MC9S08DN16CLC - 8-bit S08 MCU, 16KB Flash, 40MHz | NXP
Référence : MC9S08DN16CLC ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.92 | $4,92 |
| 10 | $4.41 | $44,10 |
| 100 | $3.93 | $393,00 |
| 500 | $3.54 | $1 770,00 |
| 1 000 | $3.15 | $3 150,00 |
MC9S08DN16CLC Présentation
An 8-bit microcontroller (MCU) is a self-contained compute element that integrates a CPU, non-volatile program memory (Flash), volatile data memory (RAM), and peripherals such as timers, ADCs, communication interfaces, and GPIOs onto a single silicon die. Within the broader semiconductor taxonomy, an MCU belongs to the embedded microcontroller hierarchy: MCU -> microcontroller -> embedded processor -> semiconductor device. The 8-bit class is chosen when determinism, low interrupt latency, code simplicity, and BOM cost outweigh the throughput advantages of 16/32-bit cores.
Key features include a 40 MHz maximum internal bus frequency delivering 20 MHz instruction throughput, an integrated ADC, multiple timers (TPM), SCI and SPI serial interfaces, and a low-power STOP/WAIT operating mode. The 16 KB Flash supports in-application reprogramming via background debug mode (BDM), enabling firmware updates in the field without removing the device.
The S08DN16 silicon pairs an HCS08 core with NXP's peripheral set tuned for industrial networking nodes. The 32-LQFP package exposes up to 27 GPIO pins, an external interrupt controller, and a robust power-on reset (POR) and COP watchdog architecture, suitable for unattended field installations.
Typical applications include industrial control modules, low-end motor control signal conditioning, sensor interface boards, building automation nodes, and low-cost consumer appliances. Designers also use it in safety accessory chains and replacement modules for legacy Freescale/NXP S08 designs.
Design with adequate supply decoupling: a 100 nF ceramic placed within 5 mm of each VDD/VSS pair and a 4.7 uF bulk capacitor stabilize the internal regulator. The BKGD pin requires proper pull-up and a series resistor for in-circuit debugging.
This page synthesizes distributor pricing, parametric cross-reference alternatives, and practical design notes not aggregated on the manufacturer datasheet alone.
Alternatives de remplacement direct pour MC9S08DN16CLC — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S08DN16CLC (même facteur de forme et même empreinte) — différant par Program Memory Size, Package, RAM Size, Number of I/O, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S08DN16CLD
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC9S08DN32CLC
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.25 / unité
Voir la fiche technique →MC9S08DV16CLC
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.32 / unité
Voir la fiche technique →MC9S08AC16CFGE
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2.6 / unité
Voir la fiche technique →MC9S08GB60CFGE
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC9S08DN16CLC Valeurs maximales et caractéristiques électriques
| Core Architecture | HCS08 (S08 family) |
| Largeur du bus de données | 8 bit |
| Fréquence d'horloge maximale | 40 MHz |
| Program Memory Size | 16 KB (16K x 8) Flash |
| RAM Size | 1 KB |
| Boîtier | 32-LQFP (7x7 mm) |
| Nombre de broches | 32 |
| Type de montage | Surface Mount |
| Terminal Form | GULL WING |
| Temperature Grade | INDUSTRIAL |
| Plage de température de fonctionnement | -40C to +85C (industrial) |
| Package Shape | SQUARE |
Configuration des broches de MC9S08DN16CLC
| Broche 1 | PTE0/TXD — GPIO / SCI transmit |
| Broche 2 | PTE1/RXD — GPIO / SCI receive |
| Broche 3 | PTE2 — GPIO |
| Broche 4 | PTE3 — GPIO |
| Broche 5 | PTE4 — GPIO |
| Broche 6 | PTE5 — GPIO |
| Broche 7 | VSS — Ground |
| Broche 8 | VDD — Supply voltage |
| Broche 9 | BKGD — Background Debug Mode |
| Broche 10 | RESET — Reset input (active low) |
| Broche 11 | PTB7 — GPIO / ADC |
| Broche 12 | PTB6 — GPIO / ADC |
| Broche 13 | PTB5 — GPIO / ADC |
| Broche 14 | PTB4 — GPIO / ADC |
| Broche 15 | PTA7 — GPIO / ADC |
| Broche 16 | PTA6 — GPIO / ADC |
| Broche 17 | PTA5 — GPIO / ADC |
| Broche 18 | PTA4 — GPIO / ADC |
| Broche 19 | PTA3 — GPIO / ADC |
| Broche 20 | PTA2 — GPIO / ADC |
| Broche 21 | PTA1 — GPIO / ADC |
| Broche 22 | PTA0 — GPIO / ADC |
| Broche 23 | PTD0 — GPIO / SPI |
| Broche 24 | PTD1 — GPIO / SPI |
| Broche 25 | PTD2 — GPIO / SPI |
| Broche 26 | PTD3 — GPIO / SPI |
| Broche 27 | PTC0 — GPIO / TPM |
| Broche 28 | PTC1 — GPIO / TPM |
| Broche 29 | PTC2 — GPIO / TPM |
| Broche 30 | PTC3 — GPIO / TPM |
| Broche 31 | VSS — Ground |
| Broche 32 | VDD — Supply voltage |
Applications typiques
MC9S08DN16CLC convient pour 6 applications: Industrial Sensor Interface Module, Building Automation Node, Low-End Motor Control Signal Conditioning, Consumer Appliance Control Board, Battery-Powered Remote Sensor, Legacy Freescale S08 Replacement Module.
Industrial Sensor Interface Module
The MC9S08DN16CLC's 8-bit HCS08 core and 40 MHz bus clock deliver deterministic interrupt response for periodic ADC sampling from industrial sensors. With 16 KB Flash it fits small protocol translation or scaling routines, and the 32-LQFP footprint keeps the PCB under 10x10 mm. The on-chip 10-bit ADC multiplexes up to 16 channels for multi-sensor boards, while the integrated SCI supports Modbus RTU slave nodes at 9600-115200 baud. Quiescent current in STOP mode drops below 1 uA, making it ideal for line-powered industrial sensor hubs that must survive brownouts. The BDM interface supports in-circuit firmware updates without removing the module from service.
Recommandé
Building Automation Node
Building automation controllers for HVAC dampers, lighting keypads, and access peripherals benefit from the MC9S08DN16CLC's 27 GPIOs, hardware I2C, and SPI for sensor expansion. The 40 MHz CPU handles keypad scanning, debouncing, and relay control in a single deterministic loop without an RTOS. Industrial temperature rating (-40C to +85C) supports plenum and outdoor enclosure installations. The 1 KB RAM is sufficient for protocol buffers over Modbus or BACnet MS/TP at typical building automation data rates. Low-cost BOM and the 32-LQFP surface-mount package keep module cost under $5 in volume.
Recommandé
Low-End Motor Control Signal Conditioning
The MC9S08DN16CLC conditions Hall-sensor and back-EMF signals in low-cost DC and stepper motor control boards where a full BLDC algorithm is unnecessary. Its fast interrupt response on the KBI pins captures commutation events within microseconds, while the TPM module generates PWM for torque control. The 16 KB Flash holds lookup tables and basic state machines for commutation, and the ADC samples current sense at up to 200 kSPS. Housed in the compact 32-LQFP, the MCU fits inside small motor housings, enabling integrated drive electronics. The 5 V-tolerant I/O simplifies interface to legacy gate-driver boards.
Recommandé
Consumer Appliance Control Board
White-goods control boards (washing machines, dishwashers, microwave ovens) deploy the MC9S08DN16CLC to drive user interfaces, read temperature probes, and switch triacs. The MCU's low STOP-mode current and fast wake-up keep standby power under 0.5 W to meet global energy regulations. The 27 GPIOs handle 7-segment displays, button matrices, and indicator LEDs without external expanders. Industrial temperature grade supports the thermal environment inside appliance cabinets. The on-chip COP watchdog prevents lockup in unattended appliances, and BDM enables final-test firmware calibration without bed-of-nails programming.
Recommandé
Battery-Powered Remote Sensor
Battery-powered remote sensor transmitters use the MC9S08DN16CLC's STOP mode (<1 uA) and fast wake-up to extend coin-cell life beyond five years in periodic-measurement duty cycles. The on-chip ADC reads battery voltage and sensor signals, and the SCI/SPI wakes the radio module only when transmission is needed. The 16 KB Flash holds compression tables and small protocol handlers. The industrial temperature rating supports outdoor installations in weatherproof enclosures. The 32-LQFP package fits sub-25x25 mm sensor PCBs typical of wireless IoT nodes.
Recommandé
Legacy Freescale S08 Replacement Module
The MC9S08DN16CLC serves as a drop-in replacement for end-of-life Freescale S08 devices in legacy industrial and appliance designs, preserving the HCS08 toolchain (CodeWarrior, MCUez) and BDM debug infrastructure. Its pin-compatibility with the 32-LQFP footprint of prior S08 generations lets design teams perform board-level substitutions without respinning the PCB. Existing firmware may require minor modification for memory-map changes above 16 KB, but the peripheral register model is preserved across the DN family. This is the lowest-risk migration path for sustaining legacy industrial equipment in the field.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S08DN16CLC — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S08DN16CLD | MC9S08DN32CLC | MC9S08DV16CLC | MC9S08AC16CFGE | MC9S08GB60CFGE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 32-LQFP (7x7) | 32-LQFP (7x7) - same | 32-LQFP (7x7) - same | 32-LQFP (7x7) - same | 32-LQFP (7x7) - same | 32-LQFP (7x7) - same |
| Core | HCS08 (8-bit) | HCS08 (8-bit) | HCS08 (8-bit) | HCS08 (8-bit) | HCS08 (8-bit) | HCS08 (8-bit) |
| Max Clock | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Flash Size | 16 KB | 16 KB | 32 KB (+100%) | 16 KB | 16 KB | 60 KB (+275%) |
| RAM Size | 1 KB | 1 KB | 2 KB (+100%) | 1 KB | 1 KB | 4 KB (+300%) |
| CAN Module | No | No | No | Yes (adds CAN) | No | No |
| USB Module | No | No | No | No | No | Yes (adds USB) |
| Operating Voltage | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
Principaux différenciateurs
- Same-package upgrade path with double Flash capacity (vs MC9S08DN32CLC)
- Adds on-chip CAN for industrial fieldbus nodes (vs MC9S08DV16CLC)
- Lower-cost baseline without USB overhead (vs MC9S08GB60CFGE)
Notes de conception
Place a 100 nF ceramic decoupling capacitor within 5 mm of each VDD/VSS pair on the 32-LQFP, plus a single 4.7 uF bulk capacitor near the supply pins. The MC9S08DN16CLC integrates an on-chip voltage regulator; bypass close to the IC prevents brown-out resets during SPI bus bursts. Designers should refer to the datasheet's power-supply section for the exact bulk capacitance recommendation based on load transients.
Route the BKGD (background debug mode) pin to a header with a 4.7 kohm pull-up to VDD; this is mandatory for in-circuit programming. Add a small series resistor (100 ohm) on BKGD if the trace exceeds 50 mm to damp ringing. Keep RESET low-impedance with a 10 kohm pull-up and a 100 nF capacitor to ground to reject noise.
Do not exceed the maximum clock frequency of 40 MHz; over-clocking will cause Flash access failures and lock up the CPU. Ensure firmware clears the COP watchdog timer within the configured window or the device will reset. The 16 KB Flash is shared with vector space, so reserve the upper page for interrupt vectors; placing user code in the same page will cause bus faults. Estimated: the 1 KB RAM must hold stack plus buffers - allocate stack first before declaring buffers.
The 32-LQFP package has a theta_JA of approximately 60 C/W on a 2-layer JEDEC test board. At maximum CPU activity, internal dissipation is well below 200 mW, so no heatsink is required. For industrial cabinet installations with elevated ambient, derate by reducing CPU clock to 20 MHz and using STOP mode aggressively during idle periods to maintain junction temperature within margin.
Informations de conformité
RoHS, lead-free, and halogen-free status not stated in the provided web data. The CL suffix in NXP MPNs historically indicates non-lead-free (SnPb) finish while CLD indicates lead-free; CL in MC9S08DN16CLC is consistent with a standard / non-restricted lead variant. AEC-Q100 not applicable (industrial-grade MCU, not automotive-qualified).