MPC885CZP66 - 66MHz PowerQUICC MPU, 32-Bit, 357-BGA | NXP
Référence : MPC885CZP66 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $32.5 | $32,50 |
| 10 | $28.75 | $287,50 |
| 100 | $24.1 | $2 410,00 |
| 500 | $20.85 | $10 425,00 |
| 1 000 | $18.4 | $18 400,00 |
MPC885CZP66 Présentation
A microprocessor (MPU) is a single-chip processor that integrates a central processing unit, cache, memory controller, and peripheral interfaces onto a single die. The PowerQUICC family sits within the broader taxonomy of embedded processors, bridging traditional microcontrollers and high-end application processors. The MPC8xx series specifically targets communications-intensive applications where deterministic I/O handling and integrated peripheral channels reduce total system cost and board complexity.
Key features include a 66 MHz core clock, a 32-bit data bus, 1 CPU core, a 357-ball grid array surface-mount package, MSL Level 3 moisture sensitivity, and integrated communications peripherals. The 25 x 25 mm PBGA offers robust thermal dissipation through bottom-side balls, while the 0.18 micrometer process balances performance with low static power consumption suitable for always-on infrastructure.
The CPM offloads communication tasks from the core, including HDLC, UART, and Ethernet MAC support, allowing deterministic wire-speed handling without CPU intervention. Internal dual-port RAM and configurable serial channels make the device well suited for legacy router, bridge, and industrial gateway designs that must maintain pin-compatible software across product generations.
Typical applications include industrial routers, telecom DSLAM line cards, factory automation controllers, point-of-sale terminals, and legacy protocol converters. The wide industrial temperature range also makes it suitable for outdoor or uncontrolled-environment embedded systems requiring long-life silicon.
When designing with this device, allocate adequate PCB area for the 357-ball BGA fanout and ensure controlled-impedance routing for memory and CPM interfaces. A multi-layer PCB with dedicated power and ground planes is strongly recommended to maintain signal integrity at 66 MHz core speeds.
This page synthesizes distributor pricing, verified same-brand alternatives, and engineering trade-off notes not found in the standalone datasheet, helping engineers and procurement teams evaluate the MPC885CZP66 against current alternatives.
Alternatives de remplacement direct pour MPC885CZP66 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC885CZP66 (même facteur de forme et même empreinte) — différant par Manufacturer, Operating Temperature, RoHS Status, Core Architecture, Maximum Clock Frequency.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC885CVR66
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC885VR66
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC885ZP66
✅ Remplacement direct✓ En stock
$18.3 / unité
Voir la fiche technique →KMPC885CZP66
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC880CZP66
✅ Remplacement direct✓ En stock
$27.85 / unité
Voir la fiche technique →MPC885CZP66 Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors |
| Series | PowerQUICC, MPC8xx |
| Core Architecture | Power Architecture, 32-bit |
| Core Count | 1 |
| Largeur du bus de données | 32 bit |
| Core Clock Speed | 66 MHz |
| Process Technology | 0.18 micrometer CMOS |
| Tension d'alimentation | 3.3 V (typical) |
| Package Type | PBGA (Plastic Ball Grid Array) |
| Package Pin Count | 357 |
| Package Size | 25 x 25 mm |
| Type de montage | Surface Mount |
| Moisture Sensitivity Level | MSL 3 |
| Température de fonctionnement | -40C to +100C |
| Terminal Form | Ball |
| Package Code | BGA |
| Package Shape | Square |
Guide de configuration des broches du MPC885CZP66 square
Configuration des broches du MPC885CZP66 (boîtier square). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC885CZP66.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC885CZP66 convient pour 6 applications: Industrial Router / Gateway, Telecom DSLAM Line Card, Factory Automation Controller, Point-of-Sale Terminal, Legacy Protocol Converter / Bridge, Embedded Control / SCADA Node.
Industrial Router / Gateway
The MPC885CZP66's integrated CPM (Communications Processor Module) handles HDLC, UART, and Ethernet MAC channels independently of the core, enabling deterministic wire-speed packet processing in industrial routers. The 66 MHz Power Architecture core plus 32-bit data bus supports routing-table lookups and management-plane tasks without external co-processors. The 357-pin PBGA offers robust thermal dissipation for always-on operation in -40C to +100C environments typical of factory floors and outdoor cabinets.
Recommandé
Telecom DSLAM Line Card
The MPC885CZP66's dual-port RAM, configurable serial channels, and hardware HDLC engines make it well-suited for legacy DSLAM line-card designs. Its 66 MHz core executes management-plane protocols while the CPM services ATM/HDLC traffic at wire speed, eliminating the need for external communication controllers. The 25 x 25 mm PBGA's bottom-side ball array provides the thermal headroom required for densely-populated central-office shelves.
Recommandé
Factory Automation Controller
The MPC885CZP66's deterministic CPM interrupt handling and parallel memory bus suit real-time factory-automation controllers interfacing with sensors, actuators, and legacy fieldbuses. The 32-bit Power Architecture executes ladder-logic or motion-control code while the CPM offloads serial-protocol traffic. The -40C to +100C industrial temperature grade and MSL 3 PBGA packaging enable reflow-compatible assembly on conveyorized SMT lines.
Recommandé
Point-of-Sale Terminal
The MPC885CZP66 integrates the CPU, memory controller, and multiple serial channels needed for point-of-sale terminals managing barcode scanners, receipt printers, payment PIN pads, and Ethernet uplinks. Its 66 MHz Power Architecture core runs terminal-application and encryption stacks, and the CPM handles peripheral serial I/O without core intervention. The 357-pin PBGA's 25 x 25 mm footprint fits within compact POS chassis layouts.
Recommandé
Legacy Protocol Converter / Bridge
The MPC885CZP66's combination of multiple UARTs, HDLC controllers, and Ethernet MAC lets it bridge legacy serial protocols (RS-232/485, HDLC) to IP networks without external bridge ICs. The 32-bit data bus and 66 MHz core provide enough throughput for protocol translation and store-and-forward buffering. The PBGA-357 package's high I/O count accommodates simultaneous multi-protocol channel connections.
Recommandé
Embedded Control / SCADA Node
The MPC885CZP66's wide -40C to +100C industrial temperature range and CPM-driven deterministic I/O make it suitable for SCADA remote terminal units (RTUs) and embedded control nodes deployed in substations, pumping stations, and pipeline monitoring. The 66 MHz Power Architecture handles local control logic while the CPM services multiple serial SCADA links simultaneously. The 25 x 25 mm PBGA is compatible with reflow-soldered industrial PCB assemblies.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC885CZP66 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC885CVR66 | MPC885VR66 | MPC885ZP66 | KMPC885CZP66 | MPC880CZP66 |
|---|---|---|---|---|---|---|
| Package | PBGA-357 (25x25 mm) | PBGA-357 (25x25 mm) - same | PBGA-357 (25x25 mm) - same | PBGA-357 (25x25 mm) - same | PBGA-357 (25x25 mm) - same | PBGA-357 (25x25 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | 32-bit Power Architecture | 32-bit Power Architecture | 32-bit Power Architecture | 32-bit Power Architecture | 32-bit Power Architecture | 32-bit Power Architecture |
| Core Clock Speed | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz |
| CPM Channel Count | Full MPC885 CPM | Full MPC885 CPM | Full MPC885 CPM | Full MPC885 CPM | Full MPC885 CPM | Reduced MPC880 CPM (subset of MPC885) |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C |
| Process Technology | 0.18 micrometer CMOS | 0.18 micrometer CMOS | 0.18 micrometer CMOS | 0.18 micrometer CMOS | 0.18 micrometer CMOS | 0.18 micrometer CMOS |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- Full MPC885 CPM peripheral integration (vs MPC880CZP66)
- Drop-in pin and software compatibility across MPC885 speed grades (vs MPC885CVR66 / MPC885VR66)
- Long-life industrial temperature silicon (vs Generic commercial 66 MHz MPUs)
Notes de conception
The 357-ball PBGA at 25 x 25 mm relies on bottom-side ball connections for both signal and thermal dissipation. Estimated: at 3.3 V supply and 66 MHz with full CPM activity, the MPC885CZP66 typically dissipates 1.5-2.5 W; design the PCB with at least 4 inner ground planes stitched with thermal vias directly under the BGA to keep junction temperature within the -40C to +100C envelope.
The PBGA-357 footprint requires a multi-layer PCB (8+ layers recommended) with controlled-impedance routing for the 32-bit memory bus and CPM serial channels. Fanout the BGA using a dog-bone or microvia-in-pad pattern; place 0.1 microfarad decoupling capacitors adjacent to each power-ball cluster and bulk tantalum or ceramic capacitors at the PCB edge connector.
MSL 3 packaging means the MPC885CZP66 must be baked and reflowed within the JEDEC J-STD-033 floor-life window after the sealed bag is opened. Inactive or improperly stored parts can develop internal delamination that causes field failures. Always log seal-break dates and rework out-of-floor-life inventory through a controlled bake-out cycle.
At 66 MHz core clock, the external memory bus and CPM serial lines generate significant edge rates; keep trace impedance at 50 ohm single-ended and use series-termination resistors on heavily-loaded address and data lines. Match bus lengths within 1.5 cm to avoid setup/hold violations on synchronous memory interfaces.
Informations de conformité
RoHS, REACH, lead-free, and halogen-free status not present in the verified web data; marked unknown per data-authenticity rules. AEC-Q100 is not_applicable because the MPC885CZP66 is an industrial MPU, not an automotive-qualified IC.
