MC8641DVU1000NE557 - MPC8641 Dual-Core 1GHz PowerPC SoC | NXP
Référence : MC8641DVU1000NE557 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1303.5 | $1 303,50 |
| 10 | $1280 | $12 800,00 |
| 100 | $1245 | $124 500,00 |
| 250 | $1210 | $302 500,00 |
| 500 | $1185 | $592 500,00 |
MC8641DVU1000NE557 Présentation
Integrated host processors (also called application processors or SoCs) combine one or more CPU cores, a high-bandwidth system bus, on-chip SRAM and L1/L2 caches, a memory controller, and a wide range of I/O peripherals onto a single die. In the broader taxonomy, an SoC sits at the top of the embedded compute hierarchy: CPU core -> SoC -> MPU/MCU -> semiconductor device. The MPC8641 sits in the high-performance tier, supporting legacy Power Architecture software while consolidating northbridge, southbridge, and I/O functions.
Key features include dual 32-bit e600 cores at 1.0 GHz, on-die L1/L2 caches, integrated DDR2 memory controller, dual Gigabit Ethernet MACs (via SerDes), PCI Express interfaces, and RapidIO fabric. The 'DVU' suffix denotes a specific FCCBGA package and industrial temperature grade, while '1000NE' denotes the 1.0 GHz core speed and the '557' suffix denotes tape-and-reel packaging and lead-free compliance per NXP ordering information.
Architecturally, the MPC8641 uses a coherent CoreNet fabric on-die that links the e600 cores, L2 cache, DMA engines, and high-speed I/O. This fabric provides higher sustained throughput than older SMP/MPC shared-bus topologies, enabling line-rate packet processing on both cores. The device also integrates hardware acceleration for buffer management and queue management used in networking firmware stacks.
Typical applications include enterprise routers and switches, line-card controllers in telecom equipment, RAID/HBA storage controllers, industrial automation controllers, and defense/aerospace compute modules. The FCCBGA-1023 package provides the thermal headroom needed to sustain 1.0 GHz dual-core operation at industrial temperature ranges.
When designing with the MPC8641, pay close attention to power sequencing (core and I/O rails must come up in a specific order), DDR2 termination and trace length matching, and junction temperature under sustained dual-core load. A multi-layer PCB with continuous power and ground planes and a thermal management strategy (heatsink plus airflow) is required because the FCCBGA package has a relatively low theta-JA compared to plastic BGA packages.
This page synthesizes distributor pricing, lifecycle signals, and practical design considerations drawn from NXP/Freescale documentation and authorized distributor listings; it is not a substitute for the official NXP hardware specifications document.
Alternatives de remplacement direct pour MC8641DVU1000NE557 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC8641DVU1000NE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC8641DVR1000NE
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC8641DVU1250NE
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC8641VTA1000
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC8641THX1000NE
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC8641DVU1000NE557 Valeurs maximales et caractéristiques électriques
| Product Family | MPC8641 (Power Architecture e600) |
| Core Architecture | PowerPC e600 (32-bit) |
| Number of Cores | 2 |
| Core Frequency | 1.0 GHz |
| Package Type | FCCBGA (Flip-Chip Ceramic BGA) |
| Pin/Ball Count | 1023 |
| Package Dimensions | 33 mm x 33 mm |
| Type de montage | Surface Mount |
| Plage de température de fonctionnement | Industrial (DV suffix) - per NXP part decoder |
| Memory Controller | DDR2 SDRAM with ECC support |
| Ethernet | Dual Gigabit Ethernet MACs (via SerDes) |
| High-Speed I/O | PCI Express, Serial RapidIO, dual 10/100/1000 Ethernet SerDes |
| L2 Cache | Integrated on-die |
| Statut RoHS | Compliant (per datasheet) |
| Lead-Free | Yes |
Guide de configuration des broches du MC8641DVU1000NE557 33 mm x 33 mm
Configuration des broches du MC8641DVU1000NE557 (boîtier 33 mm x 33 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MC8641DVU1000NE557.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MC8641DVU1000NE557 convient pour 6 applications: Enterprise Router / Switch Control Plane, Telecom Line Card Controller, RAID / HBA Storage Controller, Industrial Automation Controller, Defense / Aerospace Compute Module, Medical Imaging Workstation.
Enterprise Router / Switch Control Plane
The MC8641DVU1000NE557 fits enterprise router and switch control-plane applications because it combines dual 1.0 GHz PowerPC e600 cores with hardware-accelerated queue and buffer management, on-chip L1/L2 caches, and integrated Gigabit Ethernet MACs via SerDes. The 1023-ball FCCBGA package provides sufficient I/O to attach external PHYs, switch fabrics, and management Ethernet without external bridge chips. Power consumption and thermal output of the dual-core SoC are typically below the budget of a control-plane supervisor module, while legacy Power Architecture firmware stacks from NXP BSPs port directly. Compared to discrete multi-chip designs, the MPC8641 reduces board area and BOM count, improving MTBF for long-lifecycle telecom and enterprise networking chassis.
Recommandé
Telecom Line Card Controller
The MC8641DVU1000NE557 is well suited to telecom line-card controller applications where dual e600 cores handle control-plane protocols plus packet classification, while integrated PCI Express links to line-card framers and Serial RapidIO to backplane switch fabrics. The FCCBGA-1023 package delivers the I/O bandwidth needed to terminate multiple E1/T1/E3 spans plus Ethernet uplinks without external bridge silicon. Industrial temperature grading per the 'DVU' suffix supports outdoor-cabinet and central-office deployments. The device's coherent CoreNet fabric allows the second core to absorb control-plane bursts without dropping data-plane throughput, which is critical for SLA-bound carrier Ethernet services.
Recommandé
RAID / HBA Storage Controller
The MC8641DVU1000NE557 targets RAID and HBA storage controller applications because the dual e600 cores can run RAID parity calculation, XOR acceleration, and host-side protocol stacks (iSCSI, SAS, Fibre Channel) concurrently while DMA engines push data over PCI Express to host servers. The on-die L2 cache and DDR2 controller with ECC provide the memory bandwidth needed to sustain line-rate RAID6 reconstruction. The 1023-ball FCCBGA package supports enough PCI Express lanes and SAS/SATA PHY interfaces for an 8-24 drive enclosure. Compared to ASIC-only RAID controllers, the programmable core allows OEM-specific features like dedup, encryption, and tiering to be added post-deployment.
Recommandé
Industrial Automation Controller
The MC8641DVU1000NE557 fits industrial automation controller applications where deterministic real-time control, long-term supply availability, and ruggedized thermal performance are required. The 'DVU' suffix provides industrial temperature grading, and the FCCBGA-1023 package supports multi-protocol industrial connectivity (EtherCAT, PROFINET, EtherNet/IP) through PCI Express-attached PHYs and fieldbus interfaces. The dual e600 cores run one real-time control loop while the second manages HMI, motion planning, or fieldbus master duties. The device's heritage in carrier-grade telecom means it has a mature Linux and VxWorks BSP ecosystem, which is critical for long-lifecycle factory automation deployments with 10-15 year operational windows.
Recommandé
Defense / Aerospace Compute Module
The MC8641DVU1000NE557 fits defense and aerospace compute module applications where ruggedization, long lifecycle, and Power Architecture code reuse matter more than absolute performance-per-watt. The FCCBGA-1023 package pairs with ceramic substrate variants for vibration and shock tolerance, and the dual e600 cores run flight-deck graphics, sensor fusion, and tactical datalink stacks. NXP's extended lifecycle support and the die's ability to operate at industrial temperature make it suitable for ground-vehicle vetronics and avionics subsystems. Compared to newer ARM-based SBCs, the MPC8641 allows reuse of certified legacy PowerPC firmware with minimal re-qualification.
Recommandé
Medical Imaging Workstation
The MC8641DVU1000NE557 supports medical imaging workstation applications where dual cores handle image acquisition, reconstruction (CT/MRI preprocessing), and DICOM transfer concurrently. The DDR2 controller with ECC and substantial on-die L2 cache allow real-time processing of moderate-resolution ultrasound or fluoroscopy streams without external frame buffers. Integrated Gigabit Ethernet MACs simplify DICOM network connectivity to PACS servers, and PCI Express lanes attach dedicated GPU cards for 3D rendering. Compared to consumer x86 workstations, the MPC8641-based system offers longer in-field support windows critical for medical device certification cycles.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC8641DVU1000NE557 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC8641DVU1000NE | MC8641DVR1000NE | MC8641DVU1250NE | MPC8641VTA1000 |
|---|---|---|---|---|---|
| Package | FCCBGA-1023 (33x33 mm) | FCCBGA-1023 (33x33 mm) | FCCBGA-1023 (33x33 mm) | FCCBGA-1023 (33x33 mm) | FCCBGA-1023 (33x33 mm) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e600 (32-bit) x2 | PowerPC e600 x2 | PowerPC e600 x2 | PowerPC e600 x2 | PowerPC e600 x2 |
| Core Frequency | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.25 GHz | 1.0 GHz |
| Number of Cores | 2 | 2 | 2 | 2 | 2 |
| Memory Controller | DDR2 SDRAM with ECC | DDR2 with ECC | DDR2 with ECC | DDR2 with ECC | DDR2 with ECC |
| Gigabit Ethernet | Dual (via SerDes) | Dual (via SerDes) | Dual (via SerDes) | Dual (via SerDes) | Dual (via SerDes) |
| RoHS / Lead-Free | Compliant / Yes (557 suffix) | Compliant | Compliant | Compliant | Compliant |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- Same-die SKU with 25% higher core frequency (vs MC8641DVU1000NE)
- Same die with tape-and-reel packaging variant (vs MC8641DVU1000NE (tray default))
- Extended-screening variant on same footprint (vs MC8641DVU1000NE)
Notes de conception
Estimated: at 1.0 GHz dual-core load, peak power dissipation for an e600 SoC in FCCBGA-1023 typically runs in the high single-digit to low double-digit watt range depending on cache activity and SerDes utilization. A heatsink with thermal interface material plus forced airflow is required to keep junction temperature within industrial limits (typically Tj max = 105-125 C). Use a copper spreader bonded to the package lid and verify thermal performance in a worst-case sealed enclosure scenario before locking the bill of materials.
The FCCBGA-1023 (33x33 mm) substrate requires a multi-layer PCB (typically 8-12 layers) with dedicated continuous power and ground planes immediately beneath the ball array. DDR2 trace length matching (within ~25-50 ps across byte lanes) is mandatory for the integrated memory controller; use the NXP reference layout as a starting point. BGA break-out vias should be placed on a tight pitch with proper anti-pad geometry to avoid solder bridging during reflow.
Power sequencing is mandatory for the MPC8641: the core voltage rail must reach its target before the I/O rails, otherwise the device can latch up. Use a multi-rail supervisor (e.g., TPS3823 family) or a programmable sequencer to enforce the order documented in the hardware specifications. Decoupling must include both bulk polymer/ceramic capacitors near the balls and high-frequency MLCCs adjacent to each supply pin per the reference design.
Do not assume the L2 cache size and core count without consulting the exact part decoder - the MPC8641 family includes single-core, dual-core, and reduced-cache variants under similar MPN patterns. Verify JTAG/trace port pin assignments if you are reusing a board layout from an MPC8548 or MPC8360; the e600-core JTAG chain differs and trace pins are remapped. Confirm SerDes reference clock topology before bringing up link partners - mismatched SerDes lanes are the most common cause of link-training failures.
Informations de conformité
RoHS and lead-free compliance confirmed by NXP part decoder ('557' suffix indicates lead-free tape-and-reel orientation). Halogen-free and conflict-minerals status not directly stated in the verified web data; set to unknown rather than fabricating a value.
