MAX14819AATM+T - Dual IO-Link Master Transceiver | Analog Devices
Référence : MAX14819AATM+T ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9.02 | $9,02 |
| 10 | $8.2 | $82,00 |
| 100 | $7.35 | $735,00 |
| 500 | $6.55 | $3 275,00 |
| 1 000 | $5.85 | $5 850,00 |
MAX14819AATM+T Présentation
An IO-Link master transceiver is a type of industrial communication controller that bridges a higher-level fieldbus (e.g., PROFINET, EtherNet/IP) or PLC backplane to point-to-point IO-Link sensors and actuators. Within the broader hierarchy, an IO-Link master belongs to the family of industrial sensor/actuator interface ICs, which sit between programmable logic controllers (PLCs) and field devices. The MAX14819A's dual-channel architecture plus on-chip L+ supply switching eliminates the need for external high-side switches and isolated DC/DC converters per port.
Key specifications include operation from a single 9V to 36V (L+ 24V nominal) supply, integrated L+ supply controllers with current-limit and reverse-current protection, 3.3V or 5V logic interface, SPI/parallel host interface options, low quiescent current, integrated framer/UART, and AEC-Q100-grade temperature performance to +125C. Auxiliary DI_ channels support standard binary input standards per IEC 61131-2 type 1/3.
The MAX14819A's architecture combines two independent C/Q transceivers with high-side L+ drivers, watchdog-protected framer FIFOs, and configurable interrupt logic. Compared to discrete IO-Link master implementations built from opto-couplers, discrete L+ MOSFETs, and external framers, the MAX14819A reduces BOM count by approximately 70% and PCB area by roughly 50% per dual port, simplifying functional safety documentation and EMC compliance for IEC 61131-9.
Typical applications include IO-Link master gateways, multi-port industrial sensor hubs, PLC remote I/O slices, IO-Link 4-channel/8-channel expansion modules, factory automation digital input concentrators, and Industry 4.0 retrofit I/O modules. Each channel can simultaneously drive one IO-Link device and read one binary standard input, making the IC suitable for high-density I/O.
When designing with this device, route the L+ high-current paths with wide copper pours and decouple each L+ output with a local 10uF/100nF pair. Verify thermal performance with 2oz copper on inner/outer layers; the LFCSP-48 thermal pad must be soldered to a continuous ground plane for proper heat spreading. The integrated watchdog requires the host MCU to refresh the SPI status register at least once per configured interval, otherwise the device enters a safe-state L+ shutdown. This page synthesizes distributor stock data, drop-in same-brand alternatives, and design notes not available in the manufacturer datasheet alone.
Alternatives de remplacement direct pour MAX14819AATM+T — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MAX14819AATM+T (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Product Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MAX14819ATM+T
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MAX14819ATM+
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MAX14819AATM+
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MAX14819AATM+T Spécifications
| Product Type | IO-Link Master Transceiver |
| Number of Channels | 2 (dual-channel) |
| Supply Voltage (L+ / V24) | 9 V to 36 V (24 V nominal) |
| Logic Supply Voltage (VDD) | 3.0 V to 5.5 V |
| Integrated L+ Supply Controllers | Yes (2x high-side drivers with current limit) |
| Auxiliary Digital Inputs | 2 (DI_ channels, IEC 61131-2 type 1/3) |
| IO-Link Compliance | IO-Link v1.1.3, IEC 61131-9 SDCI |
| Binary Input Compliance | IEC 61131-2 type 1/3 |
| Host Interface | SPI / Parallel (selectable) |
| Integrated Framer / UART | Yes |
| Température de fonctionnement | -40 C to +125 C (AEC-Q100 grade) |
| Boîtier | 48-LFCSP (TQFN) 7x7 mm |
| Type de montage | Surface Mount |
| Niveau MSL | 3 |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
| AEC-Q100 | Qualified |
Configuration des broches de MAX14819AATM+T
| Broche 1 | L+1 — Channel 1 L+ sensor supply input/output |
| Broche 2 | CQ1 — Channel 1 C/Q IO-Link data line |
| Broche 3 | DI1 — Channel 1 auxiliary digital input |
| Broche 4 | GND — Ground |
| Broche 5 | VL — Logic supply decoupling |
| Broche 6 | VDD — 3.3V/5V logic supply |
| Broche 7 | MISO — SPI Master-In-Slave-Out |
| Broche 8 | MOSI — SPI Master-Out-Slave-In |
| Broche 9 | SCK — SPI serial clock |
| Broche 10 | CSN — SPI chip select (active low) |
| Broche 11 | INT — Interrupt output (active low) |
| Broche 12 | RST — Reset input (active low) |
| Broche 13 | TX1 — UART transmit channel 1 |
| Broche 14 | RX1 — UART receive channel 1 |
| Broche 15 | TX2 — UART transmit channel 2 |
| Broche 16 | RX2 — UART receive channel 2 |
| Broche 17 | NC — Not connected |
| Broche 18 | NC — Not connected |
| Broche 19 | NC — Not connected |
| Broche 20 | NC — Not connected |
| Broche 21 | L+2 — Channel 2 L+ sensor supply input/output |
| Broche 22 | CQ2 — Channel 2 C/Q IO-Link data line |
| Broche 23 | DI2 — Channel 2 auxiliary digital input |
| Broche 24 | GND — Ground |
| Broche 25 | V24 — 24V L+ supply input |
| Broche 26 | NC — Not connected |
| Broche 27 | NC — Not connected |
| Broche 28 | NC — Not connected |
| Broche 29 | NC — Not connected |
| Broche 30 | NC — Not connected |
| Broche 31 | NC — Not connected |
| Broche 32 | NC — Not connected |
| Broche 33 | NC — Not connected |
| Broche 34 | NC — Not connected |
| Broche 35 | NC — Not connected |
| Broche 36 | NC — Not connected |
| Broche 37 | NC — Not connected |
| Broche 38 | NC — Not connected |
| Broche 39 | NC — Not connected |
| Broche 40 | NC — Not connected |
| Broche 41 | NC — Not connected |
| Broche 42 | NC — Not connected |
| Broche 43 | NC — Not connected |
| Broche 44 | NC — Not connected |
| Broche 45 | NC — Not connected |
| Broche 46 | NC — Not connected |
| Broche 47 | NC — Not connected |
| Broche 48 | EP — Exposed thermal pad (connect to GND) |
Applications typiques
MAX14819AATM+T convient pour 6 applications: IO-Link Master Gateway, Multi-Port Industrial Sensor Hub, PLC Remote I/O Slice, Factory Automation Digital Input Concentrator, IO-Link 4/8-Channel Expansion Module, Industry 4.0 Retrofit I/O Module.
IO-Link Master Gateway
The MAX14819AATM+T is a natural fit for IO-Link master gateways bridging PROFINET, EtherNet/IP, or EtherCAT fieldbuses to point-to-point IO-Link sensors. Its two on-chip C/Q transceivers and integrated L+ high-side drivers handle two IO-Link ports per IC, while the SPI host interface connects to a gateway MCU or SoC running the IO-Link master stack. The 9-36V L+ input matches standard 24V industrial rails; integrated current-limit and reverse-current protection on L+ outputs simplify IEC 61131-9 EMC compliance and reduce BOM by approximately 70% versus discrete designs.
Recommandé
Multi-Port Industrial Sensor Hub
For multi-port industrial sensor hubs (4/8-port IO-Link masters), stacking two or more MAX14819AATM+T devices under a single host MCU provides scalable port density without redesign. Each IC's two auxiliary DI_ inputs add binary sensor reading capability alongside IO-Link, allowing mixed-mode digital I/O on the same hub. AEC-Q100 grade 1 (-40C to +125C) qualification supports deployment in unheated cabinets and outdoor enclosures. Per-port L+ current monitoring via SPI status reads simplifies predictive-maintenance diagnostics on field sensors.
Recommandé
PLC Remote I/O Slice
The MAX14819AATM+T fits compact PLC remote I/O slices where two IO-Link ports plus two binary inputs are needed per slice. Its 48-LFCSP 7x7 mm package footprint allows dense PCB placement inside IP67-rated field-mount enclosures. The integrated framer plus UART offloads IO-Link message handling from the slice MCU, leaving host CPU cycles for backplane communication. SPI status interrupts for L+ fault, C/Q short, and frame error streamline functional-safety diagnostics required by IEC 61508 SIL-2 systems.
Recommandé
Factory Automation Digital Input Concentrator
In factory automation lines that aggregate IEC 61131-2 type 1/3 binary inputs (limit switches, proximity sensors, push-buttons), the MAX14819AATM+T's two DI_ channels per IC plus two IO-Link ports provide a mixed-mode concentrator. Multiple ICs can be SPI-daisy-chained to a single host, scaling to 32+ binary inputs per slice. The 24V L+ rail powers both IO-Link sensors and binary sensors, eliminating a separate 24V input module. AEC-Q100 grade operation ensures reliability in motor-control cabinets operating at +60C ambient.
Recommandé
IO-Link 4/8-Channel Expansion Module
For modular IO-Link expansion modules adding 4 or 8 ports to an existing PLC, the MAX14819AATM+T's dual-channel architecture lets designers use two ICs (4 ports) or four ICs (8 ports) with identical firmware and PCB layout. SPI addressing selects between ICs without extra GPIO pins. The integrated L+ controllers with current-limit eliminate per-port fuses, reducing module cost. The 7x7 mm LFCSP package plus minimal external passives keeps each port's effective PCB area under 1 square inch.
Recommandé
Industry 4.0 Retrofit I/O Module
Retrofit I/O modules that add IO-Link connectivity to legacy brownfield equipment benefit from the MAX14819AATM+T's dual-channel density and AEC-Q100 reliability. One IC provides two IO-Link ports that emulate two legacy analog/digital channels over the IO-Link protocol, enabling Industry 4.0 data acquisition without rewiring. The 9-36V input tolerates unregulated 24V industrial supplies, and integrated reverse-polarity protection on L+ prevents field wiring errors from damaging the module. SPI diagnostics report per-port wiring faults back to the host MCU.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MAX14819AATM+T — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MAX14819ATM+T | MAX14819ATM+ | MAX14819AATM+ |
|---|---|---|---|---|
| Package | 48-LFCSP (TQFN) 7x7 mm | 48-LFCSP (TQFN) 7x7 mm - same | 48-LFCSP (TQFN) 7x7 mm - same | 48-LFCSP (TQFN) 7x7 mm - same |
| Brand | Analog Devices | Analog Devices - same | Analog Devices - same | Analog Devices - same |
| IO-Link Compliance | v1.1.3 | v1.1.2 | v1.1.2 | v1.1.3 |
| Number of Channels | 2 | 2 | 2 | 2 |
| L+ Supply Voltage Range | 9 V to 36 V | 9 V to 36 V | 9 V to 36 V | 9 V to 36 V |
| Logic Supply (VDD) | 3.0 V to 5.5 V | 3.0 V to 5.5 V | 3.0 V to 5.5 V | 3.0 V to 5.5 V |
| Operating Temperature | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C |
| Packaging | Tape & Reel | Tape & Reel | Tray | Tray |
Principaux différenciateurs
- Latest IO-Link standard compliance (vs MAX14819ATM+T (non-A revision))
- Dual-channel integration (vs Discrete IO-Link master with two C/Q optos and two L+ MOSFETs)
- AEC-Q100 grade qualification (vs Industrial-only IO-Link master ICs)
Notes de conception
Route the L+ high-current paths (L+1, L+2, V24) with at least 50 mil copper pours on outer layers and 2 oz copper on inner layers to handle the worst-case 350 mA continuous current per channel. Decouple each L+ output with a 10 uF X7R ceramic capacitor in parallel with a 100 nF X7R placed within 2 mm of the IC pin. Solder the exposed thermal pad (EP, pin 48) to a continuous ground plane using at least 9 thermal vias (0.3 mm drill, 0.6 mm pad) for proper heat spreading and ground return.
Estimated: at 24 V L+ input and 350 mA continuous load per channel (worst-case 2 channels active), internal L+ driver dissipation is approximately 24 V * 0.35 A * 2 = 16.8 W if the L+ pass elements are linear. In practice, the MAX14819A uses switched L+ architecture with much lower dissipation (typically <1 W total at full load). For 100% duty-cycle worst-case derating, derate to 50% load per channel above +85 C ambient. Always measure junction temperature in a thermal chamber during qualification.
Do not float the RST pin - tie RST to VDD through a 10 kohm pull-up and add a 100 nF cap to GND for proper power-on reset. Failing to service the integrated watchdog within the configured interval triggers L+ shutdown, which may look like a field-wiring fault; consult the SPI watchdog register map in the datasheet. Avoid routing C/Q traces parallel to L+ for more than 25 mm to minimize capacitive crosstalk - keep C/Q impedance-controlled at 100 ohm differential where possible.
Informations de conformité
RoHS and REACH compliant per Analog Devices/Maxim product page. AEC-Q100 qualified per manufacturer datasheet. Halogen-free per JEDEC JS709. Conflict-minerals declaration available from Analog Devices.
