LTM4626IY#PBF - 12A, 20V µModule Step-Down Regulator | ADI
Référence : LTM4626IY#PBF ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $32.5 | $32,50 |
| 10 | $30.16 | $301,60 |
| 100 | $27.85 | $2 785,00 |
| 500 | $25.4 | $12 700,00 |
| 1 000 | $22.95 | $22 950,00 |
LTM4626IY#PBF Présentation
A µModule regulator is a system-in-package (SiP) power converter in which the controller, MOSFETs, magnetics, and bypass components are co-packaged and pre-tuned by the manufacturer. By collapsing a discrete buck circuit into a single BGA, µModule devices shorten PCB design cycles, reduce radiated EMI, and minimize board area. The LTM4626 family belongs to the broader PoL (Point-of-Load) DC/DC converter category within power management ICs, sharing its SiP DNA with the LTM4627, LTM4638, and LTM4681 families from Analog Devices.
Key features of the LTM4626IY#PBF include ±1.5% total DC output accuracy, internal temperature monitoring with analog telemetry, selectable internal or external feedback, current-mode control for parallel multiphase operation, and programmable soft-start. The integrated inductor and FETs eliminate external loop-compensation components, simplifying the BOM to primarily input/output ceramic capacitors and feedback resistors.
Architecturally, the LTM4626 uses a valley current-mode controller with internal top and bottom N-channel MOSFETs and a shielded drum-core inductor. The BGA's bottom-side thermal pad connects directly to PCB copper for heat spreading, enabling full 12 A operation without external heatsinks on typical 4-layer boards. Remote-sense inputs compensate for PCB IR drop.
Typical applications include high-density FPGA/ASIC core and SERDES rails, telecom/datacom point-of-load conversion, PCIe and ATCA card power, industrial automation controllers, and any 12 V-bus distributed-power system needing a low-profile 6.25 mm-square footprint. Parallel multiple LTM4626 devices for 24 A, 36 A, and higher outputs.
When designing with this device, follow the datasheet's reference layout for the BGA land pattern and decoupling scheme. Use X7R or X5R ceramic capacitors with low ESR at both VIN and VOUT, place return vias adjacent to PGND balls, and provide at least 1 oz copper pours over multiple inner layers to keep the junction temperature below 125°C under full load.
This page synthesizes distributor pricing, drop-in equivalents, and practical layout notes not found in a quick glance at the datasheet, helping engineers select, qualify, and source the LTM4626IY#PBF efficiently.
Alternatives de remplacement direct pour LTM4626IY#PBF — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
LTM4626HY#PBF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LTM4626EY#PBF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LTM4626MPY#PBF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LTM4627IY#PBF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LTM4626IY
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
LTM4626IY#PBF Valeurs maximales et caractéristiques électriques
| Topologie | Step-down (buck) µModule regulator |
| Plage de tension d'entrée | 3.1 V to 20 V |
| Plage de tension de sortie | 0.6 V to 5.5 V (adjustable) |
| Courant de sortie maximal | 12 A |
| Nombre de sorties | 1 |
| Output Voltage Accuracy | ±1.5% (total DC) |
| Internal Operating Temperature Range | -40°C to +125°C (I-grade) |
| Package Type | BGA-25 (6.25 mm × 6.25 mm × 3.87 mm) |
| Type de montage | Surface Mount |
| Integrated Inductor | Yes (inside package) |
| Integrated Power FETs | Yes (top and bottom N-FET) |
| Démarrage progressif | Programmable |
| Remote Sense | Yes |
| Parallel Operation | Yes (multiphase current sharing) |
| Output Temperature Monitor | Analog TMON output |
| Statut RoHS | Compliant |
Configuration des broches de LTM4626IY#PBF
| Broche A1 | VIN — Input voltage supply |
| Broche A2 | VIN — Input voltage supply |
| Broche A3 | VIN — Input voltage supply |
| Broche A4 | VIN — Input voltage supply |
| Broche A5 | VIN — Input voltage supply |
| Broche B1 | VIN — Input voltage supply |
| Broche B2 | VIN — Input voltage supply |
| Broche B3 | VIN — Input voltage supply |
| Broche B4 | PGND — Power ground |
| Broche B5 | PGND — Power ground |
| Broche C1 | PGND — Power ground |
| Broche C2 | PGND — Power ground |
| Broche C3 | PGND — Power ground |
| Broche C4 | PGND — Power ground |
| Broche C5 | PGND — Power ground |
| Broche D1 | VOUT — Regulated output voltage |
| Broche D2 | VOUT — Regulated output voltage |
| Broche D3 | VOUT — Regulated output voltage |
| Broche D4 | VOUT — Regulated output voltage |
| Broche D5 | VOUT — Regulated output voltage |
| Broche E1 | SGND — Signal ground |
| Broche E2 | PGND — Power ground |
| Broche E3 | TMON — Output temperature monitor |
| Broche E4 | SENSE+ — Remote sense + (feedback) |
| Broche E5 | SENSE- — Remote sense - (signal ground sense) |
Applications typiques
LTM4626IY#PBF convient pour 6 applications: FPGA Core & SERDES Power Rail, Point-of-Load on 12 V Intermediate Bus, Industrial Automation Controllers, ATCA / Telecom Card Power, GPU / AI Accelerator Card Power, Test & Measurement Instrumentation.
FPGA Core & SERDES Power Rail
The LTM4626IY#PBF powers FPGA core (VCCINT) and high-speed transceiver (SERDES) rails at 0.85 V / 1.0 V / 1.2 V at up to 12 A. Its 0.6 V to 5.5 V adjustable output covers virtually every common FPGA rail, while ±1.5% total DC accuracy stays inside FPGA tolerance and avoids under-voltage lock-out at cold. The integrated inductor and internal bypass capacity suppress switching ripple from coupling into serializer/deserializer channels, which is critical for 10/25/100 Gbps SERDES jitter budgets. For multi-rail FPGAs, the LTM4626 scales by paralleling two or more devices for 24 A or 36 A, keeping the same BGA footprint per phase and using the multiphase clock-share feature to spread spectrum. Use 4-layer PCB stack-up with 1 oz pours tied to PGND balls.
Recommandé
Point-of-Load on 12 V Intermediate Bus
The LTM4626IY#PBF accepts a 3.1 V to 20 V input, making it ideal for stepping down a 12 V intermediate bus to sub-rails such as 5 V, 3.3 V, 2.5 V, 1.8 V, or 1.0 V on PoL converter cards in compute and networking boards. The 20 V tolerance gives ample headroom for 12 V bus transients and telecom battery-voltage excursions, while the µModule integration reduces a discrete buck design (controller + FETs + inductor + compensation) into a single BGA, freeing PCB area for signal integrity or additional channels. Programmable soft-start allows sequencing to fit ATCA and PCIe card inrush budgets. The Analog Devices datasheet's reference layout achieves >1,000 W/in³ power density, ideal for blade-server and edge-compute PoL nodes.
Recommandé
Industrial Automation Controllers
The LTM4626IY#PBF I-grade -40°C to +125°C internal operating-temperature range makes it suitable for industrial PLC, motion controller, and process-instrumentation boards where ambient is often elevated by sealed enclosures. From a 24 V field-bus (regenerated to 12-15 V by an upstream isolated DC/DC), the LTM4626 generates the 5 V, 3.3 V, and 1.8 V rails powering MCUs, ADCs, gate drivers, and isolated communication transceivers. The BGA's bottom paddle bonds directly to inner-layer ground copper, lifting the θJA rating low enough to drive 12 A continuously at 70°C ambient with no external heatsink. Internal output-temperature telemetry (TMON pin) supports early-board-level stress screening.
Recommandé
ATCA / Telecom Card Power
The LTM4626IY#PBF supports ATCA, AMC, and MicroTCA cards where a nominal -48 V feed is converted upstream to a 12 V intermediate bus, which then must be locally dropped to processor core, memory, and I/O voltages with tight ripple and accuracy limits. The LTM4626's internally compensated current-mode control keeps load-regulation under ±1.5% across load steps, while the µModule's shielded drum-core inductor reduces radiated EMI - an essential property when cards are densely packed in a shelf with crosstalk-prone analog and RF channels. Multiple LTM4626 parts on a card are interleaved via CLKOUT/MODE_PLLIN, reducing input-ripple amplitude by N phase cancellation and easing input-filter design.
Recommandé
GPU / AI Accelerator Card Power
Modern GPU and inference accelerators stack dozens of amps of core load at sub-1 V rails. Paralleling two or three LTM4626IY#PBF modules yields 24-36 A on a tightly regulated 0.85 V or 0.9 V rail, with current-mode sharing per phase to balance thermal stress. The compact 6.25 mm × 6.25 mm footprint enables dense packing on accelerator cards where every square millimeter is critical. Compared with discrete buck designs, the µModule's pre-tuned compensation removes a full PCB rework cycle, accelerating time-to-prototype for emerging AI silicon. Modulated switching frequency is available via SYNC input to align the converters to a system clock, simplifying conducted-EMI mitigation on the host card.
Recommandé
Test & Measurement Instrumentation
Bench and production test equipment demands clean, accurate DC rails to power ADCs, DACs, precision op-amps, and FPGA-based DSP engines. The LTM4626IY#PBF provides 0.6 V to 5.5 V at up to 12 A with ±1.5% accuracy and low output ripple across the full load range, ideal for generating local rails inside the chassis next to sensitive analog circuits. The integrated inductor and FETs contain the AC switching currents inside the package boundary, drastically reducing noise injection into nearby analog signal paths compared with discrete switching converters. Remote-sense inputs correct for PCB IR drop on long cables between the module and the load under test, ensuring the rails reach the DUT at the precise programmed voltage.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour LTM4626IY#PBF — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | LTM4626HY#PBF | LTM4626EY#PBF | LTM4626MPY#PBF | LTM4627IY#PBF | LTM4626IY |
|---|---|---|---|---|---|---|
| Brand | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices |
| Package | BGA-25 (6.25mm x 6.25mm) | BGA-25 (6.25mm x 6.25mm) - same | BGA-25 (6.25mm x 6.25mm) - same | BGA-25 (6.25mm x 6.25mm) - same | BGA-25 (15mm x 15mm) - larger | BGA-25 (6.25mm x 6.25mm) - same |
| Maximum Output Current | 12 A | 12 A | 12 A | 12 A | 15 A (+25%) | 12 A |
| Input Voltage Range | 3.1 V to 20 V | 3.1 V to 20 V | 3.1 V to 20 V | 3.1 V to 20 V | 3.1 V to 20 V | 3.1 V to 20 V |
| Output Voltage Range | 0.6 V to 5.5 V | 0.6 V to 5.5 V | 0.6 V to 5.5 V | 0.6 V to 5.5 V | 0.6 V to 5.5 V | 0.6 V to 5.5 V |
| Temperature Grade | I-grade (-40C to +125C) | H-grade (different supplier) | E-grade (0C to +125C) | MP-grade (-55C to +125C) | I-grade (-40C to +125C) | I-grade (-40C to +125C) |
| Topological Family | Buck µModule (single 12A) | Buck µModule (single 12A) | Buck µModule (single 12A) | Buck µModule (single 12A) | Buck µModule (single 15A) | Buck µModule (single 12A) |
| Parallel Multiphase Operation | Yes | Yes | Yes | Yes | Yes | Yes |
| RoHS/Lead-Free | RoHS (#PBF suffix) | RoHS | RoHS | RoHS | RoHS | Non-RoHS (no #PBF) |
Principaux différenciateurs
- Compact BGA-25 6.25 mm × 6.25 mm footprint with integrated magnetics (vs LTM4627IY#PBF (15 mm × 15 mm BGA))
- MIL/MP temperature-grade option available on the same die/footprint (vs LTM4626EY#PBF (E-grade 0°C to +125°C))
- Bottom-side paddle thermal pad for direct PCB copper bonding (vs Discrete buck controllers (e.g., LTC3871))
Notes de conception
Use the reference land pattern, via array, and component placements from the Analog Devices LTM4626 datasheet PCB layout example. Place VIN and VOUT ceramic capacitors (typically 2x 22 µF X7R 1210 plus 1x 1 µF X7R 0603) within 1-2 mm of the BGA balls, with the GND via pattern directly under PGND balls to provide shortest current return paths and minimal PCB loop inductance for clean switching. Use 1 oz copper on outer layers plus 2 oz on inner layers for thermal spreading. Estimated thermal resistance is approximately 13°C/W on a properly laid out 4-layer board; multiply this by total dissipation to estimate junction temperature rise above ambient and ensure it remains below 125°C at worst-case full load.
Estimated: at 12 VIN to 3.3 VOUT at 12 A, the LTM4626's power dissipation is approximately (12-3.3)*12/0.83 ≈ 12.6 W (assuming 83% efficiency). With ~13°C/W θJA, junction rise above ambient is around 163°C plus ambient, requiring derating above 0°C ambient. For >12 V to <1.8 V conversions at full 12 A load, either reduce ambient, increase PCB copper area (adding 4-6 inner copper pads tied to GND under the module), or parallel-multiphase two LTM4626 modules to halve the per-module thermal stress. The internal TMON pin can be sampled by an ADC for board-level thermal monitoring.
Place the external feedback resistor divider (typically 30.1 kΩ top / 10 kΩ bottom for 2.5 V output, or 14.3 kΩ / 10 kΩ for 1.2 V output) right at the SENSE+ and SENSE- balls on the LTM4626 BGA. Keep the SENSE+ trace away from the VIN/VOUT switching nodes to avoid noise injection into the feedback path. For multiphase paralleling, run the SHARE_CLK and SYNC lines in matched-length traces between modules, and attach the COMP and TMON leads in a careful star-ground configuration. The Analog Devices LTM4626 datasheet pinout table specifies digital pin locations that are worth re-checking during PCB layout review to avoid costly respins.
Informations de conformité
RoHS compliance indicated by #PBF suffix per Analog Devices product page. Not AEC-Q100 qualified (industrial/compute use, not automotive).
