LTC2323HUFD-16 - Dual 16-Bit 5Msps SAR ADC | Analog Devices
Référence : LTC2323HUFD-16 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $21.5 | $21,50 |
| 10 | $19.8 | $198,00 |
| 100 | $17.45 | $1 745,00 |
| 500 | $15.2 | $7 600,00 |
| 1 000 | $13.1 | $13 100,00 |
LTC2323HUFD-16 Présentation
An ADC (analog-to-digital converter) is an integrated circuit that samples a continuous analog voltage and converts it into a discrete digital code. SAR (successive-approximation-register) ADCs use a binary-search algorithm with an internal DAC and comparator to resolve N bits in N clock cycles, trading speed for very low power and deterministic latency. Within the broader taxonomy, the LTC2323-16 belongs to the high-speed precision SAR converter family, itself a subset of data-converter ICs, which sit inside the signal-conditioning block of mixed-signal acquisition systems. Differential-input SAR ADCs like this one reject common-mode noise picked up on long sensor or transmission-line runs.
Key features include an onboard low-drift (20 ppm/C maximum) 2.048V or 4.096V temperature-compensated reference, a high-speed SPI-compatible serial interface that supports both CMOS and LVDS modes, and one-cycle latency that simplifies software timing. The wide 8V_P-P differential input range enables high-dynamic-range acquisition with high common-mode rejection, while the internal reference eliminates external reference cost and board area. CMOS or LVDS digital I/O lets the designer trade noise immunity against the number of PCB traces.
The architecture combines two matched SAR cores with shared reference and clock generation, allowing simultaneous sampling on both channels without inter-channel skew penalties. The 5Msps per channel rate and one-cycle latency make the part well-suited to multiplexed data-acquisition front-ends, motor-control feedback loops, and multi-axis vibration or sonar arrays where deterministic timing matters.
Typical applications include industrial process control and instrumentation, multi-axis motor control, medical imaging front-ends, and automotive sensor acquisition. Differential inputs pair naturally with bridge sensors, current-sense shunts, and active drive signals where common-mode voltage can swing across the supply rails.
When designing with this part, place input RC anti-alias networks close to the analog pins and route LVDS pairs with 100-ohm differential impedance. Use the exposed pad as the primary thermal path; an unbroken top-layer ground plane directly under the EP is recommended for full-speed operation across temperature.
This page synthesizes distributor pricing, drop-in package-matched alternatives, and practical PCB-layout notes not found in the manufacturer datasheet, giving engineers a single decision-ready reference for selecting and sourcing the LTC2323HUFD-16.
Alternatives de remplacement direct pour LTC2323HUFD-16 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
LTC2323CUFD-16
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LTC2323IUFD-16
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LTC2323HUFD-16#PBF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LTC2323HUFD-12
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LTC2323HUFD-16 Valeurs maximales et caractéristiques électriques
| Résolution | 16 bit + sign |
| Number of Channels | 2 (simultaneous sampling) |
| Architecture | SAR (Successive Approximation Register) |
| Sample Rate | 5 Msps per channel |
| Input Type | Differential |
| Differential Input Range | 8 V_P-P |
| INL (Maximum) | ±4 LSB |
| Tension d'alimentation | 3.3 V or 5 V single supply |
| Internal Reference | 2.048 V or 4.096 V, 20 ppm/C max drift |
| Digital Interface | SPI-compatible, CMOS or LVDS |
| Latency | 1 conversion cycle |
| Température de fonctionnement | -40 C to +125 C (H grade) |
| Boîtier | 28-lead QFN-EP (4 mm x 5 mm) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant (#PBF suffix, lead-free) |
Configuration des broches de LTC2323HUFD-16
| Broche 1 | AIN1+ — Analog input 1, positive |
| Broche 2 | AIN1- — Analog input 1, negative |
| Broche 3 | AIN2+ — Analog input 2, positive |
| Broche 4 | AIN2- — Analog input 2, negative |
| Broche 5 | REFOUT — Internal reference output (2.048/4.096 V) |
| Broche 6 | REFIN — Reference input / bypass |
| Broche 7 | GND — Analog ground |
| Broche 8 | AVDD — Analog 5V/3.3V supply |
| Broche 9 | OVDD — Digital I/O supply |
| Broche 10 | DGND — Digital ground |
| Broche 11 | CNV — Convert / start of conversion input |
| Broche 12 | SCK — Serial clock input |
| Broche 13 | SDO — Serial data output |
| Broche 14 | SDI — Serial data input (daisy-chain) |
| Broche 15 | CS — Chip select (active low) |
| Broche 16 | BUSY — Conversion busy indicator |
| Broche 17 | LVDS/CMOS — Interface mode select |
| Broche 18 | OUT+ — LVDS data output positive |
| Broche 19 | OUT- — LVDS data output negative |
| Broche 20 | CLKOUT+ — LVDS clock output positive |
| Broche 21 | CLKOUT- — LVDS clock output negative |
| Broche 22 | PD — Power-down input |
| Broche 23 | GND — Analog ground |
| Broche 24 | AVDD — Analog supply |
| Broche 25 | GND — Analog ground |
| Broche 26 | GND — Analog ground |
| Broche 27 | GND — Analog ground |
| Broche 28 | EP — Exposed pad - thermal/ground connection |
Applications typiques
LTC2323HUFD-16 convient pour 6 applications: Industrial Process Control and Instrumentation, Multi-Axis Motor Control Feedback, Medical Imaging Front-End, Automotive Sensor Acquisition, Data Acquisition Systems (DAQ), Test and Measurement Instrumentation.
Industrial Process Control and Instrumentation
The LTC2323HUFD-16 fits industrial process control because its 16-bit resolution, 5 Msps per channel throughput, and ±4 LSB INL maximum enable accurate digitization of 4-20 mA loop and bridge sensor signals. The differential 8 V_P-P input range rejects common-mode noise from long factory cabling, and the H-grade -40 C to +125 C specification handles cabinet-temperature swings near motors and heaters. The onboard 2.048/4.096 V reference with 20 ppm/C max drift eliminates external reference components, reducing BOM cost. Designers route one channel to a pressure transducer and the second to a thermocouple-amplifier output, achieving simultaneous acquisition without inter-channel skew.
Recommandé
Multi-Axis Motor Control Feedback
The LTC2323HUFD-16's dual simultaneous-sampling SAR channels suit multi-axis motor control where current and voltage feedback must be captured at the same instant. One-cycle latency simplifies software timing for field-oriented control loops running above 50 kHz. The H-grade temperature range supports under-hood automotive ECU deployment, while the 3.3 V or 5 V single-supply operation aligns with typical MCU and FPGA I/O rails. SPI-compatible CMOS or LVDS output lets designers isolate noisy gate-drive grounds from control MCU traces. The 5 Msps per channel rate oversamples PWM edges, giving clean current waveforms for torque-ripple analysis.
Recommandé
Medical Imaging Front-End
The LTC2323HUFD-16's 16-bit + sign resolution and low-noise SAR architecture suit medical imaging front-ends such as ultrasound beamformers and patient-monitoring acquisition boards. Differential inputs pair naturally with piezoelectric transducer pre-amplifier outputs, while 8 V_P-P range captures both low-amplitude echo and high-amplitude therapy signals after gain switching. One-cycle latency enables real-time closed-loop control of transmit pulses, and H-grade operation supports clinical-environment thermal envelopes. The onboard reference and small QFN-EP footprint shrink the analog front-end, allowing denser multi-channel PCB arrays typical of portable ultrasound carts.
Recommandé
Automotive Sensor Acquisition
The LTC2323HUFD-16 in H grade (-40 C to +125 C) is qualified for automotive sensor acquisition including chassis, powertrain, and ADAS sensor modules. Its 5 Msps per channel dual SAR channels simultaneously digitize wheel-speed, suspension-position, and inertial-measurement signals, while the 8 V_P-P differential input rejects ground-shift noise across long harness runs. The SPI-compatible LVDS interface mode maintains signal integrity across vehicle harnesses subject to high EMI from ignition and motor drives. Internal reference simplifies AEC-Q100 BOM minimization, and the QFN-EP package is compatible with standard automotive PCB assembly and inspection processes.
Recommandé
Data Acquisition Systems (DAQ)
The LTC2323HUFD-16 targets high-channel-count DAQ systems where two simultaneous 5 Msps SAR channels per chip maximize density. Its 16-bit + sign dynamic range and 8 V_P-P differential inputs accommodate direct connection to conditioned bridge, thermocouple, and current-shunt signals without external gain stages. The onboard 20 ppm/C max drift reference simplifies calibration, while LVDS output mode streams data across backplanes to FPGAs or microcontrollers without signal-integrity penalties. One-cycle deterministic latency simplifies timing closure in synchronized multi-board systems that must trigger acquisition across hundreds of channels.
Recommandé
Test and Measurement Instrumentation
The LTC2323HUFD-16 fits bench-top and ATE-class test and measurement instrumentation requiring 16-bit accuracy at multi-Msps speeds. Its differential inputs and wide 8 V_P-P range allow direct connection to oscilloscope probes, arbitrary-waveform-generator outputs, and power-supply feedback nodes. The onboard reference removes a calibration variable, and the SPI-compatible CMOS or LVDS interface routes cleanly to FPGA or DSP back-ends for real-time DSP. H-grade temperature operation supports chassis-temperature instrumentation, while 5 Msps per channel captures switching-power edge transitions with sub-microsecond resolution for power-integrity analysis.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour LTC2323HUFD-16 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | LTC2323CUFD-16 | LTC2323IUFD-16 | LTC2323HUFD-16#PBF | LTC2323HUFD-12 |
|---|---|---|---|---|---|
| Brand | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices |
| Package | 28-lead QFN-EP (4x5 mm) | 28-lead QFN-EP (4x5 mm) - same | 28-lead QFN-EP (4x5 mm) - same | 28-lead QFN-EP (4x5 mm) - same | 28-lead QFN-EP (4x5 mm) - same |
| Resolution | 16 bit + sign | 16 bit + sign | 16 bit + sign | 16 bit + sign | 12 bit |
| Sample Rate | 5 Msps per channel | 5 Msps per channel | 5 Msps per channel | 5 Msps per channel | 5 Msps per channel |
| Operating Temperature | -40 C to +125 C (H grade) | 0 C to +70 C (C grade) | -40 C to +85 C (I grade) | -40 C to +125 C (H grade) | -40 C to +125 C (H grade) |
| Internal Reference | 2.048/4.096 V, 20 ppm/C | 2.048/4.096 V, 20 ppm/C | 2.048/4.096 V, 20 ppm/C | 2.048/4.096 V, 20 ppm/C | 2.048/4.096 V, 20 ppm/C |
| Digital Interface | SPI CMOS/LVDS | SPI CMOS/LVDS | SPI CMOS/LVDS | SPI CMOS/LVDS | SPI CMOS/LVDS |
| Differential Input Range | 8 V_P-P | 8 V_P-P | 8 V_P-P | 8 V_P-P | 8 V_P-P |
Principaux différenciateurs
- H-grade temperature for automotive and industrial deployments (vs LTC2323CUFD-16)
- Industrial-grade option with lower cost for benign environments (vs LTC2323IUFD-16)
- 16-bit dynamic range for instrumentation-grade SNR (vs LTC2323HUFD-12)
Notes de conception
Route analog and digital grounds as a single unified ground plane with the QFN-EP exposed pad tied directly to that plane via at least nine thermal vias in a 3x3 array. Place the input RC anti-alias networks (typically 50 ohm + 1 nF) within 5 mm of the AIN+/AIN- pins to limit kickback from the switched-capacitor SAR input. Keep LVDS pairs at 100-ohm differential impedance and length-match within 2 mm to preserve the 5 Msps eye at the receiver.
The QFN-EP pad is the primary thermal path. Without a continuous top-layer copper pour directly under the exposed pad and at least nine plated thermal vias to the inner ground plane, the part may derate above approximately 3 Msps continuous dual-channel operation at +85 C. For automotive -40 C to +125 C operation at full 5 Msps, expand the EP copper pour to at least 100 mm^2 on top and inner layers.
Use LVDS mode whenever the SPI traces exceed 50 mm or pass through noisy regions (near gate drives, switching converters, or motor phases). LVDS reduces ground-loop-induced jitter by transmitting differentially and provides 250 mV typical noise margin. Add a 100-ohm termination resistor at the far end of each LVDS pair; place termination within 5 mm of the receiver pins and bypass OVDD with a 0.1 uF X7R capacitor plus a 10 uF bulk ceramic.
Do not float the LVDS/CMOS mode-select pin: tie it high for LVDS or low for CMOS. A floating pin may cause intermittent interface failures. Do not exceed the absolute-maximum AVDD of 5.5 V or apply analog inputs before AVDD ramps; the input ESD diodes will clamp and inject errors. The REFOUT pin requires a 10 uF X7R bypass close to the pin and a 0.1 uF X7R in parallel for the internal reference to settle within 1 ms at power-up.
Informations de conformité
#PBF suffix indicates lead-free RoHS-compliant lead finish. AEC-Q100 status not explicitly stated in verified web data; H-grade temperature range supports automotive design-ins but does not by itself imply AEC-Q100 qualification. Confirm with manufacturer datasheet for AEC-Q100 lot-level data.
