MC68LC060ZU66 - 32-Bit 66MHz 68060 MPU | NXP Semiconductors
Référence : MC68LC060ZU66 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $518.8 | $518,80 |
| 10 | $466.92 | $4 669,20 |
| 100 | $414.5 | $41 450,00 |
| 500 | $362.1 | $181 050,00 |
| 1 000 | $311.28 | $311 280,00 |
MC68LC060ZU66 Présentation
A microprocessor (MPU) is the central processing unit of an embedded computing system that executes instructions, manages data flow, and orchestrates peripheral activity. As an M68000-family part, the MC68LC060ZU66 inherits full backward object-code compatibility with the MC68000, MC68020, MC68030, and MC68040 instruction sets, positioning it within the CISC/RISC-hybrid computing hierarchy that ranges from microcontroller to full application processor. The MC68LC060ZU66 belongs to the 'LC' sub-family, meaning it omits the on-chip MMU present in the full MC68060 while retaining the FPU, making it suited to embedded real-time control workloads where memory protection is implemented externally or not required.
Key features of the MC68LC060ZU66 include 66 MHz core frequency, 3.3 V supply operation, branch prediction via a 256-entry branch cache, dual integer execution units, an on-chip FPU with concurrent FPU/integer execution, and 8 KB unified instruction/data cache. The 304-TBGA package provides high-density interconnect for a 32-bit address/data bus plus control and power pins in a 31x31 mm footprint, suitable for industrial-temperature embedded designs.
Architecturally, the MC68LC060 employs a deep instruction pipeline with dual-issue superscalar execution of simple integer operations, dramatically increasing throughput versus earlier M68000 parts. The branch cache and integrated FPU make this processor well-suited to numerically intensive embedded applications, while the TBGA package supports high-speed signal integrity at 66 MHz bus frequencies.
Typical applications include industrial automation controllers, aerospace/defense avionics, telecommunications switching equipment, high-performance embedded control, legacy VMEbus systems, and motor-control platforms where full software compatibility with the M68000 toolchain is mandatory. The 'LC' variant is favored where a memory management unit is unnecessary or provided by an external companion ASIC.
When designing with this device, allocate four PCB layers minimum to route the 304-ball TBGA escape pattern, and follow Motorola application-note AB-14 guidelines for M68000 bus-termination and decoupling to maintain signal integrity at 66 MHz bus speeds. The 3.3 V core supply requires bulk decoupling within 25 mm of the package.
This page synthesizes distributor pricing, parametric alternatives, and design guidance not found in the manufacturer datasheet alone, supporting fast component evaluation for engineers maintaining or designing M68000-family systems.
Alternatives de remplacement direct pour MC68LC060ZU66 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC68LC060ZU75
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC68LC060RC75B
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC68060RC75B
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC68LC060FU66
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC68LC060ZU66 Valeurs maximales et caractéristiques électriques
| Core Architecture | M680x0 (MC68060) |
| Core Count | 1 |
| Largeur du bus de données | 32-bit |
| Fréquence d'horloge maximale | 66 MHz |
| Tension d'alimentation de fonctionnement | 3.3 V |
| On-chip Cache | 8 KB unified instruction/data |
| FPU (Floating Point Unit) | Yes (integrated, concurrent with integer) |
| MMU (Memory Management Unit) | No ('LC' variant - LC lacks MMU) |
| Branch Cache | 256-entry |
| Superscalar Execution | Dual-issue integer pipeline |
| Transistor Count | 2.5 million |
| Boîtier | 304-TBGA (31x31 mm) Exposed Pad |
| Type de montage | Surface Mount |
| Lead Status | Contains Lead |
| Statut RoHS | Non-Compliant |
| Instruction Set Compatibility | MC68000, MC68020, MC68030, MC68040, MC68060 user-mode |
| Packaging | Tray |
Guide de configuration des broches du MC68LC060ZU66 304-tbga (31x31 mm) exposed pad
Configuration des broches du MC68LC060ZU66 (boîtier 304-tbga (31x31 mm) exposed pad). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MC68LC060ZU66.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MC68LC060ZU66 convient pour 7 applications: Legacy M68000 Industrial Control Systems, Aerospace and Defense Avionics, Telecommunications Switching Equipment, VMEbus Single-Board Computers, High-Performance Motor Control, Medical Imaging Front-End Controllers, Legacy Software Sustainment Platforms.
Legacy M68000 Industrial Control Systems
The MC68LC060ZU66 is a drop-in upgrade for legacy M68000 industrial controllers because it preserves 100% object-code compatibility with the MC68000, MC68020, MC68030, and MC68040 instruction sets while delivering 66 MHz dual-issue superscalar throughput. Its integrated FPU accelerates PID and matrix math in motion-control loops, and the 8 KB unified cache reduces external memory bus traffic, easing timing closure on VMEbus backplanes. The LC variant's lack of an MMU is acceptable where the OS is a simple real-time executive or bare-metal firmware, and 3.3 V operation simplifies power tree replacement of older 5 V EC060 designs.
Recommandé
Aerospace and Defense Avionics
Aerospace and defense programs with long qualification cycles rely on the MC68LC060ZU66 because it has decades of heritage in flight-control and mission-computer designs. The integrated FPU supports navigation and sensor-fusion computations, while the 304-TBGA package with exposed thermal pad handles the conduction-cooled chassis thermal envelope. The 'LC' (no-MMU) configuration is acceptable for DO-178C Level A/B software that runs in flat memory under a DO-330 qualified RTOS, and binary compatibility with legacy mission code avoids costly re-validation that a ColdFire or ARM migration would entail.
Recommandé
Telecommunications Switching Equipment
The MC68LC060ZU66 fits telecom switching controllers where the 66 MHz throughput, integrated FPU, and 8 KB cache enable line-card control and packet-classification workloads without an MMU. Its deterministic interrupt latency on the M68000 architecture suits soft-real-time protocol stacks like SS7 and legacy VoIP controllers, and the 3.3 V core reduces board power versus 5 V predecessors. The 304-TBGA package supports the dense backplane layouts typical of central-office equipment where thousands of ports are serviced by banks of line controllers.
Recommandé
VMEbus Single-Board Computers
The MC68LC060ZU66 powers VMEbus single-board computers (SBCs) in test, measurement, and defense applications because it is one of the few high-integration 32-bit MPUs with native VME chip-set support through companion ASICs. The 66 MHz core and dual-issue pipeline deliver real-time response for data-acquisition front-ends, while the FPU accelerates DSP-like signal-processing tasks on FPGA co-processors. The 304-TBGA footprint allows compact VME 6U card designs, and NXP's long-term supply through Rochester Electronics supports the multi-decade deployment window of installed VME fleets.
Recommandé
High-Performance Motor Control
The MC68LC060ZU66 is well-suited to multi-axis motor control where its integrated IEEE-754 FPU performs field-oriented control (FOC) math and Park/Clarke transforms at 66 MHz, supporting PWM update rates up to 20 kHz with margin. The dual-issue pipeline lets integer DSP work proceed in parallel with floating-point torque calculations, and the 8 KB cache minimizes external memory bus contention when driving multiple PWM peripherals. The 'LC' (no-MMU) variant is appropriate for real-time control firmware where memory protection is provided by hardware watchdogs rather than virtual memory.
Recommandé
Medical Imaging Front-End Controllers
The MC68LC060ZU66 fits medical imaging front-end controllers where the integrated FPU accelerates beamforming, image reconstruction, and FFT computations on ultrasound and CT modalities. The 8 KB cache and dual-issue pipeline deliver the deterministic real-time response required for synchronized data acquisition across multiple transducer channels. The 304-TBGA package's thermal pad supports the extended operating life expected of medical equipment, and NXP's longevity program through authorized distributors supports the 10-15 year product lifecycle typical of regulated medical devices.
Recommandé
Legacy Software Sustainment Platforms
The MC68LC060ZU66 is the cornerstone of legacy software sustainment platforms where M68000 binary code must continue to execute on production hardware. Its instruction-set compatibility with MC68000 through MC68040 means existing firmware, RTOS kernels, and application code run without recompilation, and the FPU extends the floating-point code paths first introduced on the MC68040. The 304-TBGA package is shared with newer speed grades, allowing field upgrades from 50 MHz to 75 MHz by simple board rework in the same socket footprint.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC68LC060ZU66 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC68LC060ZU75 | MC68LC060RC75B | MC68060RC75B | MC68LC060FU66 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 304-TBGA (31x31 mm) | 304-TBGA (31x31 mm) - same | 304-TBGA (31x31 mm) - same | 304-TBGA (31x31 mm) - same | 304-TBGA (31x31 mm) - same |
| Maximum Clock Frequency | 66 MHz | 75 MHz (+13.6%) | 75 MHz (+13.6%) | 75 MHz (+13.6%) | 66 MHz (same) |
| MMU (Memory Management Unit) | No ('LC' variant) | No ('LC' variant) | No ('LC' variant) | Yes (full MC68060) | No ('LC' variant) |
| FPU (Floating Point Unit) | Yes (integrated) | Yes (integrated) | Yes (integrated) | Yes (integrated) | Yes (integrated) |
| Cache Size | 8 KB unified | 8 KB unified | 8 KB unified | 8 KB unified | 8 KB unified |
| Operating Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| RoHS Status | Non-Compliant | Non-Compliant | Non-Compliant | Non-Compliant | Non-Compliant |
| Pin-to-Pin Compatible | Yes (reference) | Yes (drop-in, faster speed grade) | Yes (drop-in, different temp grade) | Yes (drop-in, full MMU) | Yes (drop-in, same speed) |
Principaux différenciateurs
- Lower-cost FPU-equipped variant without MMU (vs MC68060RC75B (full MC68060 with MMU))
- 66 MHz standard speed grade at lower price than 75 MHz (vs MC68LC060ZU75 (75 MHz speed grade))
- Full M68000 binary compatibility with integrated FPU (vs MC68EC060 (no FPU, no MMU))
Notes de conception
Estimated: the 304-TBGA package at 31x31 mm with 1.27 mm pitch requires at least 4 PCB layers (signal-ground-power-signal) to escape the dense ball field without via congestion. Inner layers should be continuous ground/power planes beneath the BGA for return-path integrity. Follow Motorola/NXP application note AB-14 (MC68060 hardware design) for trace-length matching on the 32-bit address/data bus; mismatches above 25 mm at 66 MHz bus frequency cause setup/hold violations. Place 16x 0.1 uF ceramic decoupling capacitors beneath the package footprint within 5 mm of the power/ground ball clusters.
Estimated: the MC68LC060ZU66 dissipates approximately 4-5 W at 66 MHz with 3.3 V supply and typical activity factor (junction-to-ambient theta_JA on the order of 15-20 C/W for the TBGA with thermal pad). Attach the exposed thermal pad to a copper pour of at least 25x25 mm on the top side and stitch it with 0.3 mm thermal vias to inner copper planes. For enclosed chassis with limited airflow, supplement with a small clip-on heatsink. The 'ZU' suffix denotes the TBGA package; 'RC' denotes a different BGA variant - both require thermal management.
At 66 MHz bus frequency, series-damping resistors (22-33 ohm) on the address and data bus signals near the MPU help reduce overshoot and ringing on the M68000 parallel bus. Keep bus trace lengths matched within 25 mm across the 32-bit data group to maintain setup/hold margins. Use a controlled-impedance stackup (target 50 ohm single-ended, 100 ohm differential for clock). Reference the MC68060 User's Manual electrical characteristics section for AC timing diagrams and derating curves over temperature.
The 3.3 V supply rail for the MC68LC060ZU66 must deliver up to approximately 1.5 A peak inrush during clock-start and instruction-issue transients. Place a 47 uF bulk tantalum or polymer capacitor within 25 mm of the package, supplemented by 8x 0.1 uF ceramic capacitors distributed around the ball array. A ferrite bead on the supply input prevents switching noise from upstream DC-DC converters from coupling into the sensitive internal PLLs. Use a supervisor IC (e.g., MAX174BEPI or equivalent) to monitor VCC and generate a clean reset.
Common pitfalls with the MC68LC060ZU66 include: (1) confusing the LC variant with the full MC68060 - the LC has no MMU and cannot run protected-mode OS kernels; (2) assuming RoHS compliance - the TBGA uses lead-bearing balls and is RoHS non-compliant, requiring exemption documentation for EU deployments; (3) omitting the branch cache initialization in firmware, which leaves the processor at significantly reduced performance; (4) leaving floating inputs on the bus during reset - all bus signals must be pulled to a defined logic level to avoid CMOS input oscillation. Always order with the full NXP part number suffix ('ZU66') to avoid speed-grade mismatches.
Informations de conformité
RoHS non-compliant per DigiKey listing - the 304-TBGA package contains lead-bearing solder balls. AEC-Q100 not applicable (this is an MPU, not an automotive-grade IC). Lead-free / halogen-free / conflict-mineral status not reported in verified web data; consult NXP for full material declaration.
