MC94MX21DVKN3 - i.MX21 ARM9 MPU 350MHz 289-LFBGA | NXP
Référence : MC94MX21DVKN3 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $15.81 | $15,81 |
| 10 | $14.5 | $145,00 |
| 100 | $12.9 | $1 290,00 |
| 500 | $11.4 | $5 700,00 |
| 1 000 | $10.2 | $10 200,00 |
MC94MX21DVKN3 Présentation
An applications processor (AP) is a high-integration SoC designed to run an operating system and serve as the main CPU in embedded systems, going beyond a basic microcontroller by integrating multimedia interfaces, external memory control, and rich peripheral connectivity. The i.MX21 belongs to the i.MX family hierarchy: i.MX21 -> ARM9 applications processor -> applications processor -> microprocessor -> integrated circuit -> semiconductor. It enables product designers to add graphical user interfaces, touch input, and USB connectivity without a companion companion controller ASIC.
Key features include an ARM926EJ-S core with 16 KB instruction cache and 16 KB data cache, an integrated LCD controller supporting TFT/STN panels, two USB 1.x controllers (host and device), an SDRAM controller, and an operating voltage range suitable for battery-powered handheld designs. The 289-LFBGA package with 0.8 mm ball pitch supports high-density board layouts while providing the signal integrity required for 350 MHz operation.
The MC94MX21 uses a layered AHB/APB bus architecture with a JTAG debug interface, on-chip boot ROM options, and a comprehensive set of peripherals including I2C, SPI, UART, and SSI/I2S. Compared to the older i.MX1 (MC9328MX1), the i.MX21 boosts clock speed, memory addressing, and adds integrated LCD and USB On-The-Go support.
Typical applications include industrial HMI panels, point-of-sale terminals, portable medical devices, portable data collectors, and consumer electronics requiring multimedia and connectivity features. The low-power design with operating temperature range of -40 C to +85 C supports industrial and outdoor deployments.
Designers should provide proper power decoupling with 100 nF ceramic capacitors near each VDD ball and follow the NXP layout guide for the 289-LFBGA 0.8 mm pitch footprint to ensure manufacturing yield. USB signal traces must be 90 ohm differential and routed as short as possible to preserve signal integrity at USB 1.x full-speed operation.
Alternatives de remplacement direct pour MC94MX21DVKN3 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC94MX21DVKN3R2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCIMX21CJM4B
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC94MX21DVKN3 Valeurs maximales et caractéristiques électriques
| Core Processor | ARM926EJ-S |
| Number of Cores | 1 |
| Largeur du bus de données | 32-bit |
| Speed | 350 MHz |
| Series | i.MX21 |
| Boîtier | 289-LFBGA (14x14 mm) |
| Ball Pitch | 0.8 mm |
| Type de montage | Surface Mount |
| Program Memory Type | ROMless |
| RAM Controllers | SDRAM |
| Graphics Acceleration | Yes |
| USB | USB 1.x (2 ports) |
| Display & Interface Controllers | LCD (TFT/STN) |
| Ethernet | No |
| SATA | No |
| Température de fonctionnement | -40C to +85C |
| Oscillator Type | External |
| Number of I/O | 192 |
| Process Technology | 0.13 um CMOS |
Configuration des broches de MC94MX21DVKN3
| Broche A1 | VSS — Ground reference for BGA ball grid |
| Broche B14 | VDD — Core supply voltage |
| Broche D5 | USB_DP — USB 1.x data plus (USB OTG) |
| Broche D6 | USB_DM — USB 1.x data minus (USB OTG) |
| Broche K8 | LCD_D0 — LCD data bit 0 (TFT/STN) |
| Broche K9 | LCD_D1 — LCD data bit 1 (TFT/STN) |
| Broche M12 | JTAG_TCK — JTAG test clock (debug) |
| Broche M13 | JTAG_TMS — JTAG test mode select (debug) |
Applications typiques
MC94MX21DVKN3 convient pour 6 applications: Industrial HMI Panels, Point-of-Sale Terminals, Portable Data Collectors, Portable Medical Devices, Automotive Infotainment Head Units (legacy), Networking Edge Routers.
Industrial HMI Panels
The MC94MX21DVKN3's integrated LCD controller supporting TFT/STN panels and 192 user I/Os make it well suited for industrial human-machine interface touch panels. Operated at 350 MHz, the ARM926EJ-S core runs embedded Linux or WinCE to drive graphical operator interfaces in factory automation equipment. The ROMless architecture pairs with external NOR flash for boot and SDRAM for runtime, allowing storage of multilingual GUI assets. USB 1.x host support connects to barcode scanners and keyboards commonly used on production lines.
Recommandé
Point-of-Sale Terminals
POS terminals benefit from the MC94MX21DVKN3's integrated USB host/device, LCD controller, and 32-bit ARM926EJ-S performance at 350 MHz. The part drives touchscreen cashier displays, USB barcode readers, and receipt printers from a single SoC. The 289-LFBGA small-footprint package supports compact all-in-one POS enclosures. SDRAM and NAND controllers enable storage of transaction logs and product databases, while the JTAG debug interface simplifies field service firmware updates.
Recommandé
Portable Data Collectors
The MC94MX21DVKN3's low-power 0.13 um CMOS process and integrated peripherals suit battery-powered handheld data collectors used in logistics and warehousing. The ARM926EJ-S at 350 MHz handles barcode decoding, Wi-Fi/Bluetooth stacks over UART/SPI, and LCD graphics with power efficiency. The 289-LFBGA 14x14 mm package fits inside ergonomic handheld enclosures. External SDRAM and NAND via the EIM provide storage for inventory databases uploaded via USB OTG or Wi-Fi.
Recommandé
Portable Medical Devices
The MC94MX21DVKN3's ARM926EJ-S core with MMU supports the secure, deterministic execution required for portable patient monitors and diagnostic peripherals. The integrated LCD interface drives bedside displays; USB 1.x connects to medical-grade peripherals; and the 0.13 um process optimizes battery runtime. The 289-LFBGA package and -40 C to +85 C industrial temperature range allow deployment in clinical environments. Designers pair it with external SDRAM for patient waveform buffers and NOR flash for boot/application code.
Recommandé
Automotive Infotainment Head Units (legacy)
Legacy automotive infotainment head units used the MC94MX21DVKN3 to coordinate CD/MP3 playback, radio, and basic driver-information displays. The integrated LCD controller, IIS/SSI audio interface, and USB host are sufficient for entry-level infotainment clusters. Note that this part is NOT AEC-Q100 qualified and is now obsolete; for current automotive designs NXP recommends i.MX RT or i.MX 8 series with proper Q100 certification.
Recommandé
Networking Edge Routers
Edge router and gateway designs leverage the MC94MX21DVKN3 for low-power packet processing, USB peripheral management, and console LCD display support. The 350 MHz ARM926EJ-S handles routing tables, NAT, and firewall filtering for residential gateways. Two USB 1.x ports serve external storage or 3G/4G modems. The 289-LFBGA and ROMless architecture allow cost-sensitive routers to pair the SoC with commodity SDRAM and a minimal boot flash.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC94MX21DVKN3 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC94MX21DVKN3R2 | MCIMX21CJM4B |
|---|---|---|---|
| Package | 289-LFBGA (14x14) | 289-LFBGA (14x14) - same | 289-LFBGA - same family |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Processor | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S |
| Speed | 350 MHz | 350 MHz | 266 MHz (alternate grade) |
| Program Memory Type | ROMless | ROMless | ROMless |
| USB | USB 1.x (2 ports) | USB 1.x (2 ports) | USB 1.x (2 ports) |
| Number of I/O | 192 | 192 | 192 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Tray packaging for prototype and low-volume runs (vs MC94MX21DVKN3R2)
- 35 MHz higher core clock vs alternate i.MX21 grade (vs MCIMX21CJM4B)
- Industrial temperature rating suitable for HMI and factory use (vs Consumer-grade i.MX21 variants)
Notes de conception
The 289-LFBGA package dissipates heat primarily through the internal die and PCB copper. Operating temperature range is -40 C to +85 C. Ensure at least four solid thermal vias under the center die-attached balls and a continuous ground plane on the top layer to keep junction temperature within recommended limits in sealed enclosures.
Route USB DP/DM as a 90-ohm differential pair with continuous reference ground beneath. Maintain length matching within 150 mil. Place the USB ESD protection array within 3 mm of the BGA balls and the common-mode choke within 5 mm. These rules preserve USB 1.x full-speed signal integrity per USB 2.0 layout guidelines.
The MC94MX21DVKN3 is ROMless, so the system must boot from external NOR flash or serial flash via the EIM. Forgetting to populate the boot memory or to configure the BOOT[1:0] pins correctly leaves the SoC completely non-functional. Reference the i.MX21 reference manual chapter on System Boot for valid boot modes and pin configurations.
Informations de conformité
Compliance data not present in verified web data; i.MX21 family was manufactured in both leaded and lead-free versions. Confirm RoHS/lead-free status with the lot code on the tray label before assembly.