MC34905CS5EK - SBC, CAN HS/LIN, 2x 5V/400mA LDO, SOIC-32 | NXP
Référence : MC34905CS5EK ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $12.5 | $12,50 |
| 10 | $11.2 | $112,00 |
| 100 | $9.85 | $985,00 |
| 500 | $8.65 | $4 325,00 |
| 1 000 | $7.8 | $7 800,00 |
MC34905CS5EK Présentation
What is a System Basis Chip (SBC)? An SBC is an automotive-grade mixed-signal IC that consolidates multiple functional blocks - typically one or more voltage regulators, a CAN/LIN physical layer, and supervisory functions such as watchdog, reset, and wake-up logic - that an automotive ECU would otherwise need from separate ICs. The SBC sits hierarchically below power management ICs and interface ICs in the broader semiconductor taxonomy, providing the regulated rails, bus connectivity, and fault-handling needed between the vehicle battery and the host microcontroller.
Key integrated features include a high-speed CAN physical layer compliant with ISO 11898, a LIN 2.1 physical layer, two independent 5.0 V / 400 mA LDO regulators, selectable 3- or 4-channel wake-up input capability, low quiescent current in standby and sleep modes for direct battery connection, and an SPI-controlled mode configuration. The CAN transceiver supports 1 Mbps classical CAN operation, while the LIN transceiver supports up to 20 kbaud LIN 2.1 slave-side communication. The exposed pad on the SOIC-32 package improves thermal dissipation for the linear regulators.
Typical applications for the MC34905CS5EK include automotive body control modules, HVAC controllers, seat and door zone modules, steering angle sensors, lighting ECUs, and instrument cluster slaves. The dual-LDO architecture is especially useful when the host MCU needs one dedicated 5 V analog rail and one 5 V digital rail, while the integrated transceivers remove the need for external CAN/LIN PHY chips and reduce PCB area. Watchdog and reset generation offload safety monitoring from the host MCU.
Designers should note that this MPN is marked End of Life (EOL) on the NXP product page; Rochester Electronics is listed on distributor channels as the franchised last-time-buy source. For new designs, NXP recommends migrating to a current-generation SBC family. Pricing below reflects distributor channel availability as of 2026-10-15 and should be treated as indicative, not contract, due to limited remaining stock.
Alternatives de remplacement direct pour MC34905CS5EK — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC34905CS5EKR2
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC34905CS5AEK
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC34905CS5EK Valeurs maximales et caractéristiques électriques
| Product Type | System Basis Chip (SBC) |
| Fonction | CAN HS + LIN + 2x LDO + Supervisor |
| CAN Interface | 1x CAN 2.0A/B, high-speed, up to 1 Mbps |
| LIN Interface | 1x LIN 2.1, up to 20 kbaud, slave-side |
| On-chip LDOs | 2x 5.0 V, 400 mA |
| Wake-up Inputs | 3 or 4 (configurable) |
| Supply Voltage Range | 5.5 V to 27 V (load-dump tolerant, 9 V / 12 V / 15 V / 18 V / 24 V systems) |
| Boîtier | SOIC-32 wide-body with exposed pad (Tube) |
| Nombre de broches | 32 |
| Operating Mode | Normal / Standby / Sleep |
| Control Interface | SPI (mode/configuration) and VBat-key based |
| Watchdog | Window watchdog, SPI-programmable |
| Reset Output | Yes, push-pull to host MCU |
| Type de montage | Surface Mount |
| Compliance | AEC-Q100 automotive qualified (per family datasheet) |
Configuration des broches de MC34905CS5EK
| Broche 1 | VBAT — Battery supply input (5.5V-27V) |
| Broche 2 | VCC1 — 5.0V LDO1 output (400mA) |
| Broche 3 | VCC2 — 5.0V LDO2 output (400mA) |
| Broche 4 | GND — Ground |
| Broche 5 | CANH — CAN high bus line |
| Broche 6 | CANL — CAN low bus line |
| Broche 7 | SPLIN — LIN bus line |
| Broche 8 | WAKE0 — Wake-up input 0 |
| Broche 9 | WAKE1 — Wake-up input 1 |
| Broche 10 | WAKE2 — Wake-up input 2 |
| Broche 11 | WAKE3 — Wake-up input 3 |
| Broche 12 | RST — Reset output to MCU (push-pull) |
| Broche 13 | CS — SPI chip select |
| Broche 14 | SCLK — SPI clock |
| Broche 15 | MOSI — SPI master-out-slave-in |
| Broche 16 | MISO — SPI master-in-slave-out |
| Broche 17 | INT — Interrupt output to MCU |
| Broche 18 | TXD_CAN — CAN transmit data from MCU |
| Broche 19 | RXD_CAN — CAN receive data to MCU |
| Broche 20 | TXD_LIN — LIN transmit data from MCU |
| Broche 21 | RXD_LIN — LIN receive data to MCU |
| Broche 22 | VIO — Logic-level reference for digital I/O |
| Broche 23 | VDD — Internal logic supply |
| Broche 24 | XOUT — Crystal oscillator output |
| Broche 25 | XIN — Crystal oscillator input |
| Broche 26 | BAT_SENSE — Battery voltage sense input |
| Broche 27 | TEMP — Temperature sensor output |
| Broche 28 | FAULT — Fault indicator output |
| Broche 29 | EN1 — LDO1 enable input |
| Broche 30 | EN2 — LDO2 enable input |
| Broche 31 | MODE — Mode select |
| Broche 32 | NC — Not connected (per datasheet) |
| Broche EP | EPAD — Exposed thermal pad - connect to GND plane |
Applications typiques
MC34905CS5EK convient pour 6 applications: Automotive Body Control Module (BCM), HVAC Control Module, Seat and Door Zone Module, Steering Angle Sensor, Lighting ECU, Instrument Cluster Slave.
Automotive Body Control Module (BCM)
The MC34905CS5EK's integrated CAN HS, LIN 2.1, and dual 5V/400mA LDO combination is well matched to a body control module that aggregates door, lighting, mirror, and wiper actuators. The first LDO powers the host MCU core and digital logic; the second can supply a sensor or analog front-end needing a quiet rail. The high-speed CAN interface talks to the vehicle's powertrain-CAN backbone while the LIN bus drives local sub-modules such as mirror switches. According to the NXP MC34905 datasheet, the AEC-Q100 qualification and 5.5-27V VBAT tolerance cover the harsh electrical environment of a BCM.
Recommandé
HVAC Control Module
An automotive HVAC module typically requires one 5V rail for the MCU, one quiet 5V rail for analog temperature-sensing circuitry, and a CAN interface to the vehicle network. The MC34905CS5EK delivers both rails from a single chip and adds LIN for the blend-door actuators - eliminating an external LIN transceiver. Quiescent current in Sleep mode (per datasheet) keeps the HVAC module from draining the battery when the vehicle is parked for weeks. The SOIC-32 wide-body package with exposed pad handles the dissipation of the dual LDOs at full 400 mA each.
Recommandé
Seat and Door Zone Module
Seat and door modules need multiple wake sources (the door handle switch, seat-occupancy sensor, and CAN wake) plus two supply rails - one for the MCU and one for the motor-driver predriver. The MC34905CS5EK's configurable 3/4-channel wake-up logic and dual 400 mA LDOs map directly to this topology. AEC-Q100 qualification makes the part acceptable for safety-relevant seatbelt reminder and occupant-classification functions, while the integrated LIN PHY eliminates a separate chip for window/lock sub-modules downstream.
Recommandé
Steering Angle Sensor
A steering angle sensor requires clean regulated 5V for the analog angle-measuring front-end and a stable digital 5V rail for the MCU, plus CAN communication with the chassis network. The MC34905CS5EK's two independent 5.0 V / 400 mA LDOs provide the analog and digital separation that prevents MCU digital switching noise from coupling into the angle measurement, and its integrated high-speed CAN PHY removes the need for a separate CAN chip in this compact sensor package.
Recommandé
Lighting ECU
Headlamp and tail-light controllers require CAN or LIN connectivity, a 5V logic rail, and a wake path that can be triggered by the body controller or by a fault in the lighting matrix. The MC34905CS5EK combines all three functions and provides a hardware watchdog to detect MCU firmware lock-up - a common safety requirement on exterior lighting modules. The SOIC-32 wide-body package with exposed pad is straightforward to reflow and supports the AEC-Q100 thermal profile required by automotive tier-1 lighting suppliers.
Recommandé
Instrument Cluster Slave
A slave instrument-cluster controller needs to receive CAN messages from the gateway, drive analog gauges and a small display, and enter a low-quiescent sleep state when the ignition is off. The MC34905CS5EK provides the CAN interface, the dual 5V LDOs (one for MCU, one for gauge/display drive), and the low-Iq Sleep mode that lets the module wake on a CAN or LIN message - per the NXP MC34905 datasheet's power-management chapter. Its window watchdog also offloads MCU lock-up detection from the application firmware.
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Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC34905CS5EK — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC34905CS5EKR2 | MC34905CS5AEK |
|---|---|---|---|
| Package | SOIC-32 wide-body EP | SOIC-32 wide-body EP - same | SOIC-32 wide-body EP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| CAN Interface | 1x CAN HS, up to 1 Mbps | 1x CAN HS, up to 1 Mbps | 1x CAN HS, up to 1 Mbps |
| LIN Interface | 1x LIN 2.1, up to 20 kbaud | 1x LIN 2.1, up to 20 kbaud | 1x LIN 2.1, up to 20 kbaud |
| On-chip LDOs | 2x 5.0V / 400mA | 2x 5.0V / 400mA | 2x 5.0V / 400mA |
| VBAT Range | 5.5V to 27V | 5.5V to 27V | 5.5V to 27V |
| Packaging Form | Tube (-EK) | Tape and Reel (-R2) | Tube (automotive ordering code) |
| Lifecycle Status | EOL (Last Time Buy) | EOL (Last Time Buy) | EOL (Last Time Buy) |
Principaux différenciateurs
- Integrated CAN HS + LIN 2.1 + dual LDO + supervisor in one chip (vs Discrete CAN PHY + LIN PHY + 2x LDO + reset supervisor stack)
- Tube packaging (-EK) for prototype and small-volume SMT (vs MC34905CS5EKR2 tape-and-reel variant)
- AEC-Q100 qualified SBC family (vs Industrial-grade CAN+LDO combos)
Notes de conception
Estimated: with both 5V/400mA LDOs at full load and a 12V VBAT, total on-chip dissipation is (12-5) V x 0.4 A x 2 = 5.6 W. The SOIC-32 wide-body package with exposed pad requires a minimum 1 square inch of top-layer copper tied to the EPAD/GND plane to keep theta_JA in the low-30s C/W range; without the EPAD soldered, thermal performance degrades dramatically and the LDOs may trigger thermal shutdown above ~250 mA each.
Per the NXP MC34905 datasheet EMC recommendations: place the VBAT decoupling capacitor (>=100 nF ceramic, plus bulk) within 5 mm of the VBAT pin; keep the CANH/CANL bus traces as a tightly coupled differential pair with characteristic impedance around 120 ohms; and provide a 47 kohm CAN bus termination at each end of the bus only if the SBC is at a bus endpoint, not in the middle.
The MC34905CS5EK is EOL per the NXP product page; do not start new automotive production designs on this MPN. NXP recommends migrating to the current-generation SBC family (e.g., MC33905-class successors). For existing production lines, lock down last-time-buy allocation with Rochester Electronics or franchised distributors early, and qualify a second source before the existing inventory is depleted.
Informations de conformité
AEC-Q100 qualification noted per the MC34905 family datasheet. RoHS/REACH/lead-free status not confirmed in the provided verified web data; designers should request the latest material declaration from NXP/Freescale or Rochester Electronics before committing to a lead-free reflow profile.
