MC9S08DN16ACLC - 40MHz 16KB 8-Bit MCU | NXP | 32-LQFP
Référence : MC9S08DN16ACLC ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.3343 | $5,33 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
MC9S08DN16ACLC Présentation
A microcontroller integrates a processor core, program memory, data memory, peripherals, interrupt control, and debug or emulation resources on one semiconductor device. The S08 family targets automotive and industrial embedded systems where deterministic control, low pin count, and communication peripherals are valuable. MC9S08DN16ACLC belongs to the broader semiconductor hierarchy: MCU, embedded processor, 8-bit microcontroller, and S08DN device.
The principal verified features are a 40 MHz maximum clock, 20 MHz bus operation, 16 KB Flash organized as 16K x 8, 512 B RAM, an S08 core, an 8-bit data bus, and a 32-LQFP package measuring 7 x 7 mm. The integrated communication set includes LIN, I2C, and SPI. A cited HCS08-family source also identifies support for as many as 32 interrupt or reset sources, although device-specific applicability must be confirmed against the exact manufacturer documentation.
Technically, the MCU combines a relatively high-frequency 8-bit core with modest on-chip memory, making it appropriate for compact control logic rather than high-memory graphical workloads. Its bus speed is half the stated 40 MHz CPU frequency, a useful constraint when timing peripherals or external bus transactions. The 8-bit data architecture simplifies peripheral integration while limiting throughput compared with modern 16-bit or 32-bit MCUs.
Typical uses include LIN-connected automotive modules, industrial sensors, compact motor or actuator controllers, communication bridges, and embedded control panels. I2C suits low-speed sensors and EEPROMs, SPI supports faster peripherals, and LIN provides a vehicle-network-oriented serial interface when its electrical transceiver is implemented externally.
Designers should preserve the 20 MHz bus constraint, confirm every peripheral and pin against the exact datasheet, and design the LIN physical layer separately when the MCU is used in a vehicle network. Current distributor information lists the device in 32-LQFP, but exposed operating limits, pin names, timing values, and package thermal details require exact manufacturer data.
This page consolidates verified NXP and distributor information with selection guidance, application fit, interface considerations, and drop-in-replacement validation. It distinguishes confirmed values from parameters that still require datasheet confirmation, helping engineers avoid treating search snippets as a substitute for the exact MC9S08DN16ACLC datasheet.
Alternatives de remplacement direct pour MC9S08DN16ACLC — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S08DN16ACLC (même facteur de forme et même empreinte) — différant par Package, RAM.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
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Voir la fiche technique →MC9S08DN16ACLC Valeurs maximales et caractéristiques électriques
| Product Type | 8-bit microcontroller |
| Core Architecture | S08 |
| Maximum CPU Frequency | 40 MHz |
| Bus Frequency | 20 MHz |
| Largeur du bus de données | 8 bit |
| Flash Memory | 16 KB (16K x 8) |
| RAM | 512 B |
| LIN Connectivity | Yes |
| I2C Interface | Yes |
| SPI Interface | Yes |
| Boîtier | 32-LQFP (7 x 7 mm) |
| Nombre de broches | 32 pins |
| Type de montage | Surface mount |
| Instruction Set | HCS08 instruction set with BGND instruction |
| Maximum Interrupt and Reset Sources | Up to 32 sources |
| Embedded Emulation and Debug | Supported by the cited HCS08 family information |
Guide de configuration des broches du MC9S08DN16ACLC 32-lqfp (7 x 7 mm)
Configuration des broches du MC9S08DN16ACLC (boîtier 32-lqfp (7 x 7 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MC9S08DN16ACLC.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MC9S08DN16ACLC convient pour 6 applications: LIN-Connected Automotive Control Module, Industrial Sensor Interface, Compact Communication Bridge, Actuator and Small Motor Controller, Battery-Powered Sensor Hub, Industrial HMI and Keypad Controller.
LIN-Connected Automotive Control Module
The MC9S08DN16ACLC fits a compact LIN node because NXP identifies LIN connectivity alongside a 40 MHz S08 core, 16 KB Flash, and 512 B RAM. The MCU can execute control logic, monitor inputs, and drive actuators while communicating through a dedicated LIN transceiver. Its 20 MHz bus must be considered when timing communication and control tasks. This is a suitable architectural starting point for body, seat, climate, or sensor modules where memory demand is modest and deterministic embedded behavior is important. Production qualification still depends on verifying the exact electrical limits, temperature grade, LIN timing parameters, and external transceiver requirements in the device documentation.
Recommandé
Industrial Sensor Interface
The MC9S08DN16ACLC can consolidate readings from slower digital sensors and compact control logic because it provides 512 B RAM, 16 KB Flash, I2C, and SPI. I2C is useful for compatible sensors and memory devices, while SPI provides a faster path for peripherals that need greater transfer throughput. The 40 MHz core can support responsive state-machine-based measurement, and the 8-bit data bus aligns with many compact sensor registers. Design work should verify exact multiplexed pin assignments, peripheral instance availability, timing values, and electrical limits before assigning sensors to specific pins.
Recommandé
Compact Communication Bridge
With both I2C and SPI, the MC9S08DN16ACLC can bridge sensors or memory devices to a higher-level communications processor. Its 16 KB Flash and 512 B RAM are appropriate for protocol framing, buffering, and a compact control layer rather than demanding applications. The MCU executes instructions at up to 40 MHz through a 20 MHz bus, which must be reflected in timing budgets. Engineers should avoid assuming arbitrary pin remapping and should confirm the exact peripheral channels, alternate functions, interrupt vectors, and electrical constraints in the manufacturer documentation.
Recommandé
Actuator and Small Motor Controller
The MC9S08DN16ACLC is suitable for basic actuator, valve, or small-motor control where firmware must combine serial configuration with deterministic output sequencing. Its 40 MHz S08 core offers more headroom than many simpler 8-bit controllers, while 16 KB Flash can hold application code and 512 B RAM can support local state. The 32-LQFP package also exposes more pins than a minimal controller. Motor-drive circuitry remains external, so developers must verify available timer channels, PWM features, pin assignments, and protection requirements for the exact device before selecting the MCU.
Recommandé
Battery-Powered Sensor Hub
The MC9S08DN16ACLC can serve as a low-to-moderate-complexity sensor hub because it combines serial sensor connectivity with compact 16 KB Flash and 512 B RAM. I2C supports compatible low-speed sensors, while SPI can accommodate higher-rate devices. The exact low-power modes, active current, sleep current, and wakeup sources were not supplied, so battery-life claims require measurement and exact datasheet confirmation. A successful design should isolate unused peripherals, manage clock and bus activity, and use the MCU's documented low-power modes only after their wakeup behavior and timing are verified.
Recommandé
Industrial HMI and Keypad Controller
The MC9S08DN16ACLC can manage a compact keypad, indicator logic, status display, and serial configuration in a small human-machine interface. Its 40 MHz S08 core provides processing margin, while 16 KB Flash supports menu logic and 512 B RAM can hold short input and display buffers. I2C is useful for compatible displays or expanders, and SPI can serve faster display or storage peripherals when supported by the exact pin map. Engineers must confirm available I/O count, interrupt behavior, display timing, and pin multiplexing because the supplied data does not provide the complete pinout.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S08DN16ACLC — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S08DN16ACLC |
|---|---|---|
| Package | 32-LQFP (7 x 7 mm) | 32-LQFP (7 x 7 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | S08, 8-bit | S08, 8-bit |
| Maximum CPU Frequency | 40 MHz | 40 MHz |
| Bus Frequency | 20 MHz | 20 MHz |
| Flash Memory | 16 KB (16K x 8) | 16 KB (16K x 8) |
| RAM | 512 B | 512 B |
| Serial Interfaces | LIN, I2C, SPI | LIN, I2C, SPI |
| Unit Price | USD 5.3343 as of 2026-10-21 | USD 5.3343 reference listing as of 2026-10-21 |
Principaux différenciateurs
- Verified communication-interface combination (vs MC9S08QE32CLCR)
- Known CPU and bus timing relationship (vs MC9S08AC60CPUE)
- Verified compact package footprint (vs MC9S08QE32CLCR)
Notes de conception
Design the supply rail only after confirming the exact MC9S08DN16ACLC voltage limits and external component recommendations in the manufacturer documentation. Place required bypass capacitors at the specified power pins with short ground returns, and keep switching-regulator or motor-driver nodes away from sensitive communication traces. Because the supplied data does not state current consumption or operating voltage, do not calculate regulator headroom or thermal margins from assumed values.
Treat LIN, SPI, and I2C as separate physical routing domains. SPI traces should be short and impedance controlled where the clock rate requires it; I2C should follow its rise-time and pull-up requirements; LIN requires a suitable external transceiver, bus protection, and compliant termination. Preserve current firmware timing around the verified 20 MHz bus and validate edge rates, capacitance, and grounding in the final board.
Use the manufacturer 32-LQFP land pattern and verify pin 1 orientation from the exact package drawing before routing. Decouple power pins close to their associated ground reference and route high-current actuator or transceiver outputs away from the MCU. A solid, uninterrupted ground strategy reduces return-path discontinuities, but pad geometry, exposed thermal requirements, and assembly rules must follow the official package documentation rather than a generic 32-LQFP footprint.
Do not substitute a similarly named HCS08 device merely because it has a 32-pin package. A true drop-in replacement must preserve the exact pinout, alternate functions, power pins, reset and debug behavior, interrupt mapping, memory organization, peripheral set, electrical ratings, and firmware compatibility. MC9S08QE32CLCR appeared only in a comparison result and is not approved as a replacement by the evidence supplied.
Informations de conformité
The supplied market results do not explicitly provide part-specific RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statements. Automotive-market positioning in a cited family description is not treated as evidence that this exact ordering code is AEC-Q100 qualified.