M2GL090T-FG484I - 86K LLE IGLOO2 FPGA | Microchip
Référence : M2GL090T-FG484I ✓ ActifM2GL090T-FG484I Présentation
An FPGA is a programmable semiconductor whose configurable logic blocks and I/O can be interconnected to implement digital systems. The IGLOO2 family belongs to the broader FPGA and CPLD hierarchy within programmable logic devices. By retaining configuration data in flash, the M2GL090T-FG484I supports systems that need field-updatable logic without external configuration memory.
The device provides 86,316 logic cells, equivalent to the 86K LLE class, together with 267 I/O. Its 1.2 V operating supply and 484-ball BGA package make it appropriate for compact, high-pin-count industrial, communications, and embedded-control designs. The -1 suffix identifies a particular device grade, while the trailing I denotes the industrial-temperature option associated with the MPN.
Microchip positions the M2GL090T family for programmable control-plane logic, protocol bridging, I/O conversion and expansion, video or image processing, and secure-connectivity functions. The large I/O count provides substantial connectivity for parallel interfaces, memory interfaces, control signals, and high-speed programmable I/O. Its 484-BGA footprint also demands careful PCB layout, power delivery, via-in-pad consideration, and thermal verification.
Typical designs include Gigabit Ethernet interface logic, dual PCI Express control-plane blocks, industrial protocol converters, image-processing pipelines, system-management controllers, and secure networking equipment. The 267 I/O count is particularly useful when a design must combine multiple bus interfaces, data conversion functions, and supervisory logic in one programmable device.
Designers should use the manufacturer pinout and package information when assigning BGA balls and planning power planes. Differential pairs, high-speed interfaces, and sensitive clocks require controlled impedance and return-path continuity. Thermal analysis must include the package, PCB copper, vias, airflow, and the power dissipated by the configured logic rather than relying on a generic FPGA thermal estimate.
This page combines the confirmed device resources, package, temperature range, and application roles with a drop-in comparison, practical PCB guidance, and structured selection criteria. It is intended to help engineers determine whether the M2GL090T-FG484I fits a specific programmable-logic design before reviewing the detailed manufacturer documentation.
Alternatives de remplacement direct pour M2GL090T-FG484I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec M2GL090T-FG484I (même facteur de forme et même empreinte) — différant par Device Type, Package, Logic Elements.
M2GL090T-1FG484I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
M2GL090-FGG484I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
M2GL090T-FG484I Valeurs maximales et caractéristiques électriques
| Device Type | IGLOO2 low-density flash FPGA |
| Logic Cells | 86,316 cells |
| Logic Elements | 86K LEs |
| User I/O | 267 I/O |
| Tension d'alimentation de fonctionnement | 1.2 V |
| Minimum Operating Temperature | -40 C |
| Maximum Operating Temperature | +100 C |
| Boîtier | 484-BGA |
| Package Type | FPBGA-484 |
| Package Pin or Ball Count | 484 balls |
| Style de montage | SMD/SMT |
| Packaging | Tray |
| Configuration Memory Type | Flash |
| Programmable Logic Family | IGLOO2 series |
| Product Category | FPGA - Field Programmable Gate Array |
Guide de configuration des broches du M2GL090T-FG484I 484 balls
Configuration des broches du M2GL090T-FG484I (boîtier 484 balls). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour M2GL090T-FG484I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
M2GL090T-FG484I convient pour 6 applications: Gigabit Ethernet Control Plane, PCI Express Control and Interface Logic, Industrial Protocol Bridging, Video and Image Processing Pipeline, System Management and Secure Connectivity, I/O Expansion and System Control.
Gigabit Ethernet Control Plane
The M2GL090T-FG484I fits a Gigabit Ethernet control-plane design because Microchip identifies the IGLOO2 family for that function. Its 86,316 logic cells can accommodate packet-control, descriptor, status, interrupt, and interface-conversion logic, while 267 I/O provide substantial connectivity to transceivers, PHYs, memories, and supervisory components. The 1.2 V operating supply supports contemporary low-voltage digital logic. Engineers should partition timing-sensitive paths, verify clock-domain requirements, and confirm the exact I/O standard in the manufacturer documentation before finalizing the 484-BGA layout.
Recommandé
PCI Express Control and Interface Logic
The M2GL090T-FG484I is suitable for PCI Express control-plane and interface-adaptation logic, an application highlighted for the IGLOO2 family. Its 86,316 logic cells can support transaction handling, state machines, arbitration, configuration, status reporting, and custom data-path functions. With 267 I/O, the device can connect multiple buses, memories, and control signals without requiring several discrete logic devices. The design must still use the manufacturer timing constraints, reference-clock requirements, and board-level signal-integrity practices appropriate to each implemented interface.
Recommandé
Industrial Protocol Bridging
The M2GL090T-FG484I fits industrial protocol-bridging designs that combine multiple fieldbus, serial, parallel, or legacy interfaces. Its 86,316 logic cells provide substantial capacity for protocol state machines, data buffering, conversion tables, diagnostics, and supervisory functions. The 267-I/O count is valuable when bridging requires simultaneous access to several buses and discrete control signals. The -40 C to +100 C operating range supports industrial environments, while engineers should verify timing margins, isolation strategy, connector protection, and complete device-grade requirements for the deployed system.
Recommandé
Video and Image Processing Pipeline
The M2GL090T-FG484I can implement programmable video and image-processing functions identified by Microchip for the IGLOO2 family. Its 86,316 logic cells allow parallel pixel operations, line buffering control, thresholding, filtering, color processing, and interface timing control to be consolidated in one device. The 267 I/O count supports parallel sensor or display interfaces alongside control and memory connections. Designers should budget pipeline registers and memory resources, check achievable clock rates against the target resolution, and use the manufacturer timing and package guidance for high-speed BGA implementation.
Recommandé
System Management and Secure Connectivity
The M2GL090T-FG484I is suitable for system-management and secure-connectivity logic where programmable control and abundant I/O are required. The device can implement boot sequencing, health monitoring, configuration management, key-control interfaces, status aggregation, and communication adaptation within a 1.2 V IGLOO2 architecture. Its 86,316 logic cells allow security and management functions to coexist without splitting them across multiple low-density devices. Designers should define secure-update boundaries, external memory requirements, clock sources, and fault-response behavior, then validate the complete implementation against the required security and environmental criteria.
Recommandé
I/O Expansion and System Control
The M2GL090T-FG484I is well suited to centralized I/O expansion where a system needs many individually controlled pins plus programmable logic for sequencing and diagnostics. Its 267 user I/O can reduce the number of external interface devices in control, test, instrumentation, or embedded equipment. The 86,316 logic cells allow acquisition logic, debouncing, state machines, fault handling, and communication functions to be integrated. Engineering should group compatible I/O standards, calculate loading and timing margins, define safe power-up states, and reserve adequate decoupling and power-plane connectivity around the 484-BGA device.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour M2GL090T-FG484I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | M2GL090T-1FG484I | M2GL090-FGG484I |
|---|---|---|---|
| Package | 484-BGA | 484-BGA | 484-BGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| FPGA Family | IGLOO2 | IGLOO2 | IGLOO2 |
| Configuration Memory | Flash | Flash | Flash |
Principaux différenciateurs
- High logic density in a 484-BGA implementation (vs M2GL090-FGG484I)
- Closest confirmed resource-matched grade (vs M2GL090T-1FG484I)
- Industrial-temperature operating range (vs M2GL090T-1FG484I)
Notes de conception
Treat the 484-BGA layout as a high-density escape-routing problem. Assign every ball using the manufacturer package drawing, maintain the recommended ball-pad and via configuration, and provide continuous ground reference planes beneath signal layers. Route clocks and high-speed interfaces away from noisy power-conversion areas, and verify return paths at every layer transition before releasing artwork.
Build the 1.2 V power tree from the complete manufacturer power requirements rather than treating the core voltage as the only design constraint. Confirm required I/O voltage domains, sequencing, current capacity, ramp limits, and decoupling placement. Use the specified power pins and balls, provide adequate plane connections through vias, and verify voltage drop under the expected operating and transition currents.
Estimate junction temperature from actual FPGA activity, the package thermal model, PCB copper, via conduction, enclosure temperature, and airflow. A 484-BGA footprint can distribute heat effectively but still depends on a multilayer stack-up and continuous planes. Do not use the maximum I/O count as a proxy for power; calculate utilization from the implemented design and validate the hottest operating case in the final enclosure.
Use the manufacturer's I/O timing and board-design guidance for each implemented interface. Constrain clock and data paths, maintain matched spacing where a differential interface is used, and avoid discontinuities that create return-path discontinuities. Leave configuration, reset, and clock-source routing flexible enough for the intended boot sequence, and verify signal integrity at the target clock frequencies rather than only at nominal logic speed.
Informations de conformité
The listed technical information does not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status.
