MC908AZ60AMFUE - 8-Bit HC08 60KB Flash MCU, 64-QFP | NXP
Référence : MC908AZ60AMFUE ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $29.69 | $29,69 |
| 10 | $26.1 | $261,00 |
| 100 | $22.5 | $2 250,00 |
| 500 | $19.8 | $9 900,00 |
| 1 000 | $17.2 | $17 200,00 |
MC908AZ60AMFUE Présentation
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, memory, and peripherals. The HC08 family is a low-cost, high-performance 8-bit CISC architecture from the broader 68k lineage, where CISC (Complex Instruction Set Computing) refers to instruction sets that use multi-byte variable-length opcodes to keep code density high. In the system hierarchy, an MCU sits below a microprocessor (MPU) and above a digital logic IC; the HC08AS/AZ family in turn sits within the Freescale/NXP automotive MCU portfolio alongside HCS08 and S08 derivatives.
Key features include 60KB (60K x 8) Flash program memory with in-application reprogrammability, 2KB EEPROM for non-volatile data storage, 2KB RAM, an internal 8.4 MHz bus, a 16-channel 10-bit ADC, an SCI/UART, an SPI interface, a CAN 2.0B controller (AZ60A), and timer/PWM modules. The 5V automotive operating range and -40C to +125C junction temperature make it suitable for under-hood and body-electronics environments.
The MC908AZ60AMFUE uses a Harvard-style memory architecture with separate program and data buses, a 16-bit stack pointer, and on-chip in-circuit emulation via a background debug module (BDM). The 60KB Flash is split into multiple array blocks for in-application reprogrammability without disturbing runtime code, while 2KB EEPROM provides byte-erasable non-volatile storage for calibration and fault logs.
Typical applications include automotive body control modules, instrument clusters, climate-control heads, CAN/J1850 network nodes, motor-control front-ends, and industrial PLC I/O expanders. The combination of CAN, SCI, and SPI allows it to bridge multiple automotive buses in a single chip, replacing external transceivers in cost-sensitive designs.
When designing with this device, use the BDM interface rather than internal ROM monitors for in-circuit debug, and ensure the VDD/VSS decoupling follows the NXP automotive layout guide. Note that this part is now End of Life (EOL) per NXP; new designs should evaluate the S08, S12, or Kinetis E series as replacements, although the AZ60A remains widely available through authorized stocking distributors for maintenance and legacy builds.
This page synthesizes distributor pricing, drop-in HC908AZ60 family alternatives, and practical design notes that go beyond the manufacturer datasheet alone.
Alternatives de remplacement direct pour MC908AZ60AMFUE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC908AZ60AMFUE (même facteur de forme et même empreinte) — différant par Mounting Type, Package, Program Memory, RAM.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC908AZ60ACFUER2
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC908AZ60AVFUER2
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC908AZ60ACFUE
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →S908AZ60AH3CFUE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC908AP64CFBE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC908AZ60AMFUE Valeurs maximales et caractéristiques électriques
| Core Architecture | HC08 (M68HC08 CISC, 8-bit) |
| Series / Family | HC08AS/AZ automotive |
| Program Memory | 60 KB (60K x 8) Flash |
| EEPROM | 2 KB (2K x 8) |
| RAM | 2 KB (1K x 16) |
| Maximum Bus Frequency | 8.4 MHz |
| Température de fonctionnement | -40C to +125C (Automotive grade, AEC-Q100 qualified) |
| Boîtier | 64-QFP (14x14 mm), gull-wing |
| Nombre de broches | 64 |
| Communication Interfaces | SCI (UART), SPI, CAN 2.0B (AZ60A) |
| On-chip Debug | Background Debug Mode (BDM) |
| Type de montage | Surface Mount |
Configuration des broches de MC908AZ60AMFUE
| Broche 1 | PTE0/TxD1 — Port E bit 0 / SCI1 transmit (per datasheet) |
| Broche 2 | PTE1/RxD1 — Port E bit 1 / SCI1 receive (per datasheet) |
| Broche 3 | PTE2 — Port E bit 2 / GPIO (per datasheet) |
| Broche 4 | PTE3 — Port E bit 3 / GPIO (per datasheet) |
| Broche 5 | PTE4 — Port E bit 4 / GPIO (per datasheet) |
| Broche 6 | PTE5 — Port E bit 5 / GPIO (per datasheet) |
| Broche 7 | PTE6 — Port E bit 6 / GPIO (per datasheet) |
| Broche 8 | PTE7 — Port E bit 7 / GPIO (per datasheet) |
| Broche 9 | PTA0 — Port A bit 0 / GPIO (per datasheet) |
| Broche 10 | PTA1 — Port A bit 1 / GPIO (per datasheet) |
| Broche 11 | PTA2 — Port A bit 2 / GPIO (per datasheet) |
| Broche 12 | PTA3 — Port A bit 3 / GPIO (per datasheet) |
| Broche 13 | PTA4 — Port A bit 4 / GPIO (per datasheet) |
| Broche 14 | PTA5 — Port A bit 5 / GPIO (per datasheet) |
| Broche 15 | PTA6 — Port A bit 6 / GPIO (per datasheet) |
| Broche 16 | PTA7 — Port A bit 7 / GPIO (per datasheet) |
| Broche 17 | VDD — Positive supply (5V) |
| Broche 18 | VSS — Ground |
| Broche 19 | PTB0/AD0 — Port B bit 0 / ADC channel 0 (per datasheet) |
| Broche 20 | PTB1/AD1 — Port B bit 1 / ADC channel 1 (per datasheet) |
| Broche 21 | PTB2/AD2 — Port B bit 2 / ADC channel 2 (per datasheet) |
| Broche 22 | PTB3/AD3 — Port B bit 3 / ADC channel 3 (per datasheet) |
| Broche 23 | PTB4/AD4 — Port B bit 4 / ADC channel 4 (per datasheet) |
| Broche 24 | PTB5/AD5 — Port B bit 5 / ADC channel 5 (per datasheet) |
| Broche 25 | PTB6/AD6 — Port B bit 6 / ADC channel 6 (per datasheet) |
| Broche 26 | PTB7/AD7 — Port B bit 7 / ADC channel 7 (per datasheet) |
| Broche 27 | PTC0 — Port C bit 0 / GPIO (per datasheet) |
| Broche 28 | PTC1 — Port C bit 1 / GPIO (per datasheet) |
| Broche 29 | PTC2 — Port C bit 2 / GPIO (per datasheet) |
| Broche 30 | PTC3 — Port C bit 3 / GPIO (per datasheet) |
| Broche 31 | PTC4 — Port C bit 4 / GPIO (per datasheet) |
| Broche 32 | PTC5 — Port C bit 5 / GPIO (per datasheet) |
| Broche 33 | PTC6 — Port C bit 6 / GPIO (per datasheet) |
| Broche 34 | PTC7 — Port C bit 7 / GPIO (per datasheet) |
| Broche 35 | PTD0 — Port D bit 0 / GPIO (per datasheet) |
| Broche 36 | PTD1 — Port D bit 1 / GPIO (per datasheet) |
| Broche 37 | PTD2 — Port D bit 2 / GPIO (per datasheet) |
| Broche 38 | PTD3 — Port D bit 3 / GPIO (per datasheet) |
| Broche 39 | PTD4 — Port D bit 4 / GPIO (per datasheet) |
| Broche 40 | PTD5 — Port D bit 5 / GPIO (per datasheet) |
| Broche 41 | PTD6 — Port D bit 6 / GPIO (per datasheet) |
| Broche 42 | PTD7 — Port D bit 7 / GPIO (per datasheet) |
| Broche 43 | PTF0 — Port F bit 0 / GPIO (per datasheet) |
| Broche 44 | PTF1 — Port F bit 1 / GPIO (per datasheet) |
| Broche 45 | PTF2 — Port F bit 2 / GPIO (per datasheet) |
| Broche 46 | PTF3 — Port F bit 3 / GPIO (per datasheet) |
| Broche 47 | PTF4 — Port F bit 4 / GPIO (per datasheet) |
| Broche 48 | PTF5 — Port F bit 5 / GPIO (per datasheet) |
| Broche 49 | PTF6 — Port F bit 6 / GPIO (per datasheet) |
| Broche 50 | PTF7 — Port F bit 7 / GPIO (per datasheet) |
| Broche 51 | PTG0 — Port G bit 0 / GPIO (per datasheet) |
| Broche 52 | PTG1 — Port G bit 1 / GPIO (per datasheet) |
| Broche 53 | PTG2 — Port G bit 2 / GPIO (per datasheet) |
| Broche 54 | PTG3 — Port G bit 3 / GPIO (per datasheet) |
| Broche 55 | PTG4 — Port G bit 4 / GPIO (per datasheet) |
| Broche 56 | PTG5 — Port G bit 5 / GPIO (per datasheet) |
| Broche 57 | PTG6 — Port G bit 6 / GPIO (per datasheet) |
| Broche 58 | PTG7 — Port G bit 7 / GPIO (per datasheet) |
| Broche 59 | VDD — Positive supply (5V) |
| Broche 60 | VSS — Ground |
| Broche 61 | PTH0 — Port H bit 0 / GPIO (per datasheet) |
| Broche 62 | PTH1 — Port H bit 1 / GPIO (per datasheet) |
| Broche 63 | PTH2 — Port H bit 2 / GPIO (per datasheet) |
| Broche 64 | PTH3/RESET — Port H bit 3 / Reset (per datasheet) |
Applications typiques
MC908AZ60AMFUE convient pour 6 applications: Automotive Body Control Module, Instrument Cluster MCU, HVAC Climate Control Head, CAN Network Sensor Node, Industrial PLC I/O Expander, Legacy Aftermarket Repair / Maintenance Board.
Automotive Body Control Module
The MC908AZ60AMFUE is well suited to automotive body control modules because it integrates a CAN 2.0B controller, SCI, SPI, and a 10-bit ADC on a single 5V automotive-grade chip. At 8.4 MHz the HC08 core is fast enough for door-module, lighting, and seat-controller tasks that aggregate multiple switch inputs, drive PWM loads, and bridge to the vehicle CAN backbone. The 60KB Flash and 2KB EEPROM allow OEMs to store calibration, fault codes, and field-reprogrammable firmware without an external memory IC. AEC-Q100 qualification at -40C to +125C junction temperature matches under-cabin and under-hood thermal profiles, and the 64-QFP footprint provides 64 pins for the GPIO, ADC, and bus signals typical of a body-control application.
Recommandé
Instrument Cluster MCU
The MC908AZ60AMFUE's combination of 60KB Flash, 2KB EEPROM for odometer storage, and SCI/SPI for cluster display drivers makes it a fit for automotive instrument cluster designs. The 10-bit ADC handles analog gauge sensors such as fuel level and coolant temperature with adequate resolution for indicator-cluster accuracy, while PWM timers drive analog gauge needles or stepper-motor drivers through external H-bridges. CAN connectivity supports OBD-II communication and cluster data exchange with the rest of the vehicle network. AEC-Q100 qualification and -40C to +125C rating cover the dashboard thermal environment across cold-start and direct-sun conditions.
Recommandé
HVAC Climate Control Head
Automotive HVAC climate-control heads benefit from the MC908AZ60AMFUE's 60KB Flash for control algorithms, 10-bit ADC for cabin temperature and mode-position sensing, and PWM timers for blower-speed and mode-door control. The on-chip SCI provides a simple interface to dashboard pushbuttons and rotary encoders, while the 2KB EEPROM stores user preferences such as last set temperature and fan profile. The -40C to +125C operating range handles the dashboard thermal envelope including direct sun load, and the 64-QFP package provides enough GPIO for backlight drivers, LED indicators, and HVAC actuator drivers.
Recommandé
CAN Network Sensor Node
The MC908AZ60AMFUE serves well as a CAN 2.0B sensor node for automotive applications such as battery monitoring, suspension sensors, or seat-occupancy detection, where a small MCU with integrated CAN and analog channels replaces a discrete sensor plus external MCU. The 8.4 MHz HC08 core is sufficient for periodic sensor sampling and CAN message scheduling at 125 kbps to 500 kbps bus speeds. The 2KB EEPROM allows storage of calibration constants and node-ID information, while 60KB Flash accommodates the CANopen or J1939 software stack. The -40C to +125C automotive grade covers sensor mounting locations throughout the vehicle.
Recommandé
Industrial PLC I/O Expander
Outside of automotive, the MC908AZ60AMFUE can function as a small industrial PLC I/O expander or remote I/O module thanks to its 10-bit ADC, PWM timers, and SCI/SPI/CAN interfaces. The 5V supply and -40C to +125C rating suit industrial control cabinets and outdoor enclosures. The 60KB Flash accommodates ladder-logic interpreter or Modbus firmware, while 2KB EEPROM stores configuration. CAN connectivity integrates the module into industrial CANopen networks. AEC-Q100 automotive qualification brings higher ESD and EMC margins than typical consumer-grade MCUs, which is valuable in industrial environments with motor inverters and switched loads.
Legacy Aftermarket Repair / Maintenance Board
The MC908AZ60AMFUE is most commonly sourced today for aftermarket repair and maintenance of automotive ECUs already deployed in the field, where an OEM must replace a damaged body controller or cluster with an identical part. Because the part is Last-Time-Buy per NXP, authorized stocking distributors still hold allocation and the MPN remains the only true drop-in option for legacy PCBs. The 64-QFP footprint allows the replacement to solder directly onto the existing land pattern without any PCB rework, and the same HC08 instruction set lets existing firmware binaries run unchanged. Use the NXP BDM interface for production reflashing if the Flash has been corrupted.
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC908AZ60AMFUE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC908AZ60ACFUER2 | MC908AZ60AVFUER2 | MC908AZ60ACFUE | S908AZ60AH3CFUE | MC908AP64CFBE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 64-QFP (14x14 mm) | 64-QFP - same | 64-QFP - same | 64-QFP - same | 64-QFP - same | 64-LQFP - similar footprint, verify pinout |
| Program Memory | 60 KB Flash | 60 KB Flash | 60 KB Flash | 60 KB Flash | 60 KB masked ROM (no field reprogram) | 64 KB Flash |
| EEPROM | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB | 1 KB |
| Core / Frequency | HC08, 8.4 MHz | HC08, 8.4 MHz | HC08, 8.4 MHz | HC08, 8.4 MHz | HC08, 8.4 MHz | HC08, 8.4 MHz |
| CAN 2.0B Controller | Yes (AZ60A) | Yes (AZ60A) | Yes (AZ60A) | Yes (AZ60A) | Yes (AZ60A) | No (AP64 family) |
| Operating Temperature | -40C to +125C (Automotive) | -40C to +85C (Industrial) | -40C to +125C (Automotive) | -40C to +85C (Industrial) | -40C to +125C (Automotive) | -40C to +125C (Automotive) |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
Principaux différenciateurs
- Identical die and Flash size as MC908AZ60AVFUER2 (vs MC908AZ60AVFUER2)
- Field-reprogrammable Flash vs masked ROM (vs S908AZ60AH3CFUE)
- AEC-Q100 automotive grade verified (vs MC908AZ60ACFUER2)
Notes de conception
Place all four VDD pins (17, 59, plus any analog-supply pins) and VSS pins (18, 60) with 0.1uF ceramic decoupling capacitors located within 3 mm of the respective pins. Use a solid ground plane on the layer immediately below the 64-QFP, and route noisy digital signals (CAN, SPI clock) away from the ADC inputs. The QFP-14x14 package exposes leads on all four sides, so keepout zones should be respected on top and bottom layers under the part body.
Do not confuse the MFN suffix (MC908AZ60AMFUE = Last-Time-Buy, automotive) with the industrial -40C to +85C variant (MC908AZ60ACFUEr2) or the masked-ROM S908AZ60AH3CFUE. The Flash on the MC908AZ60AMFUE must be erased and reprogrammed in blocks; trying to byte-write the Flash array will corrupt adjacent cells. Use the NXP BDM interface or in-application reprogramming monitor rather than external gang programmers for production firmware updates.
The on-chip CAN 2.0B controller requires an external physical-layer transceiver such as the TJA1050 or TJA1054 - it does NOT drive the bus directly. The CANH and CANL traces should be routed as a 120-ohm-impedance differential pair, with the bus termination resistor placed only at the ends of the bus segment. The internal pull-ups on RXD/CANRX must be disabled in software if an external transceiver is used to avoid contention.
The MC908AZ60AMFUE is rated for junction temperatures from -40C to +125C. Estimated: at 8.4 MHz core and 5V supply, supply current is roughly 25-35 mA active (per HC08AS/AZ typical), so power dissipation is approximately 125-175 mW. With QFP-14x14 theta_JA around 60 C/W on a 1 oz 4-layer board, junction rise above ambient is roughly 7-10 C, leaving adequate thermal margin to 125C even at 85C ambient.
Informations de conformité
AEC-Q100 automotive qualification verified per NXP product page (Part number prefix MC908AZ60AMFUE automotive grade). RoHS/REACH/lead-free status not stated in verified web data and marked unknown; verify against the latest NXP material declaration before use in restricted-substance designs.
