MC68EN360ZQ25VL - 25MHz QUICC M683xx 32-Bit MPU | NXP 357-PBGA
Référence : MC68EN360ZQ25VL ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $122.3 | $122,30 |
| 10 | $115.5 | $1 155,00 |
| 100 | $108.2 | $10 820,00 |
| 500 | $99.75 | $49 875,00 |
| 1 000 | $92.4 | $92 400,00 |
MC68EN360ZQ25VL Présentation
What is a microprocessor IC? A microprocessor (MPU) is an integrated circuit that contains a central processing unit capable of executing instructions fetched from external memory. The MC68EN360 family belongs to the M683xx ColdFire/CPU32+ lineage, which evolved from the Motorola 68000 architecture into a family of integrated microprocessors with on-chip peripherals for communications and embedded control.
Key features include a single 32-bit core at 25 MHz, an integrated Ethernet media access controller (ETHRN) for 10 Mbps networking, HDLC/serial communication channels, and a DRAM controller. The part is offered in a 357-pin PBGA (also referred to as 357-BBGA) package measuring 25x25 mm, supplied in tray packaging with commercial temperature grading per the verified data.
The MC68EN360 integrates the CPU32+ core with the QUICC peripheral engine, allowing simultaneous execution of communication tasks alongside user code. The 0.57-micron process geometry and 25 MHz clock frequency place this part in the legacy Freescale/NXP embedded networking category, suited for telecom, industrial, and routing equipment designs of the late 1990s and early 2000s.
Typical applications include LAN routers and bridges, telecom switching equipment, industrial serial communication controllers, and embedded networking appliances. The on-chip Ethernet MAC reduces external component count compared to CPU-only designs of the same era.
When designing with this part, verify PCB layout tolerances for the 1.27 mm pitch BGA balls and confirm thermal vias under the package. The legacy 0.57-micron process means the device is not low-power by modern standards; ensure the power supply decoupling network matches the manufacturer's reference schematic.
This page synthesizes distributor pricing (as of 2026-10-17), drop-in alternatives including MCF5282CVM80 and MC68MH360ZQ25VL, and practical engineering notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour MC68EN360ZQ25VL — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC68EN360ZQ25VL (même facteur de forme et même empreinte) — différant par Co-Processors / DSP, Ethernet, Manufacturer, Package, Processor Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC68EN360CVR25VL
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC68EN360VR25VL
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC68EN360ZQ25L
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC68MH360ZQ25VL
✅ Remplacement direct✓ En stock
$74.6 / unité
Voir la fiche technique →MC68EN360CAI25L
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC68EN360ZQ25VL Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP USA Inc. (formerly Freescale Semiconductor, Motorola) |
| Processor Type | M683xx CPU32+ |
| Core Architecture | 32-Bit, 1 Core |
| Clock Speed (Max) | 25 MHz |
| Tension d'alimentation | 3.3 V |
| Boîtier | 357-PBGA (25x25 mm) / 357-BBGA |
| Terminal Form | Ball |
| Number of Terminals | 357 |
| Operating Temperature Grade | Commercial |
| Process Geometry | 0.57 um |
| On-chip Ethernet MAC | Yes (QUICC with ETHRN block) |
| On-chip Communication Controllers | HDLC / QUICC multi-channel |
| Packaging | Tray |
| Lead Free Status | Contains Lead |
| Statut RoHS | RoHS Non-Compliant |
Guide de configuration des broches du MC68EN360ZQ25VL 357-pbga (25x25 mm) / 357-bbga
Configuration des broches du MC68EN360ZQ25VL (boîtier 357-pbga (25x25 mm) / 357-bbga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MC68EN360ZQ25VL.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MC68EN360ZQ25VL convient pour 6 applications: LAN Router / Bridge Controller, Telecom Switching Equipment, Industrial Serial Communication Gateway, Embedded Networking Appliance, Legacy Equipment Maintenance & Repair, Embedded Education & Reference Design Platform.
LAN Router / Bridge Controller
The MC68EN360ZQ25VL's on-chip Ethernet MAC (ETHRN block) and QUICC multi-channel HDLC engine make it a natural fit for legacy 10 Mbps LAN router and bridge designs. With the CPU32+ core at 25 MHz and integrated DMA-driven serial controllers, the part handles routing-table lookups, packet forwarding, and bridge-filtering functions without external MAC silicon. Designers place the MC68EN360ZQ25VL on the router's mainboard alongside an external PHY and SDRAM. The 357-PBGA package suits multi-layer router PCBs and the 3.3V supply aligns with the legacy 5V-tolerant peripherals commonly used in 1990s networking gear.
Recommandé
Telecom Switching Equipment
The MC68EN360ZQ25VL integrates the QUICC engine with multi-channel HDLC and TDM interfaces, which were originally designed for telecom switching and channelized applications. The 25 MHz CPU32+ core handles call-control software while the on-chip CPM (Communications Processor Module) offloads HDLC framing, timeslot management, and serial bit-stream processing. Reference designs from the MC68360 family targeted central-office and PBX equipment. The 357-PBGA package supports the multi-layer, controlled-impedance PCBs typical in telecom backplane systems.
Recommandé
Industrial Serial Communication Gateway
Industrial serial gateways converting between legacy fieldbuses (RS-232/485, HDLC, synchronous serial) and Ethernet backbones were a primary application for the MC68EN360ZQ25VL. The combination of the QUICC serial controller (SCC) channels, RISC-like CPM, and Ethernet MAC lets one IC replace a CPU plus external UART and MAC chip. With the 25 MHz CPU32+ core, the device runs protocol-conversion firmware (Modbus, DNP3, proprietary) while the CPM handles real-time serial bit processing at line rate.
Recommandé
Embedded Networking Appliance
Stand-alone networking devices such as print servers, terminal servers, and protocol converters used the MC68EN360ZQ25VL as a single-chip solution combining the 32-bit CPU, Ethernet MAC, and multiple serial channels. The 0.57-micron process and 25 MHz clock deliver sufficient performance for low-to-mid throughput appliances (sub-10 Mbps) while keeping power consumption moderate for fanless industrial enclosures. The 357-PBGA package allows compact appliance form factors and supports the multi-layer PCB stackups required for clean Ethernet signal integrity.
Recommandé
Legacy Equipment Maintenance & Repair
Fielded telecom and industrial networking equipment installed in the late 1990s and 2000s often contains the MC68EN360ZQ25VL as the main processor. Long-term support scenarios - repairing, refurbishing, or extending the life of such equipment - require replacement parts with identical footprints and timing characteristics. The MC68EN360ZQ25VL's NRND status combined with authorized distributor stock (per verified DigiKey and Rochester Electronics listings) makes it the correct choice when maintaining design-form-fit-function compatibility is mandatory.
Recommandé
Embedded Education & Reference Design Platform
Universities and embedded-systems training programs historically used the MC68360 family, including the MC68EN360ZQ25VL, as a teaching platform for 32-bit CPU architecture, communication controllers, and bare-metal embedded programming. The publicly available QUICC reference manual and CPU32+ documentation make this part a self-contained learning vehicle. The 357-PBGA package requires reflow soldering, so training boards typically use a socketed BGA or break-out carrier.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC68EN360ZQ25VL — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC68EN360CVR25VL | MC68EN360VR25VL | MC68EN360ZQ25L | MC68MH360ZQ25VL | MC68EN360CAI25L |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same |
| Clock Speed | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Core Architecture | CPU32+ 32-bit | CPU32+ 32-bit | CPU32+ 32-bit | CPU32+ 32-bit | CPU32+ 32-bit | CPU32+ 32-bit |
| On-chip Ethernet MAC | Yes (ETHRN) | Yes (ETHRN) | Yes (ETHRN) | Yes (ETHRN) | No (HDLC/serial only) | Yes (ETHRN) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Temperature Grade | Commercial | Commercial | Commercial | Commercial | Commercial | Industrial Extended |
| RoHS Status | Non-Compliant (Contains Lead) | Non-Compliant (Contains Lead) | Non-Compliant (Contains Lead) | Varies by date code | Non-Compliant (Contains Lead) | Non-Compliant (Contains Lead) |
Principaux différenciateurs
- On-chip Ethernet MAC (ETHRN block) for single-CMC networking (vs MC68MH360ZQ25VL)
- Designed for legacy MC68360 PCB footprint reuse (vs MCF5282CVM80)
- Combines CPU32+ core with multi-channel HDLC CPM (vs MC68MH360ZQ25VL)
Notes de conception
The 357-PBGA package at 1.27 mm pitch requires careful escape routing on a minimum 4-layer PCB stackup. Use dog-bone fanout via-in-pad or microvia technology (laser-drilled vias on the top layer) to break out the central ball grid cleanly. Route signal traces on inner layers between via rows. Maintain a continuous ground plane directly under the BGA with stitched thermal vias (0.3 mm drill, 0.6 mm pitch) for heat dissipation. Estimated: PCB stack-up and via geometry are typical engineering practice, not datasheet-specified.
The MC68EN360ZQ25VL operates from a 3.3 V supply but its legacy 0.57-micron CMOS core is not low-power by modern standards. Provide bulk decoupling of at least 47 uF tantalum + 0.1 uF ceramic per power pin pair, plus 10 uF bulk on each 3.3 V rail segment. Place high-frequency 10 nF and 100 nF ceramics within 5 mm of each power pin. Follow the NXP MC68360 hardware reference manual power-tree recommendations.
Do not confuse the MC68EN360 (Ethernet-enabled, 'EN' suffix) with the MC68MH360 (no Ethernet MAC, HDLC/serial only) - both share the same 357-PBGA package but have different peripheral sets and firmware. Verify the BOM label matches the required suffix before PCB assembly. Also note that the part is RoHS non-compliant (contains lead); for new RoHS-bound designs consider the MCF5282 successor family (which is NOT drop-in and requires PCB rework).
Informations de conformité
RoHS Non-Compliant per verified DigiKey/distributor data; Lead Free Status = Contains Lead. AEC-Q100 not applicable (industrial/telecom MPU, not automotive). REACH and halogen-free status not specified in verified data - treat as unknown.
