P (selectable) |
| Data Bus | Multiplexed or separate (selectable) |
| Température de fonctionnement | 0 C to +70 C (commercial C grade) |
| Boîtier | 64-pin QFN (UP) 9x9 mm with exposed pad |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant (PBF suffix indicates lead-free) |
Configuration des broches de LTC2299CUP
| Broche 1 | AINA+ — Channel A positive analog input |
| Broche 2 | AINA- — Channel A negative analog input (complement) |
| Broche 3 | AINB+ — Channel B positive analog input |
| Broche 4 | AINB- — Channel B negative analog input (complement) |
| Broche 5 | VCM — Common-mode voltage bypass |
| Broche 6 | SENSE — Input range select (1V/2V P-P) |
| Broche 7 | REFT — Reference top decoupling |
| Broche 8 | REFB — Reference bottom decoupling |
| Broche 9 | REFOUT — Internal reference output |
| Broche 10 | REFIN — External reference input |
| Broche 11 | GND — Analog ground |
| Broche 12 | AVDD — Analog 3V supply |
| Broche 13 | AVDD — Analog 3V supply |
| Broche 14 | AVDD — Analog 3V supply |
| Broche 15 | GND — Analog ground |
| Broche 16 | OFA — Channel A overflow flag |
| Broche 17 | OFB — Channel B overflow flag |
| Broche 18 | DITH — Internal dither enable |
| Broche 19 | MODE — Output mode select (CMOS/LVDS) |
| Broche 20 | NC — Not connected (per datasheet) |
| Broche 21 | NC — Not connected (per datasheet) |
| Broche 22 | NC — Not connected (per datasheet) |
| Broche 23 | NC — Not connected (per datasheet) |
| Broche 24 | NC — Not connected (per datasheet) |
| Broche 25 | CLK — Clock input |
| Broche 26 | CLK — Complementary clock input |
| Broche 27 | GND — Clock ground |
| Broche 28 | DVDD — Digital 3V supply |
| Broche 29 | DVDD — Digital 3V supply |
| Broche 30 | GND — Digital ground |
| Broche 31 | D0A — Channel A data LSB |
| Broche 32 | D1A — Channel A data bit 1 |
| Broche 33 | D2A — Channel A data bit 2 |
| Broche 34 | D3A — Channel A data bit 3 |
| Broche 35 | D4A — Channel A data bit 4 |
| Broche 36 | D5A — Channel A data bit 5 |
| Broche 37 | D6A — Channel A data bit 6 |
| Broche 38 | D7A — Channel A data bit 7 |
| Broche 39 | D8A — Channel A data bit 8 |
| Broche 40 | D9A — Channel A data bit 9 |
| Broche 41 | D10A — Channel A data bit 10 |
| Broche 42 | D11A — Channel A data bit 11 |
| Broche 43 | D12A — Channel A data bit 12 |
| Broche 44 | D13A — Channel A data MSB |
| Broche 45 | D0B — Channel B data LSB |
| Broche 46 | D1B — Channel B data bit 1 |
| Broche 47 | D2B — Channel B data bit 2 |
| Broche 48 | D3B — Channel B data bit 3 |
| Broche 49 | D4B — Channel B data bit 4 |
| Broche 50 | D5B — Channel B data bit 5 |
| Broche 51 | D6B — Channel B data bit 6 |
| Broche 52 | D7B — Channel B data bit 7 |
| Broche 53 | D8B — Channel B data bit 8 |
| Broche 54 | D9B — Channel B data bit 9 |
| Broche 55 | D10B — Channel B data bit 10 |
| Broche 56 | D11B — Channel B data bit 11 |
| Broche 57 | D12B — Channel B data bit 12 |
| Broche 58 | D13B — Channel B data MSB |
| Broche 59 | NC — Not connected (per datasheet) |
| Broche 60 | NC — Not connected (per datasheet) |
| Broche 61 | NC — Not connected (per datasheet) |
| Broche 62 | NC — Not connected (per datasheet) |
| Broche 63 | NC — Not connected (per datasheet) |
| Broche 64 | NC — Not connected (per datasheet) |
Applications typiques
LTC2299CUP convient pour 6 applications: Cellular Base Station Receiver IF Sampling, Medical Ultrasound Imaging Front End, Cable Headend QAM Demodulation, Radar IF Signal Acquisition, Broadband Instrumentation and Spectrum Analysis, Communications Diversity Receiver.
Cellular Base Station Receiver IF Sampling
The LTC2299CUP digitizes dual-channel IF signals in cellular base-station receivers. Its 80 Msps sampling rate comfortably places a 70 MHz IF well below Nyquist, while 73 dB SNR at 70 MHz input preserves EVM margin for QAM demodulation. The two synchronized channels handle diversity or MIMO paths from one clock domain, eliminating channel skew. With 444 mW from a single 3V supply and 64-QFN (UP) footprint, it fits dense receiver cards without external heatsinking. SFDR of 90 dB at 70 MHz keeps spurious tones below the receiver noise floor. Per the datasheet typical application circuit, drive each analog input through a bandpass anti-alias filter and AC-couple through a transformer for best SFDR.
Recommandé
Medical Ultrasound Imaging Front End
The LTC2299CUP's dual 14-bit, 80 Msps channels suit phased-array ultrasound receivers where each channel captures one transducer echo stream. The 73 dB SNR floor enables detection of small echo amplitudes deep in tissue without raising system noise, and 110 dB channel-to-channel isolation at 100 MHz prevents cross-coupling between adjacent piezoelectric elements. The 64-QFN (UP, 9x9) exposed-pad package dissipates 444 mW into the ground plane - critical for high-channel-count probes where thermal density is a constraint. The selectable 1V/2V P-P input range adapts directly to TGC (time-gain-control) amplifier outputs without external attenuators.
Recommandé
Cable Headend QAM Demodulation
In cable-headend equipment, the LTC2299CUP samples QAM-modulated downstream carriers at IF for digital demodulation. The 14-bit resolution and 73 dB SNR at 70 MHz input deliver enough dynamic range to resolve 256-QAM constellations with low EVM. The dual channel digitizes paired downstream carriers from one clock, simplifying PCB routing. 444 mW power dissipation is acceptable in headend racks with forced-air cooling. Per the LTC2299 datasheet, enabling the internal dither mode further improves SFDR for input tones near Nyquist - common in dense QAM channel plans. The exposed pad must be soldered to a continuous ground pour for thermal and EMI performance.
Recommandé
Radar IF Signal Acquisition
The LTC2299CUP digitizes I and Q baseband channels from radar IF stages at sample rates up to 80 Msps. Its 90 dB SFDR at 70 MHz ensures that strong clutter returns and target returns are not distorted by converter spurs - critical for radar dynamic range. The 110 dB channel-to-channel isolation at 100 MHz preserves I/Q orthogonality, which determines image rejection in single-sideband radar. The 64-QFN (UP) package fits the dense multi-channel receiver cards typical of phased-array radar. AC-coupled differential inputs via a 1:1 transformer (per the datasheet typical application) achieve best SFDR with minimum second-order distortion.
Recommandé
Broadband Instrumentation and Spectrum Analysis
In wideband instrumentation, the LTC2299CUP captures two simultaneous analog channels at up to 80 Msps with 73 dB SNR - enough dynamic range for transient capture and spectrum analysis up to ~70 MHz input. The multiplexed or separate data bus modes let designers route both channels into one downstream FPGA or split them for parallel DSP. The exposed-pad 64-QFN package achieves low thermal resistance so the part can run continuously in lab instruments. 444 mW power consumption is consistent with portable, USB-powered analyzers when paired with a switching pre-regulator. The internal dither mode (per the LTC2299 datasheet) enhances SFDR for low-level spectral measurements.
Recommandé
Communications Diversity Receiver
Diversity receivers use two synchronized antenna paths to improve link reliability. The LTC2299CUP digitizes both antenna streams from one clock, guaranteeing zero skew between channels and 110 dB isolation at 100 MHz. Its 73 dB SNR at 70 MHz IF preserves EVM margin across both channels. The 64-QFN (UP) 9x9 mm package fits densely populated RF front-end cards. Selectable 1V or 2V P-P input adapts to the upstream LNA/AGC output without external range switching. According to the LTC2299 datasheet, channel-to-channel matching is trimmed at production to maintain gain/offset symmetry, simplifying downstream digital combining.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour LTC2299CUP — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | LTC2299IUP | LTC2292CUP | LTC2287CUP | LTC2282CUP | LTC2280CUP |
|---|---|---|---|---|---|---|
| Package | 64-QFN (UP, 9x9 mm) with exposed pad | 64-QFN (UP, 9x9) - same | 64-QFN (UP, 9x9) - same | 64-QFN (UP, 9x9) - same | 64-QFN (UP, 9x9) - same | 64-QFN (UP, 9x9) - same |
| Brand | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices |
| Resolution | 14 bit | 14 bit | 12 bit | 12 bit | 12 bit | 12 bit |
| Sampling Rate | 80 Msps | 80 Msps | 105 Msps | 40 Msps | 105 Msps | 105 Msps |
| Number of Channels | 2 (dual) | 2 (dual) | 2 (dual) | 2 (dual) | 2 (dual) | 2 (dual) |
| Supply Voltage | 3 V (2.7-3.4 V) | 3 V | 3 V | 3 V | 3 V | 3 V |
| Operating Temperature | 0 C to +70 C (commercial) | -40 C to +85 C (industrial) | 0 C to +70 C | 0 C to +70 C | 0 C to +70 C | 0 C to +70 C |
Principaux différenciateurs
- 14-bit resolution at 80 Msps in a 64-QFN (UP) package - dual-channel, single-supply 3V (vs LTC2292CUP)
- 110 dB channel-to-channel isolation at 100 MHz (vs LTC2287CUP)
- Flexible 1V/2V P-P input range with internal dither mode for improved SFDR (vs LTC2280CUP)
Notes de conception
Per the LTC2299 datasheet, bypass AVDD (pins 12-14) to ground with both a 0.1 uF ceramic chip capacitor and a 2.2 uF ceramic chip capacitor placed within 2-3 mm of the supply pins. Also bypass the analog supply to ground with an additional 1 uF ceramic chip capacitor. The exposed pad MUST be soldered to a continuous ground plane - this provides both the thermal path (444 mW dissipation) and a low-impedance RF ground return. Missing or starved ground pours will degrade SNR, SFDR, and channel isolation.
Drive the analog inputs differentially (AINA+/AINA- and AINB+/AINB-) through a 1:1 impedance-ratio transformer or a low-noise differential ADC driver (e.g. LTC6400-20 or AD8138) for best SFDR. Single-ended input operation is possible but typically reduces SFDR by 5-10 dB at high input frequencies. The SENSE pin must be tied to REFOUT for 2V P-P operation or to ground for 1V P-P operation - misconfiguring this pin causes either clipping or reduced dynamic range.
Route the complementary clock (CLK and CLK-) as a 100 ohm differential pair with matched length to within 1 mm; clock skew directly translates to aperture-delay mismatch between the two ADC channels and degrades channel-to-channel isolation. Keep digital output buses (D0A-D13A, D0B-D13B) physically separated from the analog input traces with a continuous ground island between them. The MODE pin (CMOS vs LVDS output mode) should be tied hard to AVDD or GND with a short trace - a floating MODE pin can cause intermittent bus errors at high sampling rates.
Do not enable the internal dither (DITH pin) when the analog input is a single-tone sinewave below 5 MHz - the dither noise raises the noise floor without improving SFDR in this regime. Verify the LTC2299CUP (commercial 0 to +70 C) is used within its temperature range; for outdoor or industrial deployments use the LTC2299IUP variant. The exposed pad must NOT be used as the only ground connection - dedicated GND pins (11, 15, 27, 30) must also be tied to the ground plane, or the part will not meet datasheet specs.
Estimated: at 25 C ambient, the LTC2299CUP dissipating 444 mW into the 64-QFN (UP) exposed-pad package (theta_JA approximately 30 C/W with a 1 sq inch copper pour on JEDEC 4-layer test board) results in a junction temperature rise of about 13 C. With commercial-grade parts rated to +70 C, this leaves substantial margin for ambient temperatures up to ~57 C without additional heatsinking. For industrial environments or higher ambient temperatures, derate accordingly or add forced-air cooling.
Informations de conformité
RoHS compliant per #PBF suffix designation. Industrial temp grade variant (LTC2299IUP) is not AEC-Q100 qualified - this ADC is intended for commercial/industrial base-station, medical imaging, and instrumentation use, not automotive.
