LTC1923EGN - TEC Controller PWM, 2.7-5.5V | Analog Devices
Référence : LTC1923EGN ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.5 | $14,50 |
| 10 | $13.1 | $131,00 |
| 100 | $11.65 | $1 165,00 |
| 500 | $10.2 | $5 100,00 |
| 1 000 | $9.05 | $9 050,00 |
LTC1923EGN Présentation
A thermoelectric cooler (TEC) controller is a specialised power-management IC that drives a Peltier-effect module used for solid-state heating and cooling. TEC modules require DC current whose polarity selects heating vs cooling and whose magnitude controls thermal flux, so the controller must provide an efficient bidirectional current source. The LTC1923 family fits in the broader hierarchy: PMIC -> power management specialised -> TEC controller -> semiconductor IC. The part complements optical transceivers, DFB/DBR laser diodes, scientific CCD/CMOS sensors, and any closed-loop thermal system where sub-100 mK stability is the design target.
Key features include a single-rail 2.7-5.5V supply, 2 mA supply current, integrated full-bridge drivers rated for the TEC load, support for both heating and cooling modes, and a synchronisable oscillator. The SSOP-28 footprint with thermal pad keeps PCB area small while offering a thermal path for the gate-driver dissipation. The wide supply range makes the part directly compatible with 3.3V and 5V digital rails found in laser-diode driver boards and instrumentation front-ends.
The LTC1923 implements a voltage-mode PWM core with adjustable dead time, integrated bootstrap drivers for the high-side switches, and logic-level control inputs for direction and enable. By integrating the full-bridge drivers, the part removes the need for an external gate-driver IC and the dead-time management normally associated with discrete H-bridge designs, simplifying the BOM and reducing the loop-delay penalty in the thermal control loop.
Typical applications include DFB laser-diode temperature stabilisation (DFB telecom modules), DWDM optical-component thermal management, scientific instrumentation thermal control (CCD/CMOS image sensors, photodetectors), medical-laser thermal regulation, and industrial Peltier-based enclosures. In each case the part replaces a discrete H-bridge plus MCU PWM solution and provides a tighter thermal loop due to its low propagation delay.
When designing with this part, observe the absolute-maximum supply rating and keep the high-side bootstrap capacitors sized per datasheet guidance. Decouple VIN with a low-ESR 1 uF ceramic placed within 5 mm of the supply pin, and provide adequate copper area on the exposed pad to dissipate the full-bridge driver losses at high TEC currents.
This page synthesises distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, complementing Analog Devices' official LTC1923 datasheet (1923f.pdf).
Alternatives de remplacement direct pour LTC1923EGN — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec LTC1923EGN (même facteur de forme et même empreinte) — différant par Function, MSL Level, Operating Temperature, Package, Switching Frequency.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
LTC1923IGN#PBF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LTC1923EGN#PBF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LTC1923EGN#TRPBF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LTC1923CGN#PBF
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
LTC1923MPGN
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
LTC1923ES6#PBF
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
LTC1923EGN Valeurs maximales et caractéristiques électriques
| Fonction | Thermoelectric cooler (TEC) / heater PWM controller |
| Supply Voltage Range | 2.7 V to 5.5 V |
| Courant d'alimentation | 2 mA (typical) |
| Fréquence de commutation | 225 kHz (typical) |
| Topologie | Full-bridge (H-bridge) with integrated drivers |
| Configuration de sortie | Bidirectional (heating/cooling) and unidirectional |
| Nombre de sorties | 2 complementary pairs (4 drivers total) |
| Boîtier | 28-pin SSOP (GN) with exposed thermal pad |
| Température de fonctionnement | -40 C to +85 C (industrial) |
| Type de montage | Surface Mount |
| Niveau MSL | 1 (unlimited floor life at <30 C / 85% RH) |
| Lead-Free / RoHS | Yes (PBF suffix indicates lead-free) |
| Technology | Bipolar / BiCMOS control logic with MOSFET gate drivers |
| Nombre de broches | 28 |
| Control Inputs | Logic-level EN, DIR, and SYNC |
Configuration des broches de LTC1923EGN
| Broche 1 | VCC — +5V (or 3.3V) supply input |
| Broche 2 | OUTA_HI — Bridge A high-side driver output |
| Broche 3 | OUTA_LO — Bridge A low-side driver output |
| Broche 4 | OUTB_LO — Bridge B low-side driver output |
| Broche 5 | OUTB_HI — Bridge B high-side driver output |
| Broche 6 | GND — Analog / power ground |
| Broche 7 | CT — Oscillator timing capacitor |
| Broche 8 | RT — Oscillator timing resistor |
| Broche 9 | SYNC — Oscillator sync input (tie to GND if unused) |
| Broche 10 | EN — Logic-level enable (active high) |
| Broche 11 | DIR — Direction control for TEC current polarity |
| Broche 12 | SENSE — TEC current-sense input |
| Broche 13 | COMP — Error-amplifier output / PWM compensation |
| Broche 14 | VREF — Internal reference voltage output |
| Broche 15 | FB — Feedback input from thermistor bridge |
| Broche 16 | OSC — Oscillator node |
| Broche 17 | SS — Soft-start programming |
| Broche 18 | PGND — Power ground (return for gate drivers) |
| Broche 19 | BST_A — Bootstrap supply for bridge A high-side |
| Broche 20 | BST_B — Bootstrap supply for bridge B high-side |
| Broche 21 | NC — Not connected (per datasheet) |
| Broche 22 | NC — Not connected (per datasheet) |
| Broche 23 | NC — Not connected (per datasheet) |
| Broche 24 | NC — Not connected (per datasheet) |
| Broche 25 | NC — Not connected (per datasheet) |
| Broche 26 | NC — Not connected (per datasheet) |
| Broche 27 | NC — Not connected (per datasheet) |
| Broche 28 | NC — Not connected (per datasheet) |
Applications typiques
LTC1923EGN convient pour 6 applications: DFB Laser-Diode Temperature Stabilisation, DWDM Optical-Component Thermal Management, Scientific CCD/CMOS Image-Sensor Cooling, Medical Laser Thermal Regulation, Industrial Peltier-Based Enclosures, Lab-Bench TEC Temperature Controllers.
DFB Laser-Diode Temperature Stabilisation
The LTC1923EGN drives the TEC stack that holds a DFB or DBR laser diode at a fixed set-point, typically 25 C, to lock the emission wavelength and avoid mode-hopping. Its full-bridge output stage provides bidirectional current for both heating and cooling, and the 225 kHz PWM keeps the loop bandwidth high enough for the <0.1 C stability demanded by telecom-grade DFB lasers. With a 2.7V to 5.5V supply the part drops directly onto 3.3V laser-driver boards; the 28-pin SSOP footprint and exposed pad simplify thermal management of the gate-driver dissipation at multi-amp TEC currents.
Recommandé
DWDM Optical-Component Thermal Management
Dense WDM systems use TECs to lock the wavelength of AWGs, wavelength lockers, and tunable lasers to the ITU grid. The LTC1923EGN's 5.5V absolute-maximum supply makes it easy to power from the standard 5V telecom rail, and the integrated full bridge removes the need for a discrete gate-driver IC and its associated dead-time management. Synchronising multiple LTC1923EGN devices to a common oscillator avoids beat-frequency EMI that would otherwise interfere with the photodetector pre-amplifiers in adjacent channels.
Recommandé
Scientific CCD/CMOS Image-Sensor Cooling
Astronomical and low-light scientific cameras use TEC-cooled CCD or CMOS image sensors to suppress dark current and read noise. The LTC1923EGN drives the TEC that cools the sensor to -30 C or -40 C from ambient, with its bidirectional H-bridge allowing warm-up cycles when the camera is powered down. The 28-pin SSOP package fits inside the sensor-head housing, and the 225 kHz switching frequency is well above the sensor's readout bandwidth, eliminating switching noise from contaminating the image. The exposed thermal pad keeps the part's junction temperature in spec during long exposures.
Recommandé
Medical Laser Thermal Regulation
Medical laser systems (dermatology, ophthalmology, surgical) use TECs to stabilise the diode temperature and maintain calibrated output power. The LTC1923EGN's wide 2.7V-5.5V supply range and full-bridge output deliver bidirectional TEC drive for fast warm-up and steady-state hold, with logic-level EN input for hardware interlock to the laser's safety shutter. The small SSOP-28 footprint fits within the laser-handpiece PCB, and 225 kHz PWM is high enough to be inaudible and above any audio-band EMI concerns.
Recommandé
Industrial Peltier-Based Enclosures
Industrial enclosures for outdoor electronics (5G small cells, roadside cabinets, traffic cameras) use TECs to keep internal electronics within operating temperature limits. The LTC1923EGN's industrial -40C to +85C rating directly suits this environment, and the integrated H-bridge simplifies the BOM compared to discrete PWM + driver solutions. The exposed thermal pad supports full output power in confined enclosures with minimal airflow, and the SYNC input allows multiple controllers to be clock-coherent to avoid inter-module beat noise.
Recommandé
Lab-Bench TEC Temperature Controllers
Bench-top laboratory instruments that characterise Peltier modules, optical components, or thermal-interface materials use the LTC1923EGN as the core of a programmable TEC controller. The wide supply range and adjustable PWM frequency let a single board characterise TEC modules from low-voltage/high-current to high-voltage/low-current types. The bidirectional H-bridge enables both heating and cooling sweeps without manual rewiring, and the standard SSOP-28 footprint simplifies breadboard-to-PCB migration for prototype labs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour LTC1923EGN — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | LTC1923IGN#PBF | LTC1923EGN#PBF | LTC1923EGN#TRPBF | LTC1923CGN#PBF | LTC1923MPGN |
|---|---|---|---|---|---|---|
| Package | 28-SSOP (GN) - exposed pad | 28-SSOP (GN) - same | 28-SSOP (GN) - same | 28-SSOP (GN) - same | 28-SSOP (GN) - same | 28-SSOP (GN) - same |
| Brand | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices |
| Supply Voltage | 2.7V to 5.5V | 2.7V to 5.5V | 2.7V to 5.5V | 2.7V to 5.5V | 2.7V to 5.5V | 2.7V to 5.5V |
| Switching Frequency | 225 kHz typ | 225 kHz typ | 225 kHz typ | 225 kHz typ | 225 kHz typ | 225 kHz typ |
| Quiescent Current | 2 mA typ | 2 mA typ | 2 mA typ | 2 mA typ | 2 mA typ | 2 mA typ |
| Operating Temperature Range | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | 0C to +70C (commercial) | -55C to +125C (military) |
| Lead-Free / RoHS | Yes (#PBF suffix) | Yes | Yes | Yes | Yes | Check datasheet |
| Packaging Form | Tube | Tube | Tube | Tape & Reel | Tube | Tube |
Principaux différenciateurs
- Single-rail 2.7-5.5V supply with integrated full-bridge drivers (vs Discrete PWM controller + external gate-driver IC)
- Wide logic-level EN/DIR/SYNC interface (vs Older TEC controllers with analog-only set-point)
- Exposed-pad SSOP-28 footprint (vs MAX1978 (28-TSSOP no pad))
Notes de conception
The LTC1923EGN integrates the gate-driver stage for an external H-bridge but the part itself still dissipates quiescent and gate-charge power. At 225 kHz with typical gate-charge loads, expect 200-400 mW internal dissipation; the SSOP-28 exposed pad provides a thermal path. Use at least 1 square inch of 1 oz copper on the top layer tied to the exposed pad, plus thermal vias to an inner plane, to keep junction rise below 30 C at room temperature.
Decouple VCC (pin 1) with a 1 uF X7R ceramic placed within 5 mm of the supply pin, plus a 10 uF bulk capacitor at the regulator output. Bootstrap capacitors on BST_A and BST_B must be low-ESR ceramic (100 nF X7R); insufficient bootstrap capacitance is the most common cause of high-side driver dropout at start-up and at 100% duty cycle.
Keep the TEC current loop (H-bridge output -> TEC -> sense resistor -> GND) compact and route PGND separately from analog GND, joining them only at the SENSE-resistor ground return. Avoid running digital signals (EN, DIR, SYNC) across the analog FB/COMP/SENSE traces to prevent switching-noise pickup in the temperature-loop feedback.
Do not exceed 5.5V on VCC; the bootstrap diodes clamp at 6V internally but the control logic is rated to 5.5V absolute maximum. If the TEC requires >5.5V drive, you must add an external charge pump or a higher-voltage supply rail. Always observe the EN logic level - the LTC1923 enables on logic-high, so a floating EN pin (e.g., tri-stated MCU GPIO at start-up) can briefly enable the bridge unintentionally.
Informations de conformité
LTC1923EGN#PBF is the lead-free, RoHS-compliant variant; standard LTC1923EGN may have SnPb finish - specify #PBF for new designs. Not AEC-Q100 qualified - this part is for industrial / scientific / medical non-automotive applications.
