MC8640DVU1250HE557 - QorIQ 1.25GHz Multi-Core Processor | NXP
Référence : MC8640DVU1250HE557 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $265 | $2 650,00 |
| 100 | $240 | $24 000,00 |
| 250 | $220 | $55 000,00 |
| 500 | $205 | $102 500,00 |
MC8640DVU1250HE557 Présentation
An integrated host processor (also called an application processor or communications processor) is a single-chip computing subsystem that integrates one or more CPU cores, cache, memory controllers, and high-speed serial I/O on a single silicon die. In the QorIQ hierarchy, the MC8640 belongs to the Power Architecture-based family that sits between discrete CPU-plus-chipset designs and full system-on-chip (SoC) devices, delivering deterministic performance for data-plane workloads while retaining the flexibility of a programmable architecture.
Key specifications include a 1.25 GHz core frequency, dual Power Architecture e600 cores, integrated L1/L2 cache, dual DDR2 memory controllers, and high-speed serial interfaces (SerDes) supporting protocols such as PCI Express, Serial RapidIO, and Gigabit Ethernet. The 'E557' suffix denotes the 105 C extended-temperature grade and specific revision/bin of the silicon, while 'H' indicates lead-free assembly and 'VU' designates the package code. The part ships in tray packaging suitable for high-mix, low-volume OEM production.
Architecturally, the MC8640 leverages a coherent dual-core fabric with on-chip MPX bus connectivity, allowing both cores to share memory and I/O coherently. This makes the part attractive for symmetric multiprocessing (SMP) workloads such as packet processing, encryption offload, and protocol termination. The 1.05 V core voltage reflects the 90 nm CMOS process used for this generation of QorIQ devices.
Typical applications include enterprise and edge routers, network-attached storage (NAS), print/image controllers, military and aerospace single-board computers, and industrial automation controllers. The 105 C temperature rating extends usability into outdoor telecom and industrial environments where commercial-grade processors would otherwise derate or fail.
When designing with the MC8640, ensure the PCB footprint accommodates the high-density BGA ball pattern and provides adequate thermal dissipation via copper pour or heatsink attachment. Decoupling capacitors must be placed as close as practical to each power pin, and SerDes reference clock routing must follow the impedance and length-matching guidelines in the hardware specifications addendum.
This page synthesizes distributor pricing, lifecycle status, and drop-in compatible QorIQ variants not consolidated on the original NXP datasheet, giving engineers a single reference for sourcing and re-design decisions.
Alternatives de remplacement direct pour MC8640DVU1250HE557 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC8640DVU1250HE557 (même facteur de forme et même empreinte) — différant par Memory Controller, Mounting Type, Operating Temperature, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC8640DVU1000HE
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$178 / unité
Voir la fiche technique →MC8640DVU1500HE
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC8640DTVU1000HE
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC8641DVU1250HE
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC8640DVU1066HE
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC8640DVU1250HE557 Valeurs maximales et caractéristiques électriques
| Part Number | MC8640DVU1250HE557 |
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Family | QorIQ |
| Series | MPC8640 |
| Core Architecture | Power Architecture e600 (dual-core) |
| Core Frequency | 1.25 GHz |
| Core Voltage (Vdd) | 1.05 V |
| Température de fonctionnement | -40 C to +105 C |
| Temperature Grade | Extended (E suffix) |
| Package Type | BGA |
| Type de montage | Surface Mount |
| Memory Controller | Dual DDR2 |
| High-Speed I/O | PCI Express, Serial RapidIO, Gigabit Ethernet (SerDes) |
| Statut RoHS | Compliant (H suffix indicates lead-free) |
| Catégorie | Embedded - Microprocessors |
Guide de configuration des broches du MC8640DVU1250HE557 bga
Configuration des broches du MC8640DVU1250HE557 (boîtier bga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MC8640DVU1250HE557.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MC8640DVU1250HE557 convient pour 6 applications: Enterprise Edge Router, Network-Attached Storage Controller, Defense Single-Board Computer, Industrial Automation Controller, Print and Image Controller, Telecom Baseband Processor.
Enterprise Edge Router
The MC8640DVU1250HE557's dual Power Architecture e600 cores at 1.25 GHz deliver enough compute headroom for line-rate packet forwarding, ACL processing, and encryption offload at the network edge. Its integrated SerDes supports Gigabit Ethernet and PCI Express, enabling direct connection to Ethernet PHYs and expansion ASICs without an external glue chip. The extended -40 C to +105 C junction range means the same hardware can be deployed in outdoor cabinets, industrial cells, or central-office racks. Compared with discrete CPU-plus-chipset designs, the integrated memory controller and on-chip MPX bus reduce BOM cost and latency for forwarding-table lookups.
Recommandé
Network-Attached Storage Controller
The dual-core coherent architecture of the MC8640DVU1250HE557 is well matched to RAID controller workloads, where one e600 core can drive the storage stack while the second handles network protocol termination (SMB, NFS, iSCSI). The integrated DDR2 controller supplies the memory bandwidth required for write-back caching, and the Serial RapidIO/PCIe SerDes ports connect directly to SAS/SATA controller ASICs. The 105 C temperature grade supports deployment in closet-style storage enclosures with limited airflow, while remaining within industrial reliability targets.
Recommandé
Defense Single-Board Computer
The MC8640DVU1250HE557's -40 C to +105 C operating range and Power Architecture determinism make it a long-standing choice for defense single-board computers (SBCs), mission computers, and avionics data concentrators. Dual coherent cores provide headroom for sensor fusion, while the on-chip DDR2 and SerDes fabric allow small-form-factor VPX/VME boards without external chipset components. The device's long lifecycle and stable firmware ecosystem are valued in defense programs where component changes require expensive re-qualification.
Recommandé
Industrial Automation Controller
In industrial PLC and motion-controller designs, the MC8640DVU1250HE557 provides the deterministic real-time performance of the Power Architecture combined with the wide temperature range required for factory floors and outdoor installations. The dual e600 cores can run a real-time OS (VxWorks, Green Hills INTEGRITY) on one core while a Linux control stack executes on the second. The integrated PCIe and Gigabit Ethernet SerDes simplify connection to industrial I/O modules and EtherCAT/PROFINET slave controllers.
Recommandé
Print and Image Controller
High-speed multi-function printer and production-print controllers use the MC8640DVU1250HE557 to drive RIP rendering, image processing, and concurrent network print-job handling. The dual-core coherent fabric lets one e600 core run the image pipeline while the second manages job queuing and protocol stacks (PCL, PostScript, PDF). The 1.25 GHz clock is sufficient for 1200 dpi color at production speeds, and the integrated memory controller feeds high-bandwidth DDR2 directly to the rendering engine.
Recommandé
Telecom Baseband Processor
Legacy 3G/4G small-cell and picocell baseband units have historically used the MC8640DVU1250HE557 as the control-plane and baseband compute element, taking advantage of its Power Architecture vector performance and SerDes connectivity to RF front-end ASICs. The extended temperature range supports outdoor picocell deployments, and the dual coherent cores allow separate handling of L1 PHY and L2/L3 protocol stacks. New designs typically migrate to QorIQ LS or Layerscape devices, but existing field hardware continues to use the MPC8640.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC8640DVU1250HE557 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC8640DVU1000HE | MC8640DVU1500HE | MC8640DTVU1000HE | MPC8641DVU1250HE | MC8640DVU1066HE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | BGA (VU) | BGA (VU) - same | BGA (VU) - same | BGA (VU) - same | BGA (VU) - same | BGA (VU) - same |
| Core Frequency | 1.25 GHz | 1.0 GHz | 1.5 GHz | 1.0 GHz | 1.25 GHz | 1.066 GHz |
| Core Voltage | 1.05 V | 1.05 V | 1.05 V | 1.05 V | 1.05 V | 1.05 V |
| Operating Temperature | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C |
| Core Architecture | Dual Power Architecture e600 | Dual Power Architecture e600 | Dual Power Architecture e600 | Dual Power Architecture e600 | Dual Power Architecture e600 | Dual Power Architecture e600 |
| Memory Controller | Dual DDR2 | Dual DDR2 | Dual DDR2 | Dual DDR2 | Dual DDR2 | Dual DDR2 |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- Specific silicon revision traceability (vs MC8640DVU1250HE)
- Mid-band frequency offering within the MPC8640 family (vs MC8640DVU1000HE)
- Dual coherent cores for SMP workloads (vs MC8640DVU1500HE)
Notes de conception
Estimated: at 1.25 GHz with both e600 cores active, the MPC8640 typically dissipates 15-20 W; budget a 25-30 W thermal envelope for the BGA package including DDR2 and SerDes I/O. Use a thermal interface material (TIM) between the package lid and a heatsink with at least 100 LFM airflow, or attach to an inner copper plane of at least 6 square inches on the PCB top side.
The MC8640 ships in a high-density BGA that requires microvia or stacked-via PCB technology. Decoupling capacitors must be placed directly under the BGA in the inner layers (land-side), and the SerDes reference clocks must be routed as 100 ohm differential pairs with length matching within 150 mil. Follow the MPC8640 hardware specifications addendum section on SerDes layout to avoid signal-integrity failures.
Do not assume all MC8640 part variants are pin-compatible. The 'VU' package code is the BGA used for the host processor; other suffixes in the family map to different package types. Also note the silicon revision suffix (e.g. '557') - older revisions may have open errata that affect specific SerDes configurations. Always cross-check the errata document for the exact revision bin in use.
Informations de conformité
Lead-free indicated by 'H' suffix in the part number. RoHS and REACH compliance per NXP material declaration. AEC-Q100 is not applicable (processor IC, not automotive-qualified discrete). Halogen-free status not explicitly stated in the verified data.
